CN207528876U - A kind of wafer probe card - Google Patents
A kind of wafer probe card Download PDFInfo
- Publication number
- CN207528876U CN207528876U CN201721708513.3U CN201721708513U CN207528876U CN 207528876 U CN207528876 U CN 207528876U CN 201721708513 U CN201721708513 U CN 201721708513U CN 207528876 U CN207528876 U CN 207528876U
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- CN
- China
- Prior art keywords
- pcb board
- engagement plate
- probe card
- contact
- conductive contact
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a kind of wafer probe card, including：First pcb board, engagement plate, the second pcb board, several probes, reversing arrangement are arranged below engagement plate and the second pcb board, are slidably connected with engagement plate, are fixedly connected with the second pcb board, reversing arrangement can drive the second pcb board to be rotated relative to the first pcb board.The reversing arrangement that the utility model is slidably connected by using engagement plate and opposite engagement plate, so that the fixing end of probe saves conducting wire and is connected to the first pcb board, the rotation of probe is unrestricted, it is adapted to the Vertical Handover test of X, Y-direction, or other multidirectional switch tests, prior art test commutation is avoided to need to unload the trouble reloaded.
Description
Technical field
The utility model is related to the test of integrated circuit wafer, more particularly to a kind of wafer probe card.
Background technology
When wafer is tested, because chip area is limited, element is laid on the Cutting Road of X and Y both directions, existing
Probe card can not rotate to another direction so unit is all fixed from a direction.When commutating test, (X-direction is changed
To Y-direction), need test of reloading after unloading, it appears cumbersome.
Utility model content
In view of the problems of the existing technology, the utility model provides a kind of wafer probe card, can carry out commutation test
It reloads without in addition unloading, testing efficiency is substantially improved.
To achieve the above object, the technical solution of the utility model is as follows：
A kind of wafer probe card, including：
First pcb board, with hard contact, which is in ring configuration, be inside equipped with it is several with it is each
Hard contact corresponds to the first salient point being electrically connected；
Engagement plate is arranged on inside the first pcb board and is secured to connect, and is in ring configuration, outer diameter and the first PCB
Plate internal diameter is suitable, and the engagement plate excircle and inner periphery are respectively equipped with several first conductive contacts, the second conductive contact, and every 1
One conductive contact and corresponding one second conductive contact electrical communication；Every one first conductive contact is matched with the first salient point to be connect
It touches；
Second pcb board, is arranged on inside engagement plate, and in ring configuration, outer diameter is suitable with engagement plate internal diameter, and second
Pcb board excircle is equipped with several second salient points, is contacted respectively with the matching of corresponding second conductive contact；
Several probes are arranged on the second pcb board, and one end of probe is electrically connected respectively with corresponding second salient point, separately
Inwardly lower section extends one end；
Reversing arrangement is arranged below engagement plate and the second pcb board, is slidably connected with engagement plate, is fixed with the second pcb board
Connection, reversing arrangement can drive the second pcb board to be rotated relative to the first pcb board.
Preferably, the hard contact along the first pcb board in and circle distribution.
Preferably, first pcb board is fixedly connected with engagement plate in buckle-type.
Preferably, second pcb board, after the first pcb board rotates 90 °, every one second salient point is conductive with every one second
Contact still matches contact.
The reversing arrangement that the utility model is slidably connected by using engagement plate and opposite engagement plate so that probe is consolidated
Fixed end saves conducting wire and is connected to the first pcb board, and the rotation of probe is unrestricted, is adapted to the Vertical Handover test of X, Y-direction,
Or other multidirectional switch tests, prior art test commutation is avoided to need to unload the trouble reloaded.
Description of the drawings
Fig. 1 is the vertical view of the utility model；
Fig. 2 is the utility model section view.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is further illustrated.
Referring to figs. 1 to shown in Fig. 2, the utility model provides a kind of wafer probe card, including：
First pcb board 1, with hard contact 11, which is in ring configuration, be inside equipped with it is several with
Each hard contact 11 corresponds to the first salient point 12 being electrically connected；
Engagement plate 2 is arranged on 1 inside of the first pcb board and is secured to connect, in ring configuration, outer diameter and first
1 internal diameter of pcb board is suitable, and 2 excircle of engagement plate and inner periphery are respectively equipped with several first conductive contacts 21, the second conductive contact
22, every one first conductive contact 21 and corresponding one second conductive contact, 22 electrical communication；Every one first conductive contact 21 with
The matching contact of first salient point 12；
Second pcb board 3, is arranged on inside engagement plate 2, and in ring configuration, outer diameter is suitable with engagement plate internal diameter, and second
3 excircle of pcb board is equipped with several second salient points 31, is contacted respectively with the matching of corresponding second conductive contact 22；
Several probes 4 are arranged on the second pcb board 3, and one end of probe 4 electrically connects respectively with corresponding second salient point 31
It connects, inwardly lower section extends another side；
Reversing arrangement 5 is arranged on 2 and second pcb board of engagement plate, 3 lower section, is slidably connected with engagement plate 2, with the second pcb board
3 are fixedly connected, and reversing arrangement 5 can drive the second pcb board 3 to be rotated relative to the first pcb board 1.
Wherein, the hard contact 11 along the first pcb board 1 in and circle distribution.
First pcb board 1 is fixedly connected with engagement plate 2 in buckle-type.
For second pcb board 3 after the first pcb board 1 rotates 90 °, every one second salient point 31 is conductive tactile with every one second
The still matching contact of point 22.
In the utility model, the fixing end of each probe 4, via the second salient point 31, second in electrical contact with it successively
Conductive contact 22, the first conductive contact 21, the first salient point 12 are connected to hard contact 11, by the conversion of engagement plate 2, eliminate
Conducting wire connects.
The reversing arrangement 5 that the utility model is slidably connected by using engagement plate 2 and opposite engagement plate 2 so that probe 4
Fixing end save conducting wire and be connected to the first pcb board 1, the rotation of probe 4 is unrestricted, is adapted to X, the vertical of Y-direction is cut
Test or other multidirectional switch tests are changed, prior art test commutation is avoided to need to unload the trouble reloaded.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Under every utility model in the utility model is conceived, equivalent structure made based on the specification and figures of the utility model
Transformation or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (4)
1. a kind of wafer probe card, which is characterized in that including：
First pcb board, with hard contact, which is in ring configuration, is inside equipped with several and each metal
Contact corresponds to the first salient point being electrically connected；
Engagement plate is arranged on inside the first pcb board and is secured to connect, in ring configuration, in outer diameter and the first pcb board
Diameter is suitable, and the engagement plate excircle and inner periphery are respectively equipped with several first conductive contacts, the second conductive contact, and every 1 first leads
Electric contact and corresponding one second conductive contact electrical communication；Every one first conductive contact is contacted with the matching of the first salient point；
Second pcb board, is arranged on inside engagement plate, and in ring configuration, outer diameter is suitable with engagement plate internal diameter, the second pcb board
Excircle is equipped with several second salient points, is contacted respectively with the matching of corresponding second conductive contact；
Several probes are arranged on the second pcb board, and one end of probe is electrically connected respectively with corresponding second salient point, the other end
Lower section extends in lateral；
Reversing arrangement is arranged below engagement plate and the second pcb board, is slidably connected with engagement plate, fixes and connects with the second pcb board
It connects, reversing arrangement can drive the second pcb board to be rotated relative to the first pcb board.
2. wafer probe card according to claim 1, which is characterized in that the hard contact along the first pcb board in
Circle distribution.
3. wafer probe card according to claim 1, which is characterized in that first pcb board is in buckle-type with engagement plate
It is fixedly connected.
4. wafer probe card according to claim 1 or 2, which is characterized in that second pcb board is with respect to the first pcb board
After 90 ° of rotation, every one second salient point is still matched with every one second conductive contact and is contacted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721708513.3U CN207528876U (en) | 2017-12-08 | 2017-12-08 | A kind of wafer probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721708513.3U CN207528876U (en) | 2017-12-08 | 2017-12-08 | A kind of wafer probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207528876U true CN207528876U (en) | 2018-06-22 |
Family
ID=62578998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721708513.3U Active CN207528876U (en) | 2017-12-08 | 2017-12-08 | A kind of wafer probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207528876U (en) |
-
2017
- 2017-12-08 CN CN201721708513.3U patent/CN207528876U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |