CN207649005U - A kind of integrated air conditioner - Google Patents
A kind of integrated air conditioner Download PDFInfo
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- CN207649005U CN207649005U CN201721845444.0U CN201721845444U CN207649005U CN 207649005 U CN207649005 U CN 207649005U CN 201721845444 U CN201721845444 U CN 201721845444U CN 207649005 U CN207649005 U CN 207649005U
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- air conditioner
- fan
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- engine structure
- heat engine
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Abstract
The utility model discloses a kind of integrated air conditioners, including shell, semiconductor refrigerating/heat engine structure, bladeless fan mechanism and cooling mechanism are equipped in the shell, the bladeless fan mechanism is located at the indoor end of semiconductor refrigerating/heat engine structure, and the cooling mechanism is located at the outdoor end of semiconductor refrigerating/heat engine structure.The purpose of this utility model is to provide a kind of integrated air conditioner for realizing air-conditioning micromation under the premise of ensureing cooling/heating effect.
Description
Technical field
The utility model is related to air-conditioning equipment field, especially a kind of integrated air conditioner.
Background technology
With the development of economy, air-conditioning comes into common people house.The Main way that present Air-conditioning Enterprise is pursued exists
In the noise control etc. of the energy-saving, air-conditioning of air-conditioning.
Since integrated air conditioner is not the main direction of studying of air-conditioning large enterprises, the integration of air-conditioning in this field
Study the research state also in the proportional diminution of simple specification.
Certainly, we are not also difficult to find in the prior art, and the application of new technology carries out in field of air conditioning
Extensive research.
For example, the application of semiconductor chilling plate, in Chinese patent application CN201310575755.X disclosing one kind adopts
With the air-conditioning of semiconductor chilling plate, main research concentrates on improving semiconductor heat-dissipating effect by the deflector of specific structure
Fruit.
Also for example, in order to reduce noise, beautiful company propose two application for a patent for invention CN201310072154.7 and
201310072154.7, theme is respectively air-conditioner outdoor unit and air conditioner indoor unit and the air-conditioning with the air conditioner indoor unit,
The main direction of studying of this two patent applications is to substitute the indoor unit and outdoor unit of traditional air conditioner using bladeless fan.
It is not difficult to find that the fast development of the science and technology using the field of air conditioning promoted of new technology, but can not deny,
Vast Air-conditioning Enterprise does not suggest that how to realize micromation in the case where significantly reducing its refrigeration, heats power for air-conditioning
Relevant programme.
Utility model content
The purpose of this utility model is to provide a kind of one for realizing air-conditioning under the premise of ensureing cooling/heating effect and being miniaturized
Body formula air-conditioning.
Technical solution provided by the utility model is：A kind of integrated air conditioner, including shell, the shell is interior to be equipped with half
Conductor cooling/heating mechanism, bladeless fan mechanism and cooling mechanism, the bladeless fan mechanism are located at semiconductor refrigerating/heat engine
The indoor end of structure, the cooling mechanism are located at the outdoor end of semiconductor refrigerating/heat engine structure.
In above-mentioned integrated air conditioner, it is additionally provided between the bladeless fan mechanism and semiconductor refrigerating/heat engine structure
Heat-conducting plate.
In above-mentioned integrated air conditioner, the bladeless fan mechanism includes fan head, air-out passage, the wind being sequentially communicated
Fan, air intake passage, indoor end of the fan close to semiconductor refrigerating/heat engine structure.
In above-mentioned integrated air conditioner, the air inlet of the air intake passage is arranged in the upper surface or lower surface of shell
Or lower surface and shell both sides.
In above-mentioned integrated air conditioner, the air-out passage is two air-out passages being arranged side by side, each goes out
A corresponding fan in wind channel.
In above-mentioned integrated air conditioner, the cooling mechanism is Water-cooled heat radiation mechanism or phase control type heat dissipation machine
Structure.
In above-mentioned integrated air conditioner, the Water-cooled heat radiation mechanism includes and the room of semiconductor refrigerating/heat engine structure
The cooling water tank of outer end in contact, the water-circulating pipe being connected on cooling water tank, the radiator coordinated with water-circulating pipe and setting
Radiator fan on the outside of radiator.
In above-mentioned integrated air conditioner, the phase control type cooling mechanism include filled with phase-change liquid phase keyholed back plate,
With the radiating fin of phase keyholed back plate cooperation and radiation air for driving air flowing in the gap of radiating fin is set in radiating fin
Fan, the outdoor end in contact of one end and semiconductor refrigerating/heat engine structure of the phase keyholed back plate.
The utility model after adopting the above technical scheme, its have the advantage that for：
(1) this programme realizes the integrated and miniature of air-conditioning using semiconductor refrigerating/heat engine structure and bladeless fan mechanism
Change, specifically, semiconductor refrigerating/heat engine structure is a kind of outstanding uncompressed refrigerating and heating device, with small, noise
Advantage small, thermal conversion efficiency is high, meanwhile, bladeless fan, can compared to the air outlet mechanism of the indoor unit of traditional air-conditioning
Wind is mixed in limited bulk, the advantage with compact, small, the mixed wind excellent effect of noise, therefore this programme makes full use of two
The advantage of person, is cleverly combined, and the one of air-conditioning is realized under the premise of ensureing that the good application of air-conditioning is experienced
Change, micromation.
(2) heat-conducting plate is arranged in this programme between bladeless fan mechanism and semiconductor refrigerating/heat engine structure, improves semiconductor system
The heat of cold heat piece passes to effect, in the case where improving semiconductor refrigerating/backing heat and passing to the background of effect, semiconductor refrigerating/backing
Efficiency will significantly improve aobvious.
(3) cooling mechanism of this programme, which is preferably Water-cooled heat radiation mechanism or phase control type cooling mechanism, the two, has
Advantage small, heat transfer efficiency is high further increases the micromation of this air-conditioning, realizes the integration of air-conditioning.
When especially with phase control type cooling mechanism, reduction that volume can become apparent.
Description of the drawings
Fig. 1 is the front view of the utility model embodiment 1；
Fig. 2 is the A-A sectional views of the utility model embodiment 1；
Fig. 3 is the three-dimensional view of the utility model embodiment 1；
Fig. 4 is the front view of the utility model embodiment 2；
Fig. 5 is the C-C sectional views of the utility model embodiment 2；
Fig. 6 is the side view of the utility model embodiment 2；
Fig. 7 is the F-F sectional views of the utility model embodiment 2；
Fig. 8 is the three-dimensional view of the utility model embodiment 2；
Fig. 9 is the schematic diagram of the shell of the utility model embodiment 1 and 2.
Specific implementation mode
With reference to embodiment, the technical solution of the utility model is described in further detail, but not structure
Any restrictions of pairs of the utility model.
Embodiment 1：
As shown in Fig. 1-3 and Fig. 9, a kind of integrated air conditioner, including shell 1, the shell 1 is interior to be equipped with semiconductor system
Cold heat mechanism 2, bladeless fan mechanism 3 and cooling mechanism 4, the bladeless fan mechanism 3 are located at semiconductor refrigerating/heat engine structure 2
Indoor end, the cooling mechanism 4 is located at the outdoor end of semiconductor refrigerating/heat engine structure 2.
In practical applications, freeze or heat by semiconductor refrigerating/heat engine structure 2, one end is that p-type is partly led
Body, other end are N-type semiconductor, are heating or refrigeration by changing its current direction to change its indoor end.It is specific next
It says, in the present embodiment, preferably P-type semiconductor is indoor end, and N-type semiconductor is outdoor end, if the side of being replaced certainly
To being also that can implement.Semiconductor refrigerating/heat engine structure 2 periphery package thermal insulation layer 21, generally using heat insulation foam or every
Heat-foamable material.
During use, in the case of summer, indoor end is refrigeration end, and bladeless fan mechanism 3 is by generating flowing
Air-flow makes air-flow transfer heat to the cooling that refrigeration end realizes air, and the heat dissipation that outdoor end is excellent by installing heat dissipation effect
Mechanism 4 realizes that the heat dissipation of outdoor end realizes the integration and micromation of air-conditioning by this method.
In the present embodiment, it is contemplated that the speed that working efficiency and its of semiconductor refrigerating/heat engine structure 2 radiate is close phase
It closes, therefore heat-conducting plate 5 is additionally provided between bladeless fan mechanism 3 and semiconductor refrigerating/the heat engine structure 2.To ensure partly to lead
System cold heat piece is bonded with heat-conducting plate 5 completely, and generally can coat one layer of heat conductive silica gel (liquid metal) in hot and cold side improves heat conduction
Rate.
The bladeless fan mechanism 3 of the present embodiment has no essential distinction with traditional bladeless fan comprising the fan head of connection
31, air-out passage 32, fan 33, air intake passage 34, indoor end of the fan 33 close to semiconductor refrigerating/heat engine structure 2；
In the bladeless fan mechanism 3 of the present embodiment, for the structure matching with integrated air conditioner, improves heat dissipation effect and improve air and mix
Close effect, described in air-out passage 32 be two air-out passages 32 being arranged side by side, correspondence one in each air-out passage 32
The internal diameter of a fan 33, the air-out passage 32 is gradually reduced on from fan 33 to the direction for fanning head 31, the mesh being so arranged
Be, from integrated air conditioner in shape for for the ease of installation generally make cuboid, then use two side by side
The fan 33 and air-out passage 32 of setting, structure is more compact, can transmit the air quantity of bigger.On the other hand, in order to improve
Wind pressure when outlet air exports more natural air-conditioner wind in favor of carrying out uniformly mixing with extraneous air, and air-out passage 32 is wanted
The tapered structure of internal diameter is made, can realize that cold wind comes out simultaneously band with larger wind pressure from fan head 31 in smaller volume in this way
Normal temperature laboratory air mixing in dynamic fan head 31, generates comfortable air-conditioner wind.According to specific specification, the air inlet of the present embodiment is logical
The air inlet in road 34 is preferably provided at the lower surface of shell 1, is either arranged in the upper and lower surface of shell 1 or setting in shell 1
Both sides and lower surface, one is hidden, two come consider fan head 31 be generally located on this integrated air conditioner face indoor one
On side, be conducive to air circulation and cooling in this way.
In the present embodiment, the cooling mechanism 4 is Water-cooled heat radiation mechanism, and specifically, the water-cooled dissipates
Heat engine structure includes and the cooling water tank 41 of the outdoor end in contact of semiconductor refrigerating/heat engine structure 2, the water that is connected on cooling water tank 41
Circulation pipe 42, the radiator 43 coordinated with water-circulating pipe 42 and the first radiator fan 44 being arranged on the outside of radiator 43.It is logical
The iterative cycles of water-circulating pipe 42 are crossed, take away the heat of outdoor end rapidly, improve the efficiency of semiconductor refrigerating/heat engine structure 2.
The integration and micromation of air-conditioning are realized by above-mentioned design, while showing excellent refrigeration and simulation nature
The effect of wind.
Embodiment 2
As shown in figures 4-9, in the present embodiment, it is substantially the same with embodiment 1, different places is, the heat dissipation
Mechanism 4 be phase control type cooling mechanism, the phase control type cooling mechanism include filled with phase-change liquid phase keyholed back plate 45, with it is phased
Radiating fin 46 that pipe 45 coordinates and be arranged in radiating fin 46 for driving air flowing in the gap of radiating fin 46 second
Radiator fan 47, the outdoor end in contact of one end and semiconductor refrigerating/heat engine structure 2 of the phase keyholed back plate 45.
Sharpest edges using phase control type cooling mechanism are that rapid heat dissipation is realized very fast by solid-state phase changes
The heat exchange of speed.
Above-described embodiment is the preferable embodiment of the utility model, but the embodiment of the utility model is not by above-mentioned
The limitation of embodiment, under other any Spirit Essences and principle without departing from the utility model made by change, modify, replace
In generation, simplifies combination, should be equivalent substitute mode, is included within the scope of protection of the utility model.
Claims (8)
1. a kind of integrated air conditioner, including shell, it is characterised in that：Semiconductor refrigerating/heat engine structure, nothing are equipped in the shell
Blade fan mechanism and cooling mechanism, the bladeless fan mechanism are located at the indoor end of semiconductor refrigerating/heat engine structure, and described dissipates
Heat engine structure is located at the outdoor end of semiconductor refrigerating/heat engine structure.
2. integrated air conditioner according to claim 1, it is characterised in that：The bladeless fan mechanism and semiconductor system
It is additionally provided with heat-conducting plate between cold heat mechanism.
3. integrated air conditioner according to claim 1, it is characterised in that：The bladeless fan mechanism includes being sequentially communicated
Fan head, air-out passage, fan, air intake passage, indoor end of the fan close to semiconductor refrigerating/heat engine structure.
4. integrated air conditioner according to claim 3, it is characterised in that：The air inlet of the air intake passage is arranged in shell
The upper surface or lower surface of body or lower surface and shell both sides.
5. integrated air conditioner according to claim 3, it is characterised in that：The air-out passage is two to be arranged side by side
Air-out passage, a corresponding fan in each air-out passage.
6. integrated air conditioner according to claim 1, it is characterised in that：The cooling mechanism is Water-cooled heat radiation mechanism
Or phase control type cooling mechanism.
7. integrated air conditioner according to claim 6, it is characterised in that：The Water-cooled heat radiation mechanism includes and partly leads
The cooling water tank of the outdoor end in contact of system cold heat mechanism, the water-circulating pipe being connected on cooling water tank coordinate with water-circulating pipe
Radiator and the radiator fan that is arranged on the outside of radiator.
8. integrated air conditioner according to claim 6, it is characterised in that：The phase control type cooling mechanism includes being filled with
The phase keyholed back plate of phase-change liquid, with the radiating fin of phase keyholed back plate cooperation and be arranged in radiating fin for driving the gap of radiating fin
The radiator fan of interior air flowing, the outdoor end in contact of one end and semiconductor refrigerating/heat engine structure of the phase keyholed back plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721845444.0U CN207649005U (en) | 2017-12-25 | 2017-12-25 | A kind of integrated air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721845444.0U CN207649005U (en) | 2017-12-25 | 2017-12-25 | A kind of integrated air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207649005U true CN207649005U (en) | 2018-07-24 |
Family
ID=62878862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721845444.0U Active CN207649005U (en) | 2017-12-25 | 2017-12-25 | A kind of integrated air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207649005U (en) |
-
2017
- 2017-12-25 CN CN201721845444.0U patent/CN207649005U/en active Active
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