CN207692252U - A kind of abrasion-resistant low thermal resistance chill bar - Google Patents
A kind of abrasion-resistant low thermal resistance chill bar Download PDFInfo
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- CN207692252U CN207692252U CN201721548388.4U CN201721548388U CN207692252U CN 207692252 U CN207692252 U CN 207692252U CN 201721548388 U CN201721548388 U CN 201721548388U CN 207692252 U CN207692252 U CN 207692252U
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- heat
- abrasion
- film
- thermal resistance
- heat conduction
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Abstract
A kind of chill bar of abrasion-resistant low thermal resistance, it include the heat conduction monomer of the glued membrane for being attached to structural member surface and multiple gap arrangements on glued membrane, the heat conduction monomer includes supporting base material and coats the heat conducting film of its outer layer, the supporting base material is foam or heat-conducting elastomer, and the surface layer of the heat conducting film is additionally provided with wear-resistance thin film.Compared with prior art, the beneficial effects of the utility model are:(1) relative to traditional chill bar, there are the utility model more heat conduction monomers, heat conductivility to obtain one times or more of promotion in unit area;(2) outermost layer of the wear-resistance thin film as heat conduction monomer is used, scratch-resistant performance is improved, the structure heat dissipation of device plug scene is particularly suitable for, will not be worn because of plug.
Description
Technical field
The utility model is related to thermal interfacial material, a kind of particularly abrasion-resistant low thermal resistance chill bar.
Background technology
With the raising of electronics miniaturization, highly integrated degree, electronic equipment dissipating heat problem is increasingly severe, therefore
The hot boundary for heat conduction is provided between the chip and radiator structure part of its fever or between structural member and structural member mostly
Plane materiel material.
Usual thermal interfacial material includes:Heat-conducting silicone grease, thermally conductive gel, chill bar and phase-change film, such hot interface material
Material belongs to static heat transfer, mostly uses organosilicon systems, hardness is low, high intolerant to friction or hardness, thermal resistance is big.Patent
CN104320954 just disclose it is such a containing hot melt heat conducting film chill bar, including supporting base material and pass through heat heat conduction
The hot melt adhesive layer of film is adhered to the hot melt heat conducting film of the supporting base material outer layer.The material mainly uses PU or rubber foam conduct
Supporting base material, the graphite in hot melt heat conducting film by wrapping up supporting base material play the role of heat transfer.Due to the PU of supporting layer
Or the rubber foam material capacity of heat transmission is poor, so its overall thermal resistance is higher.
It is above-mentioned existing for the dynamic heat transfer between such as optical module and this structural member for needing repeatedly to plug of light cage
Some thermal interfacial materials are easily impaired.Its transmission rate of optical module is even higher from 10G to 100G, and the heat that high power consumption generates is got over
Come bigger, and optical module and light cage also certainly exist the scene repeatedly plugged, and heat dissipation problem is badly in need of solving.
Therefore, by thermal interfacial material by the structural member that is thermally conducted to of optical module, and support its multiple hot plug without damaging
Get mildewed in warm conditions boundary material, this project proposes new challenge to the exploitation of thermal interfacial material.
Utility model content
The utility model provides a kind of abrasion-resistant low thermal resistance heat conduction lining to make up the above-mentioned shortcoming of the prior art
Pad is particularly suitable for the structure heat dissipation of device plug scene.
To achieve the goals above, the utility model uses the following technical solution.
A kind of chill bar of abrasion-resistant low thermal resistance includes glued membrane for being attached to structural member surface and is set to glued membrane
Multiple gap arrangements heat conduction monomer, the heat conduction monomer include supporting base material and coat its outer layer heat conducting film, it is described
Supporting base material be foam or heat-conducting elastomer, the surface layer of the heat conducting film is additionally provided with wear-resistance thin film.
As a kind of improvement of above-mentioned technical proposal, the gap between heat conduction monomer is less than or equal to the thickness of heat conduction monomer
Degree.
As a kind of improvement of above-mentioned technical proposal, the supporting base material is at square or U-shaped or L-type or strip or puts down
Template or irregular type.
As a kind of improvement of above-mentioned technical proposal, the supporting base material is heat conduction foam.
On the basis of above-mentioned improved, the heat conduction foam is to contain conduction powder aluminium oxide, aluminium nitride or boron nitride
In any one or several resin foamed material.
As a kind of improvement of above-mentioned technical proposal, the heat-conducting elastomer is using aluminium oxide, aluminium nitride, nitridation
Any one or several heat-conducting silicon rubbers or heat conductive silica gel or heat conduction polyolefin for filler in boron, aluminium powder, copper powder.
As a kind of improvement of above-mentioned technical proposal, the heat conducting film is natural graphite flakes, artificial synthesized graphite flake, stone
Black alkene piece, copper foil either any one in aluminium foil or several films being combined.
As a kind of improvement of above-mentioned technical proposal, the heat conducting film is two-sided all to use hot melt adhesive or acrylate glue or silicon
Glue caking agent gum, Nian Jie with wear-resistance thin film on one side, another side is Nian Jie with supporting base material.
As a kind of improvement of above-mentioned technical proposal, the wear-resistance thin film is proof voltage film, metal foil film, anti-EMI filter
Wave absorbing thin film, antistatic film, gauze either any one in cloth or several films being combined
As a kind of improvement of above-mentioned technical proposal, the glued membrane is acrylic acid glued membrane or silicone adhesive film or hot melt adhesive
Film.
Compared with prior art, the beneficial effects of the utility model are:
(1) relative to traditional chill bar, the utility model has more heat conduction monomers, heat conduction in unit area
Performance obtains one times or more of promotion;
(2) outermost layer of the wear-resistance thin film as heat conduction monomer is used, scratch-resistant performance is improved, device is particularly suitable for and inserts
The structure heat dissipation for pulling out scene, will not wear because of plug.
With reference to illustrating that the drawings and specific embodiments are described further the utility model.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the sectional view of the utility model.
Fig. 3 is the structural schematic diagram of the heat conduction monomer of the utility model.
Fig. 4 is the use state reference chart of the utility model.
Specific implementation mode
As shown in Fig. 1 to Fig. 3, a kind of chill bar of abrasion-resistant low thermal resistance, includes for being attached to structural member surface
The heat conduction monomer 2 of glued membrane 1 and multiple gap arrangements on glued membrane 1, the heat conduction monomer 2 include supporting base material 21 and packet
The heat conducting film 22 of its outer layer is covered, the supporting base material 21 is foam or heat-conducting elastomer, and the surface layer of the heat conducting film 22 is also
Equipped with wear-resistance thin film 23.
As shown in Fig. 2, the clearance D between heat conduction monomer 2 is less than or equal to the thickness H of heat conduction monomer 2.
As shown in Figure 1, in preferable embodiment, 21 strip of supporting base material.In other embodiments,
The supporting base material 21 can also be at square or U-shaped or L-type or plate or irregular type.
Preferably, the supporting base material 21 is heat conduction foam.
Optionally, the heat conduction foam is containing any or several in conduction powder aluminium oxide, aluminium nitride or boron nitride
The resin foamed material of kind.In preferable embodiment, the coefficient of foaming of heat conduction foam is more than or equal to 2, and thermal coefficient is more than
Equal to 0.4W/m.K.
Optionally, the heat-conducting elastomer be using aluminium oxide, aluminium nitride, boron nitride, aluminium powder, in copper powder it is any or
Several heat-conducting silicon rubbers or heat conductive silica gel or heat conduction polyolefin for filler.In preferable embodiment, heat-conducting elastomer
Thermal coefficient is more than or equal to 0.4W/m.K.
Optionally, the heat conducting film 22 be natural graphite flakes, artificial synthesized graphite flake, graphene film, copper foil or
Any one in aluminium foil or several films being combined.
Optionally, the heat conducting film 22 is two-sided all uses hot melt adhesive or acrylate glue or silicone adhesive agent gum, on one side
Nian Jie with wear-resistance thin film 23, another side is Nian Jie with supporting base material 21.
Optionally, the wear-resistance thin film 23 is that proof voltage film, metal foil film, anti-EMI filter wave absorbing thin film, antistatic are thin
Film, gauze either any one in cloth or several films being combined.
Optionally, the glued membrane 1 is acrylic acid glued membrane 1 or silicone adhesive film or hot melt adhesive film 1.
As shown in figure 4, illustrating a kind of leading for abrasion-resistant low thermal resistance of the utility model by taking optical mode group 3, light cage 4 as an example
Heating pad is applied to the structure heat dissipation of device plug scene, specific as follows:
A kind of chill bar 5 of abrasion-resistant low thermal resistance of the utility model is affixed on to the surface of optical mode group 3 by glued membrane, i.e.,
The dynamic heat transfer between more than 4 optical mode group 3, light cage structural member plugged can be realized by the chill bar 5.Optical mode group,
After the sub- grafting of light cage, since the chill bar has more heat conduction monomers in unit area, so significantly improving
Heat conductivility;When optical mode group, the plug of light cage, since the chill bar uses outermost layer of the wear-resistance thin film as heat conduction monomer,
So improving the scratch-resistant performance of the chill bar, will not be worn because of plug.
It is a kind of laboratory data of the chill bar of abrasion-resistant low thermal resistance about the utility model below.
【Experiment one】
Experimental subjects:A kind of chill bar of abrasion-resistant low thermal resistance in above-mentioned technical proposal, insulation film thickness 7um,
Heat conducting film (natural graphite flakes) thickness 17um, supporting base material (heat conduction foam) thickness 220um (thermal coefficient 0.4w/m.K).
Experiment condition:Area 25.4*25.4mm, pressure 20PSI, ASTM5470 testing standard.
Experiment content:Test the corresponding heat conductivility of different number heat conduction monomer.
Heat conduction amount of monomer | 1 | 2 | 4 | 8 |
Thermal resistance 1 | 11.49℃.cm2/W | 8.86℃.cm2/W | 5.82℃.cm2/W | 4.84℃.cm2/W |
Thermal resistance 2 | 1.78℃.in2/W | 1.37℃.in2/W | 0.90℃.in2/W | 0.71℃.in2/W |
Thermal coefficient | 0.32W/m.K | 0.41W/m.K | 0.56W/m.K | 0.70W/m.K |
Experiment conclusion:In fixed-area, as heat conduction amount of monomer increases to 8 from 1, the thermal resistance of chill bar reduces
One times or more, thermal coefficient promotes one times.Experiments have shown that a kind of chill bar of abrasion-resistant low thermal resistance of the utility model, is adopted
The mode with more heat conduction monomers is to obtain thermal conductivity more preferably than traditional chill bar in unit area
Energy.
【Experiment two】
Experimental subjects:A kind of chill bar of abrasion-resistant low thermal resistance in above-mentioned technical proposal, insulation film thickness 7um,
Heat conducting film (natural graphite flakes) thickness 17um, supporting base material (heat conduction foam) thickness 220um (thermal coefficient 0.4w/m.K).
Experiment condition:Area 25.4*25.4mm, heat conduction monomer 8, original depth 0.38mm, ASTM5470 testing standard.
Experiment content:Survey the variation of thermal resistance and thermal coefficient under different pressures state.
Pressure | 5PSI | 10PSI | 20PSI | 30PSI | 40PSI |
Thickness | 0.36mm | 0.35mm | 0.32mm | 0.30mm | 0.29mm |
Thermal resistance 1 | 5.53℃.cm2/W | 4.84℃.cm2/W | 4.60℃.cm2/W | 4.43℃.cm2/W | 4.25℃.cm2/W |
Thermal resistance 2 | 0.86℃.in2/W | 0.75℃.in2/W | 0.70℃.in2/W | 0.69℃.in2/W | 0.66℃.in2/W |
Thermal coefficient | 0.64W/m.K | 0.70W/m.K | 0.70W/m.K | 0.70W/m.K | 0.70W/m.K |
Experiment conclusion:The chill bar has compression performance, and pressure can reach 23% to 40PSI decrements;Pressure is more than
Under the conditions of 5PSI, thermal resistance and thermal coefficient are with good stability.Experiments have shown that a kind of abrasion-resistant low-heat of the utility model
The chill bar of resistance has outstanding compression performance, is very suitable for the structure heat dissipation of device plug scene.
【Experiment three】
Experimental subjects:A kind of chill bar of abrasion-resistant low thermal resistance in above-mentioned technical proposal, insulation film thickness 7um,
Heat conducting film (natural graphite flakes) thickness 17um, supporting base material (common foam) thickness 220um (thermal coefficient 0.05w/m.K).
Experiment condition:Area 25.4*25.4mm, heat conduction monomer 8, original depth 0.30mm, ASTM5470 testing standard.
Experiment content:Supporting base material uses the heat conductivility that common foam is showed
Pressure | 5PSI | 10PSI | 20PSI | 30PSI | 40PSI |
Thickness | 0.30mm | 0.29mm | 0.28mm | 0.27mm | 0.27mm |
Thermal resistance 1 | 4.94℃.cm2/W | 4.75℃.cm2/W | 4.60℃.cm2/W | 4.42℃.cm2/W | 4.31℃.cm2/W |
Thermal resistance 2 | 0.77℃.in2/W | 0.74℃.in2/W | 0.71℃.in2/W | 0.68℃.in2/W | 0.66℃.in2/W |
Thermal coefficient | 0.60W/m.K | 0.61W/m.K | 0.61W/m.K | 0.61W/m.K | 0.61W/m.K |
Experiment conclusion:Supporting base material be common foam when, thermal coefficient be less than supporting base material be heat conduction foam when, but still
With good heat conductivility.Experiments have shown that a kind of chill bar of abrasion-resistant low thermal resistance of the utility model, supporting base material are
When common foam, since it in unit area by the way of having more heat conduction monomers, still obtain than traditional
Chill bar more preferably heat conductivility.
For those skilled in the art, it can be obtained according to the revealed structure of the utility model and principle other each
Kind is corresponding to be changed and deforms, and all these change and deform the protection category for belonging to the utility model.
Claims (10)
1. a kind of chill bar of abrasion-resistant low thermal resistance, it is characterised in that:Include for be attached to the glued membrane of structural member surface and
The heat conduction monomer of multiple gap arrangements on glued membrane, the heat conduction monomer include supporting base material and coat its outer layer and lead
Hotting mask, the supporting base material are foam or heat-conducting elastomer, and the surface layer of the heat conducting film is additionally provided with wear-resistance thin film.
2. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:Between heat conduction monomer
Gap is less than or equal to the thickness of heat conduction monomer.
3. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The supporting base material
At square or U-shaped or L-type or strip or plate or irregular type.
4. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The supporting base material
For heat conduction foam.
5. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 3, it is characterised in that:The heat conduction foam
To contain resin foamed material any one or several in conduction powder aluminium oxide, aluminium nitride or boron nitride.
6. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The heat conductive elastomeric
Body be use it is any one or several for the heat-conducting silicon rubber of filler or heat conduction in aluminium oxide, aluminium nitride, boron nitride, aluminium powder, copper powder
Silica gel or heat conduction polyolefin.
7. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The heat conducting film is
Natural graphite flakes, artificial synthesized graphite flake, graphene film, copper foil either any one in aluminium foil or it is several compound and
At film.
8. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The heat conducting film is double
Face all uses hot melt adhesive or acrylate glue or silicone adhesive agent gum, Nian Jie with wear-resistance thin film on one side, another side and supporting base material
Bonding.
9. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The wear-resistance thin film
For in proof voltage film, metal foil film, anti-EMI filter wave absorbing thin film, antistatic film, gauze either cloth any one or it is several
The film being combined.
10. a kind of chill bar of abrasion-resistant low thermal resistance according to claim 1, it is characterised in that:The glued membrane is
Acrylic acid glued membrane or silicone adhesive film or hot melt adhesive film.
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CN201721548388.4U CN207692252U (en) | 2017-11-20 | 2017-11-20 | A kind of abrasion-resistant low thermal resistance chill bar |
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CN201721548388.4U CN207692252U (en) | 2017-11-20 | 2017-11-20 | A kind of abrasion-resistant low thermal resistance chill bar |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109866477A (en) * | 2017-12-04 | 2019-06-11 | 北京中石伟业科技股份有限公司 | Radiator structure in composite heat-conducting boundary material and optical module plug scene |
CN112519337A (en) * | 2020-11-04 | 2021-03-19 | 上海阿莱德实业股份有限公司 | Thermal conductive sheet having ultra-high thermal conductivity in thickness direction |
CN115141497A (en) * | 2022-09-01 | 2022-10-04 | 宜兴市国强炉业有限公司 | High-thermal-conductivity wear-resistant material for circulating fluidized bed boiler and preparation method thereof |
EP3857597A4 (en) * | 2018-09-27 | 2022-10-05 | Henkel AG & Co. KGaA | Abrasion-resistant coatings for thermal interfaces |
-
2017
- 2017-11-20 CN CN201721548388.4U patent/CN207692252U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109866477A (en) * | 2017-12-04 | 2019-06-11 | 北京中石伟业科技股份有限公司 | Radiator structure in composite heat-conducting boundary material and optical module plug scene |
EP3857597A4 (en) * | 2018-09-27 | 2022-10-05 | Henkel AG & Co. KGaA | Abrasion-resistant coatings for thermal interfaces |
CN112519337A (en) * | 2020-11-04 | 2021-03-19 | 上海阿莱德实业股份有限公司 | Thermal conductive sheet having ultra-high thermal conductivity in thickness direction |
CN115141497A (en) * | 2022-09-01 | 2022-10-04 | 宜兴市国强炉业有限公司 | High-thermal-conductivity wear-resistant material for circulating fluidized bed boiler and preparation method thereof |
CN115141497B (en) * | 2022-09-01 | 2022-12-13 | 宜兴市国强炉业有限公司 | High-thermal-conductivity wear-resistant material for circulating fluidized bed boiler and preparation method thereof |
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