CN207637953U - A kind of pure electric automobile battery pack temperature control system - Google Patents
A kind of pure electric automobile battery pack temperature control system Download PDFInfo
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- CN207637953U CN207637953U CN201720281255.9U CN201720281255U CN207637953U CN 207637953 U CN207637953 U CN 207637953U CN 201720281255 U CN201720281255 U CN 201720281255U CN 207637953 U CN207637953 U CN 207637953U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a kind of pure electric automobile battery pack temperature control systems, belong to power electronics field, the battery pack temperature control system includes controller and the semiconductor cooler that is separately connected with the controller, semiconductor heating device and battery pack, the semiconductor cooler, semiconductor heating device is arranged at the top of stack seal chamber, the controller is arranged in the inside of stack seal chamber, the utility model is based on semiconductor refrigerating, heating technology, the temperature that semiconductor technology is applied to batteries of electric automobile group controls, improve temperature control efficiency, with noiseless, without mechanical movement, the advantages that service life is long, solves the problems such as refrigerant existing for conventional compression formula temperature control system leaks.
Description
Technical field
The utility model belongs to power electronics field more particularly to a kind of pure electric automobile battery pack temperature control system.
Background technology
Thermoelectric cooling is also in popular the saying of semiconductor refrigerating, and the principle of pyroelectric effect is mainly utilized.When direct current passes through
When the circuit of two different material compositions, the phenomenon that the contact surface of two kinds of materials will produce energy exchange.Pass through direct current
When, the semiconductor being made of p-type semiconductor material and N-type semiconductor material will produce electronics by a kind of material in PN junction
The phenomenon that being migrated to another material, during migration, electrons release extra energy, therefore the contact surface
It will produce heat；Meanwhile during another contact surface electronics enters another material by a kind of material, it can absorb outer
The energy on boundary ensures that it completes this migration, therefore will produce the phenomenon that absorbing heat in the contact surface.
In existing temperature controlled technology, mainly there is a compressor cooling, absorption refrigeration, solar refrigeration, however it is above-mentioned
Several refrigeration modes seem insufficient in special industrial equipment.Semiconductor refrigerating, it is only necessary to pass through direct current
Work, the people that semiconductor internal current is flowed by change small realize.Meanwhile although semiconductor cooler it is more
In terms of being refrigeration, while also there are heat-production functions.Semiconductor when passing through direct current, freeze, another by semiconductor chip one side
Face heats.Semiconductor refrigerating technology has been widely used in agriculture field, medical field, military field at present.
Utility model content
In view of this, the utility model is based on solar battery technology and semiconductor refrigerating technology, by solar energy and semiconductor
Refrigerator is applied to batteries of electric automobile group seal chamber, improves that refrigerating efficiency, to increase refrigeration system service life short, and solves
The problems such as existing refrigerant of conventional compression of having determined formula refrigeration leaks.
The utility model is solved the above problems by following technological means：
A kind of pure electric automobile battery pack temperature control system, which is characterized in that divide including controller and with the controller
Semiconductor cooler, semiconductor heating device and the battery pack not connected, the semiconductor cooler, the setting of semiconductor heating device exist
The top of stack seal chamber, the controller are arranged in the inside of stack seal chamber,
The semiconductor cooler include the first semiconductor refrigeration chip, the refrigeration and heat radiator on the outside of stack seal chamber and
The hot face of the refrigeration fin of stack seal intracavitary side, first semiconductor refrigeration chip connects refrigeration and heat radiator by silica gel
Pedestal, the huyashi-chuuka (cold chinese-style noodles) of first semiconductor refrigeration chip passes through the pedestal of silica gel connection refrigeration fin, the refrigeration and heat radiator
Radiating end be provided with axial-flow type radiator fan, the refrigeration end of the refrigeration fin is provided with axial-flow type refrigerating fan, described the
It is filled with foamed plastics in the cavity that semiconductor refrigerating chip and refrigeration and heat radiator, refrigeration fin are formed, described the first half lead
Body refrigerating chip is fixed on stack seal chamber top by internal screw；
The semiconductor heating device include the second semiconductor refrigeration chip, the heating cooler on the outside of stack seal chamber and
The huyashi-chuuka (cold chinese-style noodles) of the heating fin of stack seal intracavitary side, second semiconductor refrigeration chip connects heating cooler by silica gel
Pedestal, the hot face of second semiconductor refrigeration chip passes through the pedestal of silica gel connection heating fin, the heating cooler
Radiating end be provided with axial-flow type cold scattering fan, the refrigeration end of the heating fin is provided with axial-flow type heating fan, described the
It is filled with foamed plastics in the cavity that two semiconductor refrigeration chips are formed with heating cooler, heating fin, described the second half lead
Body refrigerating chip is fixed on stack seal chamber top by internal screw.
Further, first semiconductor refrigeration chip, the second semiconductor refrigeration chip select TECl-12706 types
Semiconductor chilling plate.
Further, the refrigeration and heat radiator, refrigeration fin, heating cooler and heating fin select fin closeer
Aluminium Radiator.
Further, the radiator fan, refrigerating fan, cold scattering fan and heating fan select PMD121ZPMBI types
Powerful fan.
Further, the controller includes microcontroller and the temperature sensor being connect with the microcontroller, driving electricity
Road and USB turn serial port circuit, and the control signal output of the microcontroller connects semiconductor cooler and half by driving circuit
Conductor heat-producing machine, the temperature sensor are arranged in cell sealing intracavitary portion.
Further, the controller includes XH-W1504TEC type semiconductor chilling plate temperature controllers.
A kind of pure electric automobile battery pack temperature control system of the utility model has the advantages that：
The utility model discloses a kind of pure electric automobile battery pack temperature control systems, belong to power electronics field, should
Battery pack temperature control system include controller and the semiconductor cooler being separately connected with the controller, semiconductor heating device and
Battery pack, the semiconductor cooler, semiconductor heating device are arranged at the top of stack seal chamber, and the controller setting exists
The inside of stack seal chamber, the utility model are based on semiconductor refrigerating, heating technology, semiconductor technology are applied to electronic vapour
The temperature of vehicle battery pack controls, and improves temperature control efficiency, has many advantages, such as noiseless, long without mechanical movement, service life, solution
Existing for conventional compression formula temperature control system the problems such as refrigerant leakage.
Description of the drawings
It, below will be to attached needed in embodiment in order to illustrate more clearly of the technical solution of the utility model
Figure is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the utility model, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of pure electric automobile battery pack temperature control system of the utility model；
Fig. 2 is a kind of refrigerator structural schematic diagram of pure electric automobile battery pack temperature control system of the utility model；
Fig. 3 is a kind of heat-producing machine structural schematic diagram of pure electric automobile battery pack temperature control system of the utility model；
Fig. 4 is a kind of controller architecture schematic diagram of pure electric automobile battery pack temperature control system of the utility model.
Specific implementation mode
In the description of the present invention, it should be understood that term "center", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of describing the present invention and simplifying the description, rather than indicates or imply and is signified
Device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as to this practicality
Novel limitation.Term " first ", " second " are used for description purposes only, be not understood to indicate or imply relative importance or
Person implicitly indicates the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or hidden
Include one or more this feature containing ground.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is
Two or more.
The utility model is described in detail below with reference to attached drawing.
As described in Figure 1, a kind of pure electric automobile battery pack temperature control system, including controller 4 and divide with the controller 4
Semiconductor cooler 2, semiconductor heating device 3 and the battery pack 5 not connected, the semiconductor cooler 2, semiconductor heating device 3
It is arranged at the top of 5 seal chamber 1 of battery pack, the controller 4 is arranged in the inside of 5 seal chamber 1 of battery pack,
As shown in Fig. 2, the semiconductor cooler 2 includes the first semiconductor refrigeration chip 21, outside 5 seal chamber 1 of battery pack
The refrigeration fin 24 of 1 inside of refrigeration and heat radiator 23 and 5 seal chamber of battery pack of side, the heat of first semiconductor refrigeration chip 21
Face connects the pedestal of refrigeration and heat radiator 23 by silica gel 22, and the huyashi-chuuka (cold chinese-style noodles) of first semiconductor refrigeration chip 21 is connected by silica gel 22
The pedestal of refrigeration fin 24 is connect, the radiating end of the refrigeration and heat radiator 23 is provided with axial-flow type radiator fan 26, the refrigeration wing
The refrigeration end of piece 24 is provided with axial-flow type refrigerating fan 25, first semiconductor refrigeration chip 21 and refrigeration and heat radiator 23, system
Foamed plastics 28 is filled in the cavity that cold fin 24 is formed, first semiconductor refrigeration chip 2 passes through internal screw 27
It is fixed on 5 seal chamber of battery pack, 1 top.
As shown in figure 3, the semiconductor heating device 3 includes the second semiconductor refrigeration chip 31, outside 5 seal chamber 1 of battery pack
The heating fin 34 of heating cooler 33 and 5 seal chamber of battery pack 1 inside of side, second semiconductor refrigeration chip 31 it is cold
Face connects the pedestal of heating cooler 33 by silica gel 22, and the hot face of second semiconductor refrigeration chip 31 is connected by silica gel 22
The pedestal of heating fin 34 is connect, the radiating end of the heating cooler 33 is provided with axial-flow type cold scattering fan 36, the heating wing
The refrigeration end of piece 34 is provided with axial-flow type heating fan 35, second semiconductor refrigeration chip 31 and heating cooler 33, system
Foamed plastics 38 is filled in the cavity that hot fin 34 is formed, second semiconductor refrigeration chip 3 passes through internal screw 37
It is fixed on 5 seal chamber of battery pack, 1 top.
Further, first semiconductor refrigeration chip 21, the second semiconductor refrigeration chip 31 select TECl-
12706 type semiconductor chilling plates.
The overall dimensions of TECl-12706 type semiconductor chilling plates, monolithic are 40mm*40mm*40mm, maximum temperature difference electric current
For 6A, maximum temperature difference voltage is 15.4V, maximum cooling capacity 54W, maximum temperature difference>68℃.Cooling piece is by two panels potsherd group
At, among it by N-type and p-type semiconductor material on circuit with cascade connection form.The work electricity of semiconductor chilling plate
Stream is direct current, it can not only freeze again can pyrogenicity, determine to realize on same cooling piece by the polarity of change DC current
Refrigeration or pyrogenicity, the generation of this effect are exactly the principle by pyroelectric effect.Its cooling and warming situation can be by by cooling piece
No. 5 batteries are connected on conducting wire, that is, can determine whether.
Further, the refrigeration and heat radiator 23, refrigeration fin 24, heating cooler 33 and heating fin 34 are selected
The closeer Aluminium Radiator of fin.
The Aluminium Radiator for selecting fin closeer, size 300*300*40mm, bottom is smooth, and it is cold and hot to be placed in cooling piece
End is fixed, and the preferable heat conductive silica gel of heat conductivility 22 is uniformly smeared in contact position.
Further, the radiator fan 26, refrigerating fan 25, cold scattering fan 36 and heating fan 35 are selected
PMD121ZPMBI type powerful fans.
The powerful fan of PMD121ZPMBI-A, voltage 12V, electric current l.6A, power 19.2W, rotating speed 4200/min, wind
Measure 19OCFM, fan dimension 120mm*l20mm*38mm., when environment temperature is 25 DEG C, working life is 100000 hours for it.
As shown in figure 4, the controller 4 includes microcontroller and the temperature sensor being connect with the microcontroller, driving
Circuit and USB turn serial port circuit, and the control signal output of the microcontroller connects 2 He of semiconductor cooler by driving circuit
Semiconductor heating device 3, the temperature sensor are arranged inside cell sealing chamber 1.
It should be noted that controller 4 using microcontroller as processing center, receives the feedback signal of temperature sensor, pass through
FUZZY ALGORITHMS FOR CONTROL processing inside single machine, single-chip I/O mouth exports the pwm signal controlled quentity controlled variable of certain duty ratio, by driver
Effect, it is final to drive semiconductor cooler refrigeration or the heating of semiconductor heating device.Meanwhile in the peripheral circuit of microcontroller, lead to
It crosses 8 Digital sum pipes and shows given value and value of feedback, pass through the temperature target of button setting control system.Each module of hardware circuit
Effect in conductor temperature control system:
(1) temperature display:Numeral method temperature given value, value of feedback；
(2) key control is pressed:The switching of hand automatic control mode, given value setting；
(3) controller:It is realized by microcontroller design program；
(4) actuator:Semiconductor refrigerating, thermal actuator
(5) controlled device；Seal case；
(6) feedback signal:Temperature sensor acquires signal；
(7) serial communication:Turn Serial Port Line using USB between microcontroller and PC machine to communicate.
Further, the controller 4 includes XH-W1504TEC type semiconductor chilling plate temperature controllers.
The utility model discloses a kind of 5 temperature control systems of pure electric automobile battery pack, belong to power electronics field, should
5 temperature control system of battery pack includes controller 4 and the semiconductor cooler being separately connected with the controller 42, semiconductor heating
Device 3 and battery pack 5, the semiconductor cooler 2, semiconductor heating device 3 are arranged at the top of 5 seal chamber 1 of battery pack, described
Controller 4 is arranged in the inside of 5 seal chamber 1 of battery pack, and the utility model is based on semiconductor refrigerating, heating technology, by semiconductor
Technology be applied to batteries of electric automobile group 5 temperature control, improve temperature control efficiency, have it is noiseless, without mechanical movement, use
The advantages that long lifespan, solves the problems such as refrigerant existing for conventional compression formula temperature control system leaks.
Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacement；And these modifications or replacements, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (6)
1. a kind of pure electric automobile battery pack temperature control system, which is characterized in that distinguish including controller and with the controller
Semiconductor cooler, semiconductor heating device and the battery pack of connection, the semiconductor cooler, semiconductor heating device are arranged in electricity
The top of pond group seal chamber, the controller are arranged in the inside of stack seal chamber,
The semiconductor cooler includes the first semiconductor refrigeration chip, refrigeration and heat radiator and battery on the outside of stack seal chamber
Refrigeration fin on the inside of group seal chamber, the hot face of first semiconductor refrigeration chip connect the bottom of refrigeration and heat radiator by silica gel
Seat, the huyashi-chuuka (cold chinese-style noodles) of first semiconductor refrigeration chip connect the pedestal of refrigeration fin by silica gel, and the refrigeration and heat radiator dissipates
Hot junction is provided with axial-flow type radiator fan, and the refrigeration end of the refrigeration fin is provided with axial-flow type refrigerating fan, and described the first half
It is filled with foamed plastics, the first semiconductor system in the cavity that conductor refrigerating chip is formed with refrigeration and heat radiator, refrigeration fin
Cold core piece is fixed on stack seal chamber top by internal screw；
The semiconductor heating device includes the second semiconductor refrigeration chip, heating cooler and battery on the outside of stack seal chamber
Heating fin on the inside of group seal chamber, the huyashi-chuuka (cold chinese-style noodles) of second semiconductor refrigeration chip connect the bottom of heating cooler by silica gel
Seat, the hot face of second semiconductor refrigeration chip connect the pedestal of heating fin by silica gel, and the heating cooler dissipates
Hot junction is provided with axial-flow type cold scattering fan, and the refrigeration end of the heating fin is provided with axial-flow type heating fan, and described the second half
It is filled with foamed plastics, the second semiconductor system in the cavity that conductor refrigerating chip is formed with heating cooler, heating fin
Cold core piece is fixed on stack seal chamber top by internal screw.
2. pure electric automobile battery pack temperature control system according to claim 1, it is characterised in that：The first semiconductor system
Cold core piece, the second semiconductor refrigeration chip select TECl-12706 type semiconductor chilling plates.
3. pure electric automobile battery pack temperature control system according to claim 2, it is characterised in that：The refrigeration and heat radiator,
The Aluminium Radiator that refrigeration fin, heating cooler and heating fin select fin closeer.
4. pure electric automobile battery pack temperature control system according to claim 3, it is characterised in that：The radiator fan, system
Cooling fan, cold scattering fan and heating fan select PMD121ZPMBI type powerful fans.
5. pure electric automobile battery pack temperature control system according to claim 4, it is characterised in that：The controller includes single
The piece machine and temperature sensor being connect with the microcontroller, driving circuit and USB turn serial port circuit, the control of the microcontroller
Signal output end connects semiconductor cooler and semiconductor heating device by driving circuit, and the temperature sensor is arranged in battery
Inside seal chamber.
6. pure electric automobile battery pack temperature control system according to claim 5, it is characterised in that：The controller includes
XH-W1504TEC type semiconductor chilling plate temperature controllers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720281255.9U CN207637953U (en) | 2017-03-22 | 2017-03-22 | A kind of pure electric automobile battery pack temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720281255.9U CN207637953U (en) | 2017-03-22 | 2017-03-22 | A kind of pure electric automobile battery pack temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637953U true CN207637953U (en) | 2018-07-20 |
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ID=62860218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720281255.9U Active CN207637953U (en) | 2017-03-22 | 2017-03-22 | A kind of pure electric automobile battery pack temperature control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637953U (en) |
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2017
- 2017-03-22 CN CN201720281255.9U patent/CN207637953U/en active Active
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