CN207706503U - The connection structure of low-and high-frequency pcb board - Google Patents

The connection structure of low-and high-frequency pcb board Download PDF

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Publication number
CN207706503U
CN207706503U CN201721574541.0U CN201721574541U CN207706503U CN 207706503 U CN207706503 U CN 207706503U CN 201721574541 U CN201721574541 U CN 201721574541U CN 207706503 U CN207706503 U CN 207706503U
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CN
China
Prior art keywords
pin
low
frequency pcb
connection
pcb board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721574541.0U
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Chinese (zh)
Inventor
黄兆康
张贤祝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goldtron Electronics (shanghai) Co Ltd
Original Assignee
Goldtron Electronics (shanghai) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201721574541.0U priority Critical patent/CN207706503U/en
Application granted granted Critical
Publication of CN207706503U publication Critical patent/CN207706503U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of connection structures of the low-and high-frequency pcb board of various embodiments of the utility model, due to including mainly:Pin pin is connected, for connecting frequency PCB and low frequency PCB;Connecting plate pad, for connecting pin pin;With the limiting slot being arranged in supporting carrier, for being limited to the connection pin pin in welding process;The connection pin pin is L-shaped;So as to promote the efficiency of back segment welding and improve the quality of human weld.

Description

The connection structure of low-and high-frequency pcb board
Technical field
The utility model is related to low-and high-frequency pcb board welding technology fields, and in particular, to a kind of company of low-and high-frequency pcb board Binding structure.
Background technology
It is mainly for the connection production technology of low-and high-frequency PCB at present:
1.SMT re-packs, production low-and high-frequency PCBA
2. assembling section in FA, operator grips connection pin using tweezers and is positioned on two plate pads
3. operator is first welded to connect the one end pin by hand using soldering iron, then manual welding connects pin other ends
4. after the completion of pin welding to be connected, the flux on pad please be finally met
5. the problems in procedure for producing point
(1)When operator manual welding, the short circuit for closing on material and breakage are caused
(2)Product after finishing assembly, carries out high/low temperature test, due to the influence of stress, causes connection pin pad broken Damage, What is more tests pass at that time, and a period of time pad to be placed is damaged, and quality is out of control
(3)More manpower is needed, weld job is carried out.
Utility model content
The purpose of this utility model is that in view of the above-mentioned problems, a kind of connection structure of low-and high-frequency pcb board is proposed, to carry It rises the efficiency of back segment welding and improves the quality of human weld.
To achieve the above object, the technical solution adopted in the utility model is:A kind of connection structure of low-and high-frequency pcb board, Include mainly:
Pin pin is connected, for connecting frequency PCB and low frequency PCB;
Connecting plate pad, for connecting pin pin;
With the limiting slot being arranged in supporting carrier, for being limited to the connection pin pin in welding process;
The connection pin pin is L-shaped.
Further, the thickness of the connection pin pin is 0.12mm-0.15mm.
Further, the connecting plate pad is with the pore structure through connection pad.
Further, the pore structure is the ellipse of 0.45*0.9mm.
Further, the thickness of the connection pin pin is 0.12mm-0.15mm.
Further, the connecting plate pad is with the pore structure through connection pad.
Further, the pore structure is the ellipse of 0.45*0.9mm.
Further, width 0.2mm of the width of the limiting slot than connecting pin pin, the thickness ratio of limiting slot Connect the thickness thickness 1mm-2mm of pin pin.
The connection structure of the low-and high-frequency pcb board of various embodiments of the utility model, due to including mainly:Pin pin is connected, is used In connection frequency PCB and low frequency PCB;Connecting plate pad, for connecting pin pin;With the limiting slot being arranged in supporting carrier, For being limited to the connection pin pin in welding process;The connection pin pin is L-shaped;So as to promote back segment weldering The quality of the efficiency and improvement human weld that connect.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification In become apparent, or understood by implementing the utility model.
Below by drawings and examples, the technical solution of the utility model is described in further detail.
Description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings:
Fig. 1 is that the prior art linear described in the utility model embodiment connects pin pin structural schematic diagrams;
Fig. 2 is the structural schematic diagram of the L-shaped connection pin pin described in the utility model embodiment;
Fig. 3 is the connection pad with pore structure described in the utility model embodiment;
Fig. 4 is the composite unit structure schematic diagram of the limiting slot and carrier described in the utility model embodiment;
Fig. 5 is the combining structure schematic diagram of L the types pin and pad described in the utility model embodiment.
In conjunction with attached drawing, reference numeral is as follows in the utility model embodiment:
1- positive stop strips;2- limiting slots;3- supporting carriers.
Specific implementation mode
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it should be understood that described herein excellent It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
The utility model takes following technical scheme:
1. redesigning the thickness of connection pin(Current product, best thickness are 0.12-0.15mm), thickness to the greatest extent may be used Thinning, the stress after reduction welding of energy.Because after pin thickness is thinning, bending is easy in the processing procedure of supplier, have when locally When stress, material can be bent, and be reduced to damage
2. redesigning the shape of connection pin, l-shaped is designed by linear type(Such as Fig. 2), given birth to when being matched with corresponding pad When production, prevent situations of the pad by stress damage, it is specific such as schematic diagram
3. redesigning the pad for connecting pin on high frequency plate or low frequency plate, by the smooth pad of SMT, it is changed to hole peace The combination of face pad, specific such as schematic diagram 3, the size of the borehole on PAD, hole are determined according to the width and thickness of pin, at present not The technique effect of the ellipse of 0.45*0.9mm, acquirement is:Enhance the weld strength of pin and PAD.
4. during actual verification, L-type pin occurs to make due to the pulling force of tin cream during SMT reflow solderings At the bad phenomenon of left and right offset, Computer Aided Design pin limits carrier, i.e. limiting slot, is carried in support according to the thickness and width of PIN The limiting slot designed on tool prevents pin or so shift phenomenons, specific such as schematic diagram.
Wherein supporting carrier is carrier, and all actions are completed on it;
Positive stop strip, in combination on carrier, above there are many limiting slots;
On positive stop strip, positive stop strip is assembled on carrier limiting slot.
5.L types pin at SMT sections first by machine patch on the pad for being changed to hole and plane pad combinations, by stove Reflow soldering is specific such as schematic diagram 5 on plank.
6. the other end assembles section in FA, it is welded on other one piece of plank using automatic welding machine
Following advantageous effect can at least be reached:
1.L types pin uses Placement, improves the efficiency of production
2. material is thinning, the expense of material is saved
The welding of 3.L types Pin is welded using Reflow Soldering and automatic welding machine, improves the quality of welding
The entire production of 4.L types Pin is entirely machine attachment and welding, saves manpower
The change of the design of 5.L type pin pad reduces the pad crack risks after welding
Finally it should be noted that:The above descriptions are merely preferred embodiments of the present invention, is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it still can be with technical scheme described in the above embodiments is modified, or to which part technical characteristic Carry out equivalent replacement.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (5)

1. the connection structure of low-and high-frequency pcb board, which is characterized in that including:
Pin pin is connected, for connecting frequency PCB and low frequency PCB;
Connecting plate pad, for connecting pin pin;
With the limiting slot being arranged in supporting carrier, for being limited to the connection pin pin in welding process;
The connection pin pin is L-shaped.
2. the connection structure of low-and high-frequency pcb board according to claim 1, which is characterized in that the thickness of the connection pin pin Degree is 0.12mm-0.15mm.
3. the connection structure of low-and high-frequency pcb board according to claim 2, which is characterized in that the connecting plate pad be with Through the pore structure of connection pad.
4. the connection structure of low-and high-frequency pcb board according to claim 3, which is characterized in that the pore structure is 0.45* The ellipse of 0.9mm.
5. the connection structure of low-and high-frequency pcb board according to claim 4, which is characterized in that the width ratio of the limiting slot The wide 0.2mm of width of pin pin is connected, the thickness of limiting slot is thicker 1mm-2mm than the thickness for connecting pin pin.
CN201721574541.0U 2017-11-22 2017-11-22 The connection structure of low-and high-frequency pcb board Expired - Fee Related CN207706503U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721574541.0U CN207706503U (en) 2017-11-22 2017-11-22 The connection structure of low-and high-frequency pcb board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721574541.0U CN207706503U (en) 2017-11-22 2017-11-22 The connection structure of low-and high-frequency pcb board

Publications (1)

Publication Number Publication Date
CN207706503U true CN207706503U (en) 2018-08-07

Family

ID=63023233

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721574541.0U Expired - Fee Related CN207706503U (en) 2017-11-22 2017-11-22 The connection structure of low-and high-frequency pcb board

Country Status (1)

Country Link
CN (1) CN207706503U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180807

Termination date: 20211122