CN207403125U - A kind of mold for being used to manufacture notebook computer upper cover - Google Patents
A kind of mold for being used to manufacture notebook computer upper cover Download PDFInfo
- Publication number
- CN207403125U CN207403125U CN201721494801.3U CN201721494801U CN207403125U CN 207403125 U CN207403125 U CN 207403125U CN 201721494801 U CN201721494801 U CN 201721494801U CN 207403125 U CN207403125 U CN 207403125U
- Authority
- CN
- China
- Prior art keywords
- fixed
- mold
- heating plate
- notebook computer
- cooler bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a kind of mold for being used to manufacture notebook computer upper cover,Including support base,Cooler bin,Fan,Ventilation hole,Cooling frame,Waffle slab,Resistive heater,Heating plate,Spring and heat emission hole,Support base is fixed on lower die right side,Cooler bin is assemblied in support base upper surface,Ventilation hole is arranged on cooler bin front end face,Fan is fixed in ventilation hole,Cooling frame is fixed on lower face in cooler bin,Waffle slab is assemblied in cooler bin rear end face,The design achieves the functions of being quickly cooled down notebook computer upper cover moulding,Reduce cooling time,Heating plate is assemblied in lower die,Resistive heater is mounted in heating plate,Spring is fixed on heating plate rear surface,Heat emission hole is arranged on heating plate upper surface,The design achieves rapidly pre-warming lower dies,Reduce the quantity for being molded bad moulding,The utility model is easy to use,It is feature-rich,It has a safety feature,Reliability is high.
Description
Technical field
The utility model is a kind of for manufacturing the mold of notebook computer upper cover, belongs to notebook computer casing processing neck
Domain.
Background technology
Injection molding is also known as injection molding shaping, it is a kind of forming method injected and mold, injection molding forming method
Advantage is that speed of production is fast, efficient, operates and automation can be achieved, and designs and varieties are more, and shape can go from the simple to the complex, and size can be with
It is descending, and product size is accurate, and product easily updates, and the product of energy forming shape complexity, injection molding is suitable for big
Amount production and the processing and formings field such as complex-shaped product, the upper cover of laptop are notebook main external appearance faces, surface matter
Amount requirement is high, it is impossible to apparent injection molding Poor structure occurs（Such as shrink, bonding wire, warpage）, and cast gate cannot influence
The appearance of product and assembling, upper cover shaping area is big, single cast gate be difficult to fill and cause it is short penetrate or shrink, make surface occur it is bright
Aobvious bonding wire influences the surface quality of product.
In the prior art, when notebook computer upper cover injection mold just starts processing, since the temperature of lower die is relatively low, can go out
Now apparent injection molding Poor structure, generates the unnecessary wasting of resources, in the prior art, notebook computer upper cover injection mould
Have the product of processing, cooled down by Temperature fall, cooling time is long, so being badly in need of one kind for manufacturing laptop
The mold of upper cover solves the above problems.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide one kind for manufacturing notebook computer upper cover
Mold, to solve the problems mentioned in the above background technology, the utility model is easy to use, feature-rich, has a safety feature,
Reliability is high.
To achieve these goals, the utility model is to realize by the following technical solutions：One kind is used to manufacture pen
Remember the mold of this computer upper cover, including apparatus main body, mechanism and preheating mechanism are quickly cooled down, under described device main body includes
Mould, upper mold, fixed plate and injection hole, the upper mold are assemblied in lower die upper surface, and the fixed plate is mounted on upper mold upper surface,
The injection hole is mounted on dead plate upper end face centre position, and the mechanism that is quickly cooled down is fixed on lower die right side, described fast
Fast cooling body includes support base, cooler bin, fan, dust filtering lid, ventilation hole, cooling frame and waffle slab, and the support base is consolidated
Lower die right side is scheduled on, the cooler bin is assemblied in support base upper surface, and the ventilation hole is arranged on cooler bin front end face, described
Fan is fixed in ventilation hole, and the dust filtration lid is mounted on ventilation hole front end face, and the cooling frame is fixed on lower end in cooler bin
Face, the waffle slab are assemblied in cooler bin rear end face, and the preheating mechanism is mounted on lower die front end face, and the preheating mechanism includes
Sealing plate, resistive heater, heating plate, spring, heat emission hole and mounting blocks, the heating plate are assemblied in lower die, described to add
Hot water radiation wire is mounted in heating plate, and the sealing plate is arranged on heating plate front end face, and the spring is fixed on table after heating plate
Face, the heat emission hole are arranged on heating plate upper surface, and the mounting blocks are arranged on sealing plate right side and left side.
Further, the fan is fixed by the bracket in ventilation hole.
Further, the cooling frame is equipped with two groups, and cooling frame described in two groups is evenly distributed in cooler bin.
Further, the sealing plate front surface is equipped with sealing ring.
Further, the adding thermal resistance is connected by power cord with power supply.
Further, the mounting blocks front surface is equipped with mounting hole, and fixed pin is equipped in the mounting hole.
The beneficial effects of the utility model：A kind of mold for being used to manufacture notebook computer upper cover of the utility model, because
The utility model is with the addition of support base, cooler bin, fan, dust filtering lid, ventilation hole, cooling frame and waffle slab, which realizes
The function of notebook computer upper cover moulding is quickly cooled down, reduces cooling time, solves original notebook computer upper cover
Injection mold can not cool down moulding, moulding natural cooling, the problem of expending overlong time.
Because the utility model is with the addition of sealing plate, resistive heater, heating plate, spring, heat emission hole and mounting blocks, this sets
Meter realizes rapidly pre-warming lower die, reduces the quantity for being molded bad moulding, solves original notebook computer upper cover injection
When mold is just begun to warm up, lower die temperature is too low, leads to the problem of and is largely molded bad waste product moulding.
Because the utility model is with the addition of stent, the design achieves the fixation of fan, because the utility model is with the addition of sealing
Circle, the design ensure that the leakproofness of lower die, and because the utility model is with the addition of mounting hole and fixed pin, the design achieves fixations
The function of mounting blocks, the utility model is easy to use, feature-rich, has a safety feature, and reliability is high.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structure diagram for the mold for being used to manufacture notebook computer upper cover of the utility model；
Fig. 2 is that the utility model is a kind of to be quickly cooled down the structure of mechanism and shows for manufacturing in the mold of notebook computer upper cover
It is intended to；
Fig. 3 is that the utility model is a kind of to be quickly cooled down the assembling of mechanism and shows for manufacturing in the mold of notebook computer upper cover
It is intended to；
Fig. 4 is that the utility model is a kind of for manufacturing the structural representation of preheating mechanism in the mold of notebook computer upper cover
Figure；
In figure：1- lower dies, 2- are quickly cooled down mechanism, 3- preheating mechanisms, 4- upper molds, 5- fixed plates, 6- injection holes, 21- branch
Support seat, 22- cooler bins, 23- fans, 24- dust filterings lid, 25- ventilation holes, 26- cooling frames, 27- waffle slabs, 31- sealing plates, 32-
Resistive heater, 33- heating plates, 34- springs, 35- heat emission holes, 36- mounting blocks.
Specific embodiment
Technical means, creative features, achievable purpose and effectiveness to realize the utility model are easy to understand, below
With reference to specific embodiment, the utility model is expanded on further.
- Fig. 4 is please referred to Fig.1, the utility model provides a kind of technical solution：It is a kind of to be used to manufacture notebook computer upper cover
Mold including apparatus main body, is quickly cooled down mechanism 2 and preheating mechanism 3, and apparatus main body includes lower die 1, upper mold 4, fixed plate 5
And injection hole 6, upper mold 4 are assemblied in 1 upper surface of lower die, fixed plate 5 is mounted on 4 upper surface of upper mold, and injection hole 6, which is mounted on, to be fixed
5 upper surface centre position of plate.
It is quickly cooled down mechanism 2 and is fixed on 1 right side of lower die, being quickly cooled down mechanism 2 includes support base 21, cooler bin 22, wind
Fan 23, dust filtering lid 24, ventilation hole 25, cooling frame 26 and waffle slab 27, support base 21 are fixed on 1 right side of lower die, cooler bin
22 are assemblied in 21 upper surface of support base, and ventilation hole 25 is arranged on 22 front end face of cooler bin, and fan 23 is fixed in ventilation hole 25, filter
Dirt lid 24 is mounted on 25 front end face of ventilation hole, and cooling frame 26 is fixed on lower face in cooler bin 22, and waffle slab 27 is assemblied in cooling
22 rear end face of case, the design achieves the functions of being quickly cooled down notebook computer upper cover moulding, reduce cooling time.
Preheating mechanism 3 is mounted on 1 front end face of lower die, and preheating mechanism 3 includes sealing plate 31, resistive heater 32, heating plate
33rd, spring 34, heat emission hole 35 and mounting blocks 36, heating plate 33 are assemblied in lower die 1, and resistive heater 32 is mounted on heating plate
In 33, sealing plate 31 is arranged on 33 front end face of heating plate, and spring 34 is fixed on 33 rear surface of heating plate, and heat emission hole 35, which is arranged on, to be added
33 upper surface of hot plate, mounting blocks 36 are arranged on 31 right side of sealing plate and left side, the design achieves rapidly pre-warming lower die 1,
Reduce the quantity for being molded bad moulding.
Fan 23 is fixed by the bracket in ventilation hole 25, and cooling frame 26 is equipped with two groups, and two groups of cooling frames 26 uniformly divide
For cloth in cooler bin 22,31 front surface of sealing plate is equipped with sealing ring, and adding thermal resistance is connected by power cord with power supply, mounting blocks
36 front surfaces are equipped with mounting hole, and fixed pin is equipped in mounting hole.
Specific embodiment：As processing staff in use, heating plate 33 is installed in lower die 1,34 crimp of spring,
Fixed pin is installed in the mounting hole of 36 front end face of mounting blocks, so as to which sealing plate 31 be fixed, is powered to resistive heater 32,
32 energization work of resistive heater converts electrical energy into thermal energy, and resistive heater 32 distributes thermal energy to heating plate 33, heating
Heat is distributed by heat emission hole 35 to lower die 1 in plate 33, and lower die 1 is preheated, and lower die 1 is made to be rapidly achieved suitable shaping temperature
Degree after a period of time, removes fixed pin, and spring 35 replys original shape and generates an outside active force, heating plate to heating plate 33
33 under force, outwards flicks, repair and maintenance resistive heater 32, it is achieved thereby that rapidly pre-warming lower die 1, reduces into
The quantity of the bad moulding of type.
As processing staff in use, taking out molding moulding, the cooling frame 26 being put into cooler bin 22 out of lower die 1
On, it is powered to fan 23,23 energization work of fan generates air-flow and is blown into cooler bin 22, is carried into the air-flow in cooler bin 22
The heat of moulding is dispersed into from waffle slab 27 in air, and dust filtering lid 24 has filtered the air into fan 23, protects wind
The normal operation of fan 23, it is achieved thereby that being quickly cooled down the function of notebook computer upper cover moulding, reduces cooling time.
The basic principle of the utility model and main feature and the advantages of the utility model has been shown and described above, for
For those skilled in the art, it is clear that the utility model is not limited to the details of above-mentioned exemplary embodiment, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent requirements of the claims
All changes are embraced therein.Any reference numeral in claim should not be considered as to the involved right of limitation
It is required that.
Moreover, it will be appreciated that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
Using specification as an entirety, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (6)
1. it is a kind of for manufacturing the mold of notebook computer upper cover, including apparatus main body, it is quickly cooled down mechanism（2）And preheating machine
Structure（3）, it is characterised in that：Described device main body includes lower die（1）, upper mold（4）, fixed plate（5）And injection hole（6）, it is described
Upper mold（4）It is assemblied in lower die（1）Upper surface, the fixed plate（5）Mounted on upper mold（4）Upper surface, the injection hole（6）Installation
In fixed plate（5）Upper surface centre position；
It is described to be quickly cooled down mechanism（2）It is fixed on lower die（1）Right side, it is described to be quickly cooled down mechanism（2）Including support base（21）、
Cooler bin（22）, fan（23）, dust filtering lid（24）, ventilation hole（25）, cooling frame（26）And waffle slab（27）, the support base
（21）It is fixed on lower die（1）Right side, the cooler bin（22）It is assemblied in support base（21）Upper surface, the ventilation hole（25）If
It puts in cooler bin（22）Front end face, the fan（23）It is fixed on ventilation hole（25）It is interior, the dust filtration lid（24）Mounted on ventilation
Hole（25）Front end face, the cooling frame（26）It is fixed on cooler bin（22）Interior lower face, the waffle slab（27）It is assemblied in cooling
Case（22）Rear end face；
The preheating mechanism（3）Mounted on lower die（1）Front end face, the preheating mechanism（3）Including sealing plate（31）, adding thermal resistance
Silk（32）, heating plate（33）, spring（34）, heat emission hole（35）And mounting blocks（36）, the heating plate（33）It is assemblied in lower die
（1）It is interior, the resistive heater（32）Mounted on heating plate（33）It is interior, the sealing plate（31）It is arranged on heating plate（33）Front end
Face, the spring（34）It is fixed on heating plate（33）Rear surface, the heat emission hole（35）It is arranged on heating plate（33）Upper surface, institute
State mounting blocks（36）It is arranged on sealing plate（31）Right side and left side.
2. a kind of mold for being used to manufacture notebook computer upper cover according to claim 1, it is characterised in that：The fan
（23）It is fixed by the bracket in ventilation hole（25）It is interior.
3. a kind of mold for being used to manufacture notebook computer upper cover according to claim 1, it is characterised in that：The cooling
Frame（26）Two groups are equipped with, cooling frame described in two groups（26）It is evenly distributed on cooler bin（22）It is interior.
4. a kind of mold for being used to manufacture notebook computer upper cover according to claim 1, it is characterised in that：The sealing
Plate（31）Front surface is equipped with sealing ring.
5. a kind of mold for being used to manufacture notebook computer upper cover according to claim 1, it is characterised in that：The heating
Resistance wire（32）It is connected by power cord with power supply.
6. a kind of mold for being used to manufacture notebook computer upper cover according to claim 1, it is characterised in that：The installation
Block（36）Front surface is equipped with mounting hole, and fixed pin is equipped in the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721494801.3U CN207403125U (en) | 2017-11-10 | 2017-11-10 | A kind of mold for being used to manufacture notebook computer upper cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721494801.3U CN207403125U (en) | 2017-11-10 | 2017-11-10 | A kind of mold for being used to manufacture notebook computer upper cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207403125U true CN207403125U (en) | 2018-05-25 |
Family
ID=62318707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721494801.3U Expired - Fee Related CN207403125U (en) | 2017-11-10 | 2017-11-10 | A kind of mold for being used to manufacture notebook computer upper cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207403125U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774063A (en) * | 2017-11-10 | 2019-05-21 | 重庆科美模具有限公司 | A kind of laptop upper shell mould |
-
2017
- 2017-11-10 CN CN201721494801.3U patent/CN207403125U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774063A (en) * | 2017-11-10 | 2019-05-21 | 重庆科美模具有限公司 | A kind of laptop upper shell mould |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207238943U (en) | A kind of front cover for vehicle mould | |
| CN207403125U (en) | A kind of mold for being used to manufacture notebook computer upper cover | |
| CN107036482A (en) | Full clad type fin and its manufacture method | |
| CN210755070U (en) | Cooling device for injection molding and casting mold | |
| CN209063441U (en) | A kind of automation injection mold | |
| CN109774063A (en) | A kind of laptop upper shell mould | |
| CN206633331U (en) | A kind of innovative EHT cage lid injection mold | |
| CN214294313U (en) | Quick cooling device of plastics | |
| CN214726196U (en) | Medical treatment mould shedder | |
| CN211416164U (en) | Rapid cooling sole forming die | |
| CN209158802U (en) | A kind of injection mold convenient for carrying out temperature control to injection mold | |
| CN105922578A (en) | Forming substrate for 3D printer | |
| CN207388283U (en) | Efficient sound membrane forming device | |
| CN217434952U (en) | Plastic shell injection mold for electric tool | |
| CN208247380U (en) | Injection mold | |
| CN221212643U (en) | Plastic toy injection molding mould | |
| CN202293256U (en) | Heat conducting bar type cooling device | |
| CN219191123U (en) | Lamp panel injection mold | |
| CN218227752U (en) | Heat-insulating protective cover for injection molding machine | |
| CN214137091U (en) | Easily radiating injection mold | |
| CN214111267U (en) | Automobile injection mold structure | |
| CN217704251U (en) | Composite hand plate processing die based on 3D printing | |
| CN217144611U (en) | Big threshold face guard forming die | |
| CN202667605U (en) | Multifunctional aluminum alloy die-casting die for LED radiating support frames | |
| CN213035235U (en) | Injection mold processing cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180525 Termination date: 20191110 |