CN207692079U - A kind of device heating stone material by inside using semiconductor chip - Google Patents
A kind of device heating stone material by inside using semiconductor chip Download PDFInfo
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- CN207692079U CN207692079U CN201820011483.9U CN201820011483U CN207692079U CN 207692079 U CN207692079 U CN 207692079U CN 201820011483 U CN201820011483 U CN 201820011483U CN 207692079 U CN207692079 U CN 207692079U
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- stone material
- semiconductor chip
- faces
- oblate
- radiating rib
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Abstract
The utility model provides a kind of device using semiconductor chip by internal heating stone material.It includes the faces stone material A, sunflower radiating rib, semiconductor chip, heat-collecting energy-storage unit, installation bolt, the faces stone material B；The faces the stone material A, the faces stone material B are oblate cylinder, and one end of the oblate cylinder forms oblate cylindricality and sets space；The semiconductor chip has high temperature face, low temperature face, two electrodes；The sunflower radiating rib forms radially distributed multiple cooling fins, oblate cylindricality of the sunflower radiating rib embedded at the faces stone material A sets space, the high temperature face fitting sunflower radiating rib setting of the semiconductor chip, the sunflower radiating rib are used for semiconductor chip high temperature face rapid cooling to the faces stone material A.The heating device uses semiconductor chip as heating source, and using asymmetric radiator structure, can realize stone material Heated asymmetrically, and heating is fast, low energy consumption, easy to use.
Description
Technical field
It is especially a kind of to be tied using semiconductor chip and asymmetric heat dissipation the utility model is related to stone material technical field of heating
Structure can realize stone material Heated asymmetrically and the fast device by internal heating stone material that low energy consumption of heating.
Background technology
Semiconductor chip is mainly used for computer and digitlization integrated circuit, including artificial intelligence uses, because of semiconductor
Chip will produce a large amount of heat during the work time, these heat are as being a kind of damage to chip, institute for semiconductor chip
To there is the heat dissipation technology to chip, with the constantly improve of heat dissipation technology, can by a kind of form the torrid zone walk just at
One technical indicator.However, chip fever is kind damage in computer realm and artificial intelligence field, but if we
The heat of chip is suitably utilized as heat source, this damage is just become useful technology.On the basis of this idea, we
Rationally heat dissipation experiment is carried out to semiconductor chip, it is a kind of new energy breakthrough that discovery, which uses semiconductor chip as heat source, still
It needs to find adducible field, we have found in a large amount of comparison procedure, in health care, food heating, oil temperature heating, office
The fields such as portion space heating can use semiconductor chip heating technique.
Currently, healthcare industry needs to heat stone material, stone material mode of heating mainly has heater box whole to stone material from outer
Portion heating, boiling it is externally heated to stone material, it is externally heated to stone material by steam, stone material is added from outside by micro-wave oven
Heat is wound externally heated to stone material by resistance wire, and the shortcomings that such mode of heating is：
1, because using external heating, the temperature of heater needs to be higher than 3-5 times of stone material heating temperature, and heating time is long,
Energy consumption is big, and environmentally safe to carry hidden danger, stone material sustained release thermal time is short, and temperature drop speed is fast, again heating time length etc.
Disadvantage；
2, in use, it because the temperature of babinet heating monoblock stone material is the same temperature, is not easy to use hand in this way
It manipulating, is exactly that temperature is excessively high not easy to use and operation so bring another problem, temperature is too low to be easy to use and operation,
Requirement is not achieved in temperature again；
3, the safety and the requirement after heating for considering heating equipment generally heat range in 40- to stone material product
70 degree or so, during practical application, the real purpose of health therapy cannot be reached；
Although the 4, effect that some electronic equipments can reach a high temperature, because skin use cannot be in direct contact, only
It is that can not reach the products such as satisfactory effect, such as wax therapy, refreshing lamp by the methods of irradiating at a distance.
Utility model content
The purpose of this utility model is that external whole mode of heating, heater are mainly used for existing stone material heating device
Temperature is high, and heating time is long, it is big to consume energy, and cannot realize that Heated asymmetrically or mode of heating can reach heating requirements to stone material, but
Defect inconvenient to use provides a kind of device using semiconductor chip by internal heating stone material, and the heating device is using half
Conductor chip can realize stone material Heated asymmetrically as heating source, and using asymmetric radiator structure, and heating is fast, low energy consumption,
It is easy to use.
In order to solve above-mentioned prior art problem, the technical solution of the utility model is:
A kind of device heating stone material by inside using semiconductor chip of the utility model, it includes the faces stone material A, heronsbill
Cooling fin, semiconductor chip, heat-collecting energy-storage unit, installation bolt, the faces stone material B；
The faces the stone material A, the faces stone material B are oblate cylinder, and one end of the oblate cylinder forms oblate cylindricality and sets sky
Between；
The semiconductor chip has high temperature face, low temperature face, two electrodes；
The sunflower radiating rib forms radially distributed multiple cooling fins, and the sunflower radiating rib is embedded at
The oblate cylindricality in the faces stone material A sets space, the high temperature face fitting sunflower radiating rib setting of the semiconductor chip；
The principle of the semiconductor chip asymmetric fever after being powered using semiconductor, after energization fever formed high temperature face,
Low temperature face；
The heat-collecting energy-storage unit is the oblate cylinder of aluminum, and the oblate cylinder of aluminum is embedded at the oblate column in the faces stone material B
Shape sets space, and the oblate cylinder of the aluminum and sunflower radiating rib form multiple fixing threaded holes of identical quantity, the aluminium
It makes oblate cylinder mutually to fix by multiple installation bolts with sunflower radiating rib, the semiconductor chip is located in the oblate column of aluminum
Between body and sunflower radiating rib, the low temperature face paste of the semiconductor chip closes the oblate cylinder of aluminum.
The semiconductor chip is using direct current or exchange mode of heating；
The faces the stone material A and the faces stone material B, which use, is not easy crushing and the stone needle without harmful radiation, jade, marble.
The utility model utilizes the basic principle of semiconductor chip fever, using semiconductor chip as pyrotoxin, utilizes
To the method for the not reciprocity heat dissipation of semiconductor chip, and the fuel factor generated is used to being heated to stone material, to reach
It is single to the effect of reasonable employment semiconductor chip thermal energy, then by the way that thermal energy is radiated by sunflower radiating rib and heat-collection and heat-accumulation
Member forms good radiator, temperature to entirely synthesizing the packaging using stone material as external using face and to high fever heat-sink unit
It can be persistently warmed to 120-150 degree or more, the faces stone material B can hold use, and the faces stone material A are used for health therapy, when therein
When temperature reduces on one side, in addition the high one side of temperature can be longer to reach the heat accumulation time to the low face transition temperature of temperature
As a result.
A kind of device being heated stone material by inside using semiconductor chip of the utility model, advantage are had：
1, using the semiconductor chip to asymmetry fever as heat source, generated thermal energy heats stone material by inside, and
Using asymmetric radiator structure, stone material Heated asymmetrically can be realized, stone material temperature when temperature height is low, this side of temperature height
It can be adapted for body surface, low this of temperature can be suitble to the operation of operating personnel, while stone material accumulation of heat and usage time on one side
For a long time, cooling rate is slow, low energy consumption；
2, safe to use, it is wrapped up by stone material outside equipment, insulation effect is good, not will produce leaky, is suitble to any tide
Wet environment uses, and long-term to charge, when temperature reaches 150 degree or when chip both sides two sides temperature is equal, chip will not add again
Heat, to ensure will not because of to the long-term heating of this equipment cause equipment naturally with self-destruction and cause the generation of fire；
3, the device uses general 12V-5A direct currents chip as pyrotoxin, and primary charging can reach use in 5-10 minutes
Temperature, faster, the charging time is shorter for recharging temperature rise, good energy-conserving effect.
Description of the drawings
Fig. 1 is a kind of dismounting figure using semiconductor chip by the internal device for heating stone material of the utility model；
Fig. 2 is the vertical view of the sunflower radiating rib of embodiment illustrated in fig. 1.
Specific implementation mode
With reference to embodiment, the utility model is described in further detail：
Embodiment
A kind of device heating stone material by inside using semiconductor chip of the utility model, it includes the faces stone material A 1, the sun
Flower cooling fin 2, semiconductor chip 3, heat-collecting energy-storage unit 4, installation bolt 5, the faces stone material B 6；
The faces the stone material A 1, the faces stone material B 6 are oblate cylinder, and one end of the oblate cylinder forms oblate cylindricality and sets
Space；
The semiconductor chip 3 has high temperature face, low temperature face, electrode 31；
The sunflower radiating rib 2 forms radially distributed multiple cooling fins 21, and the sunflower radiating rib is embedding
The oblate cylindricality for being placed in the faces stone material A 1 sets space, and the high temperature face fitting sunflower radiating rib 2 of the semiconductor chip 3 is arranged,
The sunflower radiating rib is used for semiconductor chip high temperature face rapid cooling to the faces stone material A 1；
The principle of the asymmetric fever after being powered using semiconductor of the semiconductor chip 3, after energization fever formed high temperature face,
Low temperature face, the thermal energy of the high temperature face of the semiconductor chip, to the faces stone material A, make stone material A by sunflower radiating rib rapid cooling
The quick accumulation of heat in face, heat accumulation reach the temperature that can be worked；
The heat-collecting energy-storage unit 4 is the oblate cylinder of aluminum, and the oblate cylinder of aluminum is oblate embedded at the faces stone material B 6
Cylindricality sets space, and the oblate cylinder of the aluminum and sunflower radiating rib form four fixing threaded holes 41 of identical quantity, institute
It states the oblate cylinder of aluminum mutually to fix by multiple installation bolts 5 with sunflower radiating rib, the semiconductor chip is located in aluminum
Between oblate cylinder and sunflower radiating rib, the low temperature face paste of the semiconductor chip closes the oblate cylinder of aluminum, and the aluminum is oblate
Cylinder for cooling down, accumulation of energy, heat collection, energy storage, the thermal energy come out to semiconductor chip low temperature face receives rapidly, while half-and-half
Conductor chip low temperature face cools down, and thermal-arrest is stored in after the thermal energy in semiconductor chip low temperature face is collected to heat-collecting energy-storage unit
Storage Unit, then conducted to the faces stone material B by heat-collecting energy-storage unit, to be formed using semiconductor chip as the temperature of the both sides of core
Degree is poor；
The installation bolt 5 is additionally operable to heat-collecting energy-storage unit and radiates to the faces stone material A 1, supplements the approach that heat is transmitted, Ke Yiti
The faces high stone material A are radiated and the time of accumulation of heat；
The faces the stone material B 6 are used as working face, because accumulation of energy energy storage time is long, heating is slow, as the compensatory of the faces stone material A with
Working face is supplemented, the temperature difference with the faces stone material A can hold use between 20-34 degree.
The semiconductor chip uses DC heating mode；
The faces the stone material A and the faces stone material B, which use, is not easy crushing and the stone needle without harmful radiation.
The utility model utilizes the basic principle of semiconductor chip fever, using semiconductor chip as pyrotoxin, utilizes
To the method for the not reciprocity heat dissipation of semiconductor chip, and the fuel factor generated is used to being heated to stone material, to reach
It is single to the effect of reasonable employment semiconductor chip thermal energy, then by the way that thermal energy is radiated by sunflower radiating rib and heat-collection and heat-accumulation
Member forms good radiator, temperature to entirely synthesizing the packaging using stone material as external using face and to high fever heat-sink unit
It can be persistently warmed to 120-150 degree or more, the faces stone material B can hold use, and the faces stone material A are used for health therapy, when therein
When temperature reduces on one side, in addition the high one side of temperature can be longer to reach the heat accumulation time to the low face transition temperature of temperature
As a result.
The utility model is described in detail above, it is described above, only the preferred embodiment of the utility model and
, when the utility model practical range cannot be limited, i.e., all according to the made equivalent changes and modifications of the application range, it all should still belong to this
In utility model covering scope.
Claims (5)
1. a kind of device heating stone material by inside using semiconductor chip, which is characterized in that it includes the faces stone material A, heronsbill
Cooling fin, semiconductor chip, heat-collecting energy-storage unit, installation bolt, the faces stone material B；
The faces the stone material A, the faces stone material B are oblate cylinder, and one end of the oblate cylinder forms oblate cylindricality and sets space；
The semiconductor chip has high temperature face, low temperature face, two electrodes.
2. a kind of device heating stone material by inside using semiconductor chip according to claim 1, which is characterized in that institute
It states sunflower radiating rib and forms radially distributed multiple cooling fins, the sunflower radiating rib is embedded at the faces stone material A
Oblate cylindricality sets space, the high temperature face fitting sunflower radiating rib setting of the semiconductor chip.
3. a kind of device heating stone material by inside using semiconductor chip according to claim 1, which is characterized in that institute
It is the oblate cylinder of aluminum to state heat-collecting energy-storage unit, and oblate cylindricality of the oblate cylinder of aluminum embedded at the faces stone material B sets space,
The oblate cylinder of the aluminum and sunflower radiating rib form multiple fixing threaded holes of identical quantity, the oblate cylinder of aluminum and
Sunflower radiating rib is mutually fixed by multiple installation bolts, and the semiconductor chip is located in the oblate cylinder of aluminum and heronsbill dissipates
Between backing, the low temperature face paste of the semiconductor chip closes the oblate cylinder of aluminum.
4. a kind of device heating stone material by inside using semiconductor chip according to claim 1, which is characterized in that institute
Semiconductor chip is stated using direct current or exchange mode of heating.
5. a kind of device heating stone material by inside using semiconductor chip according to claim 1, which is characterized in that institute
The faces stone material A and the faces stone material B is stated to use and be not easy crushing and the stone needle without harmful radiation, jade, marble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820011483.9U CN207692079U (en) | 2018-01-04 | 2018-01-04 | A kind of device heating stone material by inside using semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820011483.9U CN207692079U (en) | 2018-01-04 | 2018-01-04 | A kind of device heating stone material by inside using semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207692079U true CN207692079U (en) | 2018-08-03 |
Family
ID=62990877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820011483.9U Active CN207692079U (en) | 2018-01-04 | 2018-01-04 | A kind of device heating stone material by inside using semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108024392A (en) * | 2018-01-04 | 2018-05-11 | 承德福仁堂保健咨询服务有限公司 | A kind of device using semiconductor chip by internal heating stone material |
-
2018
- 2018-01-04 CN CN201820011483.9U patent/CN207692079U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108024392A (en) * | 2018-01-04 | 2018-05-11 | 承德福仁堂保健咨询服务有限公司 | A kind of device using semiconductor chip by internal heating stone material |
| CN108024392B (en) * | 2018-01-04 | 2024-01-12 | 承德福仁堂保健咨询服务有限公司 | Device for heating stone material from inside by adopting semiconductor chip |
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