CN207650751U - A kind of processor heat sink - Google Patents
A kind of processor heat sink Download PDFInfo
- Publication number
- CN207650751U CN207650751U CN201721868418.XU CN201721868418U CN207650751U CN 207650751 U CN207650751 U CN 207650751U CN 201721868418 U CN201721868418 U CN 201721868418U CN 207650751 U CN207650751 U CN 207650751U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- conducting block
- branch
- cluster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of processor heat sink, including solid heat-conducting block, several heat dissipation clusters, several described heat dissipation clusters are laid around heat-conducting block annular, the inner end of heat dissipation cluster is connect with heat-conducting block, the outer end of heat dissipation cluster is equipped with several heat dissipation branch, adjacent heat dissipation branch angle mutually at an acute angle so that all heat dissipation branch are radial to be stretched out outward, connecting plate is at least formed there are two heat dissipation branch and after closing, the outer end of connecting plate is equipped with connection ring.Since heat-conducting block is solid, so heat conduction is very rapid, and the branch that radiates can be as soon as possible by the heat derives of heat-conducting block, and the radiator of mainboard, the utility model can be easily securely attached together with screw by the setting of connection ring, avoid the problem that the buckle of the prior art can be flicked, is broken.The utility model is used for the heat dissipation of processor.
Description
Technical field
The utility model is related to electronic equipment dissipating heat field, more particularly to a kind of processor heat sink.
Background technology
It is constantly promoted with the operation dominant frequency of desktop computer processor, the speed of service and operand of processor are also continuous
Increase, thus the operating temperature of processor can be caused also to increase, in order to ensure the normal work of computer processor, it is necessary to match
Set the more good radiator of heat dissipation effect.
Utility model content
The technical problems to be solved in the utility model is：A kind of reliable processor heat sink of connection is provided.
The solution that the utility model solves its technical problem is：
A kind of processor heat sink, including solid heat-conducting block, several heat dissipation clusters, several described heat dissipation clusters, which surround, leads
Heat block annular is laid, and the inner end for the cluster that radiates is connect with heat-conducting block, and the outer end for the cluster that radiates is equipped with several heat dissipation branch, and adjacent dissipates
Hot branch angle mutually at an acute angle so that all heat dissipation branch are radial to be stretched out outward, and at least there are two the branches that radiates
Connecting plate is formed after fork and conjunction, the outer end of connecting plate is equipped with connection ring.
As being further improved for said program, the lower surface of heat-conducting block equipped with several suppressed by graphite powder made of lead
Hot ring.
As being further improved for said program, heat-conducting block, all heat dissipation branch are integrally formed.
As being further improved for said program, heat-conducting block, heat dissipation cluster are individual member, and heat dissipation cluster is embedded in heat-conducting block
On.
The utility model has the beneficial effects that：A kind of processor heat sink, including solid heat-conducting block, several heat dissipations
Cluster, several described heat dissipation clusters are laid around heat-conducting block annular, and the inner end for the cluster that radiates is connect with heat-conducting block, and the outer end for the cluster that radiates is set
There are several branch that radiate, adjacent heat dissipation branch angle mutually at an acute angle so that all heat dissipation branch are radial
It stretches out outward, at least forms connecting plate there are two heat dissipation branch and after closing, the outer end of connecting plate is equipped with connection ring.Due to heat-conducting block
It is solid, so heat conduction is very rapid, and the branch that radiates can be as soon as possible by the heat derives of heat-conducting block, and connection ring is set
Setting easily to be securely attached together the radiator of mainboard, the utility model with screw, avoid the prior art
The problem of buckle can be flicked, is broken.The utility model is used for the heat dissipation of processor.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete
Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it
His design scheme and attached drawing.
Fig. 1 is the structural schematic diagram of the utility model embodiment.
Specific implementation mode
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations being previously mentioned in text, not singly refer to component and directly connect, and referring to can be according to specific reality
Situation is applied, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each technology in the utility model is special
Sign, can be with combination of interactions under the premise of not conflicting conflict.
Referring to Fig.1, this is the embodiments of the present invention, specifically：
A kind of processor heat sink, including solid heat-conducting block 1, several heat dissipation clusters, several described heat dissipation clusters surround
1 annular of heat-conducting block is laid, and the inner end for the cluster that radiates is connect with heat-conducting block 1, and the outer end for the cluster that radiates is equipped with several heat dissipation branch 2, phase
Adjacent heat dissipation branch 2 angle mutually at an acute angle so that all heat dissipation branch 2 are radial to be stretched out outward, and at least two
Connecting plate 21 is formed after a heat dissipation branch 2 and conjunction, the outer end of connecting plate is equipped with connection ring 22.Since heat-conducting block is solid, institute
It is very rapid with heat conduction, and the branch that radiates can be as soon as possible by the heat derives of heat-conducting block, and the setting of connection ring can be very square
Just the radiator of mainboard, the utility model is securely attached together with screw, avoid the buckle of the prior art that from flicking,
The problem of fracture.Since heat-conducting block is solid, so heat conduction is very rapid, and the branch that radiates can be as soon as possible by heat-conducting block
Heat derives, and the radiator of mainboard, the utility model can be easily firmly attached with screw by the setting of connection ring
Together, avoid the problem that the buckle of the prior art can be flicked, is broken.
The lower surface of heat-conducting block 1 equipped with several suppressed by graphite powder made of heat conduction ring 5.Heat conduction ring 5 protrudes heat-conducting block 1
0.05~0.1mm of lower surface height, in this way be convenient for smear thermally conductive grease, silica gel, simultaneously because heat conduction ring 5 be graphite powder pressure
Make, thus heat conduction ring 5 be very susceptible to it is broken, and it is broken after, graphite powder is easy to filling and needs position of radiating
On pit and uneven place, thus the heat conductivility of the utility model can be allowed very good.
The heat-conducting block 1, heat dissipation cluster of the present embodiment are individual member, and heat dissipation cluster is embedded on heat-conducting block 1, is held very much in this way
Easily realize the adaptation of various processors, mainboard.Certainly, for processor of large quantities, heat-conducting block 1, all heat dissipation branch 2 one
It is body formed.
The better embodiment of the utility model is illustrated above, but the utility model be not limited to it is described
Embodiment, those skilled in the art can also make various equivalent changes without departing from the spirit of the present invention
Type or replacement, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (4)
1. a kind of processor heat sink, including solid heat-conducting block (1), several heat dissipation clusters, it is characterised in that：It is described several
The cluster that radiates is laid around heat-conducting block (1) annular, and the inner end for the cluster that radiates is connect with heat-conducting block (1), and the outer end for the cluster that radiates is equipped with several
A heat dissipation branch (2), adjacent heat dissipation branch (2) angle mutually at an acute angle so that all heat dissipation branch (2) are radial
Stretching outward, connecting plate (21) is at least formed there are two heat dissipation branch (2) and after closing, the outer end of connecting plate (21) is equipped with connection
Ring (22).
2. a kind of processor heat sink according to claim 1, it is characterised in that：Heat-conducting block (1) if lower surface be equipped with
Dry suppressed by graphite powder made of heat conduction ring (5).
3. a kind of processor heat sink according to claim 1, it is characterised in that：Heat-conducting block (1), all heat dissipation branch
(2) it is integrally formed.
4. a kind of processor heat sink according to claim 1, it is characterised in that：Heat-conducting block (1), heat dissipation cluster are independence
Component, heat dissipation cluster are embedded on heat-conducting block (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721868418.XU CN207650751U (en) | 2017-12-26 | 2017-12-26 | A kind of processor heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721868418.XU CN207650751U (en) | 2017-12-26 | 2017-12-26 | A kind of processor heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207650751U true CN207650751U (en) | 2018-07-24 |
Family
ID=62875692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721868418.XU Expired - Fee Related CN207650751U (en) | 2017-12-26 | 2017-12-26 | A kind of processor heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207650751U (en) |
-
2017
- 2017-12-26 CN CN201721868418.XU patent/CN207650751U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180724 Termination date: 20211226 |