CN207398180U - Encapsulating structure and apply its Organnic electroluminescent device - Google Patents
Encapsulating structure and apply its Organnic electroluminescent device Download PDFInfo
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- CN207398180U CN207398180U CN201720784746.5U CN201720784746U CN207398180U CN 207398180 U CN207398180 U CN 207398180U CN 201720784746 U CN201720784746 U CN 201720784746U CN 207398180 U CN207398180 U CN 207398180U
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Abstract
The utility model is related to display technology fields, provide a kind of encapsulating structure and apply its Organnic electroluminescent device.Specifically, which includes the encapsulated layer being disposed on the substrate and the encapsulated layer is separated into several regions by several barrier ribs, the barrier rib.By setting barrier rib, encapsulated layer is separated into several regions, is mutually independent, when which bends, unequal power distribution that encapsulated layer is born, generated stress during so as to disperse encapsulating structure bending；Further, since between several regions of encapsulated layer independently of each other, after wherein certain block region causes package failure due to steam or oxygen entrance, which will not diffuse to entire encapsulated layer, and therefore, the packaging effect of the encapsulating structure is preferable.
Description
Technical field
The utility model is related to display technology fields, and in particular to a kind of encapsulating structure and apply its organic electroluminescent
Device.
Background technology
Display device provides various information with image mode on the screen, is the core technology of information communication.Organic electroluminescence
Luminescent device (English full name Organic Light-Emitting Device, abbreviation OLED) uses electroluminescent organic material,
It is active luminescent device, has many advantages, such as that low-power consumption, colour gamut are wide, volume is thinner, is expected to become next-generation mainstream illumination and tablet
Display technology.
Organic electroluminescence device is very sensitive to the erosion of water oxygen, and micro water oxygen will result in organic material in device
Oxidation, the deterioration of crystallization either electrode influences the service life of device or directly results in the damage of device.The prior art is generally logical
It crosses and drying layer is set in cover board, and pass through frit (frit) package substrate and cover board to realize the effect of stop water oxygen
Fruit.
However, mixed bubble easily causes junction to generate crack or gap during frit in the technical solution,
So as to provide the passage that water oxygen enters device.Meanwhile when the drying layer in device reaches adsorption saturation state, into device
Water oxygen still can have an impact organic material, and packaging effect is poor.
Utility model content
Therefore, the technical problems to be solved in the utility model is to overcome the problems, such as that existing encapsulation technology packaging effect is poor,
So as to provide a kind of good encapsulating structure of packaging effect and apply its Organnic electroluminescent device.
The utility model provides a kind of encapsulating structure, including the encapsulated layer being disposed on the substrate and several barrier ribs, institute
It states barrier rib and the encapsulated layer is separated into several regions.
Optionally, the encapsulated layer includes being stacked and spaced at least one organic thin film layer and at least one inorganic
Film layer.
Optionally, the barrier rib is for separating at least one organic thin film layer and/or at least one described inorganic
Film layer.
Optionally, the barrier rib includes several the first wall bodies set along the first direction and set in a second direction the
Two wall bodies.
Optionally, first wall body is discontinuous structure on length direction and/or short transverse；Second wall body
It is discontinuous structure on length direction and/or short transverse.
The utility model also provides a kind of Organnic electroluminescent device, including the Organic Light Emitting Diode being disposed on the substrate
Array layer and encapsulating structure, which is characterized in that the encapsulating structure includes encapsulated layer and several barrier ribs, the barrier
The encapsulated layer is separated into several regions by wall.
Optionally, the projection of the region on the substrate is covered in the organic LED array layer at least
The projection of one Organic Light Emitting Diode on the substrate.
Optionally, the encapsulated layer includes being stacked and spaced at least one organic thin film layer and at least one inorganic
Film layer.
Optionally, the barrier rib is for separating at least one organic thin film layer and/or at least one described inorganic
Film layer.
Optionally, the barrier rib includes several the first wall bodies set along the first direction and set in a second direction the
Two wall bodies；First wall body is discontinuous structure on length direction and/or short transverse；Second wall body is in length side
To and/or short transverse on be discontinuous structure.
Technical solutions of the utility model have the following advantages that：
1. encapsulating structure provided by the utility model, including the encapsulated layer being disposed on the substrate and several barrier ribs, institute
It states barrier rib and the encapsulated layer is separated into several regions.By setting barrier rib, encapsulated layer is separated into several regions, each other
Independently of each other, can disperse due to stress caused by encapsulating structure bending；Further, since between several regions of encapsulated layer
Independently of each other, after wherein certain block region causes package failure due to steam or oxygen entrance, which will not spread
To entire encapsulated layer, therefore, the packaging effect of the encapsulating structure is preferable.
2. encapsulating structure provided by the utility model, encapsulated layer includes being stacked and spaced at least one organic film
Layer and at least one inorganic thin film layer.Wherein, inorganic thin film layer is inorganic material, for completely cutting off steam and oxygen；Organic film
Layer is organic material, for making hole and the gap in inorganic thin film layer up, ensures the compactness peace of inorganic thin film layer film forming
Whole property.The packaging effect of the encapsulating structure can be better ensured that by spaced organic thin film layer and inorganic thin film layer；
In addition, the encapsulating structure is membrane structure, the demand of flexible package disclosure satisfy that, it is applied widely.
3. encapsulating structure provided by the utility model, the barrier rib includes several the first wall bodies set along the first direction
The second wall body set in a second direction.By setting the first wall body along the first direction and setting the second wall in a second direction
Body forms the separated region arranged along different directions in encapsulated layer, so as to preferably scattered since the encapsulating structure is curved
Stress caused by song；Meanwhile, it is capable to stop the entrance of the steam and oxygen in multiple directions, and then improve using the encapsulation knot
The service life of the device of structure.
4. encapsulating structure provided by the utility model, first wall body is non-on length direction and/or short transverse
Continuous structure；Second wall body is discontinuous structure on length direction and/or short transverse.By by the first wall body or
The problem of being arranged to discontinuous structure in the length and/or short transverse of two wall bodies, stress concentration can be reduced, and then can carry
The flexibility of the high encapsulating structure.
5. Organnic electroluminescent device provided by the utility model, including the Organic Light Emitting Diode battle array being disposed on the substrate
Row layer and encapsulating structure, the encapsulating structure include encapsulated layer and several barrier ribs, and the barrier rib is by the encapsulated layer
It is separated into several regions.By setting barrier rib, encapsulated layer is separated into several regions, is mutually independent, can be dispersed with
Generated stress when organic electro luminescent device is bent；Further, since between several regions of encapsulated layer independently of each other, when wherein
After certain block region causes package failure due to steam or oxygen entrance, which will not diffuse to entire encapsulated layer, into
And the service life of the Organnic electroluminescent device can be improved.
6. Organnic electroluminescent device provided by the utility model, the encapsulated layer is separated into several regions by barrier rib,
The projection of the region on the substrate covers at least one organic light-emitting diodes in the organic LED array layer
The projection of pipe on the substrate.In units of single or multiple Organic Light Emitting Diodes, encapsulated layer is carried out by barrier rib
Region separates, so as to realize the encapsulation to each sub-pixel or pixel unit in organic LED array layer, into
And packaging effect can be improved, extend the service life of the Organnic electroluminescent device.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution of the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it describes below
In attached drawing be the utility model some embodiments, for those of ordinary skill in the art, do not paying creativeness
On the premise of work, other attached drawings are can also be obtained according to these attached drawings.
Fig. 1 is the structure diagram of a specific example of encapsulating structure in the utility model embodiment 1；
Fig. 2 is the structure diagram of another specific example of encapsulating structure in the utility model embodiment 1；
Fig. 3 is the structure diagram of another specific example of encapsulating structure in the utility model embodiment 1；
Fig. 4 is the structure diagram of another specific example of encapsulating structure in the utility model embodiment 1；
Fig. 5 is the structure diagram of another specific example of encapsulating structure in the utility model embodiment 1；
Fig. 6 is the structure diagram of another specific example of encapsulating structure in the utility model embodiment 1；
Fig. 7 is the structure diagram of a specific example of Organnic electroluminescent device in the utility model embodiment 2；
Reference numeral：
10- substrates；20- organic LED array layers；30- encapsulating structures；31- encapsulated layers；311- organic thin film layers；
312- inorganic thin film layers；32- barrier ribs；The first wall bodies of 321-；The second wall bodies of 322-.
Specific embodiment
In order to make the purpose of this utility model, technical solution and advantage clearer, below in conjunction with attached drawing to this practicality
New embodiment is described in further detail.
, it is necessary to which explanation, term " first ", " second " are only used for description purpose in the description of the utility model, and
It is not intended that instruction or hint relative importance.
The utility model can be embodied in many different forms, and should not be construed as limited to implementation set forth herein
Example.On the contrary, provide these embodiments so that the disclosure will be thorough and complete, and the design of the utility model will be filled
Divide and be communicated to those skilled in the art, the utility model will only be defined by the appended claims.In the accompanying drawings, for clarity,
The size and relative size of layer and region can be exaggerated.It should be appreciated that when element such as layer, region or substrate are referred to as " shape
Into " or " being arranged on " another element " on " when, which can be arranged directly on another element or can also deposit
In intermediary element.On the contrary, when element is referred to as on " being formed directly into " or " being set directly at " another element, there is no centres
Element.
It will be apparent to a skilled person that the inorganic thin film layer 312 described in the embodiment of the present invention is used to completely cut off
Steam and oxygen, organic thin film layer 311 are used to ensure the compactness and planarization and inorganic thin that inorganic thin film layer 312 forms a film
The growth of defect in the film of film layer 312.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not forming conflict can be combined with each other.
Embodiment 1
The present embodiment provides a kind of encapsulating structure, as shown in Figure 1, including encapsulated layer 31 and several barrier ribs 32, the resistance
Encapsulated layer 31 is separated into several regions by next door 32.By setting barrier rib 32, encapsulated layer 31 is separated into several regions, each other
Independently of each other, can disperse due to stress caused by encapsulating structure bending；Further, since several regions of encapsulated layer 31 it
Between independently of each other, when wherein certain block region since steam or oxygen enter and after cause package failure, which will not expand
Entire encapsulated layer 31 is dissipated to, therefore, the packaging effect of the encapsulating structure 30 is preferable.
As a kind of alternative embodiment of the utility model, as shown in Fig. 2, the encapsulated layer 31 includes being stacked and be arranged at intervals
At least one organic thin film layer 311 and at least one inorganic thin film layer 312.Pass through spaced organic thin film layer 311 and nothing
Machine film layer 312 can better ensure that the packaging effect of the encapsulating structure 30；In addition, the encapsulating structure 30 is membrane structure,
It disclosure satisfy that the demand of flexible package, it is applied widely.In wherein Fig. 2, the encapsulated layer 31 of three-decker is shown, but this reality
It is not limited to this with new protection domain, the number of organic thin film layer 311 and inorganic thin film layer 312 can be according to actual conditions
It sets, for example can be 3 layers or 4 layers etc. of organic thin film layer 311 and the composition of inorganic thin film layer 312.It is to retouch in the present embodiment
It states conveniently, is described in detail by taking the encapsulated layer 31 of three-decker as an example.
As described in Figure 2, which includes several barrier ribs 32, and each barrier rib 32 separates all organic thin
Film layer 311 and inorganic thin film layer 312, so as to which encapsulated layer 31 is separated into several regions.
As a kind of alternative embodiment of the utility model, as shown in figure 3, each barrier rib 32 can be used for separating one
Organic thin film layer 311 or an inorganic thin film layer 312 can be used for separating an organic thin film layer 311 and one inorganic thin
Film layer 312.By the barrier rib 32 for mutually staggering setting as shown in Figure 3, the path of water oxygen barrier is longer, has preferable
Water oxygen obstructing capacity；Meanwhile preparation process is simple, it is easy to accomplish；In addition, the barrier rib 32 for mutually staggering setting can
Ensure that the stress that each layer in encapsulated layer 31 is born is unequal, so as to ensure preferable stress release effect, Jin Erti
The flexibility of the high encapsulating structure 30.But the scope of protection of the utility model is not limited to this, for 3 layers or more of encapsulated layer
31, as long as barrier rib 32 can separate the encapsulation of at least one organic thin film layer 311 and/or at least one inorganic thin film layer 312
Structure, belong to the scope of protection of the utility model.
As another embodiment of the utility model, as shown in figure 4, barrier rib 32 is set along the first direction including several
The first wall body 321 and the second wall body 322 for setting in a second direction, the first direction and second direction are not parallel.As this
A kind of optional embodiment of embodiment, first direction be Fig. 4 in x directions 321 width of i.e. the first wall body, second direction
For the y directions in Fig. 4, i.e. 321 length direction of the first wall body, first direction is vertical with second direction.First wall body 321 is used to divide
Every an organic thin film layer 311 and an inorganic thin film layer 312, the second wall body 322 is for one organic thin film layer 311 of separation.
By setting the first wall body 321 along the first direction and setting the second wall body 322 in a second direction, formed in encapsulated layer 31 along not
The separated region of equidirectional arrangement, so as to preferably scattered due to stress caused by encapsulating structure bending；Meanwhile the
One wall body 321 can stop the steam and oxygen of 30 both sides of encapsulating structure, and the second wall body 322 can stop the encapsulating structure
The steam and oxygen of 30 tops, therefore, the structure that 321 and second wall body 322 of the first wall body is used cooperatively can stop more
The entrance of steam and oxygen on a direction, and then improve the service life of the device using the encapsulating structure.
As another optional embodiment of the present embodiment, as shown in figure 5, using the first wall body 321 to organic film
Layer 311 carries out the separation on first direction, while the organic thin film layer 311 is carried out in second direction using the second wall body 322
Separation.By carrying out separating in both direction on same organic thin film layer 311, can stop steam in multiple directions and
Oxygen, so as to further improve the service life for the device for applying the encapsulating structure.But the protection model of the utility model
It encloses and is not limited to this, the combination of all the first wall bodies 321 and the second wall body 322 that can realize the utility model separation purpose makes
The scope of protection of the utility model is belonged to mode, for example, above-mentioned first wall body 321 can be right simultaneously with the second wall body 322
Each layer in encapsulated layer 31 in the encapsulating structure 30 is separated.
As a kind of optional embodiment of the present embodiment, as shown in fig. 6, the first wall body 321 is non-company in length direction
Continuous structure, the first wall body 321 of 30 discontinuous structure of encapsulating structure is separated, in encapsulating structure 30 in curved process
In, the first wall body 321 and the second wall body 322 can conduct, dispersive stress, so as to avoid the problem that stress concentration, into
And the flexibility of the encapsulating structure can be improved.But the scope of protection of the utility model is not limited to this, first wall body 321
In short transverse, i.e. the direction vertical with plane where x and y directions in Fig. 6 could be provided as discontinuous structure and first
Discontinuous structure can be arranged in the length and short transverse of wall body 321.Due to the first wall body 321 and the second wall body 322
The difference for differing only in setting direction, therefore, those skilled in the art should be appreciated that the length of the second wall body 322
And/or may be set to be discontinuous structure in short transverse, the second wall body 322 of the discontinuous structure can ensure second
In 30 bending process of encapsulating structure, the second wall body 322 can conduct, disperse to answer the encapsulated layer 31 that wall body 322 is separated
Power the problem of so as to avoid stress concentration, and then can further improve the flexibility of the encapsulating structure 30.
As a kind of alternative embodiment of the utility model, as shown in Figure 1, the size on the x directions of barrier rib 32 accounts for this
The 1/20-1/10 of size on encapsulated layer y directions so as to ensure in the case of effectively separating encapsulated layer, does not influence the encapsulation
The light transmittance of layer.In addition, the barrier rib 32 in the utility model is prepared using transparent polymer, the material choosing of the transparent polymer
From but be not limited to polymethyl methacrylate (PMMA/ acrylics), it is all can realize the utility model partition encapsulated layer and
The scope of protection of the utility model that belongs to of light transmittance purpose, such as polyimides, polyethylene terephthalate are not influenced
Ester, polyethylene naphthalate, dimethyl silicone polymer, polyurethane etc..
Embodiment 2
Originally apply example and a kind of Organnic electroluminescent device is provided, as shown in fig. 7, comprises setting organic light emission on the substrate 10
Diode array layer 20 and encapsulating structure 30, the encapsulating structure 30 include encapsulated layer 31 and several barrier ribs 32, the barrier
Wall 32 is used to encapsulated layer 31 being separated into several regions.By setting barrier rib 32, encapsulated layer 31 is separated into several regions, that
This can disperse due to stress caused by Organnic electroluminescent device bending independently of each other；If further, since encapsulated layer 31
Between dry region independently of each other, after wherein certain block region causes package failure due to steam or oxygen entrance, the failure area
Domain will not diffuse to entire encapsulated layer 31, and then can improve the service life of the Organnic electroluminescent device.
As a kind of optional embodiment of the present embodiment, encapsulated layer 31 is separated into several regions by barrier rib 32, the area
An Organic Light Emitting Diode in the projection covering organic LED array layer 20 of domain on the substrate 10 is in the substrate
On projection.Barrier rib 32 is set directly at the vertical direction of pixel confining layers in organic LED array layer 20, passes through
The region of a corresponding Organic Light Emitting Diode sets barrier rib to set the region that is separated of encapsulated layer, so as to realize
Encapsulation to each pixel unit or sub-pixel unit in organic LED array layer, and then encapsulation effect can be improved
Fruit extends the service life of the Organnic electroluminescent device.But the scope of protection of the utility model is not limited to this, barrier
Encapsulated layer 31 is separated into several regions by wall 32, the projection covering organic LED array layer 20 of the region on the substrate 10
In the number of Organic Light Emitting Diode projection on the substrate 10 can be multiple, for example, two, three etc..
The specific structural details for the encapsulating structure 30 not being described in detail in the present embodiment, refer to embodiment 1, herein not
It repeats again.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among the protection domain that variation is created still in the utility model.
Claims (8)
1. a kind of encapsulating structure, which is characterized in that including the encapsulated layer being disposed on the substrate and several barrier ribs, the resistance
The encapsulated layer is separated into several regions by next door；The encapsulated layer includes being stacked and spaced at least one organic film
Layer and at least one inorganic thin film layer.
2. encapsulating structure according to claim 1, which is characterized in that the barrier rib at least one described has for separating
Machine film layer and/or at least one inorganic thin film layer.
3. encapsulating structure according to claim 2, which is characterized in that the barrier rib is set along the first direction including several
The first wall body and the second wall body for setting in a second direction.
4. encapsulating structure according to claim 3, which is characterized in that first wall body is in length direction and/or height
It is discontinuous structure on direction；Second wall body is discontinuous structure on length direction and/or short transverse.
5. a kind of Organnic electroluminescent device, including the organic LED array layer being disposed on the substrate and encapsulation knot
Structure, which is characterized in that the encapsulating structure includes encapsulated layer and several barrier ribs, and the barrier rib divides the encapsulated layer
It is divided into several regions；The encapsulated layer includes being stacked and spaced at least one organic thin film layer and at least one inorganic thin
Film layer.
6. Organnic electroluminescent device according to claim 5, which is characterized in that the throwing of the region on the substrate
Shadow covers the projection of at least one Organic Light Emitting Diode on the substrate in the organic LED array layer.
7. Organnic electroluminescent device according to claim 6, which is characterized in that the barrier rib is for separation at least one
A organic thin film layer and/or at least one inorganic thin film layer.
8. Organnic electroluminescent device according to claim 7, which is characterized in that the barrier rib includes several along first
The first wall body that direction is set and the second wall body set in a second direction；First wall body is in length direction and/or height
It is discontinuous structure on direction；Second wall body is discontinuous structure on length direction and/or short transverse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720784746.5U CN207398180U (en) | 2017-07-01 | 2017-07-01 | Encapsulating structure and apply its Organnic electroluminescent device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720784746.5U CN207398180U (en) | 2017-07-01 | 2017-07-01 | Encapsulating structure and apply its Organnic electroluminescent device |
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| CN207398180U true CN207398180U (en) | 2018-05-22 |
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ID=62403346
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| CN201720784746.5U Active CN207398180U (en) | 2017-07-01 | 2017-07-01 | Encapsulating structure and apply its Organnic electroluminescent device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686746A (en) * | 2019-01-04 | 2019-04-26 | 京东方科技集团股份有限公司 | Display base plate, display device, the preparation method of mobile terminal and display base plate |
| WO2020077714A1 (en) * | 2018-10-15 | 2020-04-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display module |
-
2017
- 2017-07-01 CN CN201720784746.5U patent/CN207398180U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020077714A1 (en) * | 2018-10-15 | 2020-04-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display module |
| CN109686746A (en) * | 2019-01-04 | 2019-04-26 | 京东方科技集团股份有限公司 | Display base plate, display device, the preparation method of mobile terminal and display base plate |
| CN109686746B (en) * | 2019-01-04 | 2021-09-24 | 京东方科技集团股份有限公司 | Display substrate, display device, mobile terminal and preparation method of display substrate |
| US11244962B2 (en) | 2019-01-04 | 2022-02-08 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, display device, mobile terminal and fabricating method of display substrate |
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