CN207692135U - A kind of high intensity pcb board - Google Patents
A kind of high intensity pcb board Download PDFInfo
- Publication number
- CN207692135U CN207692135U CN201721611770.5U CN201721611770U CN207692135U CN 207692135 U CN207692135 U CN 207692135U CN 201721611770 U CN201721611770 U CN 201721611770U CN 207692135 U CN207692135 U CN 207692135U
- Authority
- CN
- China
- Prior art keywords
- laminate
- fiber cloth
- high intensity
- pcb board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model is related to technical field of PCB board, in particular a kind of high intensity pcb board, it include the first laminate, second laminate, third laminate and the 4th laminate, the basal plane of first laminate is provided with conducting wire, first laminate offers the second through-hole, the bottom of first laminate is covered with the first fiber cloth, first fiber cloth is connected with the second laminate, the bottom of second laminate is covered with the second fiber cloth, second fiber cloth is connected with third laminate, the bottom of third laminate is covered with third fiber cloth, third fiber cloth is connected with the 4th laminate, the bottom of 4th laminate is provided with conducting wire pad.The utility model is provided with fiber cloth by the first laminate, the second laminate, third laminate and the 4th each interlayer of laminate, enhances the toughness of product and the fastness of each interlayer connection；The inner wall of first through hole is provided with insulation fixed strip, conducting wire is avoided to be interfered with it, avoids conducting wire short-circuit；It is internally provided with rigidity metal strip by the fixed strip that insulate, enhances the fastness of product.
Description
Technical field
The utility model is related to technical field of PCB board more particularly to a kind of high intensity pcb boards.
Background technology
Printed circuit board { PCB circuit board }, also known as printed circuit board are the suppliers of electronic component electrical connection.It
Development have more than 100 years history；Its design is mainly layout design；Major advantage using circuit board is to subtract significantly
Few mistake connected up and assemble, improves the gentle productive labor rate of Automated water.It can be divided into single sided board, double according to the wiring board number of plies
Panel, four laminates, six laminates and other multilayer circuit boards.Since printed circuit board is not general end product, in name
It is slightly chaotic in the definition of title, such as：The motherboard of PC, referred to as mainboard, and cannot directly be known as circuit board, although main
Have the presence of circuit board in machine plate, but and differ, therefore both when assessing industry it is related cannot but say it is identical.Again for example：
Because there is integrated circuit part to load on circuit boards, thus news media he be referred to as IC plates, but it is substantial he be also not equal to
Printed circuit board.The printed circuit board that we usually say refers to the circuit board of the i.e. no upper component of bare board-.In recent ten years,
China's printed circuit board (Printed Circuit Board, abbreviation PCB) manufacturing is quickly grown, and the gross output value, total output are double
Dibit ranks first in the world.Since electronic product makes rapid progress, price war changes the structure of supply chain, and China has both industry point
Cloth, cost and the market advantage have become the most important printed circuit board production base in the whole world.Printed circuit board develops from single layer
To dual platen, multi-layer board and flex plate, and constantly develop to high-precision, high density and high reliability direction.Constantly reduce body
Product reduces cost, improves performance so that printed circuit board still maintains powerful in the evolution of future electronic product
Vitality.
But traditional PCB intensity is low, insecure, so needing to be improved a kind of circuit board of high intensity.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of high-strength PC B proposed
Plate.
To achieve the goals above, the utility model uses following technical solution：
A kind of high intensity pcb board includes the first laminate, the second laminate, third laminate and the 4th laminate, the first layer
The basal plane of plate is provided with conducting wire, and first laminate offers the second through-hole, and the bottom of first laminate is covered with the first fibre
Wei Bu, first fiber cloth are connected with the second laminate, and the bottom of second laminate is covered with the second fiber cloth, and described second is fine
Wei Bu is connected with third laminate, and the bottom of the third laminate is covered with third fiber cloth, and the third fiber cloth is connected with the 4th
The bottom of laminate, the 4th laminate is provided with conducting wire pad.
Preferably, second laminate, third laminate and the 4th laminate offer through-hole corresponding with the second through-hole.
Preferably, first laminate, the second laminate, third laminate and the 4th laminate built-up circuit plate.
Preferably, the circuit board is with the through-hole corresponding to the first laminate, the second laminate, third laminate and the 4th laminate
First through hole.
Preferably, the inner wall of the first through hole is provided with insulation fixed strip.
Preferably, the insulation fixed strip is internally provided with rigidity metal strip.
Compared with prior art, the utility model has the beneficial effects that：
1, fiber cloth is provided with by the first laminate, the second laminate, third laminate and the 4th each interlayer of laminate, enhances production
The toughness of product and the fastness of each interlayer connection.
2, insulation fixed strip is provided with by the inner wall of through-hole, conducting wire is avoided to be interfered with it, avoid conducting wire short-circuit.
3, rigidity metal strip is internally provided with by the fixed strip that insulate, enhances the fastness of product, high intensity.
In the utility model, it is not directed to part in the device and is the same as those in the prior art or can be used the prior art and be subject to reality
Existing, the utility model can effectively improve the intensity of PCB.
Description of the drawings
Fig. 1 be the utility model proposes a kind of high intensity pcb board whole structural schematic diagram；
In figure：1 first laminate, 2 second laminates, 3 third laminates, 4 the 4th laminates, 5 conducting wires, 6 first fiber cloths, 7 second
Fiber cloth, 8 third fiber cloths, 9 conducting wire pads, 10 first through hole, 11 insulation fixed strips, 12 metal strips, 13 second through-holes,
14 circuit boards.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be understood that term "upper", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.
Fig. 1 is please referred to, a kind of high intensity pcb board includes the first laminate 1, the second laminate 2, third laminate 3 and the 4th
The basal plane of laminate 4, first laminate 1 is provided with conducting wire 5, and first laminate 1 offers through-hole 13, first laminate
1 bottom is covered with the first fiber cloth 6, and first fiber cloth 6 is connected with the second laminate 2, and the bottom of second laminate 2 is covered with
Second fiber cloth 7, second fiber cloth 7 are connected with third laminate 3, and the bottom of the third laminate 3 is covered with third fiber cloth
8, the third fiber cloth 8 is connected with the 4th laminate 4, and the bottom of the 4th laminate 4 is provided with conducting wire pad 9.
Second laminate 2, third laminate 3 and the 4th laminate 4 offer through-hole corresponding with the second through-hole 13.
First laminate 1,4 built-up circuit plate 14 of the second laminate 2, third laminate 3 and the 4th laminate.
The circuit board 14 is with the through-hole corresponding to the first laminate 1, the second laminate 2, third laminate 3 and the 4th laminate 4
First through hole 10.
The inner wall of the first through hole 10 is provided with insulation fixed strip 11.
The insulation fixed strip 11 is internally provided with rigidity metal strip 12.
The working process of the utility model is as follows：Pass through the first laminate 1, the second laminate 2, third layer in practical work process
Plate 3 and 4 each interlayer of the 4th laminate are provided with fiber cloth, enhance the toughness of product and the fastness of each interlayer connection；Pass through
The inner wall of first through hole 10 is provided with insulation fixed strip 11, and conducting wire is avoided to be interfered with it, avoids conducting wire short-circuit；It is solid by insulating
That determines item 11 is internally provided with rigidity metal strip 12, enhances the fastness of product, high intensity.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
- Include the first laminate (1), the second laminate (2), third laminate (3) and the 4th laminate (4) 1. a kind of high intensity pcb board, It is characterized in that, the basal plane of first laminate (1) is provided with conducting wire (5), first laminate (1) offers the second through-hole (13), the bottom of first laminate (1) is covered with the first fiber cloth (6), and first fiber cloth (6) is connected with the second laminate (2), the bottom of second laminate (2) is covered with the second fiber cloth (7), and second fiber cloth (7) is connected with third laminate (3), the bottom of the third laminate (3) is covered with third fiber cloth (8), and the third fiber cloth (8) is connected with the 4th laminate (4), the bottom of the 4th laminate (4) is provided with conducting wire pad (9).
- 2. a kind of high intensity pcb board according to claim 1, which is characterized in that second laminate (2), third laminate (3) and the 4th laminate (4) offers through-hole corresponding with the second through-hole (13).
- 3. a kind of high intensity pcb board according to claim 1, which is characterized in that first laminate (1), the second laminate (2), third laminate (3) and the 4th laminate (4) built-up circuit plate (14).
- 4. a kind of high intensity pcb board according to claim 3, which is characterized in that the circuit board (14) and the first laminate (1), the through-hole corresponding to the second laminate (2), third laminate (3) and the 4th laminate (4) is first through hole (10).
- 5. a kind of high intensity pcb board according to claim 4, which is characterized in that the inner wall of the first through hole (10) is set It is equipped with insulation fixed strip (11).
- 6. a kind of high intensity pcb board according to claim 5, which is characterized in that the inside of the insulation fixed strip (11) It is provided with rigidity metal strip (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611770.5U CN207692135U (en) | 2017-11-28 | 2017-11-28 | A kind of high intensity pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611770.5U CN207692135U (en) | 2017-11-28 | 2017-11-28 | A kind of high intensity pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207692135U true CN207692135U (en) | 2018-08-03 |
Family
ID=62999335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721611770.5U Expired - Fee Related CN207692135U (en) | 2017-11-28 | 2017-11-28 | A kind of high intensity pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207692135U (en) |
-
2017
- 2017-11-28 CN CN201721611770.5U patent/CN207692135U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180803 Termination date: 20201128 |