CN207460594U - A kind of new electronic component HDI wiring boards - Google Patents

Abstract

The utility model discloses a kind of new electronic component HDI wiring boards, belong to wiring board art, including substrate, first circuit layer, the second circuit layer, support column, with conductive column, two first circuit layers are located at the both sides up and down of the substrate respectively, two the second circuit layers are located at two one sides of the first circuit layer away from the substrate respectively, between the substrate and two first circuit layers, support column described in three rows is equally spacedly provided between the first circuit layer and the first circuit layer, the side wall of each support column is respectively provided with there are one the conductive column.New electronic component HDI wiring boards provided by the utility model, support column is all provided between circuit layer and between circuit layer and substrate, the heat that the flaggy being spaced makes wiring board generate during the work time is distributed well, the conductive column of setting can turn between each circuit layer and the circuit between circuit layer, ensures normal electrical communication between them.

Description

A kind of new electronic component HDI wiring boards

Technical field

The utility model is related to wiring board art, more particularly to a kind of new electronic component HDI wiring boards.

Background technology

As electronic equipment develops and the progress of electronics assembly technology to light and short, high-performance, multi-functional direction, HDI products for electronic component interconnection have gone on the surface mounting technique stage comprehensively from the Through-Hole Technology stage, move towards The wafer-level package stage, and just progressively move towards the system in package stage.At the nineties initial stage in 20th century, Japan, the U.S. start Using high-density interconnection technology, which introduces blind buried via hole in conventional wiring board, and fine linewidth line-spacing can manufacture The slim, multilayer that goes out that conventional multilayer plate technique can not realize, the i.e. high-density multi-layered line of the high-density interconnected printed circuit board of stabilization Road plate has adapted to the requirement that electronic product develops to lighter, smaller, thinner, the higher direction of reliability, has met electricity of new generation The needs for the packaging density that sub- encapsulation technology is continuously improved.Therefore, high-density multi-layered wiring board technology one climbs up the arena of history, just It flourishes.

But due to the high density of HDI wiring boards, many elements are provided in small area, result in its thermal diffusivity often Not strong, the slow temperature having led in plate that distributes of heat is raised to, not only can shadow when the temperature in plate is increased to certain degree The normal work of element is rung, element and plank can be also burnt when serious, destructive influence is brought on electronic equipment.

Utility model content

The defects of in order to overcome the prior art, the technical problem to be solved by the utility model is to propose a kind of Novel electric Subcomponent HDI wiring boards can meet wiring board in the case of normal work, while have rapid heat dissipation, and the thermal effect that disappears is apparent The characteristics of, and have the characteristics that compact-sized.

For this purpose, the utility model uses following technical scheme：

The utility model provides a kind of new electronic component HDI wiring boards, including substrate, two first circuit layers, two A the second circuit layer, two first circuit layers are located at the both sides up and down of the substrate respectively, and two the second circuit layers are located at respectively The outside of two first circuit layers, the first circuit layer between the substrate and two first circuit layers, adjacent with Support column is both provided between the second circuit layer, the support column includes supporting layer and for adjacent lines plate to be electrically connected The articulamentum connect, the supporting layer are socketed on the outside of the articulamentum.

In the utility model preferably technical solution, the support column ranked first support column including 3, first described in 3 rows Support column is equally spacedly arranged between the substrate and the first circuit layer, the institute that the substrate passes through one or more The articulamentum and the first circuit layer for stating the first support column are electrically connected.

In the utility model preferably technical solution, the support column ranked second support column including 3, second described in 3 rows Support column is equally spacedly arranged between the first circuit layer and the second circuit layer, and the first circuit layer passes through one Or multiple second support columns is electrically connected with the second circuit layer.

Preferably in technical solution, the new electronic component HDI wiring boards further include at least one logical the utility model Hole, the through hole is through the second circuit layer successively and the second support column, the first circuit layer, first support Column, the substrate.

In the utility model preferably technical solution, the through hole passes through in the middle part of the articulamentum of the support column It wears.

In the utility model preferably technical solution, the support column and the substrate, the first circuit layer and The second circuit layer is bonded by epoxyn.

In the utility model preferably technical solution, the substrate, the first circuit layer and the second circuit The outside of layer is both provided with moisture protection coating.

The beneficial effects of the utility model are：

New electronic component HDI wiring boards provided by the utility model, between each circuit layer and in circuit layer And support column is all provided between substrate so that all it is spaced apart between them, and the space that this is spaced can make line The heat that road plate generates during the work time distributes well, although being separated between them with support column, sets Articulamentum can turn between each circuit layer and the circuit between circuit layer, ensure normal Electricity Federation between them System.

Description of the drawings

Fig. 1 is the cross-section structure signal for the new electronic component HDI wiring boards that specific embodiment of the present invention provides Figure；

Fig. 2 is the horizontal structure schematic diagram for the new electronic component HDI wiring boards that utility model specific embodiment provides.

In figure：

1st, substrate, 2, first circuit layer, 3, the second circuit layer, 4, support column, 5, through hole, 41, supporting layer, 42, articulamentum, 43rd, the first support column, the 44, second support column.

Specific embodiment

Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.

As described in Figure 1, a kind of new electronic component HDI wiring boards are provided in embodiment, including substrate 1, two first 2, two the second circuit layers 3 of circuit layer, two first circuit layers 2 are located at the both sides up and down of substrate 1, two the second circuit layers respectively 3 are located at the outside of two first circuit layers 2 respectively, 2 and second electricity of first circuit layer between substrate and first circuit layer, adjacent Support column 4 is provided between road floor 3, support column 4 includes supporting layer 41 and the connection for adjacent lines plate point to be connected Layer 42, supporting layer 41 is socketed on the outside of articulamentum 42.Support column 4 is provided between plate and plate so that left between each layer The space of heat dissipation is flowed by the ventilation between layer, can distribute the heat generated in the course of work in time, The supporting layer of support column 4 can ensure that support column 4 is uniform to the support force of substrate 1, first circuit layer 2, the second circuit layer 3 simultaneously Distribution, avoids wiring board from being easily broken when being subject to external force pressure.The supporting layer set simultaneously in support column 4, can be by base Circuit turn-on between plate 1 and first circuit layer 2, between first circuit layer 2 and the second circuit layer 3 ensure that between each plate Circuit communication.

In order to enable being separated between 1 and first circuit 2 of substrate, further, support column 4 ranked first support column including 3 43,3, which ranked first support column 43, is equally spacedly arranged between substrate 1 and first circuit layer 2, and substrate 1 is supported by multiple first The articulamentum 42 of column 43 is electrically connected with the first circuit layer 2, and the supporting layer 41 of the first support column 43 is by substrate 1 and first It is separated between circuit layer 2 so that the heat that substrate 1 is distributed when working with first circuit layer 2 can be by the first support column 43 and two gaps between plate distribute, while the articulamentum 42 of the first support column 43 can make substrate 1 and first circuit layer 2 it Between circuit communication.

In order to enable being separated between first circuit layer 2 and the second circuit layer 3, further, support column 4 arranges including 3 Two support columns 44,3 ranked second support column 44 and equally spacedly be arranged between first circuit layer 2 and the second circuit layer 44, the first electricity Road floor 2 is electrically connected by the articulamentum 42 of multiple second support columns 44 with the second circuit layer 3, the branch of the second support column 44 Support layer 41 will separate between the second circuit layer 3 and first circuit layer 2 so that the second circuit layer 3 is made with first circuit layer work 2 When the heat that is distributed can be distributed by the gap between the second support column 44 and two plates, while the company of the second support column 44 Circuit communication between the second circuit layer 3 and first circuit layer 2 can be made by connecing layer 42.

In order to which each flaggy is made to be interconnected, new electronic component HDI wiring boards further include through hole 5, through hole 5 through substrate 1, First circuit layer 2, the second circuit layer 3, the first support column 43 and the second support column 44, there is provided through holes 5 can cause entirely Each flaggy conducting of wiring board adds the practicability of entire wiring board.

In order to enable through hole 5 crosses support column 4, further, through hole 5 runs through from the middle part of the articulamentum 42 of support column 4.

In order to enable the close structure between support column 4 and each flaggy, further, support column 4 and substrate 1, first Circuit layer 2 and the second circuit layer 3 are bonded by epoxyn.Epoxyn as a kind of insulation stick, Bonding force is strong, and heat resistance is strong, is very suitable for being used in the bonding of support column 4 and each flaggy.

Each flaggy moisture damage in order to prevent, the both sides up and down of substrate 1, first circuit layer 2 and the second circuit layer 3 Face is both provided with moisture protection coating.Because arrange many members in substrate 1, first circuit layer 2 and the second circuit layer 3 Device and electronic circuit simultaneously as being separated between them by support column 4, are directly contacted with air, depositing in air Moisture be easy for cause short circuit occurs during use so that will be attached on circuit and electronic component It damages.After moisture protection coating, each flaggy can be wrapped up, be opened with air exclusion, protection circuit Plate keeps away from moisture.

The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality In the case of with new spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality It is not limited to the particular embodiment disclosed with new, other embodiments fallen into claims hereof all belong to In the scope of the utility model protection.

Claims (7)

1. a kind of new electronic component HDI wiring boards, including substrate (1), two first circuit layers (2) and two second electricity Road floor (3), two first circuit layers (2) are located at the both sides up and down of the substrate (1) respectively, and two the second circuit layers (3) are respectively Positioned at the outside of two first circuit layers (2), it is characterised in that：

The first circuit layer (2) and the second circuit between the substrate (1) and two first circuit layers (2), adjacent Multiple support columns (4) are both provided between layer (3)；

The support column (4) includes supporting layer (41) and the articulamentum (42) for adjacent lines plate to be electrically connected；

The supporting layer (41) is socketed on the outside of the articulamentum (42).

2. new electronic component HDI wiring boards according to claim 1, it is characterised in that：

The support column (4) ranked first support column (43) including 3；

The first support column (43) is equally spacedly arranged between the substrate (1) and the first circuit layer (2) described in 3 rows, institute State the articulamentum (42) for first support column (43) that substrate (1) passes through one or more and the first circuit layer (2) It is electrically connected.

3. new electronic component HDI wiring boards according to claim 2, it is characterised in that：

The support column (4) ranked second support column (44) including 3；

Second support column (44) described in 3 rows be equally spacedly arranged at the first circuit layer (2) and the second circuit layer (3) it Between, the first circuit layer (2) passes through one or more second support column (44) and the second circuit layer (3) electricity Property connection.

4. new electronic component HDI wiring boards according to claim 3, it is characterised in that：

Further include at least one through hole (5)；

The through hole (5) sequentially passes through the second circuit layer (3) and the second support column (44), the first circuit layer (2), first support column (43), the substrate (1).

5. new electronic component HDI wiring boards according to claim 4, it is characterised in that：

The through hole (5) is run through in the middle part of the articulamentum (42) of the support column (4).

6. new electronic component HDI wiring boards according to claim 1, it is characterised in that：

The support column (4) passes through ring with the substrate (1), the first circuit layer (2) and the second circuit layer (3) Oxygen resin adhesive bonds.

7. new electronic component HDI wiring boards according to claim 1, it is characterised in that：

The outside of the substrate (1), the first circuit layer (2) and the second circuit layer (3) is both provided with moisture protection Coating.