CN207578910U - The injection die cavities structure and its mold of a kind of phone housing quadric injection mould mold - Google Patents
The injection die cavities structure and its mold of a kind of phone housing quadric injection mould mold Download PDFInfo
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- CN207578910U CN207578910U CN201721079580.3U CN201721079580U CN207578910U CN 207578910 U CN207578910 U CN 207578910U CN 201721079580 U CN201721079580 U CN 201721079580U CN 207578910 U CN207578910 U CN 207578910U
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- injection
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- phone housing
- caster
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- Moulds For Moulding Plastics Or The Like (AREA)
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Application Number | Priority Date | Filing Date | Title |
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CN201721079580.3U CN207578910U (en) | 2017-08-25 | 2017-08-25 | The injection die cavities structure and its mold of a kind of phone housing quadric injection mould mold |
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CN201721079580.3U CN207578910U (en) | 2017-08-25 | 2017-08-25 | The injection die cavities structure and its mold of a kind of phone housing quadric injection mould mold |
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CN207578910U true CN207578910U (en) | 2018-07-06 |
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CN201721079580.3U Active CN207578910U (en) | 2017-08-25 | 2017-08-25 | The injection die cavities structure and its mold of a kind of phone housing quadric injection mould mold |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112388902A (en) * | 2020-11-02 | 2021-02-23 | 王金祥 | Positioning method and jig for secondary injection molding of sliding seat |
CN114939953A (en) * | 2022-04-26 | 2022-08-26 | 扬州港信光电科技有限公司 | High-temperature packaging device for actively inhibiting silicon carbide expansion |
-
2017
- 2017-08-25 CN CN201721079580.3U patent/CN207578910U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112388902A (en) * | 2020-11-02 | 2021-02-23 | 王金祥 | Positioning method and jig for secondary injection molding of sliding seat |
CN114939953A (en) * | 2022-04-26 | 2022-08-26 | 扬州港信光电科技有限公司 | High-temperature packaging device for actively inhibiting silicon carbide expansion |
CN114939953B (en) * | 2022-04-26 | 2023-08-29 | 扬州港信光电科技有限公司 | High-temperature packaging device capable of actively inhibiting silicon carbide expansion |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201224 Address after: 2207-35 Qianshan Gaochuang Park, building D2, Qingdao International Innovation Park, 169 Songling Road, Laoshan District, Qingdao City, Shandong Province Patentee after: Jingmi Technology (Qingdao) Co.,Ltd. Address before: 226333 southeast of the intersection of Tonghai Avenue and rugang Road, Lingang Industrial Park, Tongzhou Bay, Nantong City, Jiangsu Province Patentee before: TONGZHOU BAY NEW MATERIAL TECHNOLOGY Co.,Ltd. Patentee before: Zhou Tao |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211227 Address after: 233299 plant 20, East District, new material Photoelectric Industrial Park, Dingcheng Town Economic Development Zone, Dingyuan County, Chuzhou City, Anhui Province Patentee after: Anhui Tongwan Technology Co.,Ltd. Address before: 2207-35 Qianshan Gaochuang Park, building D2, Qingdao International Innovation Park, 169 Songling Road, Laoshan District, Qingdao City, Shandong Province Patentee before: Jingmi Technology (Qingdao) Co.,Ltd. |