CN207409328U - A kind of surface mount macromolecular thermosensitive resistor - Google Patents

A kind of surface mount macromolecular thermosensitive resistor Download PDF

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Publication number
CN207409328U
CN207409328U CN201721400088.1U CN201721400088U CN207409328U CN 207409328 U CN207409328 U CN 207409328U CN 201721400088 U CN201721400088 U CN 201721400088U CN 207409328 U CN207409328 U CN 207409328U
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China
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electrode
top electrode
lower electrode
hole
insulation plate
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CN201721400088.1U
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Chinese (zh)
Inventor
施志尧
郭源星
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Zhangzhou Yabao Electronics Co.,Ltd.
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ZHANGZHOU YABAO ELECTRONIC CO Ltd
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Abstract

The utility model discloses a kind of surface mount macromolecular thermosensitive resistors, including PPTC chips, top electrode I, top electrode II, lower electrode I, lower electrode II, left pad I, left pad II, backhand welding disk I, backhand welding disk II, upper insulation plate, lower insulation plate, left through hole and right through hole, pressing is provided with top electrode I and top electrode II on the PPTC chip upper surfaces, is pressed on the PPTC chips lower surface and is provided with lower electrode I and lower electrode II.The structure design of the utility model is reasonable, it is easy for operation, when upper/lower electrode etches, it is etched simultaneously without two sides both sides, one side etching electrode therein need to only be inside contracted, opposite side etching electrode position is constant, does not increase any production cost, the probability of electric arc generation is greatly reduced simultaneously, and there is very big application value.

Description

A kind of surface mount macromolecular thermosensitive resistor
Technical field
The utility model is related to a kind of surface mount macromolecular thermosensitive resistors.
Background technology
Polymer composite is formed after macromolecule polymeric material addition conducting particles, within the scope of specific temperature, this Kind conductive material resistivity can increase with the rise of temperature, and excess-current excess-temperature protection device is made for electricity using this characteristic The excess-current excess-temperature protection on road, in circuit, during normal work, it is relatively low to flow through the electric current of device for the devices in series, temperature also compared with It is low, low resistance state is showed, when circuit has high current to flow through, which can raise suddenly, resistance value increase so that electricity Road is in off state, and then protects circuit, if after the Abnormality remove in circuit, which is restored to low resistive state again, and circuit is just Often work, with the extension of application field, plug-in type has been unable to meet market demands, and surface mount is melted into as development trend, mesh The preceding surface labeling type polymer PTC element generally used, is cut using cutting machine, since cutting machine cutting is not avoided that do not have Burr, the jagged upper/lower electrode when being powered of opposite electrode are susceptible to electric arc, influence client's use.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of surface mount macromolecules simple in structure, easy to operate Thermistor.
To solve the above problems, the utility model adopts the following technical solution:
A kind of surface mount macromolecular thermosensitive resistor, including PPTC chips, top electrode I, top electrode II, lower electrode I, lower electricity Pole II, left pad I, left pad II, backhand welding disk I, backhand welding disk II, upper insulation plate, lower insulation plate, left through hole and right through hole, it is described Pressing is provided with top electrode I and top electrode II on PPTC chip upper surfaces, presses and is provided with down on the PPTC chips lower surface Electrode I and lower electrode II, set jagged I, the PPTC between the PPTC chip upper surfaces and top electrode I and top electrode II Jagged II is set between chip lower surface and lower electrode I and lower electrode II, the top electrode I and top electrode II the upper surface of pressing Upper insulation plate is provided with, is pressed below the lower electrode I and lower electrode II and is provided with lower insulation plate, the upper insulation plate is under Insulation board presses respectively to be arranged on notch I and notch II, and absorption is provided with left weldering respectively on the lower electrode I and top electrode I Disk I and left pad II, absorption is provided with backhand welding disk I and backhand welding disk II respectively on the lower electrode II and top electrode II, it is described on Electrode I, lower electrode I, PPTC chips, left pad I and left pad II end on be provided through left through hole, the top electrode IIth, it is provided through right through hole on the end of lower electrode II, PPTC chips, backhand welding disk I and backhand welding disk II.
Preferably, the left through hole is made of metal material, the top electrode I and lower electrode I are turned on, the right side Through hole is made of metal material, and the top electrode II and lower electrode II are turned on;The left through hole and right through hole use semicircle Shape or half elliptic via.
Preferably, the PPTC chips are made of high molecular polymer addition conducting particles.
Preferably, the upper insulation plate and lower insulation plate are using one kind in photosensitive-ink green, black, yellow.
The structure design of the utility model is reasonable, easy for operation, when upper/lower electrode etches, without two sides both sides simultaneously Etching need to only inside contract one side etching electrode therein, and opposite side etching electrode position is constant, does not increase any be produced into This, while the probability of electric arc generation is greatly reduced, there is very big application value.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the structure diagram of the utility model;
Fig. 2 is the top electrode of the utility model and PPTC chip gap structure schematic diagrames;
Fig. 3 is the lower electrode of the utility model and PPTC chip gap structure schematic diagrames.
Specific embodiment
The preferred embodiment of the utility model is described in detail below in conjunction with the accompanying drawings, so that the advantages of the utility model It can be easier to be readily appreciated by one skilled in the art with feature, it is apparent clear and definite so as to be made to the scope of protection of the utility model Define.
Refering to shown in Fig. 1-3, a kind of surface mount macromolecular thermosensitive resistor including PPTC chips 1, top electrode I 2, powers on Pole II 3, lower electrode I 4, lower electrode II 5, left pad I 7, left pad II 8, backhand welding disk I 6, backhand welding disk II 9, upper insulation plate 10, under Insulation board 11, left through hole 12 and right through hole 13, on 1 upper surface of PPTC chips pressing be provided with top electrode I 2 and top electrode II 3, on 1 lower surface of PPTC chips pressing be provided with lower electrode I 4 and lower electrode II 5,1 upper surface of PPTC chips with it is upper Set jagged I 14 between electrode I 2 and top electrode II 3,1 lower surface of PPTC chips and lower electrode I 4 and lower electrode II 5 it Between set jagged II 15, the top electrode I 2 and top electrode II 3 the upper surface of pressing are provided with upper insulation plate 10, the lower electrode I 4 and lower electrode II 5 below pressing be provided with lower insulation plate 11, the upper insulation plate 10 and lower insulation plate 11 press respectively to be set It puts on notch I 14 and notch II 15, absorption is provided with left pad I 7 and left weldering respectively on the lower electrode I 4 and top electrode I 2 Disk II 8, absorption is provided with backhand welding disk I 6 and backhand welding disk II 9, the top electrode I respectively on the lower electrode II 5 and top electrode II 3 2nd, left through hole 12, the top electrode are provided through on the end of lower electrode I 4, PPTC chips 1, left pad I 7 and left pad II 8 II 3, right through hole 13, the left side are provided through on the end of lower electrode II 5, PPTC chips 1, backhand welding disk I 6 and backhand welding disk II 9 Pad I 7, left pad II 8, backhand welding disk I 6, backhand welding disk II 9 are made of metal material is tin plating.
It is worth noting that, the left through hole 12 is made of metal material, the top electrode I 2 and lower electrode I 4 are led Logical, the right through hole 13 is made of metal material, and the top electrode II 3 and lower electrode II 5 are turned on;12 He of left through hole Right through hole 13 is using semicircle or half elliptic via.
It is worth noting that, the PPTC chips 1 are made of high molecular polymer addition conducting particles.
It is worth noting that, the upper insulation plate 10 and lower insulation plate 11 are using in photosensitive-ink green, black, yellow It is a kind of.
The standardized element that the utility model uses can commercially, shaped piece according to specification and attached drawing Record can carry out customized, the specific connection mode of each part is using bolt ripe in the prior art, rivet, weldering It connects and waits conventional means, machinery, part and equipment use in the prior art, conventional model, in addition circuit connection is using existing Conventional connection mode in technology, this will not be detailed here.
The basic principle of the utility model and main feature and the advantages of the utility model has been shown and described above.One's own profession The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description Simply illustrate the principle of the utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model is also Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model Claimed scope is defined by the appending claims and its equivalent thereof.

Claims (4)

1. a kind of surface mount macromolecular thermosensitive resistor, it is characterised in that:Including PPTC chips(1), top electrode I(2), top electrode Ⅱ(3), lower electrode I(4), lower electrode II(5), left pad I(7), left pad II(8), backhand welding disk I(6), backhand welding disk II(9), on Insulation board(10), lower insulation plate(11), left through hole(12)With right through hole(13), the PPTC chips(1)Pressing is set on upper surface It is equipped with top electrode I(2)With top electrode II(3), the PPTC chips(1)Pressing is provided with lower electrode I on lower surface(4)With lower electricity Pole II(5), the PPTC chips(1)Upper surface and top electrode I(2)With top electrode II(3)Between set jagged I(14), institute State PPTC chips(1)Lower surface and lower electrode I(4)With lower electrode II(5)Between set jagged II(15), the top electrode I (2)With top electrode II(3)The upper surface of pressing be provided with upper insulation plate(10), the lower electrode I(4)With lower electrode II(5)Under Face pressure conjunction is provided with lower insulation plate(11), the upper insulation plate(10)And lower insulation plate(11)Pressing is arranged on notch I respectively (14)With notch II(15)On, the lower electrode I(4)With top electrode I(2)Upper absorption respectively is provided with left pad I(7)With left weldering Disk II(8), the lower electrode II(5)With top electrode II(3)Upper absorption respectively is provided with backhand welding disk I(6)With backhand welding disk II(9), The top electrode I(2), lower electrode I(4), PPTC chips(1), left pad I(7)With left pad II(8)End on through set There is left through hole(12), the top electrode II(3), lower electrode II(5), PPTC chips(1), backhand welding disk I(6)With backhand welding disk II(9) End on be provided through right through hole(13).
2. a kind of surface mount macromolecular thermosensitive resistor according to claim 1, it is characterised in that:The left through hole(12) It is made of metal material, by the top electrode I(2)With lower electrode I(4)Conducting, the right through hole(13)By metal material system Into by the top electrode II(3)With lower electrode II(5)Conducting;The left through hole(12)With right through hole(13)Using semicircle Or half elliptic via.
3. a kind of surface mount macromolecular thermosensitive resistor according to claim 1, it is characterised in that:The PPTC chips (1)It is made of high molecular polymer addition conducting particles.
4. a kind of surface mount macromolecular thermosensitive resistor according to claim 1, it is characterised in that:The upper insulation plate (10)And lower insulation plate(11)Using one kind in photosensitive-ink green, black, yellow.
CN201721400088.1U 2017-10-27 2017-10-27 A kind of surface mount macromolecular thermosensitive resistor Active CN207409328U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721400088.1U CN207409328U (en) 2017-10-27 2017-10-27 A kind of surface mount macromolecular thermosensitive resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721400088.1U CN207409328U (en) 2017-10-27 2017-10-27 A kind of surface mount macromolecular thermosensitive resistor

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CN207409328U true CN207409328U (en) 2018-05-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110335731A (en) * 2019-06-21 2019-10-15 深圳市金瑞电子材料有限公司 The manufacturing method of high voltage withstanding secondary safeguard protection element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110335731A (en) * 2019-06-21 2019-10-15 深圳市金瑞电子材料有限公司 The manufacturing method of high voltage withstanding secondary safeguard protection element

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Address after: No.6, Hongjian Road, jiaomei Town, Taiwan investment zone, Zhangzhou City, Fujian Province, 363000

Patentee after: Zhangzhou Yabao Electronics Co.,Ltd.

Address before: 363007 Hongjian Industrial Zone, Longchi Development Zone, Zhangzhou City, Fujian Province

Patentee before: ZHANGZHOU YABAO ELECTRONIC Co.,Ltd.

CP03 Change of name, title or address