CN105922578A - Forming substrate for 3D printer - Google Patents
Forming substrate for 3D printer Download PDFInfo
- Publication number
- CN105922578A CN105922578A CN201610256402.7A CN201610256402A CN105922578A CN 105922578 A CN105922578 A CN 105922578A CN 201610256402 A CN201610256402 A CN 201610256402A CN 105922578 A CN105922578 A CN 105922578A
- Authority
- CN
- China
- Prior art keywords
- substrate body
- printer
- substrate
- hott bed
- forming substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
Abstract
The invention discloses a forming substrate for a 3D printer. The forming substrate for the 3D printer comprises a hot bed and a substrate body, wherein the substrate body is fixedly connected with the hot bed through fasteners; and the hot bed is used for heating the substrate body and raising the temperature of the substrate body. According to the forming substrate for the 3D printer, in the printing process, when a model is formed, a printing material is adhered to the substrate body, and the phenomenon of buckling deformation of the bottom layer of the model caused by abrupt temperature drop is greatly reduced by acquiring heat from the substrate body. The forming substrate for the 3D printer is simple and reasonable in structure set.
Description
Technical field
The present invention relates to 3D printer technology field, particularly to a kind of 3D printer molded substrate.
Background technology
3D printing technique is also known as rapid shaping technique (Rapid Prototyping Manufacturing, letter
Claim RPM) or increase material manufacturing technology, it relate to mechanical engineering, material engineering, digital control, inversely make
Make, the subject such as cad technique and computer technology.The ultimate principle of 3D printing technique be " successively print,
It is layering ", i.e. first pass through CAD software and generate threedimensional model, then by host computer Slice Software (such as
Cura, Repetier-Host, RetinaCreate etc.) it is carried out hierarchy slicing path planning, will
Generate G-code file import to slave computer controller, then by controller control 3D printing device by
Layer reproduces three-dimensional entity model.
With 3D printing rapid shaping technique as core, occur in that the different 3D former printing principle,
Wherein, fused glass pellet (FDM) equipment relies on it easy to use, simple to operate and becomes and instantly apply
Focus.Its hardware core is hot melt printing head, and printed material mostly is hot-melt plastic.Print procedure
In, under the control of the controller, feed mechanism hot-melt plastic is pushed to printing head, the most again
Through the high temperature melting of shower nozzle and extrusion molding.
There are some problem demanding prompt solutions in domestic FDM 3D forming technique in evolution, one of them
It it is exactly the model buckling deformation problem in print procedure.Model buckling deformation refers in print procedure,
Printed material molding is shunk rapidly because of temperature decrease later, causes model bottom warpage and shaped platform
Depart from.The most preferably solve printed material bottom buckling deformation problem in forming process, be
Print the key being smoothed out.
Summary of the invention
Present invention aims to defect and the deficiency of prior art, it is provided that a kind of 3D printer molding
Substrate, it is simple and reasonable, it is possible to effectively solve forming material in existing FDM3D printer print procedure
The problem expecting easy buckling deformation.
For achieving the above object, the present invention is by the following technical solutions:
A kind of 3D printer molded substrate of the present invention, including hott bed and substrate body, described substrate
Body is connected by securing member and described hott bed are fixing, and described hott bed is for adding described substrate body
Heat heats up.
Further, described substrate body is stacked and placed on described hott bed.
Further, described securing member is fastening bolt.
Further, described substrate body uses the material same or like with printed material thermal deformation coefficient
Material is made.
The invention have the benefit that the 3D printer molded substrate that the present invention provides, by using hott bed
Substrate body is carried out heat temperature raising, in print procedure, when model forming, printed material is bondd
On substrate body, by obtaining heat on substrate body, thus greatly reduce model bottom because of temperature
The buckling deformation phenomenon spending rapid drawdown and occur.Present configuration arranges advantages of simple.
Accompanying drawing explanation
Fig. 1 is the overall decomposition texture schematic diagram of the present invention.
In Fig. 1:
1, hott bed；2, substrate body；3, fastening bolt.
Detailed description of the invention
The present invention is further illustrated below in conjunction with the accompanying drawings.
A kind of 3D printer molded substrate as shown in Figure 1, including hott bed 1 and substrate body 2, substrate
Body 2 is connected by securing member is fixing with hott bed 1, it is preferable that for easy accessibility, securing member is tight
Fixing bolt 3.Hott bed 1 is for carrying out heat temperature raising to substrate body 2, specifically, in order to improve substrate
Body 2 by thermal effect, substrate body 2 is stacked and placed on hott bed 1.
In print procedure, when model forming, printed material is bonded on substrate body 2, by from
Obtain heat on substrate body 2, thus alleviate the buckling deformation that model bottom occurs because of temperature decrease.
Substrate body 2 uses the material same or like with printed material thermal deformation coefficient to be made.
After printing terminates, printer model and substrate body 2 occur collaborative because thermal deformation coefficient is same or like
Shrink, it is ensured that printed material the upper side and lower side is shunk same or like, it is to avoid because shrinking inconsistent causing
Model damages, and improves print quality.
The above is only the better embodiment of the present invention, therefore all according to described in present patent application scope
Structure, feature and principle done equivalence change or modify, be all included in present patent application scope
In.
Claims (4)
1. a 3D printer molded substrate, it is characterised in that: include hott bed and substrate body, described
Substrate body is connected by securing member and described hott bed are fixing, and described hott bed is for entering described substrate body
Row heat temperature raising.
3D printer molded substrate the most according to claim 1, it is characterised in that: described substrate
Body folded is placed on described hott bed.
3D printer molded substrate the most according to claim 1, it is characterised in that: described fastening
Part is fastening bolt.
3D printer molded substrate the most according to claim 1, it is characterised in that: described substrate
Body uses the material same or like with printed material thermal deformation coefficient to be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256402.7A CN105922578A (en) | 2016-04-21 | 2016-04-21 | Forming substrate for 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256402.7A CN105922578A (en) | 2016-04-21 | 2016-04-21 | Forming substrate for 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105922578A true CN105922578A (en) | 2016-09-07 |
Family
ID=56839722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610256402.7A Pending CN105922578A (en) | 2016-04-21 | 2016-04-21 | Forming substrate for 3D printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105922578A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108178994A (en) * | 2018-03-07 | 2018-06-19 | 深圳市纵维立方科技有限公司 | A kind of 3D printing platform spray formulation and preparation method thereof |
| CN111331132A (en) * | 2020-03-17 | 2020-06-26 | 苏州复浩三维科技有限公司 | 3D printing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203917916U (en) * | 2014-06-16 | 2014-11-05 | 天津天建众旺科技有限公司 | 3D printer shaped platform |
| CN204894517U (en) * | 2015-05-25 | 2015-12-23 | 宜春学院 | Desktop 3D printer |
-
2016
- 2016-04-21 CN CN201610256402.7A patent/CN105922578A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203917916U (en) * | 2014-06-16 | 2014-11-05 | 天津天建众旺科技有限公司 | 3D printer shaped platform |
| CN204894517U (en) * | 2015-05-25 | 2015-12-23 | 宜春学院 | Desktop 3D printer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108178994A (en) * | 2018-03-07 | 2018-06-19 | 深圳市纵维立方科技有限公司 | A kind of 3D printing platform spray formulation and preparation method thereof |
| CN111331132A (en) * | 2020-03-17 | 2020-06-26 | 苏州复浩三维科技有限公司 | 3D printing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |