CN207587537U - A kind of single-layer capacitor - Google Patents
A kind of single-layer capacitor Download PDFInfo
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- CN207587537U CN207587537U CN201721837795.7U CN201721837795U CN207587537U CN 207587537 U CN207587537 U CN 207587537U CN 201721837795 U CN201721837795 U CN 201721837795U CN 207587537 U CN207587537 U CN 207587537U
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Abstract
The utility model discloses a kind of single-layer capacitor.The single-layer capacitor includes：Top electrode, first medium layer, interior electrode, second dielectric layer and lower electrode；The top electrode is connect with the interior electrode by the first medium layer, and the interior electrode is connect with the lower electrode by the second dielectric layer；The thickness of the first medium layer is less than the thickness of the second dielectric layer；Wherein, the second dielectric layer is equipped with through-hole, and electrode material is filled in the through-hole, and the electrode material connects the interior electrode and the lower electrode.Single-layer capacitor provided by the utility model good mechanical strength of holding capacitor device while condenser capacity is increased.
Description
Technical field
The utility model is related to capacitor area, more particularly to a kind of single-layer capacitor.
Background technology
The method for increasing condenser capacity at present mainly has following 3 kinds：1st, increase the opposite dielectric parameter of ceramic dielectric；2、
Increase the electrode facing area of capacitor；3rd, reduce the thickness of ceramic dielectric layer.Method 1 when improving relative dielectric constant often
The dielectric properties such as temperature stability can be sacrificed, it is impossible to meet the requirements.Method more than 2 uses chip multilayer ceramic capacitor (Multi-
Layer Ceramic Capacitors, MLCC) technique increases electrode facing area, but used termination electrode is not suitable for
It is bonded in lead (spun gold or gold ribbon) or embedded mode assembles.Method 3 reduces the thickness of ceramic capacitor, but due to ceramics
Brittleness is big, and too small thickness will cause device frangible, and assembling process is difficult, and practical application has little significance.Therefore, without a kind of side
Holding capacitor device good mechanical strength while method can meet the capacity for increasing capacitor simultaneously.
Invention content
The purpose of this utility model is to provide a kind of single-layer capacitor, the holding capacitor while capacity for increasing capacitor
The good mechanical strength of device.
To achieve the above object, the utility model provides following scheme：
The utility model provides a kind of single-layer capacitor, and the single-layer capacitor includes：Top electrode, first medium layer,
Interior electrode, second dielectric layer and lower electrode；The top electrode is connect with the interior electrode by the first medium layer, described interior
Electrode is connect with the lower electrode by the second dielectric layer；The thickness of the first medium layer is less than the second dielectric layer
Thickness；
Wherein, the second dielectric layer is equipped with through-hole, is connected in the through-hole filled with electrode material, the electrode material
The interior electrode and the lower electrode.
Optionally, the cross section of the through-hole is circle.
Optionally, the electrode material is metal.
Optionally, the electrode material is gold, platinum gold, silver, silver-colored palladium, nickel and or copper.
Optionally, described circular a diameter of 0.05~1.0 millimeter.
Optionally, the thickness of the first medium layer is 5~30 microns, and the thickness of the second dielectric layer is 80~200
Micron.
According to specific embodiment provided by the utility model, the utility model discloses following technique effects：
Single-layer capacitor provided by the utility model, the thick dielectric layer substrate to film dielectric layer and homogeneity and electricity between the two
Pole slurry carries out cofiring and lays upper/lower electrode；Cofiring electrode is led to the dispatch from foreign news agency of thick dielectric layer bottom by through-hole by thick dielectric layer
Pole.The capacitance of capacitor depends on film dielectric layer, obtains high-capacitance, and thick dielectric layer substrate considerably increases capacitor
Mechanical strength both ensure that capacitor had big capacitance, and had been suitble to wire bonding in this way, while have preferable machinery by force
Degree meets the requirement of micro-group dress and embedded assembling.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments, for those of ordinary skill in the art, without having to pay creative labor, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the structure chart (sectional view) of the single-layer capacitor embodiment of the utility model；
Fig. 2 is the flow chart of the preparation method of the single-layer capacitor of the utility model；
Fig. 3 is the part-structure figure of the preparation process of multiple single-layer capacitors of the utility model.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
The purpose of this utility model is to provide a kind of single-layer capacitor, the holding capacitor while capacity for increasing capacitor
The good mechanical strength of device.
Above-mentioned purpose, feature and advantage to enable the utility model are more obvious understandable, below in conjunction with the accompanying drawings and have
Body embodiment is described in further detail the utility model.
Fig. 1 is the structure chart of the single-layer capacitor embodiment of the utility model, as shown in Figure 1, the single-layer capacitor packet
It includes：Top electrode 1, first medium layer 2, interior electrode 3, second dielectric layer 4 and lower electrode 5；Top electrode 1 passes through first with interior electrode 3
Dielectric layer 2 connects, and interior electrode 3 is connect with lower electrode 5 by second dielectric layer 4；The thickness of first medium layer 2 is less than second medium
The thickness of layer 4.
Wherein, second dielectric layer 4 is equipped with through-hole 6, and electrode material is filled in through-hole 6, and electrode material fills full through-hole 6,
Interior electrode 3 is connected together with lower electrode 5.Electrode material is metal.
Optionally, the cross section of through-hole 6 is circle, can facilitate processing.
Optionally, electrode material is gold, platinum gold, silver, silver-colored palladium, nickel and or copper.
Optionally, circular a diameter of 0.05~1.0 millimeter of the cross section of through-hole 6.
Further, in specific make, the thickness of first medium layer 2 is 5~30 microns, the thickness of second dielectric layer 4
It is 80~200 microns.
The utility model is connected interior electrode and lower electrode using a through-hole, and thick dielectric layer is used for increasing for substrate
Mechanical strength, film dielectric layer determine the capacity of capacitor, both ensure that capacitor had big capacitance in this way, and have been suitble to lead key
It closes, while there is preferable mechanical strength, meet the requirement of micro-group dress and embedded assembling.Although multilayer is situated between by multiple through-holes
Cofiring after matter is together in parallel, can also realize large capacity, upper and lower surface can wire bonding, but both to have been done in a small region
Graphical, the punching of electrode, will also realize that multiple through-holes carry out in parallel, complex process, dielectric layer effective area utilization rate is restricted.
Meanwhile for smaller size of capacitor, this mode is not also applicable in no longer.
The utility model additionally provides a kind of preparation method of single-layer capacitor, and Fig. 2 is the individual layer capacitance of the utility model
The flow chart of the preparation method of device.As shown in Fig. 2, the preparation method includes：
Step 201, the first film strips and the second film strips are made；The thickness of first film strips is 5~30 microns, the thickness of the second film strips
Spend is 80~200 microns.
Step 202, second film strips are gone out with the through-hole of array arrangement, Mechanical Method or laser method can be used.Circular hole
A diameter of 0.05~1.0 millimeter, depending on pitch of holes apparent capacity device size, generally 1~2mm.As shown in Figure 3.
Step 203, last layer electrode slurry figure is printed in the one side of second film strips, while is filled in the through-hole
Electrode slurry；
Step 204, first film strips and second film strips alignment are superimposed, the life of capacitor needed for preparation
Green body；The green of capacitor needed for being prepared after hot pressing, hydrostatic pressing.
Step 205, the green is sintered, forms potsherd；
Step 206, top electrode and lower electrode are prepared on the potsherd, forms the ceramic substrate with electrode；It can adopt
Be sintered with metal paste, sputter and or plating prepare top electrode and lower electrode.
Step 207, cutting-up is carried out to the ceramic substrate with electrode, forms capacitor independent one by one.Pay attention to
Interior electrode will stay side, and after preventing slice, due to there is electrode in part to bring out after scribing, interior electrode is easily and top electrode is short-circuit.
Single-layer capacitor provided by the utility model carries out the electrode slurry of film dielectric layer with thick dielectric layer and between the two
Cofiring simultaneously lays upper/lower electrode；Cofiring electrode is led to the lower electrode of thick dielectric layer bottom by through-hole by thick dielectric layer.Capacitor
Capacitance depends on film dielectric layer, obtains high-capacitance, and thick dielectric layer considerably increases the mechanical strength of capacitor, so both
It ensure that capacitor has big capacitance, be suitble to wire bonding, while there is preferable mechanical strength, meet micro-group dress and embedding
Enter the requirement of assembling.
The utility model also has the advantage that：
1st, on the basis of current material the large capacity of capacitor can be realized by reducing the thickness of first medium layer；
2nd, compared with traditional MLCC, upper and lower two surfaces can realize that lead (spun gold or gold ribbon) is bonded, and be applicable in
It is filled in micro-group；
3rd, thickness is controllable, by changing the thickness of second dielectric layer, under the premise of certain mechanical strength is met, can realize
The miniaturization of capacitor.
Specific case used herein is expounded the principle and embodiment of the utility model, above example
Explanation be merely used to help understand the method and its core concept of the utility model；Meanwhile for the general technology of this field
Personnel, according to the thought of the utility model, in specific embodiments and applications there will be changes.In conclusion
The content of the present specification should not be construed as a limitation of the present invention.
Claims (6)
1. a kind of single-layer capacitor, which is characterized in that the single-layer capacitor includes：Top electrode, first medium layer, interior electrode,
Second dielectric layer and lower electrode；The top electrode is connect with the interior electrode by the first medium layer, the interior electrode with
The lower electrode is connected by the second dielectric layer；The thickness of the first medium layer is less than the thickness of the second dielectric layer
Degree；
Wherein, the second dielectric layer is equipped with through-hole, filled with electrode material in the through-hole, described in the electrode material connection
Interior electrode and the lower electrode.
2. single-layer capacitor according to claim 1, which is characterized in that the cross section of the through-hole is circle.
3. single-layer capacitor according to claim 1, which is characterized in that the electrode material is metal.
4. single-layer capacitor according to claim 1, which is characterized in that the electrode material for gold, platinum gold, silver, silver palladium,
Nickel and or copper.
5. single-layer capacitor according to claim 2, which is characterized in that described circular a diameter of 0.05~1.0 millimeter.
6. single-layer capacitor according to claim 1, which is characterized in that the thickness of the first medium layer is micro- for 5~30
Rice, the thickness of the second dielectric layer is 80~200 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721837795.7U CN207587537U (en) | 2017-12-26 | 2017-12-26 | A kind of single-layer capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721837795.7U CN207587537U (en) | 2017-12-26 | 2017-12-26 | A kind of single-layer capacitor |
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| Publication Number | Publication Date |
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| CN207587537U true CN207587537U (en) | 2018-07-06 |
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| CN201721837795.7U Active CN207587537U (en) | 2017-12-26 | 2017-12-26 | A kind of single-layer capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946074A (en) * | 2017-12-26 | 2018-04-20 | 广州天极电子科技有限公司 | A kind of single-layer capacitor and preparation method |
-
2017
- 2017-12-26 CN CN201721837795.7U patent/CN207587537U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946074A (en) * | 2017-12-26 | 2018-04-20 | 广州天极电子科技有限公司 | A kind of single-layer capacitor and preparation method |
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Address after: 511453 No.6, Changli Road, Dongyong Town, Nansha District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Tianji Electronic Technology Co.,Ltd. Address before: 510000 the west side of the fifth floor of No.10 building, No.5 Industrial Zone, South Huaxi Enterprise Group Co., Ltd., daganwei, Haizhu District, Guangzhou City, Guangdong Province Patentee before: AURORA TECHNOLOGIES Co.,Ltd. |
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