CN207705162U - A kind of novel pressing die head - Google Patents
A kind of novel pressing die head Download PDFInfo
- Publication number
- CN207705162U CN207705162U CN201820085262.6U CN201820085262U CN207705162U CN 207705162 U CN207705162 U CN 207705162U CN 201820085262 U CN201820085262 U CN 201820085262U CN 207705162 U CN207705162 U CN 207705162U
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- die head
- pressing mold
- rectangular pressing
- groove body
- straight line
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Abstract
The utility model discloses a kind of novel pressing die head, including die head ontology and die head inner cavity, the die head inner cavity includes a rectangular pressing mold groove body, and a rectangular pressing mold pilot trench, four straight line diversion trenches and four air discharge ducts are provided in the rectangular pressing mold groove body；Wherein, four straight line diversion trenches are drawn from four angles of the rectangular pressing mold pilot trench and are extended on corresponding four angles of the rectangular pressing mold groove body respectively；Four air discharge ducts are respectively set on four sides of the rectangular pressing mold groove body bottom.The utility model is by four straight line diversion trenches for solder liquid water conservancy diversion is uniform and four air discharge ducts to be used to, in pressure tin forming, air be discharged, prevent that tin forming is pressed bubble occur, press tin effect good.
Description
Technical field
The utility model is related to semiconductor packaging device field more particularly to a kind of novel pressing die heads.
Background technology
In the load process of semiconductor packages, need to be consolidated using scolding tin or glue when chip is fixed on frame
It is fixed, and due to the terminal applies feature of power device, main feature has two aspects, when requirement high load, second is that requiring high
Heat conduction, based on this 2 points of main features, so most of the fixed form that patch uses is that scolding tin is used to be fixed, and
For pressure tin forming quality requirements constantly improves improve patch quality and product application when stability and reliably
Property, pressing die head is to press the key modules of tin forming, and the pressing die head of high-quality can provide the guarantee of high-quality for load and product.
Tin module pressing die head, either foreign well-known producer are pressed used in the load process of semiconductor packages at this stage
Or domestic more strong manufacturer, manufacturing process are all made of high price, the engineering steel of high rigidity and the surface of quenching
Heat treatment mode, because the main function of hardened face heat treatment mode is to improve pressing die head case hardness and wear-resisting property, institute
It is in order to improve the service life of pressing die head, to reduce the cost of semiconductor packages with its main purpose.
1) in application aspect, the pressing die head of the mode of this Surface heat-treatent using quenching is in terms of case hardness
It improves, but is not promoted in not viscous tin performance, cause pressing die head inner cavity to be easy viscous tin and influence to press tin forming effect, therefore, such as
Fruit will improve pressure tin forming effect it is necessary to there is very high not viscous tin ability for the pressing mold head surface being in direct contact with tin；
2) it because pressure tin effect is bad, directly results in patch levelness and tin climbs and standard is highly not achieved, or even occur
Tinbase cavity；
In terms of manufacturing cost, first, material cost is high, but high hardness material cause to increase processing technology complexity and
Difficulty.
Therefore, the prior art is defective, needs to improve.
Utility model content
Technical problem to be solved in the utility model is：It is uniform to provide a kind of solder liquid water conservancy diversion, when pressing tin, Ke Yipai
Go out air, prevents pressure tin forming from bubble, the good novel pressing die head of pressure tin effect occur.
The technical solution of the utility model is as follows：A kind of novel pressing die head, including die head ontology and die head inner cavity, the mould
Head inner cavity includes a rectangular pressing mold groove body, and a rectangular pressing mold pilot trench, four straight line water conservancy diversion are provided in the rectangular pressing mold groove body
Slot and four air discharge ducts；Wherein, four straight line diversion trenches are drawn and are extended to from four angles of the rectangular pressing mold pilot trench respectively
On corresponding four angles of the rectangular pressing mold groove body；Four sides of the rectangular pressing mold groove body bottom are respectively set in four air discharge ducts
Bian Shang.
Applied to above-mentioned technical proposal, in the novel pressing die head, the surface of the die head inner cavity is also coated with CRN platings
Layer.
Applied to each above-mentioned technical proposal, in the novel pressing die head, the die head ontology is additionally provided with an installation
Slot, the mounting groove are set as the arc mounting groove that bottom is circular shape.
Applied to above-mentioned technical proposal, in the novel pressing die head, the side of the arc mounting groove is also respectively set
There are two symmetrical vias.
Using the above scheme, the utility model is used for solder liquid water conservancy diversion is uniform by four straight line diversion trenches, and
Four air discharge ducts are used to, when pressing tin forming, air be discharged, and prevent pressure tin forming from bubble occur, pressure tin effect is good.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cross section structure schematic diagram of the utility model.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
A kind of novel pressing die head is present embodiments provided, as illustrated in fig. 1 and 2, the novel pressing die head includes die head ontology
10 and die head inner cavity 20.
Wherein, a rectangular pressing mold groove body 40 is provided on the die head inner cavity 20, the groove depth of rectangular pressing mold groove body 40 is
0.015cm is provided with 30, four straight line diversion trenches of a rectangular pressing mold pilot trench and four exhausts in the rectangular pressing mold groove body 40
Slot, wherein four straight line diversion trenches include straight line diversion trench 51, straight line diversion trench 52, straight line diversion trench 53 and straight line diversion trench
54, four air discharge ducts include air discharge duct 61, air discharge duct 62, air discharge duct 63 and air discharge duct 64；Wherein, four straight line diversion trench difference
It draws and is extended on corresponding four angles of the rectangular pressing mold groove body from four angles of the rectangular pressing mold pilot trench 30；Four rows
Air drain is respectively set on four sides of rectangular 40 bottom of pressing mold groove body；Four straight line diversion trenches are for leading solder liquid
Stream is uniform, and four air discharge ducts are used for when pressing tin forming, and air is discharged, and prevents pressure tin forming from bubble occur, to influence to press
Tin effect.
Also, the surface of the die head inner cavity 20 is also coated with a CRN coating；In this way, using CRN process of surface treatment, no
It only improves pressing die head case hardness and reaches wear-resisting requirement, it is often more important that CRN coating is very smooth, cannot not there is viscously the property of tin
Can, to improve tin liquor in the mobility of pressing die head intracavitary and ensure to press tin forming effect, and ensure patch quality and to product
Yield rate.
Alternatively, the die head ontology 10 is additionally provided with a mounting groove 101, mounting groove 101 is used to install pressing die head, also,
The mounting groove 101 is set to the arc mounting groove that bottom is circular shape and to be installed as more being bonded in this way, when installation,
Installation is more firm.
Or the side of the arc mounting groove is also respectively provided with two symmetrical vias 102, by the way that via is arranged
102, it can be reinforced and be installed by via 102, and it is possible to pass through the connection installation situation inside via observation.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality
All any modification, equivalent and improvement etc., should be included in the guarantor of the utility model made by within novel spirit and principle
Within the scope of shield.
Claims (4)
1. a kind of novel pressing die head, including die head ontology and die head inner cavity, it is characterised in that：
The die head inner cavity includes a rectangular pressing mold groove body, and a rectangular pressing mold pilot trench, four are provided in the rectangular pressing mold groove body
A straight line diversion trench and four air discharge ducts；
Wherein, four straight line diversion trenches draw from four angles of the rectangular pressing mold pilot trench and extend to the rectangular pressing mold respectively
On corresponding four angles of groove body；
Four air discharge ducts are respectively set on four sides of the rectangular pressing mold groove body bottom.
2. novel pressing die head according to claim 1, it is characterised in that：The surface of the die head inner cavity is also coated with a CRN
Coating.
3. novel pressing die head according to claim 1, it is characterised in that：The die head ontology is additionally provided with a mounting groove,
The mounting groove is set as the arc mounting groove that bottom is circular shape.
4. novel pressing die head according to claim 3, it is characterised in that：The side of the arc mounting groove is also respectively set
There are two symmetrical vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820085262.6U CN207705162U (en) | 2018-01-18 | 2018-01-18 | A kind of novel pressing die head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820085262.6U CN207705162U (en) | 2018-01-18 | 2018-01-18 | A kind of novel pressing die head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705162U true CN207705162U (en) | 2018-08-07 |
Family
ID=63035358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820085262.6U Active CN207705162U (en) | 2018-01-18 | 2018-01-18 | A kind of novel pressing die head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207705162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115101445A (en) * | 2022-06-22 | 2022-09-23 | 深圳市钜沣泰科技有限公司 | Improved die head for semiconductor chip loading machine |
-
2018
- 2018-01-18 CN CN201820085262.6U patent/CN207705162U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115101445A (en) * | 2022-06-22 | 2022-09-23 | 深圳市钜沣泰科技有限公司 | Improved die head for semiconductor chip loading machine |
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