CN207473567U - Cover sheet, touch screen cover board and touch-control display panel - Google Patents
Cover sheet, touch screen cover board and touch-control display panel Download PDFInfo
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- CN207473567U CN207473567U CN201721028172.5U CN201721028172U CN207473567U CN 207473567 U CN207473567 U CN 207473567U CN 201721028172 U CN201721028172 U CN 201721028172U CN 207473567 U CN207473567 U CN 207473567U
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Abstract
Cover sheet disclosed in the utility model includes the transparent semiconductor layer of substrate and setting on the substrate, and the resistance value of the semiconductor layer is 105Ω/□‑109Ω/□.Cover sheet sets semiconductor layer on substrate, and semiconductor layer is enable to reduce the influence for the electronic component that cover sheet is provided below in extraneous static field, so as to which electronic component be avoided to fail.The invention also discloses a kind of touch screen cover board and touch-control display panels.
Description
Technical field
The utility model is related to technical field of touch control, more particularly to a kind of cover sheet, touch screen cover board and touch-control are shown
Panel.
Background technology
Cover sheet is generally located on electronic component (such as touch sensing), when cover sheet is located at local electrostatic field
When in stronger environment, the part of electronic component can form high pressure or larger circuit and fail so as to cause electronic component.
Utility model content
The embodiment of the utility model provides a kind of cover sheet, touch screen cover board and touch-control display panel.
The cover sheet of the utility model embodiment includes：
Substrate；And
The transparent semiconductor layer of setting on the substrate, the resistance value of the semiconductor layer is 105Ω/□-109Ω/
□.When the resistance value of semiconductor layer is less than 105Ω/, then during user's operation cover sheet, semiconductor layer can participating user and flexibility
The formation of coupled capacitor between touch sensing, while entire semiconductor layer is in same equipotential, when user is in cover sheet
Upper any position operates, and the signal detected by each subdivision sensor array on flexible touch sensing is identical, so as to lead
Cause flexible touch sensing that can not carry out position of touch detection.If the resistance value of semiconductor layer is more than 109Ω/, then semiconductor
The attribute of layer is insulator, and in the external world, there are high electrostatic while locally lying in a large amount of charges (namely the external world), semiconductor layers
On a large amount of charges cannot quickly be distributed in the surface of semiconductor layer or other places are transmitted to by semiconductor layer, thus partly lead
The a large amount of charges of local convergence collection of body layer, a large amount of charges of semiconductor layer part rapid aggregation can make pair of flexible touch sensing
Answer on local location can a large amount of charges of rapid aggregation, whens local location rapid aggregation of flexible touch sensing a large amount of charges is flexible
Touch sensing can form larger current, and the electric current on flexible touch sensing can cause flexible touch sensing to be hit when excessive
It wears and open circuit occurs.Therefore the resistance value of the semiconductor layer is 105Ω/□-109Ω/ is suitable.
In some embodiments, the resistance value of the semiconductor layer is 106Ω/□-108Ω/□.When the resistance of semiconductor layer
Be worth is 106Ω/□-108Ω/ can enable during user's operation protection cover board flexibility touch sensing pick up electric signal so as to
Realize position of touch detection, and can be when the external world is in the presence of local high voltage (namely a large amount of charges in part) by charge Quick uniform
Conduct to the surface of semiconductor layer or prevent the charge-conduction on semiconductor layer to other regions the electrostatic of touch sensing
It wounds.
In some embodiments, the material of the semiconductor layer includes polymer semiconductor.Polymer semiconductor it is soft
Property is more preferable compared with the toughness of inorganic semiconductor, and therefore, semiconductor layer, which is made, in polymer semiconducting material can make the tough of cover sheet
Property is preferable.
In some embodiments, the material of the semiconductor layer includes inorganic semiconductor, and the inorganic semiconductor includes
Zinc tin oxide, antimony pentoxide, SnO2:P, any one in zinc oxide, carbon nanotube, silicon carbide, GaAs.It is inorganic partly to lead
The stability of semiconductor layer made of body is compared with semiconductor layer made of polymer semiconductor, therefore, inorganic semiconductor manufactured half
Conductor layer can make the performance of cover sheet more stable.
In some embodiments, the semiconductor layer is arranged on the side of the close user of the substrate.
In some embodiments, the semiconductor layer is arranged on the side of the separate user of the substrate.When substrate has
When having anti-fingerprint to act on and having higher hardness, the side of the close user of substrate can be not provided with anti-finger print layer and superabrasive layer just
It can make cover sheet that there is anti-fingerprint effect anti-scratch effect.
In some embodiments, the cover sheet further includes polaroid, and it is remote that the polaroid is arranged on the substrate
From user side, the semiconductor layer is arranged on the polaroid.Polaroid is as the base material for setting semiconductor layer and incites somebody to action partly
Conductor layer is produced on polaroid, and cover sheet can directly be glued using existing substrate with being provided with the polaroid of semiconductor layer
It connects to be formed, wounded substrate when avoiding semiconductor layer being produced on substrate.
In some embodiments, the cover sheet further includes insulating layer and anti-finger print layer, the insulating layer and described
Anti-finger print layer is successively set on the semiconductor layer.When user's operation cover sheet, anti-finger print layer can be reduced and is adhered to
Moisture content and greasy dirt on cover sheet.
In some embodiments, the cover sheet, which further includes, is arranged between the insulating layer and the anti-finger print layer
Superabrasive layer, the superabrasive layer is for protecting the cover sheet.Superabrasive layer can be used for protection cover sheet to avoid protection cap
The surface of plate easily scratches.
The touch screen cover board of the utility model embodiment includes：
Cover sheet described in above-mentioned any one embodiment；With
Flexible touch sensing, the flexibility touch sensing are arranged on the side of the separate user of the cover sheet.
In some embodiments, the flexible touch sensing includes metal grill sensor, silver nanowire film passes
Sensor and carbon nano-tube film.Due to metal grill sensor, silver nanowire thin film sensor and carbon nano-tube film have compared with
Good toughness, thus set the toughness of the touch screen cover board of flexible touch sensing preferable.
In some embodiments, the touch screen cover board includes polaroid and the touch-control being arranged on polaroid electricity
Pole, in the side of the separate user of the substrate, the semiconductor layer, the polaroid and the touch control electrode sequentially form
On the substrate.Polaroid is as the base material for setting touch control electrode and touch control electrode is produced on polaroid, touch screen lid
Plate can be formed directly using existing cover sheet is be bonded with the polaroid for being provided with touch control electrode, be avoided touch control electrode system
Make injury protection cover board when on cover sheet.
The touch-control display panel of the utility model embodiment includes：
Touch screen cover board described in above-mentioned any one embodiment；With
Display module, the display module are arranged on the separate user side of the cover sheet, and the flexibility touch-control passes
Sensor is between the cover sheet and the display module or is integrated in the display module.
Touch-control display panel, touch screen cover board and the cover sheet of the utility model embodiment set on substrate and partly lead
Body layer enables semiconductor layer to reduce the influence for the electronic component that cover sheet is provided below in extraneous static field, so as to avoid
Electronic component fails.
The additional aspect and advantage of the embodiment of the utility model will be set forth in part in the description, partly will be from
The practice for becoming embodiment that is apparent or passing through the utility model in following description is recognized.
Description of the drawings
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination accompanying drawings below to embodiment
It will be apparent and be readily appreciated that, wherein：Illustrating in newly-increased attached drawing modification, specification
Fig. 1-3 is the sectional view of the cover sheet of the utility model certain embodiments；
Fig. 4 is the sectional view of the touch-control display panel of the utility model certain embodiments；
Fig. 5 is the sectional view of the touch screen cover board of the utility model certain embodiments；
Fig. 6-8 is the sectional view of the cover sheet of the utility model certain embodiments；
Fig. 9 is the sectional view of the touch screen cover board of the utility model certain embodiments；
Figure 10-13 is the sectional view of the touch-control display panel of the utility model certain embodiments；With
Figure 14-15 is the sectional view of the cover sheet of the utility model certain embodiments.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and it is not intended that this practicality
Novel limitation.
In the description of the present invention, it is to be appreciated that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Convenient for description the utility model and simplify description rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.In addition, term " first ",
" second " is only used for description purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature." first " is defined as a result, the feature of " second " can be expressed or implicitly include one or more
The feature." multiple " are meant that two or more in the description of the present invention, unless otherwise clearly specific
It limits.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanically connected or be electrically connected or can mutually communicate；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the interaction relationship of connection inside two elements or two elements.For this field
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model unless specifically defined or limited otherwise, fisrt feature second feature it " on " or it
" under " can be in direct contact including the first and second features, it is not to be in direct contact but lead to that can also include the first and second features
Cross the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " above " including
One feature is right over second feature and oblique upper or is merely representative of fisrt feature level height higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
- 3 are please referred to Fig.1, the cover sheet 100 of the utility model embodiment includes substrate 10 and setting on the substrate 10
Transparent semiconductor layer 20, the resistance value of semiconductor layer 20 is 105Ω/□-109Ω/□。
Wherein, substrate 10 is made of clear material, and specifically, substrate 10 can be by glass, sapphire, polymethylacrylic acid
Methyl esters (PolymethylMethacrylate, PMMA), makrolon (Polycarbonate, PC), poly terephthalic acid second two
Ester (Polyethyleneterephtalate, PET), has height at cyclenes macromolecule (Cyclo Olefin Polymers, COP)
The organic/inorganic composite material of case hardness is formed.In the present embodiment, substrate 10 is rectangular.In other embodiments,
Substrate 10 can also rounded, oval, triangle, polygon.
Semiconductor layer 20 can be one layer, and semiconductor layer 20 be arranged on one of surface of substrate 10 (such as Fig. 1 and
Shown in Fig. 2).Semiconductor layer 20 may be two layers, and semiconductor layer 20 is arranged on two surfaces of substrate 10 (such as Fig. 3 institutes
Show).Usually, cover sheet 100 is arranged on electronic component (for example, flexible touch sensing 70 as shown in Figure 4).Partly lead
Body layer 20 can be organic semiconductor or inorganic semiconductor.
Specifically, when cover sheet 100 is located in the stronger environment of electrostatic field, (for example, in the external world, there are high electrostatic or outer
Boundary locally lies in a large amount of charges) when, the part of semiconductor layer 20 can accumulate a large amount of charge and form partial high pressure, due to partly leading
Its electric conductivity is identical with conductor under high voltages for body layer 20, and therefore, the charge of the local accumulation of semiconductor layer 20 can be distributed to
On entire semiconductor layer 20, part is formed with flexible touch sensing 70 so as to avoid the partial charge of semiconductor layer 20 excessive
High pressure, and the partial charge of semiconductor layer 20 is avoided to discharge to flexible touch sensing 70 and lead to flexible 70 quilt of touch sensing
Breakdown；When user's operation cover sheet 100, due to user carry charge signal is smaller and the resistance value of semiconductor layer 20 compared with
Greatly, therefore, semiconductor layer 20 is equivalent to insulator and cannot participate in the coupling of user and the flexible coupling of touch sensing 70 formation
Capacitance is closed, position of touch detection can be carried out so as to cause flexible touch sensing 70.Similarly, cover sheet 100 is arranged on it
When on his electronic component, the semiconductor layer 20 that is set on substrate 10 can avoid being formed on electronic component partial high pressure or part compared with
High current and electronic component is caused to fail.
When the resistance value of semiconductor layer 20 is less than 105Ω/, then during user's operation cover sheet 100, semiconductor layer 20 can join
The formation of coupled capacitor between user and flexible touch sensing 70, while entire semiconductor layer 20 is in same equipotential,
As user, any position operates on cover sheet 100, and each subdivision sensor array on flexible touch sensing 70 is examined
The signal measured is identical, and position of touch detection can not be carried out so as to cause flexible touch sensing 70.If the resistance of semiconductor layer
Value is more than 109Ω/, then the attribute of semiconductor layer 20 is insulator, and in the external world, there are high electrostatic (namely extraneous parts
There are during a large amount of charges), a large amount of charges assembled on semiconductor layer 20 cannot quickly be distributed in the surface or logical of semiconductor layer 20
It crosses semiconductor layer 20 and is transmitted to other places, thus a large amount of charges of local convergence collection of semiconductor layer 20,20 part of semiconductor layer
A large amount of charges of rapid aggregation can make the meeting a large amount of charges of rapid aggregation on the correspondence local location of flexible touch sensing 70, flexible
Flexibility touch sensing 70 can form larger current during the local location rapid aggregation of touch sensing 70 a large amount of charges, and flexibility is touched
Electric current on control sensor 70 can cause flexible touch sensing 70 breakdown and open circuit occurs when excessive.Therefore semiconductor layer
Resistance value is 105Ω/□-109Ω/ is suitable.
The cover sheet 100 of the utility model embodiment sets semiconductor layer 20 on the substrate 10, makes semiconductor layer 20
The influence for the electronic component that cover sheet 100 is provided below in extraneous static field can be reduced, so as to which electronic component be avoided to fail.
Referring to Fig. 4, the touch-control display panel 300 of the utility model embodiment includes touch screen cover board 200 and display
Module 80.
Display module 80 is arranged on the side of the separate user of touch screen cover board 200, and display module 80 includes organic light emission
Diode (Organic Light-Emitting Diode, OLED) display module 82 and liquid crystal display (Liquid Crystal
Display, LCD) display module 84.
Referring to Fig. 4, the touch screen cover board 200 of the utility model embodiment includes cover sheet 100 and flexible touch-control
Sensor 70.
Fig. 4 and Fig. 5 is please referred to, flexible touch sensing 70 is arranged on the side of the separate user of cover sheet 100.It is flexible
Touch sensing 70 may include touch control electrode 72, at this point, as shown in figure 4, touch control electrode 72 (flexible touch sensing 70) is direct
It is arranged on cover sheet 100.Flexible touch sensing 70 may also include touch-control base material 74 and be arranged on touch-control base material 74
From touch control electrode 72, at this point, as shown in figure 5, flexible touch sensing 70 is bonded in cover sheet 100 by transparent optical cement
On, optical cement can be：Solid state optics glue (Optically Clear Adhesive, OCA), liquid optical cement (Optical
Clear Resin,OCR).Flexible touch sensing 70 is received including metal grill sensor, silver nanowire thin film sensor and carbon
Mitron thin film sensor, since metal grill sensor, silver nanowire thin film sensor and carbon nano-tube film sensor have
Preferable toughness, thus set the toughness of the touch screen cover board 200 of flexible touch sensing 70 preferable.Flexible touch sensing
70 for detecting position of touch of user's touch-control on cover sheet 100, specifically, when user's touch-control cover sheet 100, uses
The finger at family forms parasitic capacitance with flexible touch sensing 70, is able to confirm that finger touch exists according to the information of the parasitic capacitance
Position of touch on cover sheet 100.
The cover sheet 100 of the utility model embodiment includes substrate 10 and setting on the substrate 10 transparent is partly led
Body layer 20.
Substrate 10 is made of clear material, and specifically, substrate 10 can be by glass, sapphire, polymethyl methacrylate
(PolymethylMethacrylate, PMMA), makrolon (Polycarbonate, PC), polyethylene terephthalate
(Polyethyleneterephtalate, PET), cyclenes macromolecule (Cyclo Olefin Polymers, COP) have high table
The organic/inorganic composite material of surface hardness is formed.In the present embodiment, substrate 10 is rectangular.In other embodiments, base
Plate 10 can also rounded, oval, triangle, polygon.
Semiconductor layer 20 is arranged on the side of separate user of substrate 10, and specifically, semiconductor layer 20 is arranged on substrate
Between 10 and flexible touch sensing 70, semiconductor layer 20 can be set on the substrate 10 by way of plated film.At this point, substrate
The side surface of 10 close user has anti-fingerprint effect or is provided with anti-finger print layer 40 (as shown in Figure 6) to avoid substrate 10
Surface be easily adhered moisture content and greasy dirt, so as to promote user experience.The side surface of the close user of substrate 10 also have compared with
High hardness or the surface setting superabrasive layer 60 (as shown in Figure 7) of substrate 10 easily scratch to avoid cover sheet 100.Work as base
The surface of plate 10 need set anti-finger print layer 40 when, can be set between the surface of substrate 10 and anti-finger print layer 40 insulating layer 50 so as to
Anti-finger print layer 40 is adhered to by modes such as plated film, sputtering, spraying platings on the surface of the substrate 10.
The resistance value of semiconductor layer 20 is 105Ω/□-109Ω/, for example, the resistance value of high resistant composite bed 20 can be 105
Ω/□、5×105Ω/□、106Ω/□、5×106Ω/□、107Ω/□、5×107Ω/□、108Ω/□、5×108Ω/
□、109Any one in Ω/ etc..Preferably, the resistance value of semiconductor layer 20 is 106Ω/□-108Ω/□.Semiconductor layer
20 material can be polymer semiconductor or inorganic semiconductor.Usually, the flexibility of polymer semiconductor is compared with inorganic semiconductor
Toughness it is more preferable, therefore, semiconductor layer 20, which is made, in polymer semiconducting material can make the toughness of cover sheet 100 preferable；And
And polymer semiconductor is fabricated to semiconductor layer 20 and can be used that technique is more and technique is simpler.Inorganic semiconductor includes oxidation
Tin zinc, antimony pentoxide, SnO2:P, any one in zinc oxide, carbon nanotube, silicon carbide, GaAs.Usually, it is inorganic
The stability of semiconductor layer 20 is compared with semiconductor layer 20 made of polymer semiconductor, therefore, inorganic semiconductor made of semiconductor
Manufactured semiconductor layer 20 can make the performance of cover sheet 100 more stable.
Specifically, when cover sheet 100 is located in the stronger environment of local electrostatic field, the part of semiconductor layer 20 can accumulate
Tire out a large amount of charge and form partial high pressure, due to semiconductor layer 20, its electric conductivity is identical with conductor under high voltages,
The charge of the local accumulation of semiconductor layer 20 can be distributed on entire semiconductor layer 20, so as to avoid the part electricity of semiconductor layer 20
Lotus is excessive and forms partial high pressure with flexible touch sensing 70 and the partial charge of semiconductor layer 20 is avoided to be passed to flexible touch-control
Sensor 70 discharges and causes flexible touch sensing 70 breakdown；When cover sheet 100 is located at the stronger environment of local electrostatic field
When middle, if being not provided with semiconductor layer 20 on substrate 10, the part of flexible touch sensing 70 can be accumulated compared with multi-charge and soft
Larger electric current is formed on property touch sensing 70, since the electric current that flexible touch sensing 70 is merely able to bear is smaller,
The larger current formed in flexible touch sensing 70 is easy to cause flexible touch sensing 70 and fails.Similarly, cover sheet 100
When being arranged on other electronic components, the semiconductor layer 20 set on substrate 10 can avoid forming partial high pressure on electronic component
Or local larger current and electronic component is caused to fail.
Touch-control display panel 300, touch screen cover board 200 and the cover sheet 100 of the utility model embodiment are in substrate
Semiconductor layer 20 on 10 is set, semiconductor layer 20 is enable to reduce the electronics that cover sheet 100 is provided below in extraneous static field
The influence of element, so as to which electronic component be avoided to fail.
The touching display screen panel 300 and touch screen cover board 200 of the utility model embodiment by setting on the substrate 10
Semiconductor layer 20 is put, semiconductor layer 20 is enable to reduce influence of the extraneous static field to flexible touch sensing 70 soft so as to avoid
Property touch sensing 70 fails.
Referring to Fig. 8, in some embodiments, the cover sheet 100 of the above embodiment further includes polaroid 30, partially
Mating plate 30 is arranged on the separate user side of substrate 10, and semiconductor layer 20 is arranged on polaroid 30.Specifically, substrate 10 is with setting
The polaroid 30 for being equipped with semiconductor layer 20 can be by transparent optics glue sticking.Semiconductor layer 20 can be arranged on substrate 10 with
Between polaroid 30, it can also be arranged on the side of separate substrate 10 of polaroid 30.Polaroid 30 is as setting semiconductor
Semiconductor layer 20 is simultaneously produced on polaroid 30 by the base material of layer 20, and cover sheet 100 can directly use existing substrate 10
Polaroid 30 with being provided with semiconductor layer 20 is Nian Jie to be formed, wounded substrate when avoiding making semiconductor layer 20 on the substrate 10
10.Polaroid 30 can be the polaroid 821 being applied in combination with OLED modules 822, and OLED modules 822 include cathode layer, shine
The elements such as layer, anode layer and substrate.
Referring to Fig. 9, in some embodiments, the touch screen cover board 200 of the above embodiment further includes polaroid 30
And the touch control electrode 72 on polaroid 30 is arranged on, at this point, polaroid 30 can be as the touch-control base material of flexible touch sensing 70.
In the side of the separate user of substrate 10, semiconductor layer 20, polaroid 30 and touch control electrode 72 sequentially form on the substrate 10.Tool
Body, semiconductor layer 20 can make on the substrate 10, and touch control electrode 72 is produced on polaroid 30, be provided with semiconductor layer 20
Substrate 10 is bonded together with flexible touch sensing 70 by transparent optical cement；Or semiconductor layer 20 and touch control electrode 72 are divided
It is not arranged on two sides of polaroid 30, substrate 10 is with being provided with the flexible touch sensing 70 of semiconductor layer 20 by saturating
Bright optical cement bonds together.Touch control electrode 72 as the base material for setting touch control electrode 72 and is produced on polarisation by polaroid 30
On piece 30, touch screen cover board 200 can be directly using existing cover sheet 100 and the polaroid 30 for being provided with touch control electrode 72
Bonding is formed, injury protection cover board when avoiding touch control electrode 72 being produced on cover sheet 100.When polaroid 30 is and OLED
During the rotatory polarization piece 821 that module 822 is applied in combination, touch-control base material of the polaroid 30 as flexible touch sensing 70, convenient for system
Make the smaller touch-control display panel 300 of thickness.Polaroid 30 can be the rotatory polarization piece 821 being applied in combination with OLED modules,
OLED modules 822 include the elements such as cathode layer, luminescent layer, anode layer and substrate.
0-11 is please referred to Fig.1, in some embodiments, the OLED in the touch-control display panel 300 of the above embodiment
Display module 82 includes being successively set on polaroid 821 and OLED modules 822 towards the direction far from user, and OLED modules 822 wrap
Include the elements such as cathode layer, luminescent layer, anode layer and substrate.Flexible touch sensing 70 (touch control electrode 72) can be arranged on polarisation
On piece 821, flexible touch sensing 70 (touch control electrode 72) can set on the side of the close user of polaroid 821 or be arranged on
On the side of the separate user of polaroid 821.When only touch control electrode 72 is arranged on polaroid 821, polaroid 821 can conduct
Flexible touch sensing 70 is collectively formed with touch control electrode 72 in touch-control base material, polaroid 821.Present embodiment flexibility touch-control senses
Device 70 (touch control electrode 72) is arranged on polaroid 821, therefore does not need to additionally increase a touch-control base material, consequently facilitating will touch
Control display panel 30 is made thinner.
2-13 is please referred to Fig.1, in some embodiments, the LCD in the touch-control display panel 300 of the above embodiment is shown
Show that module 84 includes the elements such as the upper polaroid 841 set gradually towards the direction far from user, colored filter 842.Flexibility is touched
Control sensor 70 (touch control electrode 72) can be arranged on one of the close user in upper polaroid 841 and positioned at upper polaroid 841
On side.Flexible touch sensing 70 (touch control electrode 72) can also be arranged between upper polaroid 841 and colored filter 842,
At this point, flexible touch sensing 70 (touch control electrode 72) can be arranged in upper polaroid 841 or be arranged on colored filter 842
On.When only touch control electrode 72 is arranged in upper polaroid 841, upper polaroid 841 can be used as touch-control base material, upper polaroid 841
Flexible touch sensing 70 is collectively formed with touch control electrode 72.Present embodiment flexibility touch sensing 70 (touch control electrode 72) is set
It puts in upper polaroid 841 or is arranged on colored filter 842, therefore do not need to additionally increase a touch-control base material, so as to
Convenient for touch-control display panel 30 is made thinner.
4 are please referred to Fig.1, in some embodiments, the semiconductor layer 20 in the cover sheet 100 of the above embodiment
The close user side of substrate 10 can be arranged on.In other embodiments, semiconductor layer 20 is arranged on the close of substrate 10
During user side, cover sheet 100 further includes insulating layer 50 and anti-finger print layer 40, and insulating layer 50 and anti-finger print layer 40 are set gradually
On semiconductor layer 20, that is to say, that anti-finger print layer 40, insulating layer 50, semiconductor layer 20 and substrate 10 in cover sheet 100
It sets gradually.When user's operation cover sheet 100, anti-finger print layer 40 can reduce the moisture content being adhered on cover sheet 100
And greasy dirt.Usually, the surface adhesion performance of semiconductor layer 20 is weaker, and the surface adhesion performance of insulating layer 50 is stronger, anti-fingerprint
Setting insulating layer 50 is convenient for being arranged on anti-finger print layer 50 on the surface of cover sheet 100 between layer 40 and semiconductor layer 20.
5 are please referred to Fig.1, in some embodiments, the cover sheet 100 of the above embodiment further includes superabrasive layer 60,
Superabrasive layer 60 is arranged between insulating layer 50 and anti-finger print layer 40, and superabrasive layer 60 is used to protect cover sheet 100 to avoid protection
The surface of cover board 100 easily scratches.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment party
Formula or example particular features, structures, materials, or characteristics described be contained in the utility model at least one embodiment or
In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And
And particular features, structures, materials, or characteristics described can close in any one or more embodiments or example
Suitable mode combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature." multiple " are meant that at least two, such as two in the description of the present invention,
It is a, three etc., unless otherwise specifically defined.
Although the embodiment of the utility model has been shown and described above, it is to be understood that above-mentioned embodiment party
Formula is exemplary, it is impossible to is construed as a limitation of the present invention, those of ordinary skill in the art are in the utility model
In the range of the above embodiment can be changed, change, replace and modification, the scope of the utility model by claim and
Its equivalent limits.
Claims (11)
1. a kind of cover sheet, which is characterized in that including：
Substrate；And
The transparent semiconductor layer of setting on the substrate, the material of the semiconductor layer includes polymer semiconductor, described
The resistance value of semiconductor layer is 105Ω/□-109Ω/□。
2. cover sheet according to claim 1, which is characterized in that the resistance value of the semiconductor layer is 106Ω/□-108
Ω/□。
3. cover sheet according to claim 1, which is characterized in that the semiconductor layer is arranged on the close of the substrate
The side of user.
4. cover sheet according to claim 1, which is characterized in that the semiconductor layer is arranged on the separate of the substrate
The side of user.
5. cover sheet according to claim 4, which is characterized in that the cover sheet further includes polaroid, described inclined
Mating plate is arranged on the substrate far from user side, and the semiconductor layer is arranged on the polaroid.
6. according to the cover sheet described in claim 3-5 any one, which is characterized in that the cover sheet further includes insulation
Layer and anti-finger print layer, the insulating layer and the anti-finger print layer are successively set on the semiconductor layer.
7. cover sheet according to claim 6, which is characterized in that the cover sheet, which further includes, is arranged on the insulation
Superabrasive layer between layer and the anti-finger print layer, the superabrasive layer are used to protect the cover sheet.
8. a kind of touch screen cover board, which is characterized in that including：
Cover sheet described in claim 1-4 and 6-7 any one；With
Flexible touch sensing, the flexibility touch sensing are arranged on the side of the separate user of the cover sheet.
9. touch screen cover board according to claim 8, which is characterized in that the flexibility touch sensing includes metal grill
Sensor, silver nanowire thin film sensor and carbon nano-tube film sensor.
10. touch screen cover board according to claim 8, which is characterized in that the touch screen cover board includes polaroid and sets
The touch control electrode on the polaroid is put, in the side of the separate user of the substrate, the semiconductor layer, the polarisation
Piece and the touch control electrode sequentially form on the substrate.
11. a kind of touch-control display panel, which is characterized in that including：
Touch screen cover board described in claim 8 or 9；With
Display module, the display module are arranged on the separate user side of the cover sheet, the flexibility touch sensing
Between the cover sheet and the display module or it is integrated in the display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721028172.5U CN207473567U (en) | 2017-08-16 | 2017-08-16 | Cover sheet, touch screen cover board and touch-control display panel |
Applications Claiming Priority (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756981B (en) * | 2020-12-11 | 2022-03-01 | 大陸商寶宸（廈門）光學科技有限公司 | Protective cover, touch panel and method of manufacturing the touch panel |
| WO2024055765A1 (en) * | 2022-09-14 | 2024-03-21 | 京东方科技集团股份有限公司 | Cover plate, display module, and display device |
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2017
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756981B (en) * | 2020-12-11 | 2022-03-01 | 大陸商寶宸（廈門）光學科技有限公司 | Protective cover, touch panel and method of manufacturing the touch panel |
| WO2024055765A1 (en) * | 2022-09-14 | 2024-03-21 | 京东方科技集团股份有限公司 | Cover plate, display module, and display device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210427 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: HUANGJIAHU Economic Development Zone, Jiangxi province Nanchang City Road 330013 Patentee before: Nanchang OFilm Tech. Co.,Ltd. |
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| TR01 | Transfer of patent right |