CN207541550U - A kind of host computer of built-in cycle water radiating device - Google Patents

A kind of host computer of built-in cycle water radiating device Download PDF

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Publication number
CN207541550U
CN207541550U CN201721377474.3U CN201721377474U CN207541550U CN 207541550 U CN207541550 U CN 207541550U CN 201721377474 U CN201721377474 U CN 201721377474U CN 207541550 U CN207541550 U CN 207541550U
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CN
China
Prior art keywords
copper pipe
side plate
heat
plate
coolant
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721377474.3U
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Chinese (zh)
Inventor
刘勇勇
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Individual
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Individual
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Publication date
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Priority to CN201721377474.3U priority Critical patent/CN207541550U/en
Application granted granted Critical
Publication of CN207541550U publication Critical patent/CN207541550U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of host computers of built-in cycle water radiating device,Including mainframe box,CPU radiators,Pedestal and the electronic component in mainframe box,The mainframe box includes the first side plate,Second side plate,Front shroud and back shroud,First heat emission fan is installed on the first side plate,The inner cavity of second side plate is equipped with the first copper pipe,And first copper pipe side side wall embedded in the second side plate side wall on,Installing plate for fixing mainboard is installed on the second side plate on the lateral wall embedded with the first copper pipe,The second heat emission fan is installed on the separate side wall of installing plate for being used to fix mainboard of second side plate,The coolant input terminal of first copper pipe is connect with the coolant output terminal of CPU radiators,The coolant input terminal of CPU radiators and the output terminal of circulating pump connect,The input terminal of circulating pump is connect with the coolant output terminal of coolant storage tank.The host computer good heat dissipation effect of the built-in cycle water radiating device, it is simple in structure, and low cost, it is easy to spread.

Description

A kind of host computer of built-in cycle water radiating device
Technical field
The utility model is related to computer equipment technical field more particularly to a kind of computers of built-in cycle water radiating device Host.
Background technology
Computer mainframe internal part is numerous, and heat dissipation effect is bad, is easy to cause the parts on mainboard because of overheat and nothing Method radiates and damages in time, and existing computer is radiated with fan, but because of the installation site and effect of fan It is undesirable to be easy to cause heat dissipation effect.
Therefore, we are badly in need of designing a kind of host computer of built-in cycle water radiating device and solve the above problems.
Utility model content
The purpose of this utility model is and a kind of built-in recirculated water proposed in order to solve shortcoming in the prior art The host computer of radiator.
To achieve these goals, the utility model employs following technical solution:
A kind of host computer of built-in cycle water radiating device, including mainframe box, CPU radiators, pedestal and installation Electronic component in mainframe box, the mainframe box include the first side plate, the second side plate, front shroud and back shroud, the first side First heat emission fan is installed, the inner cavity of the second side plate is equipped with the first copper pipe, and the side side wall of the first copper pipe is embedded in second on plate On the side wall of side plate, installing plate for fixing mainboard is installed on the second side plate on the lateral wall embedded with the first copper pipe, second Side plate far from for fix mainboard the side wall of installing plate on the second heat emission fan is installed, the coolant input terminal of the first copper pipe with The coolant output terminal connection of CPU radiators, the coolant input terminal of CPU radiators and the output terminal of circulating pump connect, The coolant output terminal of the input terminal of circulating pump and coolant storage tank connect, and coolant stores the coolant input terminal and the of tank The coolant output terminal connection of one copper pipe, CPU radiators include third heat emission fan, machine box, heat-conducting plate and the second copper pipe, In, the second copper pipe is on heat-conducting plate, and organic box is installed on the top of heat-conducting plate, and machine box is installed on the side side wall far from heat-conducting plate There is third heat emission fan, the second copper pipe is placed in the interior intracavitary of machine box, and wherein mainframe box is mounted on the top of pedestal, coolant storage Tank and circulating pump are mounted on the interior intracavitary of pedestal.
Preferably, first copper pipe and the second copper pipe are bent S-shaped, and the vertical section of the first copper pipe and the second copper pipe Equal semicircular in shape.
Preferably, the side wall of the first copper pipe is embedded on second side plate and is filled for fixing between the installing plate of mainboard There is heat conductive silica gel, and hole is thread through for fixing on the installing plate of mainboard to be provided with.
Preferably, 2-4 the first heat emission fans on first side plate are installed, 2-4 second is equipped on the second side plate Heat emission fan, and the second side plate is in hollow structure.
Preferably, the heat-conducting plate uses aluminium alloy matter heat-conducting plate or copper heat-conducting plate.
The utility model advantageous effect:The host computer of the built-in cycle water radiating device is provided with by being mounted with copper thereon Pipe, heat emission fan and the mainframe box for installing the components such as the installing plate of mainboard composition, and it is also provided with CPU heat dissipation dresses thereon It puts, considerably increases heat-sinking capability, and good heat dissipation effect, it is simple in structure, and low cost, it is easy to spread.
Description of the drawings
Fig. 1 be the utility model proposes a kind of built-in cycle water radiating device host computer structure diagram;
Fig. 2 be the utility model proposes a kind of built-in cycle water radiating device host computer the first copper pipe structure The connection diagram of schematic diagram and the first copper pipe and CPU radiators and coolant storage tank;
Fig. 3 be the utility model proposes a kind of built-in cycle water radiating device host computer the first side plate and first The location diagram of heat emission fan;
Fig. 4 be the utility model proposes a kind of built-in cycle water radiating device host computer the second side plate and second The location diagram of heat emission fan;
Fig. 5 be the utility model proposes a kind of built-in cycle water radiating device host computer the second side plate and first Copper pipe location diagram;
Fig. 6 be the utility model proposes a kind of built-in cycle water radiating device host computer the second side plate section Figure;
Fig. 7 be the utility model proposes the perpendicular of the first copper pipe of host computer of built-in cycle water radiating device a kind of cut Face figure;
Fig. 8 be the utility model proposes a kind of built-in cycle water radiating device host computer CPU radiators Structure diagram;
Fig. 9 be the utility model proposes a kind of built-in cycle water radiating device host computer heat-conducting plate and the second bronze medal Pipe location diagram;
Figure 10 be the utility model proposes a kind of built-in cycle water radiating device host computer third heat emission fan and The location diagram of machine box.
In figure:1 mainframe box, 11 first heat emission fans, 12 first side plates, 13 second heat emission fans, 14 second side plates, 15 first Copper pipe, 16 are radiated for fixing the installing plate of mainboard, 17 coolants storage tank, 18 circulating pumps, 2 CPU radiators, 21 thirds Fan, 22 machine boxes, 23 heat-conducting plates, 24 second copper pipes, 3 pedestals.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.
With reference to Fig. 1-10, a kind of host computer of built-in cycle water radiating device, including mainframe box 1, CPU radiators 2nd, pedestal 3 and the electronic component in mainframe box, mainframe box 1 include the first side plate 12, the second side plate 14, front shroud and Back shroud, the first heat emission fan 11 is equipped on the first side plate 12, and the inner cavity of the second side plate 14 is equipped with the first copper pipe 15, and the first bronze medal The side side wall of pipe 15 is installed on the side wall of the second side plate 14 on second side plate 14 on the lateral wall embedded with the first copper pipe 15 Be useful for the installing plate 16 of fixed mainboard, the second side plate 14 far from for fix mainboard the side wall of installing plate 16 on be equipped with the Two heat emission fans 13, the coolant input terminal of the first copper pipe 15 are connect with the coolant output terminal of CPU radiators 2, CPU heat dissipation dresses 2 coolant input terminal is put to connect with the output terminal of circulating pump 18, input terminal and coolant the storage tank 17 of circulating pump 18 it is cold But liquid output terminal connects, and the coolant input terminal of coolant storage tank 17 is connect with the coolant output terminal of the first copper pipe 15, CPU Radiator 2 includes third heat emission fan 21, machine box 22,23 and second copper pipe 24 of heat-conducting plate, wherein, the second copper pipe 24 is embedded in heat conduction On plate 23, organic box 22 is installed on the top of heat-conducting plate 23, and machine box 22 is equipped with third on the side side wall far from heat-conducting plate 23 and dissipates Heat fan 21, the second copper pipe 24 are placed in the interior intracavitary of machine box 22, and wherein mainframe box 1 is mounted on the top of pedestal 3, coolant storage Tank 17 and circulating pump 18 are mounted on the interior intracavitary of pedestal 3, and the first copper pipe 15 and the second copper pipe 24 bend S-shaped, and the first bronze medal The equal semicircular in shape of vertical section of 15 and second copper pipe 24 of pipe, the side wall on the second side plate 14 embedded with the first copper pipe 15 are fixed with being used for Filled with heat conductive silica gel between the installing plate 16 of mainboard, and hole is thread through for fixing on the installing plate 16 of mainboard to be provided with, the 2-4 the first heat emission fans 11 on side plate 12 are installed, 2-4 the second heat emission fans 13, and second are installed on second side plate 14 Side plate 14 is in hollow structure, and heat-conducting plate 23 uses aluminium alloy matter heat-conducting plate or copper heat-conducting plate.
Operation principle:In use, mainboard to be installed to the installing plate 16 for fixing mainboard, then master is installed on mainboard Electronic component in cabinet, then CPU radiators 2 are installed on CPU.
Coolant in coolant storage tank 17 is flowed under the action of circulating pump 18 in CPU radiators 2, then It flows out in the first copper pipe 15 from CPU radiators 2, is then flow back into again in coolant storage tank 17 along the first copper pipe 15.
CPU radiators 2 are made of third heat emission fan 21, machine box 22,23 and second copper pipe 24 of heat-conducting plate, can be substantially The heat generated during CPU work is dispersed, part heat is dispersed by third heat emission fan 21, and part heat is trickled in the second copper pipe 24 Coolant is taken away.
The installing plate 16 that the heat generated during main board work is used for fixed mainboard is taken away, on the installing plate 16 of fixed mainboard The heat cooling agent in the first copper pipe 15 that trickled is taken away, and the heat on the first copper pipe 15 can be taken away by the second heat emission fan 13.
More than, the only preferable specific embodiment of the utility model, but the scope of protection of the utility model is not limited to In this, in the technical scope that any one skilled in the art discloses in the utility model, according to the utility model Technical solution and its utility model design be subject to equivalent substitution or change, should all cover the scope of protection of the utility model it It is interior.

Claims (5)

1. a kind of host computer of built-in cycle water radiating device, including mainframe box(1), CPU radiators(2), pedestal(3) With the electronic component in mainframe box, it is characterised in that:The mainframe box(1)Including the first side plate(12), the second side Plate(14), front shroud and back shroud, the first side plate(12)On the first heat emission fan is installed(11), the second side plate(14)Inner cavity set There is the first copper pipe(15), and the first copper pipe(15)Side side wall be embedded in the second side plate(14)Side wall on, the second side plate(14) It is upper to be embedded with the first copper pipe(15)Lateral wall on installing plate for fixing mainboard is installed(16), the second side plate(14)Far from use In the installing plate of fixed mainboard(16)Side wall on the second heat emission fan is installed(13), the first copper pipe(15)Coolant input terminal With CPU radiators(2)Coolant output terminal connection, CPU radiators(2)Coolant input terminal and circulating pump(18)'s Output terminal connects, circulating pump(18)Input terminal and coolant store tank(17)Coolant output terminal connection, coolant storage Tank(17)Coolant input terminal and the first copper pipe(15)Coolant output terminal connection, CPU radiators(2)It is dissipated including third Heat fan(21), machine box(22), heat-conducting plate(23)With the second copper pipe(24), wherein, the second copper pipe(24)Embedded in heat-conducting plate(23)On, Heat-conducting plate(23)Top organic box is installed(22), machine box(22)Far from heat-conducting plate(23)Side side wall on third be installed dissipate Heat fan(21), the second copper pipe(24)It is placed in machine box(22)Interior intracavitary, wherein mainframe box(1)Mounted on pedestal(3)Top, Coolant stores tank(17)And circulating pump(18)Mounted on pedestal(3)Interior intracavitary.
2. the host computer of a kind of built-in cycle water radiating device according to claim 1, which is characterized in that described first Copper pipe(15)With the second copper pipe(24)Bend S-shaped, and the first copper pipe(15)With the second copper pipe(24)Vertical section in half It is round.
3. the host computer of a kind of built-in cycle water radiating device according to claim 1, which is characterized in that described second Side plate(14)It is upper to be embedded with the first copper pipe(15)Side wall with for fixing the installing plate of mainboard(16)Between filled with heat conductive silica gel, And the installing plate for fixing mainboard(16)On be provided with and be thread through hole.
4. the host computer of a kind of built-in cycle water radiating device according to claim 1, which is characterized in that described first Side plate(12)On 2-4 the first heat emission fans are installed(11), the second side plate(14)On 2-4 the second heat emission fans are installed(13), And second side plate(14)In hollow structure.
A kind of 5. host computer of built-in cycle water radiating device according to claim 1, which is characterized in that the heat conduction Plate(23)Using aluminium alloy matter heat-conducting plate or copper heat-conducting plate.
CN201721377474.3U 2017-10-24 2017-10-24 A kind of host computer of built-in cycle water radiating device Expired - Fee Related CN207541550U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721377474.3U CN207541550U (en) 2017-10-24 2017-10-24 A kind of host computer of built-in cycle water radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721377474.3U CN207541550U (en) 2017-10-24 2017-10-24 A kind of host computer of built-in cycle water radiating device

Publications (1)

Publication Number Publication Date
CN207541550U true CN207541550U (en) 2018-06-26

Family

ID=62609459

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721377474.3U Expired - Fee Related CN207541550U (en) 2017-10-24 2017-10-24 A kind of host computer of built-in cycle water radiating device

Country Status (1)

Country Link
CN (1) CN207541550U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180626

Termination date: 20211024