CN207381019U - A kind of flexible display substrates motherboard, flexible display substrates and display device - Google Patents
A kind of flexible display substrates motherboard, flexible display substrates and display device Download PDFInfo
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- CN207381019U CN207381019U CN201721529903.4U CN201721529903U CN207381019U CN 207381019 U CN207381019 U CN 207381019U CN 201721529903 U CN201721529903 U CN 201721529903U CN 207381019 U CN207381019 U CN 207381019U
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Abstract
The utility model embodiment provides a kind of flexible display substrates motherboard, flexible display substrates and display device, it is related to display technology field, it can solve the problem of that existing flexible display substrates motherboard causes to cut crackle in the larger stress for cutting separated generation in the process and cutting crackle is difficult to eliminate in cutting crack growth to display unit and flexible display substrates is caused to fail.Cleavable region between two display units including multiple display units and arbitrary neighborhood, flexible display substrates motherboard includes flexible substrate substrate and the multiple inorganic insulation film layers being arranged on flexible substrate substrate, at least one film layer in multiple inorganic insulation film layers has within the border in cleavable region and through the pierced pattern of at least one film layer, and along the width in cleavable region, two lateral boundaries of pierced pattern are located at the both sides of the center line in cleavable region respectively.
Description
Technical field
The utility model is related to display technology field more particularly to a kind of flexible display substrates motherboard, flexible display substrates
And display device.
Background technology
With the extensive use of people's living standards continue to improve and the display device every field in production and living,
People are also increasing to the demand of display device.During the process for producing of display device, in order to improve display
The production efficiency of device reduces production cost, display device either TFT-LCD (Thin Film Transistor Liquid
Crystal Display, thin-film transistor LCD device) or OLED (Organic Light Emitting
Diode, organic electroluminescent diode display device) etc., it is to cut separation again after carrying out integrated artistic making on motherboard,
Further complete back segment module technique.By taking the flexible display substrates motherboard of flexible substrates makes as an example, first in Flexible Displays base
Multiple display cell structures are made with the arrangement mode of high usage simultaneously on plate motherboard, the flexible display substrates that will be completed
Motherboard carries out cutting separation in the cleavable region between two neighboring display unit, then again respectively to multiple independent soft
Property display base plate carry out subsequent technique.
Cutting mode to flexible display substrates motherboard is usually break bar cutting or laser cutting, and this cutting mode can
Relatively smooth smooth section is obtained, still, the stress that cutting process generates easily is generated in cutting position perpendicular to cutting side
To cutting crackle, if cutting crackle further extend in display unit, be likely to result in the display of flexible display substrates
It is abnormal, even result in entire flexible display substrates failure.
Under the developing direction of display panel narrow frame, with the continuous constriction of display floater frame, Flexible Displays base
The distance between line position and display unit edge also gradual constriction are cut on plate motherboard, the distance weakened for cutting crack propagation
Reduce, it is easier to occur, due to caused flexible display substrates Problem of Failure in cutting crack growth to display unit, to cause soft
Property display base plate making defect rate rise, and then the cost of manufacture of flexible display substrates is caused to improve.
To solve the above-mentioned problems, in the prior art, in the pre-incision lines position of flexible display substrates motherboard with precuting
Region between the display unit of line both sides removes inorganic material layer to form grooving, is split by the grooving of formation to weaken cutting
The trend that line is further propagated by inorganic material layer into display unit, still, grooving simply opposite can weaken cutting and split
The propagation of line for example, for the larger cutting crackle of stress, is still difficult to effectively prevent its propagation into display unit,
Therefore, the problem of flexible display substrates fail caused by cutting crackle still exists.
Utility model content
The utility model embodiment provides a kind of flexible display substrates motherboard, flexible display substrates and display device, can
Solve existing flexible display substrates motherboard causes to cut crackle and cutting in the larger stress for cutting separated generation in the process
Crackle is difficult to eliminate, and cuts the problem of in crack growth to display unit flexible display substrates being caused to fail.
In order to achieve the above objectives, the embodiment of the utility model adopts the following technical scheme that：
The one side of the utility model embodiment provides a kind of flexible display substrates motherboard, including multiple display units with
And the cleavable region between two display units of arbitrary neighborhood, flexible display substrates motherboard include flexible substrate substrate and
The multiple inorganic insulation film layers being arranged on flexible substrate substrate, at least one film layer in multiple inorganic insulation film layers have position
Within the border in cleavable region and through the pierced pattern of at least one film layer, and along the width in cleavable region,
Two lateral boundaries of pierced pattern are located at the both sides of the center line in cleavable region respectively.
Preferably, the overlapping margins on the border of pierced pattern and cleavable region.
Preferably, multiple inorganic insulation film layers are respectively provided with pierced pattern in cleavable region, multiple inorganic insulation film layers
Pierced pattern is identical and the pierced pattern of multiple inorganic insulation film layers is set along the orthographic projection direction of multiple film layers.
Further, the stress absorption pattern being mainly made of metal or organic material is provided in pierced pattern.
Preferably, the area of stress absorption pattern is less than the area of the pierced pattern where it, and with close to display unit
Between the edge of the pierced pattern of one side have gap and/or, have between the center line in stress absorption pattern and cleavable region
There is gap.
Preferably, flexible display substrates motherboard include be located at display unit in thin film transistor (TFT), stress absorption pattern by
Metal material is formed, and the source electrode and drain electrode of stress absorption pattern and thin film transistor (TFT) are with the same material of layer, alternatively, stress absorption pattern
Grid with thin film transistor (TFT) is the same as the same material of layer.
The another aspect of the utility model embodiment provides a kind of flexible display substrates, including display unit and is located at
The fringe region on display unit periphery, flexible display substrates include flexible substrate substrate and are arranged on flexible substrate substrate
Multiple inorganic insulation film layers, at least one film layer in multiple inorganic insulation film layers have from the outer boundary of fringe region to display
Unit extends through the pierced pattern of at least one film layer.
Preferably, the overlapping margins of the border of pierced pattern and fringe region.
Preferably, multiple inorganic insulation film layer edge regions are respectively provided with pierced pattern, and multiple inorganic insulation film layers are engraved
Null pattern is identical and the pierced pattern of multiple inorganic insulation film layers is set along the orthographic projection direction of multiple film layers.
Further, the stress absorption pattern being mainly made of metal or organic material is provided in pierced pattern.
Preferably, the area of stress absorption pattern is less than the area of the pierced pattern where it, and with close to display unit
Between the edge of the pierced pattern of one side have gap and/or, have between stress absorption pattern and the outer boundary of fringe region
Gap.
Preferably, flexible display substrates include the thin film transistor (TFT) being located in display unit, and stress absorption pattern is by metal
Material is formed, and the source electrode of stress absorption pattern and thin film transistor (TFT) and is drained with the same material of layer, alternatively, stress absorption pattern with it is thin
The grid of film transistor is the same as the same material of layer.
The utility model embodiment in another aspect, a kind of display device is provided, including any one above-mentioned Flexible Displays
Substrate.
A kind of flexible display substrates motherboard of the utility model embodiment, flexible display substrates and display device, including multiple
Cleavable region between display unit and two display units of arbitrary neighborhood, flexible display substrates motherboard include flexible liner
Substrate and the multiple inorganic insulation film layers being arranged on flexible substrate substrate, it is at least one in multiple inorganic insulation film layers
Film layer has within the border in cleavable region and through the pierced pattern of at least one film layer, and along cleavable region
Width, two lateral boundaries of pierced pattern are located at the both sides of the center line in cleavable region respectively.To Flexible Displays base
When plate motherboard is cut, cutting line is cut through pierced pattern, since pierced pattern runs through multiple inorganic insulation film layers
In at least one film layer, and both sides of the center line positioned at cleavable region so that reduce at least one layer of or removal completely
Inorganic insulation film layer at the position that cutting line extends to display unit direction so that the stress that cutting generates is smaller, subtracts
The generation of crackle is cut caused by few stress due to cutting.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of structure diagram for flexible display substrates motherboard that the utility model embodiment provides；
Fig. 2 is a kind of one of hierarchical structure schematic diagram of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 3 is the two of the hierarchical structure schematic diagram for a kind of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 4 is the three of the hierarchical structure schematic diagram for a kind of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 5 is the four of the hierarchical structure schematic diagram for a kind of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 6 is the five of the hierarchical structure schematic diagram for a kind of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 7 is the six of the hierarchical structure schematic diagram for a kind of flexible display substrates motherboard that the utility model embodiment provides；
Fig. 8 is a kind of structure diagram for flexible display substrates that the utility model embodiment provides；
Fig. 9 is a kind of one of hierarchical structure schematic diagram of flexible display substrates that the utility model embodiment provides；
Figure 10 is the two of the hierarchical structure schematic diagram for a kind of flexible display substrates that the utility model embodiment provides；
Figure 11 is the three of the hierarchical structure schematic diagram for a kind of flexible display substrates that the utility model embodiment provides；
Figure 12 is the four of the hierarchical structure schematic diagram for a kind of flexible display substrates that the utility model embodiment provides；
Figure 13 is the five of the hierarchical structure schematic diagram for a kind of flexible display substrates that the utility model embodiment provides；
Figure 14 is a kind of flow chart of the cutting method for flexible display substrates motherboard that the utility model embodiment provides.
Reference numeral：
10- flexible substrate substrates；20- inorganic insulation film layers；The pierced pattern of 30- flexible display substrates motherboards；31- is flexible
The pierced pattern of display base plate；The stress absorption pattern of 40- flexible display substrates motherboards；The stress of 41- flexible display substrates is inhaled
Receive pattern；50- thin film transistor (TFT)s；X- display units；The cleavable regions of Y-；Y1- fringe regions；L- cutting lines.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
The utility model embodiment provides a kind of flexible display substrates motherboard, as shown in Figure 1, including multiple display unit X
And the cleavable region Y between two display unit X of arbitrary neighborhood, as shown in Fig. 2, flexible display substrates motherboard is including soft
Property underlay substrate 10 and the multiple inorganic insulation film layers 20 being arranged on flexible substrate substrate 10, multiple inorganic insulation film layers 20
In at least one film layer have positioned at cleavable region Y border within and through at least one film layer pierced pattern 30,
And along the width of cleavable region Y, two lateral boundaries of pierced pattern 30 are located at the center line of cleavable region Y respectively
Both sides.
It should be noted that first, as shown in Figure 1, a display unit X refers to cutting from flexible display substrates motherboard
The region that part necessary to obtaining a flexible display substrates occupies is cut, including display unit necessary to realizing display
Divide and do not allow the part being cut off for providing cabling of signal line etc. for display, for example, flexible display substrates motherboard
On a display unit X can include：It is subsequently used for being formed display area (also referred to as Active Area, the abbreviation of display screen
AA areas) part, can also include being subsequently used for the part of the non-display area of display screen (including driving circuit, such as GOA electricity
Road etc. can also include the region for setting other chips).It is exemplary, it, can be with each for OLED display
Border of the border of thinner package film layer as display unit X.
Second, cleavable region Y refers to the periphery of display unit X, can be cut off for flexible display substrates
Part occupied by region.But it should be noted that in cutting technique, not cut off in cleavable region completely, specifically
, in cutting technique, cut along the cutting line L in cleavable region Y, and adjacent two display unit X it
Between can be split along a cutting line L.It is exemplary, as shown in Figure 1, cutting line L can be located at the center of cleavable region Y
The position of center line of line position or approximate cleavable region Y.
3rd, as shown in Fig. 2, multiple inorganic insulation film layers 20 are set on flexible substrate substrate 10, wherein, it is described inorganic
Specific set in number of plies the utility model embodiment of insulating film layer 20 is not specifically limited, can be according to flexible display substrates
Design needs to set one or more layers, it is generally the case that the inorganic insulation film layer 20 set on flexible substrate substrate 10 includes
There is multilayer.For example, inorganic insulation film layer 20 can include in display unit X formed thin film transistor (TFT) gate insulation layer,
Interlayer dielectric layer etc., alternatively, can also include being generally formed in the resistance for being used to stop water and oxygen on flexible substrate substrate 10
Barrier, buffer layer etc..Pierced pattern 30 within border (as shown in phantom in Figure 2) scope positioned at cleavable region Y can
To run through one layer in multilayer inorganic insulation film layer 20, the multilayer in multilayer inorganic insulation film layer 20 can also be run through.It is exemplary,
As shown in Figure 2, it is the situation of whole levels of the pierced pattern 30 in multilayer inorganic insulation film layer 20.
4th, as shown in Figure 2, it is generally the case that when being cut to flexible display substrates motherboard, cutting line L is (as schemed
In 2 shown in heavy line) it is cut along the position of center line of cleavable region Y, two lateral boundaries difference position of pierced pattern 30
In the both sides of the center line of cleavable region Y, then cutting line L in pierced pattern 30 by passing through.Therefore, cutting line L is acted only on
Flexible substrate substrate 10 and except pierced pattern 30 other inorganic insulation film layers 20 in addition to perforative inorganic insulation film layer 20.
Reduce the level quantity of the inorganic insulation film layer 20 acted on during cutting line L cuttings, that is, reduce cutting force inorganic
The stress intensity generated on insulating film layer 20.
A kind of flexible display substrates motherboard of the utility model embodiment, includes the two of multiple display units and arbitrary neighborhood
Cleavable region between a display unit, flexible display substrates motherboard include flexible substrate substrate and are arranged on flexible substrate
Multiple inorganic insulation film layers on substrate, at least one film layer in multiple inorganic insulation film layers have positioned at cleavable region
Within border and through the pierced pattern of at least one film layer, and along the width in cleavable region, two of pierced pattern
Lateral boundaries are located at the both sides of the center line in cleavable region respectively.When being cut to flexible display substrates motherboard, cutting line
It is cut through pierced pattern, due at least one film layer of the pierced pattern in multiple inorganic insulation film layers, and is located at
The both sides of the center line in cleavable region so that reduce at least one layer of or removal cutting line extends to display unit direction completely
Position at inorganic insulation film layer so that cutting generate stress it is smaller, reduce due to cutting stress caused by cutting
The generation of crackle.
Preferably, as shown in figure 3, the border of pierced pattern 30 and the overlapping margins of cleavable region Y.
As shown in figure 3, the border of pierced pattern 30 and the overlapping margins of cleavable region Y, i.e., it will be in cleavable region Y
One or more layers in inorganic insulation film layer 20 removes divided by is formed completely pierced pattern 30.So, to Flexible Displays base
When plate motherboard is cut, since pierced pattern 30 contains the scope of entire cleavable region Y, cutting operation will not be in hollow out
Stress is generated on pattern 30, crackle caused by stress will not be formed on pierced pattern 30, and is not provided with engraving at other
Stress in the inorganic insulation film layer 20 of null pattern 30 will not be propagated on pierced pattern 30, so as to reduce what cutting generated
While the intensity of stress, the transmitting carrier of stress is decreased.
Preferably, it is more as shown in figure 3, multiple inorganic insulation film layers 20 are respectively provided with pierced pattern 30 in cleavable region Y
The pierced pattern 30 of a inorganic insulation film layer 20 is identical and the pierced pattern 30 of multiple inorganic insulation film layers 20 is along multiple film layers
Orthographic projection direction is set.
As shown in figure 3, the pierced pattern 30 of multiple inorganic insulation film layers 20 is set along the orthographic projection direction of multiple film layers, i.e.,
Integrally run through on the direction that multiple pierced patterns 30 are stacked in inorganic insulation film layer 20, so that being cut along cutting line L positions
When, the active force of cutting operation is applied only on flexible substrate substrate 10.Since flexible substrate substrate 10 is organic material making
It forms, organic material is usually not easy to crack in cut edge due to the effect of stress, and organic material is for stress
Communication effect it is poor, on flexible substrate substrate 10 cutting be not likely to produce crackle, so, it becomes possible to effective to reduce pair
Stress when flexible display substrates motherboard is cut in the inorganic insulation film layer 20 on cutting line both sides, so as to reduce stress cracking
Incidence, and then the display unit X on flexible display substrates motherboard is protected, it avoids causing flexible display substrates due to cutting stress
Failure.
Further, as shown in figure 4, being provided with the stress that is mainly made of metal or organic material in pierced pattern 30
Absorb pattern 40.
Stress absorption pattern 40 has the property that can absorb simultaneously dispersive stress, as shown in figure 4, being set in pierced pattern 30
Stress absorption pattern 40 is put, enables to be still unavoidable from the stress that can be generated during cutting and can be transferred to stress absorption pattern
Inside 40, stress is made to be absorbed and disperse, cracked so as to avoid stress concentration in film layer, and cause crackle into one
Step is propagated in display unit X.
Metal or organic material are since its own is with the ability that can be absorbed and disperse stress, it is preferred, therefore, that main
The making material of metal or organic material as stress absorption pattern 40 is used, stress absorption and scattered, reduction can be played
The possibility and the crackle for having generated that stress cracks in film layer weaken it further into display unit X
The risk of propagation.
Preferably, as shown in figure 5, the area of stress absorption pattern 40 be less than its where pierced pattern 30 area, and
Close to display unit X one sides pierced pattern 30 edge between have gap a1 and/or, stress absorption pattern 40 with can
There is gap a2 between the center line of cutting region Y.
As shown in figure 5, the area of stress absorption pattern 40 is less than the area of the pierced pattern 30 set by it, this practicality is new
Type embodiment is not limited the concrete shape of stress absorption pattern 40, could be provided as it is variously-shaped, as long as meet stress suction
The group of receipts 40 is arranged in pierced pattern 30.The face of the pierced pattern 30 formed in one or more layers inorganic insulation film layer 20
Product is big, is filled in that the area of stress absorption pattern 40 in pierced pattern 30 is small, and stress absorption pattern 40 should be with pierced pattern 30
Edge between there are gaps.
On this basis so that stress absorption pattern 40 with close to display unit X one sides pierced pattern 30 edge it
Between there is gap a1, so, even if the cutting stress transfer that generates is to stress absorption during cutting flexible display substrates motherboard
It is not completely absorbed or disperses on pattern 40, in stress absorption pattern 40 and the close also existing gap a1 in display unit X one sides
Stress is enabled not have carrier to be transferred, the risk of crackle is caused at the edge of display unit X so as to avoid stress.
Or so that there are gap a2, normal conditions between the center line of stress absorption pattern 40 and cleavable region Y
Under, cutting line L when being cut to flexible display substrates motherboard along the center line or approximated centerlines of cleavable region Y for position into
Row cutting operation, so, gap a2 cause cutting not generate stress in the 30 perforative film layer of institute of pierced pattern, so as to
It will not be cracked in the 30 perforative film layer of institute of pierced pattern, the stress generated for cutting in other film layers, moreover it is possible to
It is enough to be absorbed and disperseed by the stress absorption pattern 40 being arranged in pierced pattern 30, so as to reduce the generation of crackle and biography
It broadcasts.
Alternatively, above two mode is combined, it is exemplary, as shown in Figure 5 so that stress absorption pattern 40 and close display
While there is gap a1 between the edge of the pierced pattern 30 of unit X one sides, also have between the center line of cleavable region Y
Have gap a2, so, on the one hand can pass through gap a2 so that during cutting reduce generate stress and due to stress and
On the other hand the crackle generated in film layer, for the stress being difficult to avoid that, is being absorbed and divided by stress absorption pattern 40
On the basis of dissipating, additionally it is possible to by gap a1, further stop that the crackle that stress and stress generate is passed into display unit X
It broadcasts.
It preferably, should as shown in fig. 7, flexible display substrates motherboard includes the thin film transistor (TFT) 50 being located in display unit X
Power absorbs pattern 40 and is made of metal material, and stress absorption pattern 40 is with the source electrode of thin film transistor (TFT) 50 and drain electrode with the same material of layer
Material, alternatively, as shown in fig. 6, the grid of stress absorption pattern and thin film transistor (TFT) is the same as the same material of layer.
As shown in fig. 6, include thin film transistor (TFT) 50 in display unit X on flexible display substrates motherboard, it is exemplary,
Thin film transistor (TFT) 50 is made of the grid, gate insulation layer, semiconductor active layer, source electrode and the drain electrode that set gradually and passivation layer,
The stress absorption pattern 40 of the utility model embodiment is made of metal material, stress absorption pattern 40 and thin film transistor (TFT) 50
Grid is with the same material of layer, i.e., before the grid for making the thin film transistor (TFT) 50 in display unit X, by running through inorganic insulating membrane
The pierced pattern 30 of layer 20 removes one or more layers inorganic insulation film layer 20 having been formed on flexible substrate substrate 10, so
Afterwards by a patterning processes, in the grid for making the thin film transistor (TFT) 50 in display unit X simultaneously in cleavable region Y
Stress absorption pattern 40 is made, from the manufacturing process steps without additionally increasing stress absorption pattern 40.It then proceeds by
The subsequent film of display unit X makes, and forms structure as shown in Figure 6.
However, the flexible display substrates motherboard that this mode makes, as shown in fig. 6, for making in display unit X
Latter made each inorganic insulation film layer 20 of the grid of thin film transistor (TFT) 50, for example, gate insulation layer, due in stress absorption figure
It makes, then can only retain after case 40.
It is preferred, therefore, that as shown in fig. 7, the stress absorption pattern 40 of the utility model embodiment is made of metal material,
Stress absorption pattern 40 with the same material of layer, that is, is making the film in display unit X with the source electrode of thin film transistor (TFT) 50 and drain electrode
When the source electrode of transistor 50 and drain electrode, by a patterning processes, while stress absorption pattern is made in cleavable region Y
40, from the manufacturing process steps without additionally increasing stress absorption pattern 40.
It should be noted that with display unit X in thin film transistor (TFT) 50 source electrode and drain electrode with layer make stress inhale
Before receiving pattern 40, the inorganic insulation film layer 20 having been formed on cleavable region Y is removed first, forms pierced pattern
30, then by a patterning processes, in the source electrode for making the thin film transistor (TFT) 50 in display unit X and drain electrode simultaneously can
Stress absorption pattern 40 is made in cutting region Y, from the manufacturing process steps without additionally increasing stress absorption pattern 40.So
Subsequent processing step is carried out again afterwards, to form structure as shown in Figure 7.
The another aspect of the utility model embodiment provides a kind of flexible display substrates, as shown in figure 8, single including display
The first X and fringe region Y1 positioned at display unit X peripheries.As shown in figure 9, flexible display substrates include flexible substrate substrate 10
And multiple inorganic insulation film layers 20 on flexible substrate substrate 10 are arranged on, it is at least one in multiple inorganic insulation film layers 20
Film layer has the pierced pattern 31 that at least one film layer is extended through from the outer boundary of fringe region Y1 to display unit X.
It should be noted that as shown in Figure 10, fringe region Y1 refers to the periphery of display unit X, for Flexible Displays
It is remaining close to display unit X one sides after substrate motherboard is by the center line of cleavable region Y or the position cutting of approximated centerlines
Part.The outer boundary of fringe region Y1 is the edge referred to after cutting line L cuttings.
Preferably, as shown in Figure 10, the border of pierced pattern 31 and the overlapping margins of fringe region Y1.
As shown in Figure 10, the overlapping margins of the border of pierced pattern 31 and fringe region Y1, i.e. nothing in fringe region Y1
Pierced pattern 31 is formed after one or more layers complete removal in machine insulating film layer 20.The flexible display substrates of this structure, by
In the one side of pierced pattern 31 extends to the edge of display unit X, opposite side is extended at cutting line L, i.e., pierced pattern 31 wraps
Containing entire fringe region Y1, stress will not be generated on pierced pattern 31 when being cut along cutting line L, it will not be
Crackle caused by forming stress on pierced pattern 31, and answering in the inorganic insulation film layer 20 that other are not provided with pierced pattern 31
Power will not be propagated on pierced pattern 31, so as to while the intensity for the stress that cutting generates is reduced, decrease stress
Transmitting carrier.
Preferably, as shown in Figure 10, multiple 20 edge region Y1 of inorganic insulation film layer are respectively provided with pierced pattern 31, multiple
The pierced pattern 31 of inorganic insulation film layer 20 is identical and the pierced pattern 31 of multiple inorganic insulation film layers 20 along multiple film layers just
Projecting direction is set.
As shown in Figure 10, the pierced pattern 31 of multiple inorganic insulation film layers 20 is set along the orthographic projection direction of multiple film layers,
Integrally run through on the direction that i.e. multiple pierced patterns 31 are stacked in inorganic insulation film layer 20, so that being cut along cutting line L positions
The active force of operation is applied only on flexible substrate substrate 10.Since flexible substrate substrate 10 is made for organic material, have
Machine material is usually not easy to crack in cut edge due to the effect of stress, and organic material is imitated for the propagation of stress
Fruit is poor, is cut on flexible substrate substrate 10 and is not likely to produce crackle, so, it becomes possible to is effective to reduce Flexible Displays base
Plate is in cutting, the stress in the inorganic insulation film layer 20 on cutting line L both sides, so as to reduce the incidence of stress cracking,
And then the display unit X on flexible display substrates is protected, it avoids due to cutting stress flexible display substrates being caused to fail.
Further, as shown in figure 11, it is provided in pierced pattern 31 and is mainly answered by what metal or organic material were formed
Power absorbs pattern 41.
Stress absorption pattern 41 has the property that can absorb simultaneously dispersive stress, as shown in figure 11, in pierced pattern 31
Stress absorption pattern 41 is set, enables to be still unavoidable from the stress that can be generated during cutting that stress absorption figure can be transferred to
Inside case 41, stress is made to be absorbed and disperse, is cracked so as to avoid stress concentration in film layer, and cause crackle into
One step is propagated in display unit X.
Metal or organic material are since its own is with the ability that can be absorbed and disperse stress, it is preferred, therefore, that main
The making material of metal or organic material as stress absorption pattern 41 is used, stress absorption and scattered, reduction can be played
The possibility and the crackle for having generated that stress cracks in film layer weaken it further into display unit X
The risk of propagation.
Preferably, as shown in figure 11, the area of stress absorption pattern be less than its where pierced pattern 31 area, and with
Close to display unit X one sides pierced pattern 31 edge between have gap a1 and/or, stress absorption pattern 41 and edge
There is gap a2 between the outer boundary of region Y1.
As shown in figure 11, the area of stress absorption pattern 41 is less than the area of the pierced pattern 31 set by it, and stress is inhaled
Pattern 41 should there are gaps between the edge of pierced pattern 31 for receipts.
On this basis so that stress absorption pattern 41 with close to display unit X one sides pierced pattern 31 edge it
Between there is gap a1, so, even if not being completely absorbed or disperseing on cutting stress transfer to stress absorption pattern 41,
Stress absorption pattern 41 enables stress not have carrier to be transferred with the close also existing gap a1 in display unit X one sides,
So as to avoid stress the risk of crackle is caused at the edge of display unit X.
Or so that there is gap a2 between the outer boundary of stress absorption pattern 41 and fringe region Y1, so,
Gap a2 causes cutting not generate stress in the 31 perforative film layer of institute of pierced pattern, so as to be passed through in pierced pattern 31
It is cracked in the film layer worn, the stress generated for cutting in other film layers, additionally it is possible to by being arranged on pierced pattern 31
Interior stress absorption pattern 41 is absorbed and disperseed, so as to reduce the generation of crackle and propagation.
Alternatively, above two mode is combined, it is exemplary, as shown in figure 11 so that stress absorption pattern 41 is shown with close
Show between the edge of the pierced pattern 31 of unit X one sides while there is gap a1, between the outer boundary of fringe region Y1 also
With gap a2, so, on the one hand can pass through gap a2 so that during cutting reduce generate stress and due to stress and
The crackle generated in film layer, on the other hand, for the stress being difficult to avoid that, by stress absorption pattern 41 absorb and
On the basis of scattered, additionally it is possible to by gap a1, further stop that the crackle that stress and stress generate is passed into display unit X
It broadcasts.
Preferably, as shown in figure 13, flexible display substrates include the thin film transistor (TFT) 50 being located in display unit X, stress
It absorbs pattern 41 to be made of metal material, the source electrode of stress absorption pattern 41 and thin film transistor (TFT) 50 and drain with the same material of layer,
Alternatively, as shown in figure 12, the grid of stress absorption pattern 41 and thin film transistor (TFT) is the same as the same material of layer.
As shown in figure 12, thin film transistor (TFT) 50 is included in the display unit X of flexible display substrates, exemplary, film is brilliant
Body pipe 50 is made of the grid, gate insulation layer, semiconductor active layer, source electrode and the drain electrode that set gradually and passivation layer, this practicality
The stress absorption pattern 41 of new embodiment is made of metal material, and stress absorption pattern 41 and the grid of thin film transistor (TFT) 50 are same
The same material of layer, i.e., before the grid for making the thin film transistor (TFT) in display unit X, by running through engraving for inorganic insulation film layer 20
Null pattern 31 removes one or more layers inorganic insulation film layer 20 having been formed on flexible substrate substrate 10, then passes through one
Secondary patterning processes make stress in the grid for making the thin film transistor (TFT) 50 in display unit X while in edge region Y1
Pattern 41 is absorbed, from the manufacturing process steps without additionally increasing stress absorption pattern 41.Then proceed by display unit X
Subsequent film make, form structure as shown in figure 12.
However, the flexible display substrates that this mode makes, as shown in figure 12, for thin in making display unit X
Latter made each inorganic insulation film layer 20 of the grid of film transistor 50, for example, gate insulation layer, due in stress absorption pattern
It makes, then can only retain after 41.
It is preferred, therefore, that as shown in figure 13, the stress absorption pattern 41 of the utility model embodiment is by metal material structure
Into the source electrode and drain electrode of stress absorption pattern 41 and thin film transistor (TFT) 50 are with the same material of layer, i.e., thin in making display unit X
When the source electrode of film transistor 50 and drain electrode, by a patterning processes, while stress absorption pattern is made in edge region Y1
41, from the manufacturing process steps without additionally increasing stress absorption pattern 41.
It should be noted that with display unit X in thin film transistor (TFT) 50 source electrode and drain electrode with layer make stress inhale
Before receiving pattern 41, the inorganic insulation film layer 20 having been formed on fringe region Y1 is removed first, forms pierced pattern 31,
Then by a patterning processes, in the source electrode for making the thin film transistor (TFT) 50 in display unit X and drain electrode simultaneously at edge
Stress absorption pattern 41 is made in the Y1 of region, from the manufacturing process steps without additionally increasing stress absorption pattern 41.Then
Subsequent processing step is carried out again, to form structure as shown in fig. 13 that.
The utility model embodiment in another aspect, a kind of display device is provided, including any one above-mentioned Flexible Displays
Substrate.
A kind of display device that the utility model embodiment provides, using above-mentioned flexible display substrates, since flexibility is aobvious
Show the pierced pattern 31 set on substrate, alternatively, stress absorption pattern 41 is additionally provided in pierced pattern 31, to substantially reduce
Flexible display substrates edge may cut influence of the crackle to display effect caused by cutting stress, so that soft
Property display base plate in device be effectively protected improve display device processing yield and display device display effect
Fruit.In the above-mentioned specific descriptions to flexible display substrates, the display device made to flexible display substrates has carried out in detail
Thin explanation, details are not described herein again.
The another aspect of the utility model embodiment provides a kind of cutting method of flexible display substrates motherboard, such as Figure 14
It is shown, including：
S101, flexible display substrates motherboard is cut along cutting line L.Wherein, it is soft to be located at any of the above-described by cutting line L
In the range of two lateral boundaries of the pierced pattern 30 described in property display base plate motherboard.
As shown in figure 14, the flexible display substrates motherboard of the utility model embodiment is needed after completing along cutting line
L is cut, and is separated by the cutting of cutting line L, after flexible display substrates motherboard is divided into multiple flexible display substrates, then
Other processing steps are carried out to each flexible display substrates.Wherein, to the cutting of flexible display substrates motherboard, can be cut for break bar
It cuts, even if the point of a knife of break bar is cut along the path of cutting line L, alternatively, can also be using laser cutting, chooses appropriate big
The laser beam of outgoing is directed at cutting line L and extended along cutting line L and cut by small lasing light emitter.Cutting line L is located at flexible base board mother
In the range of two lateral boundaries of the pierced pattern 30 of plate, two lateral boundaries of pierced pattern 30 refer to pierced pattern close to phase
The border of the side of two adjacent flexible display substrates to be separated.
It is above-mentioned to the illustrating of structure, the cutting mode of flexible display substrates motherboard etc. in, for this practicality
The cutting method of the flexible display substrates motherboard of new embodiment is described in detail, and details are not described herein again.
The above is only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, in the technical scope that any one skilled in the art discloses in the utility model, variation can be readily occurred in
Or replace, it should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model should be with the power
Subject to the protection domain of profit requirement.
Claims (13)
1. a kind of flexible display substrates motherboard, between two display units including multiple display units and arbitrary neighborhood
Cleavable region, which is characterized in that the flexible display substrates motherboard includes flexible substrate substrate and being arranged on described soft
Property underlay substrate on multiple inorganic insulation film layers, at least one film layer in the multiple inorganic insulation film layer, which has, is located at institute
It states within the border in cleavable region and through the pierced pattern of at least one film layer, and along the width in the cleavable region
Direction is spent, two lateral boundaries of the pierced pattern are located at the both sides of the center line in the cleavable region respectively.
2. flexible display substrates motherboard according to claim 1, which is characterized in that the border of the pierced pattern with it is described
The overlapping margins in cleavable region.
3. flexible display substrates motherboard according to claim 1 or 2, which is characterized in that the multiple inorganic insulation film layer
It is respectively provided with pierced pattern in the cleavable region, the pierced pattern of the multiple inorganic insulation film layer is identical and the multiple nothing
The pierced pattern of machine insulating film layer is set along the orthographic projection direction of the multiple film layer.
4. flexible display substrates motherboard according to claim 1 or 2, which is characterized in that set in the pierced pattern
There is the stress absorption pattern being mainly made of metal or organic material.
5. flexible display substrates motherboard according to claim 4, which is characterized in that the area of the stress absorption pattern is small
In the area of the pierced pattern where it, and close to display unit one side pierced pattern edge between have gap and/
Or, there is gap between the stress absorption pattern and the center line in the cleavable region.
6. flexible display substrates motherboard according to claim 4, which is characterized in that the flexible display substrates motherboard includes
Thin film transistor (TFT) in the display unit, the stress absorption pattern are made of metal material, the stress absorption figure
The source electrode and drain electrode of case and the thin film transistor (TFT) are with the same material of layer, alternatively, the stress absorption pattern and the film crystal
The grid of pipe is the same as the same material of layer.
7. a kind of flexible display substrates, the fringe region including display unit and positioned at the display unit periphery, feature
It is, the flexible display substrates include flexible substrate substrate and are arranged on multiple inorganic exhausted on the flexible substrate substrate
Velum layer, at least one film layer in the multiple inorganic insulation film layer have outer boundary from the fringe region to described aobvious
Show that unit extends through the pierced pattern of at least one film layer.
8. flexible display substrates according to claim 7, which is characterized in that the border of the pierced pattern and the edge
The overlapping margins in region.
9. the flexible display substrates according to claim 7 or 8, which is characterized in that the multiple inorganic insulation film layer is in institute
It states fringe region and is respectively provided with pierced pattern, the pierced pattern of the multiple inorganic insulation film layer is identical and the multiple inorganic insulation
The pierced pattern of film layer is set along the orthographic projection direction of the multiple film layer.
10. the flexible display substrates according to claim 7 or 8, which is characterized in that be provided with master in the pierced pattern
The stress absorption pattern to be made of metal or organic material.
11. flexible display substrates according to claim 10, which is characterized in that the area of the stress absorption pattern is less than
The area of pierced pattern where it, and close to display unit one side pierced pattern edge between have gap and/
Or, there is gap between the stress absorption pattern and the outer boundary of the fringe region.
12. flexible display substrates according to claim 10, which is characterized in that the flexible display substrates include being located at institute
The thin film transistor (TFT) in display unit is stated, the stress absorption pattern is made of metal material, the stress absorption pattern and institute
It states the source electrode of thin film transistor (TFT) and drains with the same material of layer, alternatively, the grid of the stress absorption pattern and the thin film transistor (TFT)
Extremely with the same material of layer.
13. a kind of display device, which is characterized in that including such as claim 7-12 any one of them flexible display substrates.
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| CN201721529903.4U CN207381019U (en) | 2017-11-15 | 2017-11-15 | A kind of flexible display substrates motherboard, flexible display substrates and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742476A (en) * | 2017-11-15 | 2018-02-27 | 京东方科技集团股份有限公司 | A kind of flexible display substrates motherboard and its cutting method, flexible display substrates, display device |
| CN108519709A (en) * | 2018-06-01 | 2018-09-11 | Oppo广东移动通信有限公司 | Electrochromism motherboard, electrochromic cells, shell and electronic equipment |
| CN111969122A (en) * | 2020-08-11 | 2020-11-20 | Tcl华星光电技术有限公司 | Display mother board |
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2017
- 2017-11-15 CN CN201721529903.4U patent/CN207381019U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742476A (en) * | 2017-11-15 | 2018-02-27 | 京东方科技集团股份有限公司 | A kind of flexible display substrates motherboard and its cutting method, flexible display substrates, display device |
| CN107742476B (en) * | 2017-11-15 | 2024-03-12 | 京东方科技集团股份有限公司 | Flexible display substrate mother board, cutting method thereof, flexible display substrate and display device |
| CN108519709A (en) * | 2018-06-01 | 2018-09-11 | Oppo广东移动通信有限公司 | Electrochromism motherboard, electrochromic cells, shell and electronic equipment |
| CN111969122A (en) * | 2020-08-11 | 2020-11-20 | Tcl华星光电技术有限公司 | Display mother board |
| US11758753B2 (en) | 2020-08-11 | 2023-09-12 | Tcl China Star Optoelectronics Technology Co., Ltd. | Display motherboard |
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