CN207692132U - A kind of pcb board of ultra-thin multilayer - Google Patents
A kind of pcb board of ultra-thin multilayer Download PDFInfo
- Publication number
- CN207692132U CN207692132U CN201721611602.6U CN201721611602U CN207692132U CN 207692132 U CN207692132 U CN 207692132U CN 201721611602 U CN201721611602 U CN 201721611602U CN 207692132 U CN207692132 U CN 207692132U
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- China
- Prior art keywords
- left plate
- plate
- winding displacement
- ultra
- upper left
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model is related to technical field of PCB board, in particular a kind of pcb board of ultra-thin multilayer, it include upper left plate, the basal plane of upper left plate is provided with the first conducting wire, the bottom of upper left plate is connected with lower-left plate, the basal plane of lower-left plate is provided with the second conducting wire, and the side wall of upper left plate and lower-left plate is connected with insulating layer, and the side wall of insulating layer is connected with upper right plate and bottom right plate far from one end of upper left plate and lower-left plate.The utility model is provided with winding displacement hole by the side wall of insulating layer, and the winding displacement hole is internally provided with winding displacement, and winding displacement is located at the basal plane of lower-left plate and bottom right plate, and pass through winding displacement hole, so that the circuit board number of plies is reduced, but function, purposes, effect are constant, reach ultra-thin effect；It is connected with lower-left plate by the bottom of upper left plate, the bottom of upper right plate is connected to bottom right board group into complete circuit board；The basal plane of bottom right plate is provided with conducting wire, the bottom of bottom right plate is provided with pad, optimizes wiring.
Description
Technical field
The utility model is related to technical field of PCB board more particularly to a kind of PCB plates of ultra-thin multilayer.
Background technology
Printed circuit board { PCB circuit board }, also known as printed circuit board are the suppliers of electronic component electrical connection.It
Development have more than 100 years history；Its design is mainly layout design；Major advantage using circuit board is to subtract significantly
Few mistake connected up and assemble, improves the gentle productive labor rate of Automated water.It can be divided into single sided board, double according to the wiring board number of plies
Panel, four laminates, six laminates and other multilayer circuit boards.Since printed circuit board is not general end product, in name
It is slightly chaotic in the definition of title, such as：The motherboard of PC, referred to as mainboard, and cannot directly be known as circuit board, although main
Have the presence of circuit board in machine plate, but and differ, therefore both when assessing industry it is related cannot but say it is identical.Again for example：
Because there is integrated circuit part to load on circuit boards, thus news media he be referred to as IC plates, but it is substantial he be also not equal to
Printed circuit board.The printed circuit board that we usually say refers to the circuit board of the i.e. no upper component of bare board-.In recent ten years,
China's printed circuit board (Printed Circuit Board, abbreviation PCB) manufacturing is quickly grown, and the gross output value, total output are double
Dibit ranks first in the world.Since electronic product makes rapid progress, price war changes the structure of supply chain, and China has both industry point
Cloth, cost and the market advantage have become the most important printed circuit board production base in the whole world.Printed circuit board develops from single layer
To dual platen, multi-layer board and flex plate, and constantly develop to high-precision, high density and high reliability direction.Constantly reduce body
Product reduces cost, improves performance so that printed circuit board still maintains powerful in the evolution of future electronic product
Vitality.
But traditional PCB plate is all to connect layer by layer, and thickness is thicker, some equipment need ultrathin circuit board, so being directed to this
Kind needs, it would be desirable to improve a kind of ultrathin circuit board.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of ultra-thin multilayer proposed
Pcb board.
To achieve the goals above, the utility model uses following technical solution：
A kind of pcb board of ultra-thin multilayer, includes upper left plate, and the basal plane of the upper left plate is provided with the first conducting wire, described
The bottom of upper left plate is connected with lower-left plate, and the basal plane of the lower-left plate is provided with the second conducting wire, the upper left plate and lower-left plate
Side wall is connected with insulating layer, and the side wall of the insulating layer is connected with upper right plate and bottom right far from one end of upper left plate and lower-left plate
Plate.
Preferably, the bottom of the upper right plate is connected to bottom right plate.
Preferably, the side wall of the insulating layer is provided with winding displacement hole, and the winding displacement hole is internally provided with winding displacement.
Preferably, the winding displacement is located at the basal plane of lower-left plate and bottom right plate, and passes through winding displacement hole.
Preferably, the basal plane of the bottom right plate is provided with privates.
Preferably, the bottom of the bottom right plate is provided with pad.
Compared with prior art, the utility model has the beneficial effects that：
1, winding displacement hole is provided with by the side wall of insulating layer, the winding displacement hole is internally provided with winding displacement, and winding displacement is located at a left side
The basal plane of lower plate and bottom right plate, and pass through winding displacement hole so that the circuit board number of plies is reduced, but function, purposes, effect are constant, reach
Ultra-thin effect.
2, lower-left plate is connected with by the bottom of upper left plate, the bottom of upper right plate is connected to bottom right board group into complete circuit
Plate.
3, privates is provided with by the basal plane of bottom right plate, the bottom of bottom right plate is provided with pad, optimizes wiring.
In the utility model, it is not directed to part in the device and is the same as those in the prior art or can be used the prior art and be subject to reality
Existing, the utility model can be effectively so that circuit board be thinning, and other performances are constant.
Description of the drawings
Fig. 1 be the utility model proposes a kind of ultra-thin multilayer pcb board whole structural schematic diagram；
Fig. 2 be the utility model proposes a kind of ultra-thin multilayer pcb board part structural schematic diagram；
In figure：1 upper left plate, 2 first conducting wires, 3 lower-left plates, 4 second conducting wires, 5 insulating layers, 6 upper right plates, 7 bottom right plates, 8 rows
String holes, 9 winding displacements, 10 privates, 11 pads.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be understood that term "upper", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.
Fig. 1-2 is please referred to, a kind of pcb board of ultra-thin multilayer, includes upper left plate 1, and the basal plane of the upper left plate 1 is provided with
The bottom of first conducting wire 2, the upper left plate 1 is connected with lower-left plate 3, and the basal plane of the lower-left plate 3 is provided with the second conducting wire 4, institute
The side wall for stating upper left plate 1 and lower-left plate 3 is connected with insulating layer 5, and the side wall of the insulating layer 5 is far from upper left plate 1 and lower-left plate 3
One end is connected with upper right plate 6 and bottom right plate 7.
The bottom of the upper right plate 6 is connected to bottom right plate 7.
The side wall of the insulating layer 5 is provided with winding displacement hole 8, and the winding displacement hole 8 is internally provided with winding displacement 9.
The winding displacement 9 is located at the basal plane of lower-left plate 3 and bottom right plate 7, and passes through winding displacement hole 8 so that and the circuit board number of plies is reduced,
But function, purposes, effect are constant, reach super rich effect.
The basal plane of the bottom right plate 7 is provided with privates 10.
The bottom of the bottom right plate 7 is provided with pad 11.
The working process of the utility model is as follows：Winding displacement hole is provided with by the side wall of insulating layer 5 in practical work process
8, the winding displacement hole 8 is internally provided with winding displacement 9, and winding displacement 9 is located at the basal plane of lower-left plate 3 and bottom right plate 7, and by winding displacement hole 8,
So that the circuit board number of plies is reduced, but function, purposes, effect are constant, reach ultra-thin effect；It is connected with by the bottom of upper left plate 1
Lower-left plate 3, the bottom of upper right plate 6 are connected to bottom right plate 7 and form complete circuit board；The basal plane of bottom right plate 7 is provided with
The bottom of three wires 10, bottom right plate 7 is provided with pad 11, optimizes wiring.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of pcb board of ultra-thin multilayer includes upper left plate (1), which is characterized in that the basal plane of the upper left plate (1) is arranged
There are the first conducting wire (2), the bottom of the upper left plate (1) to be connected with lower-left plate (3), the basal plane of the lower-left plate (3) is provided with
The side wall of two conducting wires (4), the upper left plate (1) and lower-left plate (3) is connected with insulating layer (5), and the side wall of the insulating layer (5) is remote
One end from upper left plate (1) and lower-left plate (3) is connected with upper right plate (6) and bottom right plate (7).
2. a kind of pcb board of ultra-thin multilayer according to claim 1, which is characterized in that the bottom of the upper right plate (6) connects
It is connected to bottom right plate (7).
3. a kind of pcb board of ultra-thin multilayer according to claim 1, which is characterized in that the side wall of the insulating layer (5) is set
It is equipped with winding displacement hole (8), the winding displacement hole (8) is internally provided with winding displacement (9).
4. a kind of pcb board of ultra-thin multilayer according to claim 3, which is characterized in that the winding displacement (9) is located at lower-left plate
(3) and the basal plane of bottom right plate (7), and pass through winding displacement hole (8).
5. a kind of pcb board of ultra-thin multilayer according to claim 1, which is characterized in that the basal plane of the bottom right plate (7) is set
It is equipped with privates (10).
6. a kind of pcb board of ultra-thin multilayer according to claim 1, which is characterized in that the bottom of the bottom right plate (7) is set
It is equipped with pad (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611602.6U CN207692132U (en) | 2017-11-28 | 2017-11-28 | A kind of pcb board of ultra-thin multilayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611602.6U CN207692132U (en) | 2017-11-28 | 2017-11-28 | A kind of pcb board of ultra-thin multilayer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207692132U true CN207692132U (en) | 2018-08-03 |
Family
ID=62999316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721611602.6U Expired - Fee Related CN207692132U (en) | 2017-11-28 | 2017-11-28 | A kind of pcb board of ultra-thin multilayer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207692132U (en) |
-
2017
- 2017-11-28 CN CN201721611602.6U patent/CN207692132U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180803 Termination date: 20201128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |