CN207517067U - A kind of infrared scaling board synchronous with visible ray dual camera - Google Patents
A kind of infrared scaling board synchronous with visible ray dual camera Download PDFInfo
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- CN207517067U CN207517067U CN201720655643.9U CN201720655643U CN207517067U CN 207517067 U CN207517067 U CN 207517067U CN 201720655643 U CN201720655643 U CN 201720655643U CN 207517067 U CN207517067 U CN 207517067U
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- panel
- bottom plate
- scaling board
- visible ray
- infrared
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Abstract
The utility model discloses a kind of scaling boards for infrared camera calibration synchronous with visible image capturing head, the scaling board is by panel, heat conductive pad, cooling piece, conduction cooling pad, bottom plate, power supply, fixed screw, saddle covers heat bridge composition, scaling board uses panel, the design of bottom plate double-layer structure, upper strata panel temperature is relatively warm and appearance is white, lower floor's baseplate temp is relatively low and color is black, the panel of scaling board is according to the C＆T information that bottom plate is leaked out after calibration pattern hollow out, infrared camera and visible image capturing head can take identical calibration pattern according to the C＆T difference between panel and bottom plate, cooperation calibration software may realize infrared camera calibration synchronous with visible image capturing head, available in infrared and visible ray use processing system.
Description
Technical field
The utility model is related to a kind of scaling boards, are taken the photograph simultaneously suitable for infrared camera and visible ray more particularly to a kind of
As the fixed scaling board of leader, belong to camera calibration field.
Background technology
There are visible image capturing head and infrared camera in infrared image and visual image fusion system, they are acquired respectively
Visible images and infrared image.Due to two camera inner parameter is inconsistent and installation site is inconsistent etc. it is many because
Element leads to their acquired image visual field size and location disunities.Image fusion system is to a variety of band images of realization
Fusion, it is necessary first to distortion correction and spatial registration are carried out to two kinds of images after acquisition, to eliminate the distortion of each camera
And image is made spatially to be mutually aligned unanimously.Method that there are many corrections of infrared and visible image capturing head image and registration,
Fairly simple method is to use to be similar to the calibration solution that ordinary stereo calibration principle is realized.
In common binocular solid scaling method by the graphic-print for having particular law on scaling board, to be calibrated two are taken the photograph
As the same scaling board of head acquisition and its surrounding image, mark is searched in the image that then calibrating procedure is got in two width cameras
Position and size in image coordinate system residing for fixed board pattern, and by with being calculated after the comparison of the actual physical size of scaling board
The parameters such as focal length, zoom ratio and the distortion degree of each camera, while the letter of the relative position between two cameras can also be obtained
Breath.It can realize that the distortion correction of two different camera acquired images and space are matched using parameter obtained by calibrating
It is accurate.Scaling board image is generally printed on hard plate material or ceramic material, in this way demarcate plate pattern between relative position not
It can be because phenomenon deformation be expanded with heat and contract with cold, so as to ensure the precision of calibration.
However in infrared camera and visible image capturing leader are fixed, since infrared camera is to the scaling board figure of printing type
Case（Especially middle Long Wave Infrared Probe）It is insensitive, therefore visible image capturing head and infrared can not be realized using common scaling board
The synchronous calibration of camera.Existing infrared camera method uses round steel ball and the realization of high-precision three-dimensional posture instrument, this method
Cost is higher and calibration flow is complicated.It can be real currently without molding infrared camera and visible image capturing leader fixed board product
Existing infrared camera is synchronous with the high efficiency of visible image capturing head to be demarcated.The scaling board cost of general user's autonomous Design is higher,
And calibration effect is bad.
Utility model content
In order to solve the above problem present in background technology, the utility model devises infrared and visible ray double wave segment mark
Fixed board can realize infrared camera calibration synchronous with visible image capturing head, be merged available for visible images with infrared image
In the system of processing.
To achieve these goals, the specific technical solution of the utility model is as follows：
A kind of infrared and visible ray dual camera scaling board, including panel, heat conductive pad, cooling piece, conduction cooling pad, bottom plate, electricity
Source, fixed screw, saddle cover heat bridge, and panel is arranged on above bottom plate, and polylith cooling piece is provided between panel and bottom plate, is freezed
Piece is connect by conduction cooling pad with bottom plate, and cooling piece is connect by heat conductive pad with panel, and the power supply is connect with cooling piece, on bottom plate
It is provided with multiple saddle and covers heat bridge, fixed between panel and bottom plate, between cooling piece and panel, bottom plate by fixed screw；
Panel appearance color is white, and bottom plate appearance color is black, and panel temperature is higher than baseplate temp, is come in a manner of hollow out on panel
Represent the pattern of scaling board.
Further, using the circular array of hollow out and corner cut square boundary pattern as the pattern of scaling board on the panel,
Each the spacing between small diameter of a circle and the center of circle determines, jagged on square boundary.
Further, it is connected between the circular array patterning on the panel and outside by leave strip.
Further, the cooling piece is semiconductor chilling plate, and polylith semiconductor chilling plate is separately mounted to panel and bottom plate
Between multiple and different orientation, the refrigeration face of cooling piece connect by conduction cooling pad with bottom plate side, and the radiating surface of cooling piece passes through
Heat conductive pad is connect with panel side.
Further, the appearance color of the panel and bottom plate is realized by different coating, the temperature of panel and bottom plate
It is realized and controlled using semiconductor chilling plate.
Further, it is four that the saddle, which covers heat bridge, and the color that saddle covers heat bridge is black.
Further, the panel and bottom plate are made of alloy material, to increase the temperature diffusion of refrigerated medium heat source.
Further, the power supply is constant voltage/current isolator, unifies power supply mode or independence after multi-disc refrigeration piece collection parallel connection
Adjust power supply mode.
Further, the pattern of the scaling board can pass through the calibration in Halcon softwares by Halcon software Direct Recognitions
Function realizes calibration.The recognizer for voluntarily writing circular array feature is needed to find out two calibration if using OpenCV softwares
Character pair point in plate could realize calibration to after.
The utility model compared with prior art, has the following advantages：
（1）It can realize infrared camera calibration synchronous with visible image capturing head, it is higher to make simple and calibration efficiency.
（2）It is designed using double-layer metal plate cold and hot surface, the temperature distribution of scaling board, cost is realized using semiconductor chilling plate
It is relatively low and with obvious effects.
Description of the drawings
Fig. 1 is the overall structure figure of the utility model；
Fig. 2 is the panel size figure of the utility model；
Fig. 3 is cooling piece scheme of installation in the utility model；
Fig. 4 is cooling piece electrical schematic in the utility model；
Reference sign：1- panels, 2- heat conductive pads, 3- cooling pieces, 4- conduction cooling pads, 5- bottom plates, 6- power supplys, 7- are fixed
Screw, 8- saddle cover heat bridge.
Specific embodiment
Below with reference to attached drawing, the technical solution of the utility model is described further：
Embodiment 1
As shown in Figure 1, one kind described in the utility model is infrared and visible ray dual camera scaling board is by following portion
Divide and form：Panel 1, heat conductive pad 2, cooling piece 3, conduction cooling pad 4, bottom plate 5, power supply 6, fixed screw 7, saddle cover heat bridge 8, panel 1
5 top of bottom plate is arranged on, polylith cooling piece 3 is provided between panel 1 and bottom plate 5, cooling piece 3 is connected by conduction cooling pad 4 and bottom plate 5
It connects, cooling piece 3 is connect by heat conductive pad 2 with panel 1, and the power supply 6 is connect with cooling piece 3, and multiple saddle are provided on bottom plate 5
Heat bridge 8 is covered, is fixed between panel 1 and bottom plate 5, between cooling piece 3 and panel 1, bottom plate 5 by fixed screw 7；Outside panel 1
Color is seen as white, 5 appearance color of bottom plate is black, and 1 temperature of panel is higher than 5 temperature of bottom plate, is carried out table in a manner of hollow out on panel 1
The pattern of indicating fixed board.
The realization principle of scaling board is：Scaling board uses the design of panel 1,5 double-layer structure of bottom plate, 1 temperature of upper strata panel
Relatively hot and appearance is white, and 5 temperature of lower floor's bottom plate is relatively low and color is black, represents to mark in a manner of hollow out on panel 1
The pattern of fixed board is leaked out the C＆T information of bottom plate 5 by the part of hollow out, passes through the face between control panel 1 and bottom plate 5
The difference of color and temperature is so as to make infrared camera and visible image capturing head can get calibration maps in same scaling board
Case.
Panel 1 and bottom plate 5 are made of the preferable alloy material of thermal conductivity, to realize preferable heat-transfer effect, this reality
It applies in example and is designed using stainless steel material.
In order to ensure that infrared camera and visible image capturing head can identify calibration pattern simultaneously, scaling board uses double
Layer structural panel and different and temperature and color combine：The temperature of panel 1 is relatively hot and appearance is white, the temperature of bottom plate 5
Relatively low and color is spent for black, and appearance color is realized by using different coating, and the temperature of panel 1 utilizes semiconductor refrigerating
The refrigeration and heat sinking function of piece 3 realize control, and the semiconductor chilling plate of model TEC1-12703 is used in the present embodiment.
Using the circular array of hollow out and corner cut square boundary pattern as the pattern of scaling board, Mei Ge little on the panel 1
Spacing between diameter of a circle and the center of circle determines, jagged on square boundary.
As shown in Fig. 2, scaling board is designed and sized to 30 × 30cm in embodiment, wherein the main part of calibration pattern accounts for
It is 20 × 20cm according to space.Using circular array pattern as calibration identification icon in the panel 1 of scaling board, set in the present embodiment every
A diameter of 1.25cm of a roundlet, the spacing between the center of circle are 2.5cm, and devise notch in the upper left corner of panel 1 with convenient
Calibrating procedure identifies the direction of rotation of scaling board.According to the requirement of stated accuracy, the specific quantity of the circle in circular array and big
Small voluntarily to be set according to the accuracy requirement of calibration, circle number of patterns more at most stated accuracy is relatively higher, battle array in the present embodiment
Row size is 7 × 7.
It is connected between circular array patterning and outside on the panel 1 by leave strip, and play the role of heat transfer.
But the leave strip of four direction can destroy the rectangular shape of circular array periphery, be broken caused by pattern to solve leave strip
Bad problem devises 4 saddle in scaling board and covers heat bridge 8.The color that saddle covers heat bridge 8 is black, and saddle as 5 bottom plates
Heat bridge 8 is covered to be fixed on bottom plate 5 thus in low temperature.
The fixed screw 7 of penetration type is used between panel 1 and bottom plate 5 and between cooling piece 3 and panel 1, bottom plate 5
It is fixed.
The polylith semiconductor chilling plate 3 is respectively placed at orientation multiple and different between panel and bottom plate, cooling piece 3
Refrigeration face is connect by bottom plate side with conduction cooling pad, and the radiating surface of cooling piece 3 is connect by panel side with heat conductive pad.
As shown in figure 3, there is polylith cooling piece 3 to be respectively placed at four different sides up and down between panel 1 and bottom plate 5
On position, so as to ensure the temperature equalization of panel 1 and bottom plate 5, and mounting means is：5 side of bottom plate is leaned in the refrigeration face of cooling piece 3,
The radiating surface of semiconductor chilling plate 3 leans on 1 side of panel.It using heat conductive pad 2 and is led successively between cooling piece 3 and panel 1, bottom plate 5
Cold pad 4 connects, and gasket can play buffering, fixation and conductive force.
Since the rated power of general semiconductor refrigerating flake products is all very big, and scaling board does not need to be too big in actual work
Refrigeration work consumption, therefore power for constant voltage/current isolator using power supply 6 easily to control and adjust the power of cooling piece 3.Multi-disc
Semiconductor chilling plate 3 unifies power supply mode after can taking parallel connection or separately adjustable power supply mode, former mode can be right
The power of all cooling pieces 3 carries out unified adjustment, and latter approach can individually adjust the power of each cooling piece 3.
One is used after power supply mode as shown in Figure 4 disclosed in the present embodiment, i.e. 3 parallel connection of each two semiconductor chilling plate
Constant current constant voltage source 6 powers, and the output current in constant current constant voltage source 6 can adjust, so as to fulfill to connected two semiconductor systems
The power of cold 3 is controlled.
The pattern of the scaling board can be by Halcon software Direct Recognitions, therefore the mark in Halcon softwares may be used
Determine function and be directly realized by calibration.
It is demarcated if based on OpenCV libraries, then needs voluntarily to write the feature of circular array and corner cut square boundary
Recognizer, to find out realization calibration after character pair point and matching double points in two scaling boards.
Claims (7)
1. a kind of infrared scaling board synchronous with visible ray dual camera, which is characterized in that including panel, heat conductive pad, cooling piece, lead
Cold pad, bottom plate, power supply, fixed screw, saddle cover heat bridge, and panel is arranged on above bottom plate, is provided between panel and bottom plate more
Block cooling piece, cooling piece are connect by conduction cooling pad with bottom plate, and cooling piece is connect by heat conductive pad with panel, the power supply and refrigeration
Piece connects, and being provided with multiple saddle on bottom plate covers heat bridge, passes through between panel and bottom plate, between cooling piece and panel, bottom plate
Fixed screw is fixed；Panel appearance color is white, and bottom plate appearance color is black, and panel temperature is higher than baseplate temp, panel
On represent the pattern of scaling board in a manner of hollow out.
A kind of 2. infrared scaling board synchronous with visible ray dual camera as described in claim 1, which is characterized in that the panel
On using the circular array of hollow out and corner cut square boundary pattern as the pattern of scaling board, each between small diameter of a circle and the center of circle
Spacing determine, it is jagged on square boundary.
A kind of 3. infrared scaling board synchronous with visible ray dual camera as described in claim 1, which is characterized in that the refrigeration
Piece is semiconductor chilling plate, and polylith semiconductor chilling plate is separately mounted to orientation multiple and different between panel and bottom plate, refrigeration
The refrigeration face of piece is connect by conduction cooling pad with bottom plate side, and the radiating surface of cooling piece is connect by heat conductive pad with panel side.
A kind of 4. infrared scaling board synchronous with visible ray dual camera as claimed in claim 3, which is characterized in that the panel
It is realized with the appearance color of bottom plate by different coating, the temperature of panel and bottom plate realizes control using semiconductor chilling plate.
A kind of 5. infrared scaling board synchronous with visible ray dual camera as described in claim 1, which is characterized in that the saddle
It is four to cover heat bridge, and the color that saddle covers heat bridge is black.
A kind of 6. infrared scaling board synchronous with visible ray dual camera as described in claim 1, which is characterized in that the panel
It is made with bottom plate of alloy material.
A kind of 7. infrared scaling board synchronous with visible ray dual camera as described in claim 1, which is characterized in that the power supply
For constant voltage/current isolator, unified power supply mode or separately adjustable power supply mode after multi-disc refrigeration piece collection parallel connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720655643.9U CN207517067U (en) | 2017-06-07 | 2017-06-07 | A kind of infrared scaling board synchronous with visible ray dual camera |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720655643.9U CN207517067U (en) | 2017-06-07 | 2017-06-07 | A kind of infrared scaling board synchronous with visible ray dual camera |
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| CN207517067U true CN207517067U (en) | 2018-06-19 |
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| CN201720655643.9U Expired - Fee Related CN207517067U (en) | 2017-06-07 | 2017-06-07 | A kind of infrared scaling board synchronous with visible ray dual camera |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107067442A (en) * | 2017-06-07 | 2017-08-18 | 云南师范大学 | A kind of infrared scaling board synchronous with visible ray dual camera |
| CN112184784A (en) * | 2020-09-27 | 2021-01-05 | 烟台艾睿光电科技有限公司 | Double-spectrum image alignment method and device, electronic equipment and storage medium |
-
2017
- 2017-06-07 CN CN201720655643.9U patent/CN207517067U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107067442A (en) * | 2017-06-07 | 2017-08-18 | 云南师范大学 | A kind of infrared scaling board synchronous with visible ray dual camera |
| CN107067442B (en) * | 2017-06-07 | 2023-08-15 | 云南师范大学 | Infrared and visible light double-camera synchronous calibration plate |
| CN112184784A (en) * | 2020-09-27 | 2021-01-05 | 烟台艾睿光电科技有限公司 | Double-spectrum image alignment method and device, electronic equipment and storage medium |
| CN112184784B (en) * | 2020-09-27 | 2023-06-06 | 烟台艾睿光电科技有限公司 | Dual-spectrum image alignment method and device, electronic equipment and storage medium |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180619 Termination date: 20200607 |