CN207452279U - Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field - Google Patents
Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field Download PDFInfo
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- CN207452279U CN207452279U CN201721341783.5U CN201721341783U CN207452279U CN 207452279 U CN207452279 U CN 207452279U CN 201721341783 U CN201721341783 U CN 201721341783U CN 207452279 U CN207452279 U CN 207452279U
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- magnetic field
- plating solution
- heatproof
- electroplate liquid
- electroplating bath
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Abstract
The utility model discloses electrochemistry plating solution dispersal devices under a kind of high-intensity magnetic field, it includes magnetic field generator, electroplating bath, grid baffle, electrode, power supply, conduit, gas cylinder, ultrasonic unit composition.The utility model conduit mouth is connected with pressurized gas bottle, adjusting bubble agitation intensity can be reached by adjusting the size of pressure reducing valve, plating liquid stream is made to flow from the bottom to top, so as to achieve the purpose that stir plating solution, simultaneously, in a manner that ultrasonic wave disperses, bubble and electroplate liquid can further be disperseed, reach and more uniformly disperse electroplate liquid, the space under high-intensity magnetic field can be efficiently used, mixing effect is good, the effect of mass transmitting of plating solution can be significantly improved during plating particularly composite plating, it is evengranular in plating solution be suspended in electroplate liquid, so as to improve the quality of coating of acquisition, prepare high performance product.
Description
Technical field
The utility model is related to electroplating technologies, are specially electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field.
Background technology
Electroplating technology is widely used in the fields such as automobile making, aerospace, surface functional material preparation and decoration.20
Since century 70, electroplating technology particularly composite plating technology obtains fast development, since the 1990s,
Apply plating under the technology, that is, magnetic field in magnetic field on the basis of composite plating technology and obtain quick fast exhibition, with the hair of superconductor technology
Exhibition is even more the extensive attention for causing domestic and international researcher in high-intensity magnetic field electroplating technology.This is mainly due to magnetic fields and electric field
Reciprocation caused by MHD effects can significantly improve quality of coating.Simultaneously as additional energy and magnetic that magnetic field provides
The effect of coating crystal grain, preferred orientation can also significantly be refined by changing the effect of power, improve the quality and performance of coating.In high-intensity magnetic field
Under, plating solution perturbation action caused by this MHD effects can even reach mechanical agitation intensity effect of mass transmitting, but this disturbance is made
It is limited to the peptizaiton of electroplating trench bottom with only limiting in two interelectrode electroplate liquids, thus in its plating solution particle it is scattered
Still there are problems for property.
At present, domestic and international researcher has carried out the scattering problem of the plating solution of composite plating under magnetic field some researchs, such as
Simple single broncho-alveolar stirring, mechanical mixing method etc..But using bubble agitation method in plating trench bottom bubble proof to plating
When liquid stirs, uneven to the stirring action of electroplate liquid, uniformity and the stability for obtaining coating are poor.Using conventional mechanical
During stirring plating, since the electrode of connection stirring rod is usually ferrimagnet, it is necessary to away from field region, it must lengthen and stir
Bar is mixed, but stability is not good enough, while there is also many difficulties in operability etc..Although the above method is to a certain extent
The quality of coating can be significantly improved, but the above method still needs in controllability, operability, cost of production technology etc.
It is further to improve.
Utility model content
The method and equipment disperseed the purpose of this utility model is to provide electrochemistry plating solution under an a kind of high-intensity magnetic field utilize
Ultrasonic wave aids in multiple rows of bubble to disperse electroplate liquid, realizes a more uniform effect of electroplate liquid dispersion ratio, operable letter
Single, dispersion effect is good, and cost is than relatively low, with overcome the deficiencies in the prior art.
To achieve the above object, the utility model provides following technical solution：
Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field, including heatproof electroplating bath, heating unit is wrapped in heatproof plating
Slot surrounding, and the heating unit is connected with temperature controller, magnetic field generator package heating unit is equipped with plating in heatproof electroplating bath
Liquid, anode and cathode are inserted into electroplate liquid respectively, and the anode and cathode connect the plating outside heatproof electroplating bath respectively
Power supply simultaneously causes electroplating power supply, anode, cathode and electroplate liquid to form control loop, and conduit is set in heatproof plating groove bottom,
The input end of the conduit is connected with the gas cylinder equipped with compressed gas by gas-guide tube, and is set on gas-guide tube and adjusted pressure reducing valve reality
Existing adjusting gas flow so as to achieve the purpose that stir electroplate liquid, and is set in heatproof electroplating bath between the duct and the electrodes
Grid baffle sets Vltrasonic device in heatproof plating trench bottom connection.
Under a kind of foregoing high-intensity magnetic field in electrochemistry plating solution dispersal device, from interior between magnetic field generator and heating unit
Insulation material layer and water cooling plant are set gradually to outer, and insulation material layer package heating unit, water cooling plant package are adiabatic
Material layer, magnetic field generator package water cooling plant, the magnetic direction which generates is straight up.
Under a kind of foregoing high-intensity magnetic field in electrochemistry plating solution dispersal device, electroheat pair and the electricity are set in heatproof electroplating bath
Thermocouple is connected with temperature controller.
Under a kind of foregoing high-intensity magnetic field in electrochemistry plating solution dispersal device, mesh is uniformly arranged in grid baffle.
The utility model principle：The plating solution particle of particle size range is added in electroplate liquid, then bubble agitation and is aided in super
The agitating mode that sound wave disperses is stirred electroplate liquid, after control is dispersed with stirring intensity, opens magnetic field generator and plating electricity
Source electroplated under high-intensity magnetic field, enrichment of the particle in cathode surface to a certain extent is realized under the influence of a magnetic field, so as to favourable
In the coating that qualification is made.
Compared with prior art, this practical information has obvious prominent substantive distinguishing features and marked improvement:
（1）The space in steady magnetic field area in kicker magnet can be effectively utilized；
（2）Since electric device is away from field regions, the utility model, which can reduce, even eliminates magnetic field to electric device
Interference；
（3）Very good to the dispersion effect of electroplate liquid as a result of bubble agitation and Vltrasonic device, this is special to plating
It is not that composite plating is very favorable；
（4）Easy to operate, dispersion effect is good, at low cost, improves its lumber recovery and quality.
Description of the drawings
Attached drawing 1 is the structure diagram of the utility model；
Attached drawing 2 is the utility model baffle arrangement schematic diagram.
Specific embodiment
The utility model embodiment：Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field, as shown in drawings, including heatproof electricity
Coating bath 1, heating unit 2 is wrapped in 1 surrounding of heatproof electroplating bath, and the heating unit 2 is connected with temperature controller 17, magnetic field generator 3
Heating unit 2 is wrapped up, electroplate liquid 4 is equipped in heatproof electroplating bath 1, anode 5 and cathode 6 are inserted into electroplate liquid 4 respectively, and the sun
Pole 5 and cathode 6 Lian Jie not be located at the electroplating power supply 8 outside heatproof electroplating bath 1 and cause electroplating power supply 8, anode 5, cathode 6 and electricity
Plating solution 4 forms control loop, conduit 9 is set on 1 bottom surface of heatproof electroplating bath, the input end of the conduit 9 is with being equipped with compressed gas
Gas cylinder 10 connected by gas-guide tube 11, and on gas-guide tube 11 set adjust pressure reducing valve 12 realize adjusting gas flow, so as to
Achieve the purpose that stir electroplate liquid 4, and grid baffle 14 is set in the heatproof electroplating bath 1 between conduit 9 and electrode, in heatproof
The connection of 1 bottom of electroplating bath sets Vltrasonic device 13.
Set gradually insulation material layer 15 and water cooling dress from inside to outside wherein between magnetic field generator 3 and heating unit 2
16 are put, and the insulation material layer 15 package heating unit 2, water cooling plant 16 wrap up insulation material layer 15, magnetic field generator 3 wraps up
Water cooling plant 16,18 direction of magnetic field which generates are straight up, electroheat pair 7 to be set in heatproof electroplating bath 1
And the electroheat pair 7 is connected with temperature controller 17, and mesh 19 is uniformly arranged in grid baffle 14.
When specifically used
The present embodiment comprising magnetic field generator, electrode, power supply, baffle, gas cylinder, temperature controller etc. by forming, by particle size range
Plating solution particle add in electroplate liquid, then using blowing aerating body and the agitating mode of ultrasonic wave is stirred electroplate liquid, control
After making stirring intensity, open magnetic field generator and electroplating power supply electroplated under high-intensity magnetic field, realization under the influence of a magnetic field
Enrichment of the grain in cathode surface to a certain extent, so as to be conducive to that the coating of qualification is made.
Concrete operation step is as follows：
(a) electroplate liquid has been configured, and has added granule particles, using ultrasonic wave mechanical agitation has been added to carry out under no magnetic field
Pre- stirring, makes particle is substantially uniform to be suspended in electroplate liquid, and electroplate liquid is added in electroplating bath.
(b) equipment such as magnetic field generator, electroplating bath, conduit, gas cylinder, ultrasonic unit are assembled.
(c) by controlling pressure reducing valve that the compressed gas scale of construction is controlled to regulate and control bubble agitation speed, and ultrasonic unit is opened.So
Afterwards, magnetic field generator is opened, regulates magnetic field intensity.
(d) open power supply to be electroplated, adjust suitable current density and electroplated, prepare qualified coating.
Above-mentioned application can be the DC power supply of constant amplitude with power supply or be duty cycle and frequency-adjustable on the electrode
The pulse power or duty cycle, the frequency and cycle can be reversed DC power supply, provide different characteristics for electromagnetic viscosimeter process
Electric current.Magnetic field generator can be the magnetic field that electromagnet generates, or permanent magnet uses the magnetic that magnetic Circuit Design obtains
, it can also be using the Bitter magnets magnetic that either superconducting magnet or Bitter magnets and superconducting magnet hybrid magnet provide
, the magnetic induction intensity provided is 0.001-40T.
Composite plating iron tests is carried out in magnetic field using the device of the present embodiment
The ingredient of the present embodiment electroplate liquid is：0.90mol/L FeSO4,0.15mol/LFeCl2,0.43mol/LNH4C1,
Reduced iron powder 1g/L, wetting agent drip/L, dispersant cetyl trimethylammonium bromide for saturation neopelex solution 2
0.5g/L, then the H2SO4 of 0.9mol/L, adjusting pH value are 1.5, add in the pure silicon granules of 50g/L.It is filling peak diameter
The electroplate liquid 8 of 1 micron of silicon particle 20 is inserted in the heatproof electroplating bath 7 that capacity is 50L.
It for 0.5mm, length and width is that 10mm, silicon content are the low silicon silicon strips of 2wt% as silicon strip cathode 6, pure to use thickness
Iron plate is anode 5, and thickness 1m is immersed in electroplate liquid 4, by cathode 6 and DC power supply（That is electroplating power supply 8）Cathode connection,
Pure iron piece Anodic 5 is connected with the anode of DC power supply 8, using temperature controller 17 and heating unit 2 and thermocouple 7
Electroplate liquid 4 is heated to 30 DEG C and is kept the temperature, while adjusts pressure reducing valve 12, make argon gas by gas-guide tube 11 by electroplate liquid 4 by down toward
Upload supplies gas bubble into electroplating bath 1, controls bubble flow 5L/min, opens ultrasonic unit 13, and power 480W is then turned on
Composite plating DC power supply 8, adjustment DC current density are 2A/dm2；The magnetic field of Stationary Magnetic Field Generator for Magnetic 3 is carried by electromagnet
For magnetic induction intensity remains 10T.The direction of the magnetic line of force 18 is horizontal direction, vertical with electroplating current direction.
After the completion of composite electrodeposition, the Composite Coatings iron layer of high silicon is obtained（That is coating 21）, it is measured through EDS (energy spectrum analysis),
The Composite Coatings iron layer silicone content is 12.64wt%.
Comparative example 1.
Identical with embodiment electroplating parameter, difference lies in magnetic field is not added with, cladding silicon granule content is only 1.8wt%.
Comparative example 2.
It is identical with embodiment electroplating parameter, difference lies in magnetic field is not added with, ultrasonic wave is not added with, cladding silicon granule content is only
For 0.82wt%, and the uniformity that particle is distributed on coating is poor.
Comparative example 3
It is identical with embodiment electroplating parameter, difference lies in magnetic field is not added with, ultrasonic wave is not added with, is not added with bubble agitation, is plated
Most of particles are deposited to plating trench bottom quickly in liquid, and cladding silicon granule content is only 0.08wt%.
The description of said program is the utility model being intended to facilitate those of ordinary skill in the art to understand and use,
Person skilled in the art obviously can easily make embodiment various modifications, and therefore, the utility model is unlimited
In above-mentioned real scheme, those skilled in the art's method according to the present utility model does not depart from what the utility model scope was made
It improves and modification all should be within the scope of protection of the utility model.
Claims (4)
1. a kind of electrochemistry plating solution dispersal device under high-intensity magnetic field, including heatproof electroplating bath（1）, it is characterised in that：Heating unit (2)
It is wrapped in heatproof electroplating bath (1) surrounding, and the heating unit（2）With temperature controller（17）Connection, magnetic field generator (3) package heating
Device (2) is equipped with electroplate liquid (4) in heatproof electroplating bath (1), and anode (5) and cathode (6) are inserted into respectively in electroplate liquid (4), and
The anode (5) and cathode (6) are connected respectively positioned at heatproof electroplating bath（1）External electroplating power supply (8) and so that electroplating power supply
(8), anode (5), cathode (6) and electroplate liquid (4) form control loop, in heatproof electroplating bath（1）Conduit is set on bottom surface（9）,
The input end of the conduit (9) and the gas cylinder (10 equipped with compressed gas）It is connected by gas-guide tube (11), and in gas-guide tube（11）On
It sets and adjusts pressure reducing valve（12）Adjusting gas flow is realized, so as to reach stirring electroplate liquid（4）Purpose, and in conduit（9）With
Heatproof electroplating bath between electrode（1）Interior setting grid baffle（14）, in heatproof electroplating bath（1）Bottom connection sets Vltrasonic device
（13）.
2. electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that：Occur in magnetic field
Insulation material layer (15) and water cooling plant (16), and the heat insulating material are set gradually between device (3) and heating unit (2) from inside to outside
The bed of material (15) package heating unit (2), water cooling plant (16) package insulation material layer (15), magnetic field generator (3) package water cooling
Device (16), magnetic field (18) direction which generates is straight up.
3. electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that：It is electroplated in heatproof
Slot（1）Interior setting electroheat pair（7）And the electroheat pair（7）With temperature controller（17）Connection.
4. electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that：In grid baffle
（14）It is uniformly arranged mesh（19）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721341783.5U CN207452279U (en) | 2017-10-18 | 2017-10-18 | Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721341783.5U CN207452279U (en) | 2017-10-18 | 2017-10-18 | Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207452279U true CN207452279U (en) | 2018-06-05 |
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ID=62249685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721341783.5U Expired - Fee Related CN207452279U (en) | 2017-10-18 | 2017-10-18 | Electrochemistry plating solution dispersal device under a kind of high-intensity magnetic field |
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| Country | Link |
|---|---|
| CN (1) | CN207452279U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410852A (en) * | 2020-10-30 | 2021-02-26 | 中冶赛迪技术研究中心有限公司 | Nano composite electroplating equipment and electroplating process |
| CN113235152A (en) * | 2021-03-30 | 2021-08-10 | 陈岩领 | High-uniformity metal plating electroplating process |
| CN115305559A (en) * | 2022-09-01 | 2022-11-08 | 温州泰钰新材料科技有限公司 | Plating solution dispersing method |
-
2017
- 2017-10-18 CN CN201721341783.5U patent/CN207452279U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410852A (en) * | 2020-10-30 | 2021-02-26 | 中冶赛迪技术研究中心有限公司 | Nano composite electroplating equipment and electroplating process |
| CN113235152A (en) * | 2021-03-30 | 2021-08-10 | 陈岩领 | High-uniformity metal plating electroplating process |
| CN115305559A (en) * | 2022-09-01 | 2022-11-08 | 温州泰钰新材料科技有限公司 | Plating solution dispersing method |
| CN115305559B (en) * | 2022-09-01 | 2023-10-13 | 温州泰钰新材料科技有限公司 | Plating solution dispersion method |
| WO2024046426A1 (en) * | 2022-09-01 | 2024-03-07 | 温州泰钰新材料科技有限公司 | Plating solution dispersion method |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180605 Termination date: 20181018 |