CN207472380U - Fluid level sensor - Google Patents
Fluid level sensor Download PDFInfo
- Publication number
- CN207472380U CN207472380U CN201721371316.7U CN201721371316U CN207472380U CN 207472380 U CN207472380 U CN 207472380U CN 201721371316 U CN201721371316 U CN 201721371316U CN 207472380 U CN207472380 U CN 207472380U
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- China
- Prior art keywords
- conducting
- level sensor
- fluid level
- piezoelectric ceramics
- fixed
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Abstract
The utility model provides a kind of fluid level sensor, the ultrasonic module including casing and together with sleeve-assembled.The ultrasonic module is fixed to including piezoelectric ceramics, the first conducting terminal and one end on piezoelectric ceramics and the other end is fixed to the conducting bridge of the first conducting terminal, and conducting bridge is " S " type.The fluid level sensor of the utility model can reduce the technical issues of conducting bridge and the first conducting terminal or conducting bridge and piezoelectric ceramics is caused to come off due to temperature change by the way that conducting bridge to be arranged to " S " type.
Description
Technical field
The utility model is related to a kind of fluid level sensor, especially a kind of fluid level with ultrasonic module passes
Sensor.
Background technology
Fluid level sensor generally comprises casing and the ultrasonic module together with sleeve-assembled.Ultrasonic module packet
Piezoelectric ceramics, the first conducting terminal and one end are included fixed on piezoelectric ceramics and the other end is fixed to leading for the first conducting terminal
Electric bridge, conducting bridge are of a straight line type.When in use, due to conducting bridge, the first conducting terminal and piezoelectric ceramics coefficient of thermal expansion not
Together, as temperature changes repeatedly, conducting bridge bears tensile stress or extrusion stress repeatedly, conductive so as to cause conducting bridge and first
The problem of terminal or piezoelectric ceramic piece come off and cause short circuit.
Utility model content
The purpose of this utility model be to provide one kind be not easy to cause due to temperature change conducting bridge and the first conducting terminal or
The fluid level sensor that conducting bridge and piezoelectric ceramics come off.
One side according to the present utility model provides a kind of fluid level sensor, including casing and with casing group
The ultrasonic module being fitted together, the ultrasonic module include piezoelectric ceramics, the first conducting terminal and one end and are fixed to pressure
On electroceramics and the other end is fixed to the conducting bridge of the first conducting terminal, and the conducting bridge is " S " type.
Preferably, first conducting terminal include be connected with conducting bridge, the connecting pin equipped with the first mounting surface, it is described
Piezoelectric ceramics is equipped with the second mounting surface, and first mounting surface and the second mounting surface are in the same plane.
Preferably, the conducting bridge includes third mounting surface, the third mounting surface and the first mounting surface, the second mounting surface
It is in the same plane and be fixed together.
Preferably, the conducting bridge further includes the upper surface parallel with third mounting surface.
Preferably, the conducting bridge narrows from its both ends to centre is gradual.
Preferably, the ultrasonic module further includes housing and fixed to the lid on housing, the lid and housing
It is secured together to form receiving space, the piezoelectric ceramics is fixed on housing.
Preferably, the ultrasonic module further includes the second conducting end being fixed to by injection molding on housing
Son, the piezoelectric ceramics are fixed to by conducting resinl on the second conducting terminal.
Preferably, the piezoelectric ceramics, the first conducting terminal and conducting bridge are placed in receiving space, the ultrasonic wave group
Part further include be placed in receiving space and fixed to the circuit board on housing, first conducting terminal and the second conducting terminal with
Circuit board electrical connection.
Preferably, the housing is equipped with the accommodating space of opening, and first conducting terminal includes being connected with conducting bridge
The connecting pin connect, the connecting pin, conducting bridge and piezoelectric ceramics are placed in accommodating space, and being additionally provided in the accommodating space will even
Connect the fluid sealant that end, conducting bridge and piezoelectric ceramics seal up.
Preferably, first conducting terminal is fixed to housing by way of injection molding.
Fluid level sensor provided by the utility model can be reduced by the way that conducting bridge to be arranged to " S " type because of temperature
Change and cause conducting bridge and the first conducting terminal or conducting bridge and the technical issues of piezoelectric ceramics comes off.
Description of the drawings
Fig. 1 is the stereogram of the fluid level sensor of the utility model；
Fig. 2 is the three-dimensional exploded view of the ultrasonic module of the utility model；
Fig. 3 is the sectional view of the ultrasonic module of the utility model；
Fig. 4 is the enlarged drawing at " A " in Fig. 3；
Fig. 5 is the stereogram of section components in ultrasonic module.
Specific embodiment
Shown in Figure 1, the utility model provides a kind of fluid level sensor 100, including casing 2 and with casing 2
The ultrasonic module 1 fitted together.
Referring to shown in Fig. 2 to Fig. 5, ultrasonic module 1 is fixed including piezoelectric ceramics 15, the first conducting terminal 17 and one end
On to piezoelectric ceramics 15 and the other end is fixed to the conducting bridge 16 of the first conducting terminal 17.Conducting bridge 16 is " S " type.This practicality is new
Type by conducting bridge 16 by being arranged to " S " type, it is possible to reduce the variation of the stress inside the conducting bridge 16 caused by expand with heat and contract with cold,
It reduces stress variation and is damaged caused by component.
First conducting terminal 17 with conducting bridge 16 including being connected, the connecting pin 171 equipped with the first mounting surface 1711.Piezoelectricity
Ceramics 15 are equipped with the second mounting surface 151, and the first mounting surface 1711 and the second mounting surface 151 are in the same plane.Conducting bridge 16
Including third mounting surface 161,161 and first mounting surface 1711 of third mounting surface, the second mounting surface 151 it is in the same plane and
It is fixed together.By being set as above, can cause between conducting bridge 16 and piezoelectric ceramics 15,16 and first conducting end of conducting bridge
There was only tensile stress or extrusion stress between son 17, without torsion.
Conducting bridge 16 further includes the upper surface 162 parallel with third mounting surface 161.Due to third mounting surface 161 and upper
Surface 162 is parallel, thus conducting bridge 16 can direct punch forming, manufacture it is relatively simple.
Conducting bridge 16 narrows from its both ends to centre is gradual.By the setting can conducting bridge 16 be easier to become
Shape can easier absorb the variation of the size caused by expanding with heat and contract with cold.
Ultrasonic module 1 further includes housing 12 and fixed to the lid 11 on housing 12.Lid 11 is fixed with housing 12
To formation receiving space 19 together.Piezoelectric ceramics 15 is fixed on housing 12.
Ultrasonic module 1 further includes the second conducting terminal 14 being fixed to by injection molding on housing 12.Piezoelectricity
Ceramics 15 are fixed to by conducting resinl 18 on the second conducting terminal 14.Conducting bridge 16 can occur by a relatively large margin in Impact direction
Flexible deformation so as to reduce the stress that conducting resinl 18 is subject to, and then solves the problems, such as that conducting resinl 18 detaches and causes short circuit.
Conducting bridge 16, the first conducting terminal 17 and piezoelectric ceramics 15 are fixed together, then use fluid sealant by conducting resinl 18
(not shown) embedding.Operating temperature is between -40 DEG C to 120 DEG C, when the temperature is changed, due to conducting bridge 16, the first conducting end
Son 17, piezoelectric ceramics 15, conducting resinl 18 are different with the coefficient of thermal expansion of casting glue, and as temperature changes repeatedly, conducting bridge 16 is anti-
Tensile stress or extrusion stress are born again.The embodiment of the utility model reduces 16 and first conducting terminal 17 of conducting bridge or piezoelectricity pottery
The problem of tile 15 comes off and causes short circuit.
Piezoelectric ceramics 15, the first conducting terminal 17 and conducting bridge 16 are placed in receiving space 19, and ultrasonic module 1 is also wrapped
Include be placed in receiving space 19 and fixed to the circuit board 13 on housing 12, the first conducting terminal 17 and the second conducting terminal 14 with
Circuit board 13 is electrically connected.In the present embodiment, the first conducting terminal 17 and the second conducting terminal 14 are consolidated by way of grafting
Determine onto circuit board 13.In other embodiments, the first conducting terminal 17 and the second conducting terminal 14 can also pass through other sides
Formula is fixed on circuit board 13.
Housing 12 is equipped with the accommodating space 121 of opening.First conducting terminal 17 includes the company being connected with conducting bridge 16
Connect end 171.Connecting pin 171, conducting bridge 16 and piezoelectric ceramics 15 are placed in accommodating space 121.Be additionally provided in accommodating space 121 by
The fluid sealant (not shown) that connecting pin 171, conducting bridge 16 and piezoelectric ceramics 15 seal up.
In a preferred embodiment, the first conducting terminal 17 is fixed to housing 12 by way of injection molding.
Those skilled in the art can be obvious, and the above exemplary embodiments of the utility model can be carry out various modifications and be become
Type is without departing from the spirit and scope of the utility model.Accordingly, it is intended to the utility model covering is made to fall in the appended claims
And its modifications and variations to the utility model in the range of equivalent arrangements.
Claims (10)
1. a kind of fluid level sensor, including casing (2) and the ultrasonic module (1) fitted together with casing (2), institute
Ultrasonic module (1) is stated to be fixed on piezoelectric ceramics (15) including piezoelectric ceramics (15), the first conducting terminal (17) and one end
And the other end is fixed to the conducting bridge (16) of the first conducting terminal (17), which is characterized in that the conducting bridge (16) is " S " type.
2. fluid level sensor as described in claim 1, which is characterized in that first conducting terminal (17) is including with leading
Electric bridge (16) is connected, the connecting pin (171) equipped with the first mounting surface (1711), and the piezoelectric ceramics (15) is equipped with the second installation
Face (151), first mounting surface (1711) and the second mounting surface (151) are in the same plane.
3. fluid level sensor as claimed in claim 2, which is characterized in that the conducting bridge (16) includes third mounting surface
(161), the third mounting surface (161) and the first mounting surface (1711), the second mounting surface (151) are in the same plane and solid
It is scheduled on together.
4. fluid level sensor as claimed in claim 3, which is characterized in that the conducting bridge (16) further includes pacifies with third
The parallel upper surface (162) in dress face (161).
5. fluid level sensor as claimed in claim 4, which is characterized in that the conducting bridge (16) is from its both ends to centre
It is gradual to narrow.
6. fluid level sensor as described in claim 1, which is characterized in that the ultrasonic module (1) further includes housing
(12) and fixed to the lid (11) on housing (12), the lid (11) is secured together to form receiving sky with housing (12)
Between (19), the piezoelectric ceramics (15) is fixed on housing (12).
7. fluid level sensor as claimed in claim 6, which is characterized in that the ultrasonic module (1), which further includes, to be passed through
Injection molding is fixed to the second conducting terminal (14) on housing (12), and the piezoelectric ceramics (15) passes through conducting resinl (18)
Fixed on the second conducting terminal (14).
8. fluid level sensor as claimed in claim 7, which is characterized in that the piezoelectric ceramics (15), the first conducting end
Sub (17) and conducting bridge (16) are placed in receiving space (19), and the ultrasonic module (1), which further includes, is placed in receiving space
(19) in and fixed to the circuit board (13) on housing (12), first conducting terminal (17) and the second conducting terminal (14) and
Circuit board (13) is electrically connected.
9. fluid level sensor as claimed in claim 6, which is characterized in that the housing (12) is equipped with the accommodating of opening
Space (121), first conducting terminal (17) include the connecting pin (171) being connected with conducting bridge (16), the connecting pin
(171), conducting bridge (16) and piezoelectric ceramics (15) are placed in accommodating space (121), be additionally provided in the accommodating space (121) by
The fluid sealant that connecting pin (171), conducting bridge (16) and piezoelectric ceramics (15) seal up.
10. fluid level sensor as claimed in claim 9, which is characterized in that first conducting terminal (17) passes through note
Molding mode is moulded fixed to housing (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721371316.7U CN207472380U (en) | 2017-10-20 | 2017-10-20 | Fluid level sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721371316.7U CN207472380U (en) | 2017-10-20 | 2017-10-20 | Fluid level sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207472380U true CN207472380U (en) | 2018-06-08 |
Family
ID=62264475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721371316.7U Active CN207472380U (en) | 2017-10-20 | 2017-10-20 | Fluid level sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207472380U (en) |
-
2017
- 2017-10-20 CN CN201721371316.7U patent/CN207472380U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191230 Address after: 130033 No. 1981, Wuhan Road, Changchun Economic Development Zone, Jilin, China Patentee after: Shibeite automotive electronics (Changchun) Co., Ltd. Address before: 130033 No. 1981, Wuhan road, economic development zone, Changchun City, Jilin Province Patentee before: Continental Automotive Electronics (Changchun) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 130033 No. 1981, Wuhan Road, Changchun Economic Development Zone, Jilin, China Patentee after: WeiPai automotive electronics (Changchun) Co., Ltd Address before: 130033 No. 1981, Wuhan Road, Changchun Economic Development Zone, Jilin, China Patentee before: Shibeite automotive electronics (Changchun) Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |