CN207382665U - A kind of dust-proof circuit board - Google Patents
A kind of dust-proof circuit board Download PDFInfo
- Publication number
- CN207382665U CN207382665U CN201721367533.9U CN201721367533U CN207382665U CN 207382665 U CN207382665 U CN 207382665U CN 201721367533 U CN201721367533 U CN 201721367533U CN 207382665 U CN207382665 U CN 207382665U
- Authority
- CN
- China
- Prior art keywords
- dust
- circuit board
- ventilated membrane
- snap
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model provides a kind of dust-proof circuit board, and including circuit board body, ventilated membrane A, ventilated membrane B, heat dissipation resin bed A, heat dissipation resin bed B, snap-gauge, dust-proof piece is fixedly connected between opposite two snap-gauges.Ventilated membrane A, ventilated membrane B can stop dust, and its gas permeability contributes to circuit board body to generate distributing for heat when working.Heat dissipation resin bed A, heat dissipation resin bed B can absorb heat from ventilated membrane A, ventilated membrane B, contribute to the transmission of heat and distribute, and dust can be adsorbed.The snap-gauge of setting can distribute heat into air, dust-proof piece is fastened between two opposite snap-gauges and is fixed, prevents dust from entering circuit board body, the snap-gauge of setting facilitates dust-proof piece of placement and replacement, when needing to remove dust, the dust on dust-proof piece need to only be blown off.Its is simple in structure, can effectively prevent dust and enters circuit board body, dust removing is convenient and efficient, and effectively promotes heat dissipation for circuit board effect.
Description
Technical field
The utility model is related to circuit board technology fields, specifically disclose a kind of dust-proof circuit board.
Background technology
Circuit board refers to connecting electronic component to form an electronic device for carrying certain function.Existing circuit board sheet
Body is exposed aerial, dust entrance is often had in routine use, for using in some outdoor electronic equipments
Circuit board, dust accretions situation are even more serious.Circuit board dust accretions can not only influence the normal work and efficiency of electric elements,
But also short trouble can be caused, so as to reduce the service life of circuit board and electric elements.
Existing dust-proof circuit board usually in circuit board surface coated with resins glue or sticks film progress proofing dust and protecting, so
Circuit board surface is frequently resulted in be sealed, circuit board heating is difficult to distribute, and influences electronic product normal work and service life, because
Its thermal diffusivity is also must be considered that when the dust-proof processing of this circuit board.
Utility model content
Based on this, it is necessary to for prior art problem, provide a kind of dust-proof circuit board, unique structure be set, in electricity
Road plate body both sides set ventilated membrane, on ventilated membrane smear heat dissipation resin bed, and heat dissipation resin bed on set dust-proof piece into
The dust-proof circuit board of the dust-proof countermeasure of row.
To solve prior art problem, the utility model discloses a kind of dust-proof circuit board, including circuit board body, circuit board
Bodies top and bottom have been respectively fixedly connected with ventilated membrane A, ventilated membrane B, and ventilated membrane A tops are adjacent heat dissipation resin bed A, breathes freely
Film B bottom contiguous has heat dissipation resin bed B, and circuit board body top opposite sides is fixedly connected with snap-gauge, circuit board body bottom
Opposite sides is fixedly connected with snap-gauge, and dust-proof piece is fixedly connected between opposite two snap-gauges.
Preferably, dust-proof piece is sponge.
Preferably, heat dissipation resin bed A, heat dissipation resin bed B are heat-conducting silicone grease.
Preferably, snap-gauge is epoxy resin board.
Preferably, dust-proof piece it is highly consistent with snap-gauge.
The beneficial effects of the utility model are：The utility model discloses a kind of dust-proof circuit board, sets unique assembling knot
Structure is respectively fixedly connected with ventilated membrane A, ventilated membrane B at the top and bottom of circuit board body, and ventilated membrane A, ventilated membrane B can be to dusts
Stopped, and its gas permeability contributes to circuit board body to generate distributing for heat when working.Respectively at the top of ventilated membrane A and
Ventilated membrane B bottoms set heat dissipation resin bed A, heat dissipation resin bed B, heat dissipation resin bed A, heat dissipation resin bed B can from ventilated membrane A, thoroughly
Heat is absorbed on air film B, contribute to the transmission of heat and is distributed, and dust can be adsorbed.The snap-gauge of setting can conduct
Heat transferring medium distributes heat into air, and dust-proof piece is fastened between opposite snap-gauge and is fixed, prevent dust into
Enter circuit board body, the snap-gauge of setting facilitates dust-proof piece of placement and replacement, only need to be by dust-proof piece when needing to remove dust
On dust blow off.Its is simple in structure, can effectively prevent dust and enters circuit board body, and dust removing is convenient and efficient, and
And effectively promote heat dissipation for circuit board effect.Sponge is arranged to by dust-proof piece, it, only need to be opposite anti-using the porous loose structure of sponge
The blowing of dirt block can remove dust, and heat dissipation effect is good.Snap-gauge is arranged to epoxy resin board, utilizes the height of epoxy resin
Thermal conductivity effectively promotes heat dissipation for circuit board effect, and epoxy resin has high-strength characteristic, can promote circuit board intensity.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram of the utility model.
Reference numeral is：Circuit board body 1, ventilated membrane A2, ventilated membrane B3, heat dissipation resin bed A4, heat dissipation resin bed B5, card
Plate 6, dust-proof piece 7.
Specific embodiment
For that can further appreciate that the feature of the utility model, technological means and the specific purposes reached, function, below
The utility model is described in further detail with specific embodiment with reference to attached drawing.
With reference to figure 1.
The utility model embodiment discloses a kind of dust-proof circuit board, including circuit board body 1,1 top of circuit board body and
Bottom has been respectively fixedly connected with ventilated membrane A2, ventilated membrane B3, and ventilated membrane A2 tops are adjacent heat dissipation resin bed A4, ventilated membrane B3 bottoms
Portion's adjoining has heat dissipation resin bed B5, and 1 top opposite sides of circuit board body is fixedly connected with snap-gauge 6,1 bottom phase of circuit board body
Both sides are fixedly connected with snap-gauge 6, dust-proof piece 7 is fixedly connected between opposite two snap-gauges 6.
Concrete principle is that ventilated membrane is a kind of plastic film, can prevent dust by, have good gas permeability.Thoroughly
The setting of air film A2, ventilated membrane B3 prevent dust from entering circuit board body 1, and the heat that circuit board body 1 generates when working can be saturating
Cross ventilated membrane A2, ventilated membrane B3 is outwards distributed.Radiating resin bed A4, heat dissipation resin bed B5 can be from ventilated membrane A2, ventilated membrane B3
Draw heat is simultaneously distributed toward upper layer transfers, and the resin bed A4 that radiates, heat dissipation resin bed B5 can adsorb part dust.Card
The setting of plate 6 adds heat dissipation area, and snap-gauge 6 can be used as heat dissipation vehicle from draw heat in circuit board body 1 and into air
It transfers.It is fixed on for dust-proof piece 7 between two opposite snap-gauges 6, dust is stopped.
Based on above-described embodiment, dust-proof piece 7 is sponge or cotton.Dust-proof piece 7 is sponge or cotton, utilizes sponge or cotton
Porous loose structure, can effectively adsorb dust, and its result of ventilating heat dissipation is good.
Based on above-described embodiment, heat dissipation resin bed A4, heat dissipation resin bed B5 are heat-conducting silicone grease.Heat-conducting silicone grease is a kind of high
Heat conductive insulating organosilicon material, almost never cures, can at a temperature of -50 DEG C~+230 DEG C for a long time keep use when fat
Paste state.Not only there is excellent electrical insulating property, but also have excellent thermal conductivity.Heat dissipation resin bed A4, heat dissipation resin bed B5 are set
For heat-conducting silicone grease, heat dissipation resin bed A4, heat dissipation resin bed B5 can be rapidly from draw heats on ventilated membrane A2, ventilated membrane B3 and past
Upper layer transfers distribute, and adsorbable part dust.
Based on above-described embodiment, snap-gauge 6 is epoxy resin board.Epoxy resin has heat safe good characteristic, to metal
There is excellent adhesive strength with the surface of nonmetallic materials, dielectric properties are good, and deformation retract rate is small, and hardness is high, extensively should
For electronic product packaging.Snap-gauge 6 is arranged to epoxy resin board, it, can be quickly from circuit board body 1 using its high-termal conductivity
Upper draw heat and being transferred into air distributes；Using its high-strength hardness property, the integral strength of circuit board can be promoted.
Based on above-described embodiment, dust-proof piece 7 highly consistent with snap-gauge 6.Dust-proof piece 7 is arranged to unanimously with 6 height of snap-gauge,
The dismounting and fixation of convenient dust-proofing block 7.
Above example only expresses a kind of embodiment of the utility model, and description is more specific and detailed, but not
Can the limitation to the utility model patent scope therefore be interpreted as.It should be pointed out that the ordinary skill people for this field
For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality
With new protection domain.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of dust-proof circuit board, including circuit board body (1), which is characterized in that at the top and bottom of the circuit board body (1)
Ventilated membrane A (2), ventilated membrane B (3) are respectively fixedly connected with, ventilated membrane A (2) top is adjacent heat dissipation resin bed A (4), institute
Stating ventilated membrane B (3) bottom contiguous has heat dissipation resin bed B (5), and circuit board body (1) top opposite sides is fixedly connected with
Snap-gauge (6), circuit board body (1) bottom opposite sides are fixedly connected with snap-gauge (6), opposite two snap-gauges (6)
Between be fixedly connected with dust-proof piece (7).
2. a kind of dust-proof circuit board according to claim 1, which is characterized in that described dust-proof piece (7) are sponge.
3. a kind of dust-proof circuit board according to claim 1, which is characterized in that the heat dissipation resin bed A (4), heat dissipation tree
Lipid layer B (5) is heat-conducting silicone grease.
4. a kind of dust-proof circuit board according to claim 1, which is characterized in that the snap-gauge (6) is epoxy resin board.
A kind of 5. dust-proof circuit board according to claim 1, which is characterized in that dust-proof piece (7) and the snap-gauge (6)
It is highly consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721367533.9U CN207382665U (en) | 2017-10-23 | 2017-10-23 | A kind of dust-proof circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721367533.9U CN207382665U (en) | 2017-10-23 | 2017-10-23 | A kind of dust-proof circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207382665U true CN207382665U (en) | 2018-05-18 |
Family
ID=62335891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721367533.9U Expired - Fee Related CN207382665U (en) | 2017-10-23 | 2017-10-23 | A kind of dust-proof circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207382665U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108751722A (en) * | 2018-08-11 | 2018-11-06 | 芜湖市新海域智能科技有限公司 | A kind of computer hard disk substrate devitrified glass and preparation method |
-
2017
- 2017-10-23 CN CN201721367533.9U patent/CN207382665U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108751722A (en) * | 2018-08-11 | 2018-11-06 | 芜湖市新海域智能科技有限公司 | A kind of computer hard disk substrate devitrified glass and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180518 Termination date: 20201023 |