CN207588298U - A kind of power distribution cabinet dehumidification system based on semiconductor chilling plate - Google Patents
A kind of power distribution cabinet dehumidification system based on semiconductor chilling plate Download PDFInfo
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- CN207588298U CN207588298U CN201721613345.XU CN201721613345U CN207588298U CN 207588298 U CN207588298 U CN 207588298U CN 201721613345 U CN201721613345 U CN 201721613345U CN 207588298 U CN207588298 U CN 207588298U
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- Prior art keywords
- chilling plate
- semiconductor chilling
- cold end
- power distribution
- hot junction
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Abstract
The utility model discloses a kind of power distribution cabinet dehumidification systems based on semiconductor chilling plate, and including cabinet, the cabinet is internally provided with semiconductor chilling plate, Temperature Humidity Sensor, heat pipe and fin；The semiconductor chilling plate includes cold end and hot junction, and the cold end is connected with hot junction；The heat pipe is set to the both sides in the cold end and hot junction；The fin is arranged side by side in the both sides of the heat pipe；Dehumidification system further includes the channel of damp and hot exchange in the fan and cabinet that change the cabinet inner air and outer air circulation；The cold end and hot junction are used for the conversion in cold end and hot junction by changing the direct current direction of the semiconductor chilling plate；The utility model is simple in structure, high efficiency, low energy consumption, safe ready, easily controllable；Power distribution cabinet condensation trouble can be fundamentally solved, reaches dehumidifying, energy-efficient purpose.
Description
Technical field
The utility model is related to Heating,Ventilating and Air Conditioning technical field, especially a kind of power distribution cabinet dehumidifying based on semiconductor chilling plate
System.
Background technology
In summer especially in plum rain season, wet weather, high fever, power distribution cabinet internal unit longtime running can generate heat,
Finally so that power distribution cabinet generates moisture condensation；Moisture condensation is very big for the harmfulness of power distribution cabinet, be easy to cause the aging of circuit, reduces circuit
Insulation performance, more safety accident is caused to the problems such as Electrical Safety, information security.In recent years, both at home and abroad to semiconductor
The theory and experimental study of refrigeration are more and more, since semiconductor has simple in structure, small, noiseless, without abrasion, longevity
The advantages that life is long, reliability is high, pollution-free, has been widely used at present the daily life of auto industry, chemical industry, medical treatment and household
It is living etc.；It is vast that it is used for the dehumidification by condensation prospect of the facilities such as power distribution cabinet.
Utility model content
Technical problem to be solved in the utility model is exactly the deficiency in being for the above-mentioned prior art, provides one kind
Simple in structure, high efficiency, low energy consumption, safe ready, the easily controllable power distribution cabinet dehumidification system based on semiconductor chilling plate.
Technical solution is used by the utility model solves its technical problem：A kind of distribution based on semiconductor chilling plate
Cabinet dehumidification system, including cabinet, the cabinet is internally provided with semiconductor chilling plate, Temperature Humidity Sensor, heat pipe and fin；
The semiconductor chilling plate includes cold end and hot junction, and the cold end is connected with hot junction；The heat pipe be set to the cold end and
The both sides in hot junction；The fin is arranged side by side in the both sides of the heat pipe；Dehumidification system, which further includes, changes outer space in the cabinet
The channel of damp and hot exchange in the fan and cabinet that air-flow leads to；The cold end and hot junction are by changing the straight of the semiconductor chilling plate
Galvanic electricity direction is used for the conversion in cold end and hot junction.
Further, the heat-insulated of isolation heat exchange is provided between the cold end of the semiconductor chilling plate and hot junction
Plate.
Further, the fin is internally provided with phase change heat storage material.
Further, the phase change heat storage material is paraffin or aluminium powder.
Further, the external cladding of the fin is provided with hygroscopic material.
Further, the hygroscopic material is silica gel.
Further, the outside of dehumidification system be additionally provided with the control semiconductor chilling plate, Temperature Humidity Sensor and
The control system of fan.
Further, the Temperature Humidity Sensor is SHT1x/SHT7x Temperature Humidity Sensors.
Further, the channel includes the cold wind coordinated with the cold end outlet, the hot wind with hot junction cooperation
Air outlet and the heat exchanger channels with fan cooperation.
Compared with prior art, the beneficial effects of the utility model are：
The utility model is simple in structure, high efficiency, low energy consumption, safe ready, easily controllable；It can fundamentally solve to match
Electric cabinet condensation trouble reaches dehumidifying, energy-efficient purpose.
When this dehumidification system is run, air is pushed by fan in power distribution cabinet, and across cold end, vapor is attached to the silicon of fin
Dehumidification by condensation is carried out above glue；When moisture detection device detects silica gel moisture absorption saturation, using change semiconductor DC side
Always the hot and cold side of semiconductor is controlled, rotation dehumidification system is not needed to, avoids system bulk excessive the problem of being difficult to rotate；Make
Former cold end is converted to hot junction, former hot junction and is converted to cold end, and outdoor air carries out heating moisture absorption across fin.
The thermal insulation board of isolation heat exchange is provided between the cold end of semiconductor chilling plate and hot junction；Partition heat makes cold end
Decline respectively with hot-side temperature, rise.
Fin is internally provided with phase change heat storage material（Paraffin or aluminium powder）, semiconductor chilling plate is made preferably to conduct heat, and
It can sustainedly and stably carry out, it is excessive to ensure that heat transfer will not be fluctuated, extends semiconductor chip and hygroscopic material（Silica gel）Use
Service life.
Finned outer adheres to hygroscopic material（Silica gel）, when carrying out cooling and dehumidifying to air, moisture absorption is flowed through by processing air
Material（Silica gel）, with hygroscopic material（Silica gel）Heat and quality are transmitted, is reduced by processing air themperature, water capacity declines；When right
When the outer air of cabinet is handled, after flowing through fin, air is humidified by heating, the hygroscopic material on fin（Silica gel）It is adsorbed
Moisture is taken to outside cabinet by air, is reached hygroscopic material by heating evaporation（Silica gel）Regenerated purpose.
Description of the drawings
Fig. 1 show the utility model dehumidification system principle schematic；
Fig. 2 show the structure diagram of the utility model heat pipe, radiating fin；
Fig. 3 show the control system attachment structure schematic diagram of the utility model.
In attached drawing：1 it is cabinet, 2 be semiconductor chilling plate, 3 be Temperature Humidity Sensor, 4 be heat pipe, 5 be fin, 6 is cold
End, 7 be hot junction, 8 be fan, 9 be channel, 10 be control system, 11 be thermal insulation board, 12 be cold wind outlet, 13 be hot-blast outlet,
14 be heat exchanger channels.
Specific embodiment
The utility model is described in further detail below in conjunction with specific embodiment.It should be appreciated that described herein
Specific embodiment is only used to explain the utility model, is not used to limit the utility model.
In the description of the present invention, it is to be appreciated that term " " center ", " longitudinal direction ", " transverse direction ", " on ", " under ",
The orientation or position relationship of the instructions such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies description rather than instruction
Or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore be not understood that
For the limitation to the utility model.
As shown in Figure 1, 2, 3, a kind of power distribution cabinet dehumidification system based on semiconductor chilling plate, including cabinet 1, the cabinet
1 is internally provided with semiconductor chilling plate 2, Temperature Humidity Sensor 3, heat pipe 4 and fin 5；The semiconductor chilling plate 2 includes cold
End 6 and hot junction 7, the cold end 6 are connected with hot junction 7；The heat pipe 4 is set to the both sides in the cold end 6 and hot junction 7；It is described
Fin 5 is arranged side by side in the both sides of the heat pipe 4；High efficiency and heat radiation can be reached, and air exit temp will not be too low, improved
The efficiency of solid absorption dehumidifying；Dehumidification system further includes wet in the fan 8 of change 1 inner air and outer air of the cabinet circulation and cabinet 1
The channel 9 of heat exchange；The cold end 6 and hot junction 7 are used for cold end 6 by changing the direct current direction of the semiconductor chilling plate 2
With the conversion in hot junction 7.
The thermal insulation board 11 of isolation heat exchange is provided between the cold end 6 of the semiconductor chilling plate 2 and hot junction 7；Partition
Heat makes cold end 6 and 7 temperature of hot junction decline respectively, rise.
The fin 5 is internally provided with phase change heat storage material；Fin 5 is internally provided with phase change heat storage material（Paraffin or
Aluminium powder）, semiconductor chilling plate 2 is made preferably to conduct heat, and can sustainedly and stably carry out, it is excessive to ensure that heat transfer will not be fluctuated,
Extend semiconductor chip and hygroscopic material（Silica gel）Service life.
The external cladding of the fin 5 is provided with hygroscopic material；5 outside attachment hygroscopic material of fin（Silica gel）, when to sky
When gas carries out cooling and dehumidifying, hygroscopic material is flowed through by processing air（Silica gel）, with hygroscopic material（Silica gel）Heat and quality are transmitted,
It is reduced by processing air themperature, water capacity declines；When air is handled outside to cabinet, after flowing through fin 5, air is heated
It is humidified, the hygroscopic material on fin 5（Silica gel）The moisture adsorbed is taken to outside cabinet by air, is reached moisture absorption by heating evaporation
Material（Silica gel）Regenerated purpose.
The outside of dehumidification system is additionally provided with the control for controlling the semiconductor chilling plate 2, Temperature Humidity Sensor 3 and fan 8
System 10 processed.
The Temperature Humidity Sensor 3 is SHT1x/SHT7x Temperature Humidity Sensors.
The channel 9 includes the cold wind coordinated with the cold end 6 outlet 12, the hot air outlet with the hot junction 7 cooperation
13 and with the fan 8 cooperation heat exchanger channels 14.
The present apparatus is in use, when Temperature Humidity Sensor 3 detects that 1 inside humiture of cabinet reaches systemic presupposition value, temperature
Humidity sensor 3 sends a signal to control system 10, and control system 10 receives the temperature-humidity signal of Temperature Humidity Sensor 3, control
The control fan 8 of system 10 admits air into the cold end 6 of semiconductor chilling plate 2；It is exchanged heat by the fin 5 being connect with heat pipe 4,
Vapor condensation process occurs in heat transfer process, condensed water is attached on the hygroscopic material of fin 5；By the process, heat pipe 4 carries
The high air themperature of 6 gas outlet of cold end improves the effect of refrigeration, and the air for being dehumidified cooling enters in cabinet 1, has reached sky
The purpose of gas dehumidifying, reduces the temperature in cabinet.
Outdoor air is by heat exchanger channels 14, the inside for being forced into cabinet 1 through passing through fan 8；Pass through semiconductor refrigerating
The heat pipe 4 and fin 5 that the hot junction 7 of piece 2 connects, outdoor air,（Air i.e. except cabinet）Heat up moisture absorption；Air passes through fin
5, the hygroscopic material above fin 5 is made to cool down scattered wet, then air is discharged by fan 8 inside cabinet 1；The process air is inhaled
Heat enhances the heat dissipation in the hot junction 7 of semiconductor chilling plate 2, ensures that 7 temperature of hot junction is unlikely to excessively high, improves semiconductor chilling plate 2
The efficiency of refrigeration.
When the temperature and fin of the heat pipe 4 that Temperature Humidity Sensor 3 detects inside cabinet 1, semiconductor chilling plate 2 connects
When the humiture of hygroscopic material on 5 reaches low temperature, high humility, Temperature Humidity Sensor 3 sends a signal to control system 10, control
System 10 receives the temperature-humidity signal of Temperature Humidity Sensor 3, the direct current direction of automatic conversion semiconductor chilling plate 2；Semiconductor
There is the semi-conducting material of N-type and p-type (bismuth telluride) among cooling piece 2；The operation principle of semiconductor chilling plate is:When one piece of N-type
When semi-conducting material and one piece of p-type semiconductor material are connected to galvanic couple pair, after connecting DC current, with regard to turning for energy can be generated
It moves, the connector that electric current is flowed to p-type element by N-type element absorbs heat, becomes the connector that cold end is flowed to N-type element by p-type element
Heat is discharged, becomes hot junction.（Determined on same cooling piece by changing the polarity of DC current so as to change semiconductor
The cold end of cooling piece and the conversion in hot junction, the hot junction of semiconductor chilling plate are changed into cold end；Cold end is changed into hot junction）.At this point, cabinet
Processed air enters the hot junction 7 (becoming cold end 6 at this time) of semiconductor chilling plate 2 in body 1, and the fin 5 connected carries out water
Enter in cabinet after the dehumidifying of steam condensation adsorption；Outdoor air is sucked by fan 8, is connected by semiconductor chilling plate 2
Heat pipe 4, fin 5, high temperature at this time, the hygroscopic material of high water capacity takes away a large amount of moisture by air, and discharges except cabinet 1；
It realizes the recycling of hygroscopic material, reaches energy-efficient purpose, moreover, enhancing the hot junction heat release of semiconductor chilling plate significantly.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanical connection or electrical connection；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection of two components interiors.For the ordinary skill in the art, on being understood by concrete condition
State concrete meaning of the term in the utility model.
The above is only the preferred embodiment of the utility model, it is noted that for the general of the art
For logical technical staff, under the premise of the utility model principle is not departed from, several improvements and modifications can also be made, these change
The scope of protection of the utility model is also should be regarded as into retouching.
Claims (9)
1. a kind of power distribution cabinet dehumidification system based on semiconductor chilling plate, including cabinet（1）, the cabinet（1）Inside setting
There is semiconductor chilling plate（2）, Temperature Humidity Sensor（3）, heat pipe（4）And fin（5）；The semiconductor chilling plate（2）Including cold
End（6）And hot junction（7）, the cold end（6）With hot junction（7）It is connected；The heat pipe（4）It is set to the cold end（6）And hot junction
（7）Both sides；The fin（5）It is arranged side by side in the heat pipe（4）Both sides；Dehumidification system, which further includes, changes the cabinet
（1）The fan of inner air and outer air circulation（8）And cabinet（1）The channel of interior damp and hot exchange（9）；The cold end（6）And hot junction（7）Pass through
Change the semiconductor chilling plate（2）Direct current direction be used for cold end（6）And hot junction（7）Conversion.
2. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：It is described partly to lead
Body cooling piece（2）Cold end（6）With hot junction（7）Between be provided with isolation heat exchange thermal insulation board（11）.
3. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：The fin
（5）Be internally provided with phase change heat storage material.
4. the power distribution cabinet dehumidification system according to claim 3 based on semiconductor chilling plate, it is characterised in that：The phase transformation
Heat-storing material is paraffin or aluminium powder.
5. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：The fin
（5）External cladding be provided with hygroscopic material.
6. the power distribution cabinet dehumidification system according to claim 5 based on semiconductor chilling plate, it is characterised in that：Hygroscopic material
For silica gel.
7. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：Dehumidification system
Outside be additionally provided with the control semiconductor chilling plate（2）, Temperature Humidity Sensor（3）And fan（8）Control system（10）.
8. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：It is described warm and humid
Spend sensor（3）For SHT1x/SHT7x Temperature Humidity Sensors.
9. the power distribution cabinet dehumidification system according to claim 1 based on semiconductor chilling plate, it is characterised in that：The channel
（9）Including with the cold end（6）The cold wind outlet of cooperation（12）And the hot junction（7）The hot air outlet of cooperation（13）With with
The fan（8）The heat exchanger channels of cooperation（14）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721613345.XU CN207588298U (en) | 2017-11-28 | 2017-11-28 | A kind of power distribution cabinet dehumidification system based on semiconductor chilling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721613345.XU CN207588298U (en) | 2017-11-28 | 2017-11-28 | A kind of power distribution cabinet dehumidification system based on semiconductor chilling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207588298U true CN207588298U (en) | 2018-07-06 |
Family
ID=62734154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721613345.XU Expired - Fee Related CN207588298U (en) | 2017-11-28 | 2017-11-28 | A kind of power distribution cabinet dehumidification system based on semiconductor chilling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207588298U (en) |
-
2017
- 2017-11-28 CN CN201721613345.XU patent/CN207588298U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180706 Termination date: 20201128 |
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| CF01 | Termination of patent right due to non-payment of annual fee |