CN207517641U - Etching machines - Google Patents
Etching machines Download PDFInfo
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- CN207517641U CN207517641U CN201721567699.5U CN201721567699U CN207517641U CN 207517641 U CN207517641 U CN 207517641U CN 201721567699 U CN201721567699 U CN 201721567699U CN 207517641 U CN207517641 U CN 207517641U
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- electrode plate
- etching machines
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- 238000005530 etching Methods 0.000 title claims abstract description 66
- 239000006096 absorbing agent Substances 0.000 claims description 17
- 230000035939 shock Effects 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 10
- 239000000112 cooling gas Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 10
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009296 electrodeionization Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
The utility model discloses a kind of etching machines.Etching machines include etch chamber, electrode plate, the first support device and the second support device being arranged between the first support device.Electrode plate, the first support device and the second support device are located in etch chamber.First support device is configured to by workpiece portion be placed in the first support device so that workpiece is arranged at intervals with electrode plate.Second support device is configured to support workpiece and is risen or fallen relative to electrode plate.In the etching machines of the utility model embodiment, first support device workpiece can cause workpiece to be arranged at intervals in etching process with electrode plate, workpiece lower surface is not easy or avoids generating the raised marking (Emboss ink), and then improve the yield of workpiece due to the electrostatic adsorption force influence of electrode plate.
Description
Technical field
The utility model is related to etching technique field more particularly to a kind of etching machines.
Background technology
In the etching machines of the relevant technologies, when carrying out dry-etching to glass substrate, because glass substrate is by lower part electricity
Pole electrostatic adsorption force influences, and the surface of glass substrate easily generates the raised marking (Emboss ink), is nanometer or micron level
Damage, this marking can form scraggly structure, Jin Erying after follow-up sour wet process on the surface of glass substrate
Ring the yield of glass substrate.
Utility model content
The utility model embodiment provides a kind of etching machines.
A kind of etching machines of the utility model embodiment include etch chamber, electrode plate, the first support device and set
Put the second support device between first support device, the electrode plate, first support device and described second
Support device is located in the etch chamber, and first support device is configured to described by by workpiece portion being placed on
So that the workpiece is arranged at intervals with the electrode plate in first support device, second support device is configured to support institute
Workpiece is stated to rise or fall relative to the electrode plate.
Set the first support device that workpiece is made to be arranged at intervals with electrode plate in the etching machines of the utility model embodiment,
In etching process, lower surface is not easy or avoids generating the raised marking due to electrostatic adsorption force influence of electrode plate workpiece
(Emboss ink), and then improve the yield of workpiece.
In some embodiments, first support device includes spaced at least two support arm, the branch
Brace is formed with step structure, and the step structure is formed with support slot, and the support slot of two support arms is opposite to be set
It puts, the step structure is configured as through being placed on the workpiece portion in the support slot so that the workpiece and institute
State electrode plate interval setting.
In some embodiments, second support device includes spaced multiple support columns, the support column
Through the electrode plate and it is configured to that the workpiece is supported to rise or fall.
In some embodiments, the support arm includes the shock absorber part being arranged on the step structure.
In some embodiments, first support device is formed through the support arm and connects the support slot
Venthole.
In some embodiments, the shock absorber part and the venthole are arranged at intervals.
In some embodiments, the etching machines include plasma generator, the plasma generator quilt
Configuration is shaped as plasma so that the surface of workpiece described in the plasma etching.
In some embodiments, the etching machines include blowning installation, and the blowning installation is configured to cool down
Gas blows to the workpiece.
In some embodiments, the etching machines include connecting the driving device of first support device, described
Driving device is configured to that first support device is driven to rise or fall relative to the electrode plate.
In some embodiments, first support device includes 4 support arms, 4 support arms it is flat
EDS maps assume diamond in shape.
The additional aspect and advantage of the utility model embodiment will be set forth in part in the description, partly will be under
Become apparent in the description in face or recognized by the practice of the utility model.
Description of the drawings
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination accompanying drawings below to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 is the planar structure schematic diagram at a visual angle of the etching machines of the utility model embodiment；
Fig. 2 is the planar structure schematic diagram at a visual angle of the support arm of the utility model embodiment；
Fig. 3 is the planar structure schematic diagram at another visual angle of the support arm of the utility model embodiment；
Fig. 4 is the planar structure schematic diagram at another visual angle of the support arm of the utility model embodiment；With
Fig. 5 is diagrammatic cross-section of the etching machines of Fig. 1 along V-V directions.
Main element symbol description：
Etching machines 10, etch chamber 11, electrode plate 12, stomata 122, the first support device 13, support arm 132, step
Structure 1322, support slot 1324, shock absorber part 1326, venthole 1328, the second support device 14, support column 142, plasma hair
Raw device 15, blowning installation 16, driving device 17, work chamber 18, workpiece 20, plasma 30.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and it is not intended that this practicality
Novel limitation.
In the description of the present invention, it is to be appreciated that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Convenient for description the utility model and simplify description rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.In addition, term " first ",
" second " is only used for description purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature." first " is defined as a result, the feature of " second " can be expressed or implicitly include one or more
The feature." multiple " are meant that two or more in the description of the present invention, unless otherwise clearly specific
It limits.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanically connected or be electrically connected or can mutually communicate；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the interaction relationship of connection inside two elements or two elements.For this field
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the description of the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it
" on " or it " under " can be in direct contact including the first and second features, it is not directly to connect that can also include the first and second features
It touches but passes through the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " on
Face " is including fisrt feature right over second feature and oblique upper or to be merely representative of fisrt feature level height special higher than second
Sign.Fisrt feature second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward
Side is merely representative of fisrt feature level height less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the etching machines 10 of the utility model embodiment include etch chamber 11, electrode plate 12, first
Support device 13 and the second support device 14 being arranged between the first support device 13.Electrode plate 12, the first support device 13
It is located in etch chamber 11 with the second support device 14.First support device 13 is configured to by the way that workpiece 30 is partly placed
So that workpiece 20 is arranged at intervals with electrode plate 12 in the first support device 13.Second support device 14 is configured to support workpiece
20 rise or fall relative to electrode plate 12.
The etching machines 10 of the utility model can be used for etching workpiece 20, and during etching, workpiece 20 is placed on etch chamber
In 11, plasma 30, which moves downward, is etched workpiece 20.Workpiece 20 can be inhaled by the electrostatic of electrode plate 12 during due to etching
Attached power influences, and therefore, using the first support device 13 support workpiece 20 so that workpiece 20 and electrode plate 12 are arranged at intervals, can keep away
Exempt from workpiece 20 and electrode plate 12 is in direct contact so that the lower surface of workpiece 20 is not easy or avoids generating protrusion in etching process
The marking (Emboss ink), it is follow-up to carry out not allowing to be also easy to produce scraggly structure, and then improve the good of product during sour wet etching
Rate.Wherein, the second support device 14 can rise when workpiece 20 passes in and out etch chamber 11 to support workpiece 20, in etching at present
It drops so that the first support device 13 supports workpiece 20,20 back side of workpiece is contacted with object when reducing etching.
In some embodiments, etch chamber 11 is formed with relatively closed work chamber 18.
In this way, work chamber 18, which is etching workpiece 20, provides closed space, be conducive to control in work chamber 18
Air pressure, and plasma 30 can be avoided to dissipate the quality for leading to concentration deficiency or the etching of other gases affects.
In some embodiments, the first support device 13 includes spaced at least two support arm 132.Support arm
132 are formed with step structure 1322.Step structure 1322 is formed with support slot 1324, the support slot 1324 of two support arms 132
It is oppositely arranged.Step structure 1322 be configured as by by 20 part of workpiece be placed in 1324 support slots so that workpiece 20 with
Electrode plate 12 is arranged at intervals.
In this way, workpiece 20 is placed on support arm 132, step structure 1322 can limit the displacement of workpiece 20 so that work
Part 20 is not easy in etching process to occur mobile and damage.
In some embodiments, support arm 132 is made of ceramics.
In this way, ceramics can be etched with plasma resistant 30 so that support arm 132 be not readily susceptible in etching process etc. from
Daughter 30 is etched and is damaged, and is conducive to improve the service life of support arm 132.Certainly, in some embodiments, support arm 132
Material can be not limited to embodiments discussed above, and can be made as needed of suitable etch-resistant material.
It is appreciated that support arm 132 step structure 1322 limit workpiece 20 displacement and be unfavorable for travelling workpiece 20 with
Workpiece 20 is made to pass in and out etch chamber 11.Second support device 14 can before the etch or etching is completed rear support workpiece 20 and risen,
Support arm 132 declines so that workpiece 20 moves at this time.During etching, workpiece 20 may the influence generation temperature change of subject plasma 30
Change and cause 20 softening transform of workpiece, therefore, support arm 132 rises in etching process and the second support device 14 declines, and avoids
Second support device 14 be in direct contact workpiece 20 so that 20 back side out-of-flatness of workpiece and influence 20 yield of workpiece.
In some embodiments, the second support device 14 includes spaced multiple support columns 142.Support column 142
Penetrating electrode plate 12 simultaneously is configured to that workpiece 20 is supported to lift.
It, can before the etch or rear support work is completed in etching in this way, support column 142 is arranged between two support arms 132
Part 20 rises.It is appreciated that support column 142 supports one end of workpiece 20 to be located at same supporting plane, workpiece 20 can be placed on
It is lifted on supporting plane.In addition, support column 142 can be uniformly arranged, be conducive to steadily support workpiece 20 in this way.
Specifically, in some embodiments, multiple support columns 142 are in array distribution.In this way, the support column of array distribution
142 on same line the distance of two neighboring support column 142 it is equal so that the support force that workpiece 20 is subject to is uniformly distributed, together
Sample is conducive to steadily support workpiece 20.Certainly, in some embodiments, the distribution mode of support column 142 can also be according to work
The size and shape of part 20 is configured.
In some embodiments, the quantity of support column 142 can be according to the shape, size and weight and support of workpiece 20
Enabling capabilities of column 142 etc. are converted.
Also referring to Fig. 2, Fig. 3 and Fig. 4, in some embodiments, support arm 132 includes being arranged on step structure
Shock absorber part 1326 on 1322.
In this way, support arm 132 is used to support workpiece 20, the higher material of generally use hardness is made, and workpiece 20 is directly put
It puts and is easily damaged on support arm 132.Shock absorber part 1326 is provided on step structure 1322 can cause support arm 132
Cushioning effect can be played during stress during support workpiece 20, workpiece 20 is reduced or avoided and damages.
In some embodiments, the first support device 13 is formed through support arm 132 and connects support slot 1324
Venthole 1328.
In this way, during etching, workpiece 20 may subject plasma 30 influence to generate temperature change, etching machines 10 can lead to
It crosses venthole 1328 and conveys cooling gas to workpiece 20 so that the part that workpiece 20 is placed on step structure 1322 can be by cold
But the influence of gas and keep lower temperature, be conducive to keep 20 stable structure of workpiece and being etched.
In the illustrated embodiment, 1328 vertical connection support slot 1324 of venthole.Shock absorber part 1326 can be rubber pad.
In this way, shock absorber part 1326 is usually the highly elastic material with reversible deformation, such as rubber pad can protect workpiece 20
It is not easy to be supported 132 active force of arm in etching process and damage.
In some embodiments, shock absorber part 1326 and venthole 1328 are arranged at intervals.
In this way, shock absorber part 1326 and the interval of venthole 1328 enable venthole 1328 to convey cooling gas to workpiece 20
So as to keep lower temperature.
Specifically, in some embodiments, shock absorber part 1326 is 3, venthole 1328 is 2.Shock absorber part 1326 and logical
Stomata 1328 is arranged alternately.Certainly, in other embodiments, the quantity of shock absorber part 1326 and the quantity of venthole 1328 can roots
It is converted according to the size of the size of support arm 132, the size of shock absorber part 1326 and venthole 1328.
In some embodiments, shock absorber part 1326 can be in cone.In this way, workpiece 20 contacts the vertex of cone, erosion is reduced
The contact area of shock absorber part 1326 and workpiece 20 during quarter, meanwhile, increase cooling gas and the contact area of workpiece 20, be conducive to lose
Carve workpiece 20.
Referring to Fig. 1, in some embodiments, etching machines 10 include plasma generator 15.Plasma
Body generator 15 is configured to form plasma 30 so that plasma 30 etches the surface of workpiece 20.
In this way, plasma generator 15 can ionize etching gas to form plasma 30, pass through electric field and magnetic field
Control plasma 30 forms high-velocity particles and is delivered to 20 surface of workpiece, and the surface of high-velocity particles bombardment workpiece 20 is with to workpiece
20 non-shaded portions are etched.
In some embodiments, plasma emitters 15 include top electrode.In this way, top electrode ionization etching gas is formed
Plasma 30, plasma 30 etch downwards workpiece 20.Control etc. is conducive to by the distance for controlling workpiece 20 and top electrode
The efficiency that gas ions 30 etch.
In some embodiments, etching machines 10 include blowning installation 16.Blowning installation 16 is configured to that gas will be cooled down
Body blows to workpiece 20.
In this way, in etching process, workpiece 20 may subject plasma 30 influence to generate temperature change and softening transform.Branch
Brace 132 supports workpiece 20 periphery so that 20 central part of workpiece do not support and may be because of gravity sag.Blowning installation 16
Cooling gas is delivered to workpiece 20 can be so that workpiece 20 keeps lower temperature and is not easy to soften.Blowning installation 16 is blown upwards
During gas, gas moves upwards to form certain impulse force, and control cooling gas delivery rate can be that workpiece 20 provides support force, have
Conducive to preventing 20 central part of workpiece sagging to ensure 20 yield of workpiece.
In some embodiments, blowning installation 16 is arranged on 12 lower section of electrode plate, and electrode plate 12 is formed with stomata 122,
Cooling gas is delivered up by stomata 122 to workpiece 20.
In some embodiments, blowning installation 16 connects the venthole 1328 of support arm 132.
In some embodiments, cooling gas is helium.In this way, liquid helium has low boiling point, liquid helium generates low temperature when gasifying,
Helium after gasification can be used in cooling down workpiece 20.Meanwhile helium is inert gas, has very strong stability, into etching
It is smaller to the influence of etching after cavity 11.
In some embodiments, etching machines 10 include the driving device 17 of the first support device 13 of connection.Driving dress
17 are put to be configured to that the first support device 13 is driven to rise or fall relative to electrode plate 12.
In this way, when workpiece 20 passes in and out etching machines 10, need to lift the first support device 13 so that workpiece 20 moves.Driving
Device 17 can drive the first support device 13 to rise so that the first support device 13 supports workpiece 20 in etching.Driving device
17 can drive the first support device 13 to decline so that workpiece 20 is moved into and out etching machines 10 before the etch or after the completion of etching.
In some embodiments, driving device 17 connects the second support device 14.In this way, driving device 17 can lose
The second support device 14 is driven to decline during quarter so that the first support device 13 supports workpiece 20.Driving device 17 can be before the etch
Or the second support device 14 of driving rises that workpiece 20 is supported to be moved into and out etching machines 10 so as to workpiece 20 after the completion of etching.
In some embodiments, driving device 17 includes cylinder and/or stepper motor.In this way, driving device 17 can be controlled
It makes the first support device 13 and/or the second support device 14 and carries out back and forth movement in one or more directions to be risen
Drop.Specifically, in some embodiments, cylinder and/or stepper motor can be multiple.
Referring to Fig. 5, in some embodiments, the first support device 13 includes 4 support arms 132.4 support arms
132 plane distribution assumes diamond in shape.
In this way, the first support device 13 forms the support arm 132 that two pairs of support slots 1324 are oppositely arranged so that the first support
Device 13 can limit workpiece 20 and is subjected to displacement in orthogonal both direction, be more advantageous to keeping workpiece in etching process
Stablize 20 position.
In some embodiments, the plane distribution of 4 support arms 132 is rectangular.It is equally beneficial for keeping workpiece 20
Stablize position.
Certainly, in other embodiments, the quantity of support arm 132 can be not limited to embodiment discussed above, and
It can be converted according to the shape of workpiece 20, the size of size and weight and support arm 132 and enabling capabilities.
In the description of this specification, reference term " embodiment ", " is schematically implemented " certain embodiments "
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine embodiment or example describe it is specific
Feature, structure, material or feature are contained at least one embodiment or example of the utility model.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can in an appropriate manner combine in any one or more embodiments or example.
While there has been shown and described that the embodiment of the utility model, those of ordinary skill in the art can manage
Solution：A variety of to the progress of these embodiments can change in the case of the principle and objective for not departing from the utility model, change,
It replaces and modification, the scope of the utility model is limited by claim and its equivalent.
Claims (10)
1. a kind of etching machines, which is characterized in that including etch chamber, electrode plate, the first support device and be arranged on described
The second support device between one support device, the electrode plate, first support device and the second support device position
In in the etch chamber, first support device is configured to by by workpiece portion being placed on the first support dress
It puts so that the workpiece is arranged at intervals with the electrode plate, second support device is configured to support the workpiece opposite
It is risen or fallen in the electrode plate.
2. etching machines as described in claim 1, which is characterized in that first support device include it is spaced at least
Two support arms, the support arm are formed with step structure, and the step structure is formed with support slot, two support arms
The support slot is oppositely arranged, and the step structure is configured as through being placed on the workpiece portion in the support slot
So that the workpiece is arranged at intervals with the electrode plate.
3. etching machines as claimed in claim 2, which is characterized in that second support device includes spaced multiple
Support column, the support column is through the electrode plate and is configured to that the workpiece is supported to rise or fall.
4. etching machines as claimed in claim 2, which is characterized in that the support arm includes being arranged on the step structure
Shock absorber part.
5. etching machines as claimed in claim 4, which is characterized in that first support device is formed through the support
Arm and the venthole for connecting the support slot.
6. etching machines as claimed in claim 5, which is characterized in that the shock absorber part and the venthole are arranged at intervals.
7. etching machines as described in claim 1, which is characterized in that the etching machines include plasma generator, institute
Plasma generator is stated to be configured to form plasma so that the surface of workpiece described in the plasma etching.
8. etching machines as described in claim 1, which is characterized in that the etching machines include blowning installation, the air blowing
Device is configured to cooling gas blowing to the workpiece.
9. etching machines as described in claim 1, which is characterized in that the etching machines include connecting the first support dress
The driving device put, the driving device be configured to drive first support device relative to the electrode plate rise or under
Drop.
10. etching machines as claimed in claim 2, which is characterized in that first support device includes 4 supports
Arm, the plane distribution of 4 support arms assume diamond in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721567699.5U CN207517641U (en) | 2017-11-20 | 2017-11-20 | Etching machines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721567699.5U CN207517641U (en) | 2017-11-20 | 2017-11-20 | Etching machines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207517641U true CN207517641U (en) | 2018-06-19 |
Family
ID=62540373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721567699.5U Active CN207517641U (en) | 2017-11-20 | 2017-11-20 | Etching machines |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207517641U (en) |
-
2017
- 2017-11-20 CN CN201721567699.5U patent/CN207517641U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200324 Address after: 518000 Rouyu international flexible display base, No.18 dingshanhe Road, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN ROYOLE DISPLAY TECHNOLOGY Co.,Ltd. Address before: 518172 43 Universiade Software Town, 8288 Longgang Avenue, Henggang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd. |
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Denomination of utility model: etcher Effective date of registration: 20201020 Granted publication date: 20180619 Pledgee: CITIC Bank Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN ROYOLE DISPLAY TECHNOLOGY Co.,Ltd. Registration number: Y2020980006952 |
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