CN207369428U - Circuit board heats detent mechanism - Google Patents
Circuit board heats detent mechanism Download PDFInfo
- Publication number
- CN207369428U CN207369428U CN201721500381.5U CN201721500381U CN207369428U CN 207369428 U CN207369428 U CN 207369428U CN 201721500381 U CN201721500381 U CN 201721500381U CN 207369428 U CN207369428 U CN 207369428U
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- China
- Prior art keywords
- circuit board
- vertical columns
- interlocking bar
- detent mechanism
- lifting seat
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Abstract
The utility model belongs to field of mechanical technique, more particularly to a kind of circuit board hot melt detent mechanism.It solves the prior art and designs the technical problem such as unreasonable.This circuit board hot melt detent mechanism includes vertical columns, the positioned-lifting seat that is slidably connected and can be lifted in vertical direction with vertical columns is equipped with vertical columns, the positioned-lifting seat is connected with lift drive mechanism, the pressure strip that it is slidably connected with vertical columns below positioned-lifting seat is additionally provided with vertical columns, the upper end that the interlocking bar being vertically arranged and interlocking bar are connected with the pressure strip passes through the relief hole of positioned-lifting seat, the interlocking bar lift drive mechanism being connected with the upper end of interlocking bar is equipped with vertical columns, some hot melts are equipped with positioned-lifting seat to heat column and be equipped with some resigning through holes being inserted into one by one for the hot melt heating column on pressure strip.The utility model has the advantage of：Production efficiency can be improved and improve product quality.
Description
Technical field
The utility model belongs to field of mechanical technique, more particularly to a kind of circuit board hot melt detent mechanism.
Background technology
Manipulator its be widely used in various production operations.
The structure of vacuum pressure sensor includes having the pedestal of opening and the circuit board being arranged on pedestal, on circuit board
Have some location holes, there is some hot melt columns inserted in the location hole on pedestal, upon assembly, manually by circuit board install to
In pedestal and hot melt column is inserted in location hole, then carries out artificial sweat soldering again.
It is this manually hot melt structure mode its have the disadvantage that：Welding efficiency is relatively low, causes production cost higher；Its
It is secondary, it is not suitable for the dispensing operation of batch, secondly, welding quality can not ensure, cause the stability of the welding quality of product poor.
In order to solve above-mentioned technical problem, for example, Chinese patent literature discloses a kind of flexible circuit board EMI heat
Molten false sticker [application number：201520776122.X], including base, is fixed with stent and false sticker lower template, stent on base
On cylinder and push rod are installed, push rod is connected between cylinder and cope plate installing plate, and false patch is fixed with cope plate installing plate
Machine cope plate, false sticker cope plate are equipped with first through hole, and false sticker lower template is equipped with the second through hole, is fixed in first through hole
There is METAL HEATING PROCESS column, pilot pin is fixed with the second through hole, place flexible circuit board in false sticker lower template, on flexible circuit board
Equipped with some location holes, pilot pin passes through location hole.Program METAL HEATING PROCESS column is in a short time by the invalid of electromagnetic shielding film
Area is heated, and electromagnetic shielding film is quickly fitted on flexible circuit board, efficient, and can prevent electromagnetic shielding film excessive glue；Nothing
It need to heat by hand, security is good；The position of METAL HEATING PROCESS column and pilot pin can adjust, and various sizes of flexible circuit board can be given to paste
Electromagnetic shielding film is closed, versatility is good.
Above-mentioned scheme is simply not proposed to circuit board with heating the hot-melt adhesive paste of column, and therefore, urgent need design is a can
To solve the circuit board of above-mentioned technical problem hot melt detent mechanism.
Utility model content
The purpose of this utility model is in view of the above-mentioned problems, production efficiency can be improved and improve product quality by providing one kind
Circuit board hot melt detent mechanism.
To reach above-mentioned purpose, the utility model employs following technical proposal：This circuit board hot melt detent mechanism includes
Vertical columns, are equipped with the positioned-lifting seat that is slidably connected and can be lifted in vertical direction with vertical columns on vertical columns,
The positioned-lifting seat is connected with lift drive mechanism, be additionally provided with vertical columns below positioned-lifting seat its with it is solid
Determine the pressure strip that column is slidably connected, the upper end that the interlocking bar being vertically arranged and interlocking bar are connected with the pressure strip passes through
The relief hole of positioned-lifting seat, is equipped with the interlocking bar lift drive mechanism being connected with the upper end of interlocking bar on vertical columns,
Positioned-lifting seat is equipped with some hot melts and heats column and heat column one by one for the hot melt equipped with some on pressure strip
The resigning through hole of insertion.
The hot melt heating column combination lift drive mechanism of setting, it can not only greatly improve production efficiency, but also
Labor intensity can be greatly reduced, batch jobs can be suitable for, design is more reasonable and meets the production requirement of current enterprise.
The pressure strip of setting, it can further improve the processing quality of product.
Pressure strip is L-shaped, it is easily installed.
In above-mentioned circuit board hot melt detent mechanism, hot melt heating column upper end is connected on heat block.
In above-mentioned circuit board hot melt detent mechanism, some arrays are equipped between the heat block and positioned-lifting seat
The insulated heat column of distribution.
In above-mentioned circuit board hot melt detent mechanism, the heat block includes two pieces of stacked agglomerate bodies, positioned at
The agglomerate body of lower section is equipped with small blocks, and hot melt heating column upper end is connected in small blocks.
In above-mentioned circuit board hot melt detent mechanism, positioning cantilever slab is equipped with the top of the vertical columns, it is described
Lift drive mechanism and interlocking bar lift drive mechanism are separately positioned on positioning cantilever slab.
In above-mentioned circuit board hot melt detent mechanism, the lift drive mechanism includes lifting driving cylinder, described
Lifting driving cylinder be connected by shaft coupling with positioned-lifting seat.
In above-mentioned circuit board hot melt detent mechanism, the interlocking bar lift drive mechanism includes interlocking bar cylinder,
The interlocking bar cylinder is connected with interlocking bar upper end.
In above-mentioned circuit board hot melt detent mechanism, the vertical columns are equipped with the guided way being vertically arranged, institute
The positioned-lifting seat and pressure strip stated are slidably connected with guided way respectively.
In above-mentioned circuit board hot melt detent mechanism, the vertical columns lower end is equipped with installation fixed structure.
In above-mentioned circuit board hot melt detent mechanism, the installation fixed structure includes being arranged on vertical columns lower end
Reinforcement boss, vertical columns lower end and/or strengthen boss lower end be equipped with mounting flange.
Compared with prior art, it is the advantages of this circuit board hot melt detent mechanism：
1st, the hot melt heating column combination lift drive mechanism set, it can not only greatly improve production efficiency, but also
Labor intensity can also be greatly reduced, batch jobs can be suitable for, design is more reasonable and meets the production requirement of current enterprise.
2nd, the pressure strip set, it can further improve the processing quality of product.
3rd, it is simple in structure and easily fabricated.
Brief description of the drawings
Fig. 1 is structure diagram provided by the utility model.
In figure, vertical columns C1, strengthen boss C11, mounting flange C12, positioned-lifting seat C2, lifting driving cylinder C2a,
Shaft coupling C2b, hot melt heating column C21, heat block C22, insulated heat column C23, pressure strip C3, interlocking bar cylinder C3a, linkage
Bar C31, resigning through hole C32, positioning cantilever slab C4.
Embodiment
It is the specific embodiment of utility model and with reference to attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these embodiments.
As shown in Figure 1, this circuit board hot melt detent mechanism includes vertical columns C1, Gu it is equipped with installation determining column C1 lower ends
Fixed structure.
Specifically, above-mentioned installation fixed structure includes the reinforcement boss C11 for being arranged on vertical columns C1 lower ends, in fixation
Column C1 lower ends and/or the lower end of reinforcement boss C11 are equipped with mounting flange C12.
Mounting flange C12 is fixed in rack, and some connection bolts are equipped with mounting flange C12, connects bolt and machine
Frame is threadedly coupled.
The positioned-lifting that is slidably connected and can be lifted in vertical direction with vertical columns C1 is equipped with vertical columns C1
Seat C2, the positioned-lifting seat C2 be connected with lift drive mechanism, and specifically, which, which includes lifting, drives gas
Cylinder C2a, lifting driving cylinder C2a are connected by shaft coupling C2b with positioned-lifting seat C2.
The compression that it is slidably connected with vertical columns C1 below positioned-lifting seat C2 is additionally provided with vertical columns C1
The upper end that the interlocking bar C31 being vertically arranged and interlocking bar C31 are connected with plate C3, the pressure strip C3 passes through positioned-lifting seat
The relief hole of C2, is equipped with the interlocking bar lift drive mechanism being connected with the upper end of interlocking bar C31, specifically on vertical columns C1
Ground, the interlocking bar lift drive mechanism include interlocking bar cylinder C3a, the interlocking bar cylinder C3a and connect with interlocking bar C31 upper ends
Connect.
Secondly, the guided way being vertically arranged, the positioned-lifting seat C2 and pressure strip C3 are equipped with vertical columns C1
It is slidably connected respectively with guided way.
The guided way of setting its can realize vertical direction lifting regularity and stability.
Some hot melts are equipped with positioned-lifting seat C2 to heat column C21 and be equipped with pressure strip C3 some for described
The resigning through hole C32 that hot melt heating column C21 is inserted into one by one.
The hot melt heating column C21 of the present embodiment has three, and resigning through hole C32 has three, and hot melt heating is vertical
Column C21 and resigning through hole C32 is corresponded.
Secondly, hot melt heating column C21 upper ends are connected on heat block C22.Heat block C22 and positioned-lifting seat C2 it
Between be equipped with some array distributions insulated heat column C23.Insulated heat column C23 includes cylindrical body and the company being threaded through in cylindrical body
Fitting, one end of connector are connected with heat block C22, and the other end is connected with positioned-lifting seat C2.
Further, the heat block C22 of the present embodiment includes two pieces of stacked agglomerate bodies, on underlying agglomerate body
Equipped with small blocks, hot melt heating column C21 upper ends are connected in small blocks.Small blocks are located at the center of agglomerate body
Domain.
In addition, positioning cantilever slab C4 is equipped with the top of vertical columns C1, the lift drive mechanism and interlocking bar lifting
Driving mechanism is separately positioned on positioning cantilever slab C4.
The positioning cantilever slab C4 of setting, its can further expansion space utilization rate.
The operation principle of the present embodiment is as follows：
After the hot melt column on pedestal is inserted in the location hole on circuit board, the upper end for heating column protrudes from circuit board
Upper surface, at this time, can be by pedestal by lift drive mechanism and interlocking bar lift drive mechanism, hot melt heating column C21
On hot melt column upper end heat and heat, heat and cool down so as to which circuit board is fixed.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Described specific embodiment can be done various modifications or additions or using similar by belonging to those skilled in the art
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (10)
1. a kind of circuit board heats detent mechanism, it is characterised in that mechanism includes vertical columns (C1), at vertical columns (C1)
It is equipped with the positioned-lifting seat (C2) that is slidably connected and can be lifted in vertical direction with vertical columns (C1), the positioning liter
Drop seat (C2) be connected with lift drive mechanism, be additionally provided with vertical columns (C1) positioned at positioned-lifting seat (C2) lower section its with consolidate
Determine the pressure strip (C3) that column (C1) is slidably connected, the interlocking bar (C31) being vertically arranged is connected with the pressure strip (C3)
And the upper end of interlocking bar (C31) passes through the relief hole of positioned-lifting seat (C2), is equipped with vertical columns (C1) and interlocking bar
(C31) the interlocking bar lift drive mechanism of upper end connection, some hot melts are equipped with positioned-lifting seat (C2) and heat column
(C21) and on pressure strip (C3) some resigning through holes being inserted into one by one for the hot melt heating column (C21) are equipped with
(C32)。
2. circuit board according to claim 1 heats detent mechanism, it is characterised in that the hot melt heating column
(C21) upper end is connected on heat block (C22).
3. circuit board according to claim 2 heats detent mechanism, it is characterised in that the heat block (C22) and calmly
The insulated heat column (C23) of some array distributions is equipped between position lifting seat (C2).
4. the circuit board hot melt detent mechanism according to Claims 2 or 3, it is characterised in that heat block (C22) bag
Two pieces of stacked agglomerate bodies are included, small blocks, hot melt heating column (C21) upper end are equipped with underlying agglomerate body
It is connected in small blocks.
5. circuit board according to claim 1 heats detent mechanism, it is characterised in that at the top of the vertical columns (C1)
Equipped with positioning cantilever slab (C4), the lift drive mechanism and interlocking bar lift drive mechanism are separately positioned on positioning cantilever slab
(C4) on.
6. circuit board according to claim 5 heats detent mechanism, it is characterised in that the lift drive mechanism includes
Lifting driving cylinder (C2a), lifting driving cylinder (C2a) are connected by shaft coupling (C2b) with positioned-lifting seat (C2).
7. circuit board according to claim 5 heats detent mechanism, it is characterised in that the interlocking bar elevator drive machine
Structure includes interlocking bar cylinder (C3a), and the interlocking bar cylinder (C3a) is connected with interlocking bar (C31) upper end.
8. circuit board according to claim 1 heats detent mechanism, it is characterised in that is set on the vertical columns (C1)
There is the guided way being vertically arranged, the positioned-lifting seat (C2) and pressure strip (C3) are slidably connected with guided way respectively.
9. circuit board according to claim 1 heats detent mechanism, it is characterised in that described vertical columns (C1) lower end
Equipped with installation fixed structure.
10. circuit board according to claim 9 heats detent mechanism, it is characterised in that the installation fixed structure bag
The reinforcement boss (C11) for being arranged on vertical columns (C1) lower end is included, in vertical columns (C1) lower end and/or strengthens boss (C11)
Lower end be equipped with mounting flange (C12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721500381.5U CN207369428U (en) | 2017-11-10 | 2017-11-10 | Circuit board heats detent mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721500381.5U CN207369428U (en) | 2017-11-10 | 2017-11-10 | Circuit board heats detent mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207369428U true CN207369428U (en) | 2018-05-15 |
Family
ID=62343968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721500381.5U Active CN207369428U (en) | 2017-11-10 | 2017-11-10 | Circuit board heats detent mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207369428U (en) |
-
2017
- 2017-11-10 CN CN201721500381.5U patent/CN207369428U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 314117 No. 8, Fuyuan Road, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee after: MiFu Technology (Zhejiang) Co.,Ltd. Address before: 314117 Room 202, No. 1, Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: MIFU TECHNOLOGY (ZHEJIANG) Co.,Ltd. |
|
| CP03 | Change of name, title or address |