CN207503947U - A kind of silicon chip detent mechanism - Google Patents
A kind of silicon chip detent mechanism Download PDFInfo
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- CN207503947U CN207503947U CN201721046649.2U CN201721046649U CN207503947U CN 207503947 U CN207503947 U CN 207503947U CN 201721046649 U CN201721046649 U CN 201721046649U CN 207503947 U CN207503947 U CN 207503947U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of silicon chip detent mechanism, including：Firm banking；Drive component on firm banking；And the left and right limit assembly on firm banking, wherein, left and right limit assembly includes sliding the left limit plate and right limit plate being coupled on firm banking, left limit plate is parallel with right limit plate and is arranged at intervals to form the placed channel being located between the two, and left limit plate is selectively close to each other or separate under the driving of drive component with right limit plate.According to the utility model, improve silicon wafer horizontal degree and to moderate precision simultaneously, additionally it is possible to the efficiency of positioning centering is improved, so as to further improve production efficiency.
Description
Technical field
The utility model is related to machinery field, more particularly to a kind of silicon chip detent mechanism.
Background technology
In general, silicon chip of solar cell recipe step is included with next step：1st, making herbs into wool, by silicon chip surface corruption
Lose the pattern of pyramid；2nd, it spreads, silicon chip surface forms PN junction；3rd, it etches, the PN junction of silicon chip edge is removed, prevents electricity
Pond short circuit；4th, PSG is removed, cleaning silicon chip surface removes silicon dioxide layer；5th, PECVD plates one layer of antireflective coating in silicon chip surface；
6th, printing-sintering, prints electrode and back surface field, and dries sintering.In above-mentioned recipe step, need repeatedly to shift silicon chip,
And just need to position the spatial position of silicon chip in transfer process, ensure its centering and levelness, so as to improve silicon chip
Processing quality, in the prior art to the centering of silicon chip positioning need human assistance the step of it is more, lead to the degree of automation
It is low, centering location efficiency is low, while centering positioning precision it is also limited.In view of this, it is really necessary to develop a kind of silicon chip to determine
Position mechanism, to solve the above problems.
Utility model content
For the shortcomings of the prior art, the purpose of this utility model is to provide a kind of silicon chip detent mechanism,
Its improve silicon wafer horizontal degree and to moderate precision simultaneously, additionally it is possible to improve positioning centering efficiency, so as to further improve
Production efficiency.
In order to realize above-mentioned purpose according to the present utility model and other advantages, a kind of silicon chip detent mechanism is provided, is wrapped
It includes：
Firm banking；
Drive component on firm banking；And
Left and right limit assembly on firm banking,
Wherein, left and right limit assembly includes sliding the left limit plate and right limit plate being coupled on firm banking, left limit
Plate is parallel with right limit plate and is arranged at intervals to form the placed channel being located between the two, and left limit plate is driving with right limit plate
It is selectively close to each other or separate under the driving of dynamic component.
Preferably, drive component includes：
Driving motor；And
The first oval plate being sequentially connected with the power output end of driving motor, periphery is oval,
Wherein, the first oval plate is set on fixed seat and between left limit plate and right limit plate, left limit plate
Inside and the inside of right limit plate contact always with the periphery retaining surface of the first oval plate.
Preferably, the bottom inside of left limit plate and the bottom inside of right limit plate have been respectively and fixedly connected with left slider and right cunning
Block, firm banking are equipped with left rail plate between left limit plate and right limit plate and right rail plate, left slider and
Right sliding block slides with left rail plate and right rail plate be coupled respectively, and the inside of the inside of left slider and right sliding block is always with the
The periphery retaining surface contact of one oval plate.
Preferably, the left limit wheel for rolling connection and the right side are respectively equipped at the top of the top of left limit plate and right limit plate
Position-limited wheel.
Preferably, the upstream of the placed channel, the side of firm banking are connected with located upstream component.
Preferably, located upstream component includes：
With the upstream pedestal of firm banking Joint；And
Upstream gag lever post on the pedestal of upstream,
Wherein, upstream gag lever post can be on the pedestal of upstream toward polyslip.
Preferably, the first oval plate is equipped with the second oval oval plate of periphery, the second oval plate and driving electricity
The power output end of machine is sequentially connected, and the inside of upstream gag lever post contacts always with the periphery retaining surface of the second oval plate, upstream
Gag lever post is selectively close to each other under the driving of drive component or far from the placed channel.
Preferably, the long axis of the first oval plate and the long axis of the second oval plate are perpendicular.
Preferably, upstream pedestal is equipped with the upstream rail plate perpendicular to the placed channel, upstream gag lever post
Bottom is connected with the upstream sliding block that mating is slided with upstream rail plate, and upstream sliding block is equipped with link block.
Preferably, one end of link block and upstream sliding block Joint, the other end then with the periphery of the second oval plate always
Retaining surface contacts, and upstream rail plate and horizontal plane form an angle α.
Compared with prior art, advantage is the utility model：It is in raising silicon wafer horizontal degree and to moderate precision
Simultaneously, additionally it is possible to the efficiency of positioning centering is improved, so as to further improve production efficiency.
Description of the drawings
Fig. 1 is the stereogram according to silicon chip detent mechanism described in the utility model；
Fig. 2 is the left view according to silicon chip detent mechanism described in the utility model.
Specific embodiment
The following describes the utility model in further detail with reference to the accompanying drawings, the aforementioned and other mesh of the utility model
, feature, aspect and advantage will be apparent, to enable those skilled in the art can be real according to this with reference to specification word
It applies.In the accompanying drawings, for clarity, shape and size can be amplified, and identical attached drawing mark will be used in all figures
Remember to indicate the same or similar component.In the description, such as " forepart ", " rear portion ", " top ", " lower part ", " top " and
The relative terms of " bottom " and its derivative words should be interpreted to refer to then as described in or such as the institute in the attached drawing being discussed
The orientation shown.These relative terms are for convenience and are usually not intended to need specifically to be orientated.It is related to attached
The term (for example, " connection " and " attachment ") connect, couple etc. refers to that these structures are solid directly or indirectly to one another by intermediate structure
Fixed or attachment relationship and movable or rigidly attached or relationship, unless otherwise clearly stating.
With reference to Fig. 1, silicon chip detent mechanism 3 includes：Firm banking 31, drive component 32, left and right limit assembly 34, wherein,
Drive component 32 and left and right limit assembly 34 are set on firm banking 31, and left and right limit assembly 34, which includes sliding, is coupled to fixation
Left limit plate 341 and right limit plate 342 on pedestal 31, left limit plate 341 it is parallel with right limit plate 342 and be arranged at intervals with
Form the placed channel being located between the two, the selectivity under the driving of drive component 32 with right limit plate 342 of left limit plate 341
Ground is close to each other or separate.In a preferred embodiment, one is additionally provided between left limit plate 341 and right limit plate 342 to be used for
The article carrying platform (not shown) of silicon chip is carried, thus when left limit plate 341 and right limit plate 342 are close to each other, article carrying platform
On silicon chip can be clamped positioning, can will be to be clamped fixed and when left limit plate 341 and right limit plate 342 are located remotely from each other
The silicon chip of position is put on article carrying platform.
Referring again to Fig. 1, drive component 32 includes：
Driving motor 321；And
The first oval plate 322 being sequentially connected with the power output end of driving motor 321, periphery is oval,
Wherein, the first oval plate 322 be set on firm banking 31 and positioned at left limit plate 341 and right limit plate 342 it
Between, the periphery retaining surface of the inside of left limit plate 341 and the inside of right limit plate 342 always with the first oval plate 322 contacts.When
It is left when the inside of left limit plate 341 and the inside of right limit plate 342 are in contact with the longitudinal end peripheral surface of the first oval plate 322
Placed channel between limiting plate 341 and right limit plate 342 is opened, and at this time can be put into the silicon chip of positioning to be clamped；And work as
It is left when the inside of left limit plate 341 and the inside of right limit plate 342 are in contact with the short axle end peripheral surface of the first oval plate 322
Limiting plate 341 is close with right limit plate 342 and the two is closest, at this time can position the silicon wafer clamping in placed channel.
Further, the bottom inside of left limit plate 341 and the bottom inside of right limit plate 342 have been respectively and fixedly connected with left slider
3411 and right sliding block 3421, firm banking 31 is equipped with the left rail plate between left limit plate 341 and right limit plate 342
311 and right rail plate 312, left slider 3411 and right sliding block 3421 respectively with left rail plate 311 and right rail plate 312
Periphery retaining surface of the inside of slip mating, the inside of left slider 3411 and right sliding block 3421 always with the first oval plate 322 connects
It touches.So that left limit plate 341 and right limit plate 342 can on firm banking 31 Stable sliding.
Further, the top of left limit plate 341 and the top of right limit plate 342 are respectively equipped with the left limit for rolling connection
Wheel 3412 and right limit wheel 3422.Left limit wheel 3412 and right limit wheel 3422 can be by left limit plates 341 and right limit plate 342
The face contact force for being applied to silicon chip the right and left becomes rolling contact power, reduces left limit plate 341 with right limit plate 342 to silicon chip
Compressing, so as to playing certain protective effect to silicon chip.
Referring again to Fig. 1, the upstream of the placed channel, the side of firm banking 31 are connected with located upstream component 33.
Further, located upstream component 33 includes：
With the upstream pedestal 331 of 31 Joint of firm banking；And
Upstream gag lever post 333 on upstream pedestal 331,
Wherein, upstream gag lever post 333 can be on upstream pedestal 331 toward polyslip.
Referring again to Fig. 1, the first oval plate 322 is equipped with the second oval oval plate 323 of periphery, the second oval plate
323 are sequentially connected with the power output end of driving motor 321, the inside of upstream gag lever post 333 always with the second oval plate 323
Periphery retaining surface contact, upstream gag lever post 333 are selectively close to each other under the driving of drive component 32 or far from described fixed
Bit port.So that upstream gag lever post 333 can play the role of the upstream edge of silicon chip limiting and then position.
Further, the long axis of the first oval plate 322 and the long axis of the second oval plate 323 are perpendicular.So that when a left side
When the inside of limiting plate 341 and the inside of right limit plate 342 are in contact with the longitudinal end peripheral surface of the first oval plate 322, upstream
Longitudinal end peripheral surface of the inside of gag lever post 333 also with the second oval plate 323 is in contact, at this time left limit plate 341 and right limit
The upstream of placed channel and placed channel between plate 342 is opened, and at this time can be put into the silicon chip of positioning to be clamped；Work as a left side
When the inside of limiting plate 341 and the inside of right limit plate 342 are in contact with the short axle end peripheral surface of the first oval plate 322, upstream
The inside of gag lever post 333 is also in contact with the short axle end peripheral surface of the second oval plate 323, at this time left limit plate 341 and right limit
The upstream of placed channel and placed channel between plate 342 is closed, and silicon chip can be clamped positioning at this time.
With reference to Fig. 2, upstream pedestal 331 is equipped with the upstream rail plate 334 perpendicular to the placed channel, upstream limiting
The bottom of bar 333 is connected with the upstream sliding block 3331 that mating is slided with upstream rail plate 334, and upstream sliding block 3331, which is equipped with, to be connected
Connect block 332.
Further, one end of link block 332 and 3331 Joint of upstream sliding block, the other end then with the second oval plate 323
Periphery remain that face contacts, upstream rail plate 334 and horizontal plane form an angle α.In a preferred embodiment, even
It connects to roll on one end that block 332 is contacted with the periphery retaining surface of the second oval plate 323 and is connected with upstream pulley 3321, which slides
Wheel 3321 keeps rolling surface to contact with the periphery of the second oval plate 323, so as to reduce the abrasion of the second oval plate 323, carries
High-durability.In another embodiment, angle α is 30 °.In another embodiment, angle α is 45 °.
Number of devices and treatment scale described herein are the explanations for simplifying the utility model.To the utility model
Application, modifications and variations will be readily apparent to persons skilled in the art.
Although the embodiment of the utility model is disclosed as above, it is not limited in institute in specification and embodiment
Row use, it can be applied to various fields suitable for the present invention completely, for those skilled in the art, can
Easily realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, this practicality
It is novel to be not limited to specific details and legend shown and described herein.
Claims (10)
1. a kind of silicon chip detent mechanism (3), which is characterized in that including：
Firm banking (31)；
Drive component (32) on firm banking (31)；And
Left and right limit assembly (34) on firm banking (31),
Wherein, left and right limit assembly (34) is including sliding the left limit plate (341) and the right limit that are coupled on firm banking (31)
Plate (342), left limit plate (341) is parallel with right limit plate (342) and interval setting is led to forming the positioning being located between the two
Road, left limit plate (341) are selectively close to each other or separate under the driving of drive component (32) with right limit plate (342).
2. silicon chip detent mechanism (3) as described in claim 1, which is characterized in that drive component (32) includes：
Driving motor (321)；And
The first oval plate (322) being sequentially connected with the power output end of driving motor (321), periphery is oval,
Wherein, the first oval plate (322) is on firm banking (31) and positioned at left limit plate (341) and right limit plate
(342) between, the inside of left limit plate (341) and the inside of right limit plate (342) periphery with the first oval plate (322) always
Retaining surface contacts.
3. silicon chip detent mechanism (3) as claimed in claim 2, which is characterized in that the bottom inside of left limit plate (341) and the right side
The bottom inside of limiting plate (342) has been respectively and fixedly connected with left slider (3411) and right sliding block (3421), and firm banking (31) is equipped with
Left rail plate (311) and right rail plate (312) between left limit plate (341) and right limit plate (342), left slider
(3411) and right sliding block (3421) slides with left rail plate (311) and right rail plate (312) be coupled respectively, left slider
(3411) the periphery retaining surface of inside and the inside of right sliding block (3421) always with the first oval plate (322) contacts.
4. silicon chip detent mechanism (3) as claimed in claim 3, which is characterized in that the top of left limit plate (341) and right limit
It is respectively equipped at the top of plate (342) and rolls the left limit wheel (3412) of connection and right limit wheel (3422).
5. silicon chip detent mechanism (3) as claimed in claim 2, which is characterized in that the upstream of the placed channel, firm banking
(31) side is connected with located upstream component (33).
6. silicon chip detent mechanism (3) as claimed in claim 5, which is characterized in that located upstream component (33) includes：
With the upstream pedestal (331) of firm banking (31) Joint；And
Upstream gag lever post (333) on upstream pedestal (331),
Wherein, upstream gag lever post (333) can be on upstream pedestal (331) toward polyslip.
7. silicon chip detent mechanism (3) as claimed in claim 6, which is characterized in that the first oval plate (322) is in equipped with periphery
The second oval plate (323) of ellipse, the second oval plate (323) and the power output end of driving motor (321) are sequentially connected, on
Periphery retaining surface of the inside of trip gag lever post (333) always with the second oval plate (323) contacts, and upstream gag lever post (333) is driving
It is selectively close to each other or far from the placed channel under the driving of dynamic component (32).
8. silicon chip detent mechanism (3) as claimed in claim 7, which is characterized in that the long axis and second of the first oval plate (322)
The long axis of oval plate (323) is perpendicular.
9. silicon chip detent mechanism (3) as claimed in claim 7, which is characterized in that upstream pedestal (331) is equipped with perpendicular to institute
The upstream rail plate (334) of placed channel is stated, the bottom of upstream gag lever post (333) is connected with and upstream rail plate (334)
The upstream sliding block (3331) of mating is slided, upstream sliding block (3331) is equipped with link block (332).
10. silicon chip detent mechanism (3) as claimed in claim 9, which is characterized in that slided with upstream one end of link block (332)
Block (3331) Joint, periphery of the other end then with the second oval plate (323) remain that face contacts, upstream rail plate
(334) form an angle α with horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721046649.2U CN207503947U (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip detent mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721046649.2U CN207503947U (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip detent mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503947U true CN207503947U (en) | 2018-06-15 |
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ID=62496243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721046649.2U Active CN207503947U (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip detent mechanism |
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| Country | Link |
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| CN (1) | CN207503947U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658255A (en) * | 2017-08-21 | 2018-02-02 | 罗博特科智能科技股份有限公司 | A kind of silicon chip detent mechanism |
| CN111627853A (en) * | 2020-07-30 | 2020-09-04 | 清华大学 | Wafer centering device |
-
2017
- 2017-08-21 CN CN201721046649.2U patent/CN207503947U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658255A (en) * | 2017-08-21 | 2018-02-02 | 罗博特科智能科技股份有限公司 | A kind of silicon chip detent mechanism |
| CN107658255B (en) * | 2017-08-21 | 2023-08-25 | 罗博特科智能科技股份有限公司 | Silicon wafer positioning mechanism |
| CN111627853A (en) * | 2020-07-30 | 2020-09-04 | 清华大学 | Wafer centering device |
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