CN207354321U - A kind of radiator of high density SFP optical port interchangers - Google Patents
A kind of radiator of high density SFP optical port interchangers Download PDFInfo
- Publication number
- CN207354321U CN207354321U CN201720665504.4U CN201720665504U CN207354321U CN 207354321 U CN207354321 U CN 207354321U CN 201720665504 U CN201720665504 U CN 201720665504U CN 207354321 U CN207354321 U CN 207354321U
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- Prior art keywords
- shell
- radiator
- high density
- driver
- optical port
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Abstract
The utility model discloses a kind of radiator of high density SFP optical port interchangers, its structure includes storage battery, driver, mainboard, shell, radiator body, heat sensor, protective cover, shaft, flabellum, driver, heat transfer device, the shell is the rectangular parallelepiped structure of the strong inner hollow of outer wall, shell side surface is equipped with storage battery and is mutually perpendicular to, the radiator body is two lateral sections are equal and internal strong rectangular parallelepiped structure, radiator body surrounded surface is located at housing internal surface, and the case surface right end is equipped with housing.The utility model is equipped with heat sensor, detector detects the temperature in high density SFP optical port interchangers, by circuit board in temperature data transfer to sensor main body, radiator body is driven to radiate through process chip control actuator, avoid the excessive heat dissipation of high density SFP optical port interchanger temperatures not in time, effectively improve heat dissipation effect.
Description
Technical field
The utility model is a kind of radiator of high density SFP optical port interchangers, belongs to switch device field.
Background technology
Interchanger means that " switch " is a kind of network equipment for electric signal forwarding.It can be appointing for access switch
Two network nodes of meaning provide the pathway for electrical signals exclusively enjoyed.Most common interchanger is Ethernet switch.Other are common also
There are telephone voice switch, optical fiber switch etc..
Prior art discloses Application No.：201320102385.3 a kind of high density SFP optical ports interchanger and its dissipate
Thermal, it includes cabinet, and the cabinet is formed by rear panel, side panel and with front panel, and front panel is equipped with SPF optical fiber
Mouthful, power panel, pcb board and fan are equipped with the cabinet, the fan is installed on rear panel and abuts chassis cover plate, institute
State fan to radiate using bleed type, open up ventilation hole with fan corresponding position on panel in the rear, it is close on the side panel
The position of SPF optical fiber ports opens up ventilation hole.The utility model is improved by being laid out two aspects to casing structure and pcb board,
Solve the problems, such as that the heat dissipation of high density SFP optical ports interchanger is bad.But its be disadvantageous in that can not be according to high density SFP light
Temperature situation in mouth switch, radiates automatically, temperature interference is influenced using effect.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of high density SFP optical port interchangers
Radiator, can not be radiated automatically with solving the said equipment according to the temperature situation in high density SFP optical port interchangers,
The problem of easily making temperature interference influence using effect.
To achieve these goals, the utility model is to realize by the following technical solutions：A kind of high density SFP light
The radiator of mouth switch, its structure include storage battery, driver, mainboard, shell, radiator body, heat sensor, anti-
Shield, shaft, flabellum, driver, heat transfer device, the shell be the strong inner hollow of outer wall rectangular parallelepiped structure, shell side
Surface is equipped with and storage battery and is mutually perpendicular to, and the radiator body is two lateral sections are equal and internal strong cuboid knot
Structure, radiator body surrounded surface are located at housing internal surface, and the radiator body outer surface edge is set inside the shell
Surface, shell side surface are welded and are mutually perpendicular to driver side face extremities, and the mainboard cuts for both sides
Face and it is mutually perpendicular to, shell inner surface is equipped with mainboard, storage battery side surface and welding and phase on outer side surface
Mutually vertical, the driver is located at shell side face center by being electrically connected storage battery, the driver inside bottom end,
Shaft side center is located at driver inside top end, and the heat sensor is the equal cylinder knot in two lateral sections
Structure, heat sensor side rim surface are located at case surface right end and are mutually perpendicular to.The heat sensor is by detecting
Device, circuit board, process chip, actuator, sensor main body, housing composition, the detector top surface end and housing bottom
Portion's face extremities welding, the circuit board lower surface are located at enclosure internal surface and are parallel to each other, and the process chip is two
Lateral section is equal and is mutually perpendicular to, and process chip, the actuator bottom end and circuit are equipped with above circuit board top surface
Be flexibly connected using interference fit type above plate surface, the sensor main body lower surface be located above circuit board surface and
It is mutually perpendicular to, the case surface right end is equipped with housing.
Further, the protective cover both-side ends are gap-matched mode with driver side surface and are flexibly connected.
Further, the flabellum is that section is fan-shaped, and shaft rim surface is equipped with flabellum.
Further, the heat transfer device lower surface and radiator body over top surface soldered and it is in same water
It is flat.
Further, the flabellum is equipped with 6 flabellums.
Further, it is respectively 15cm*10cm, 20cm*15cm that the shell, which is equipped with 2 and length and width,.
Further, the shell has plastics to be made.
Further, the storage battery is matched with driver.
The beneficial effects of the utility model are that detector is in high density SFP optical port interchangers equipped with heat sensor
Temperature detects, and by circuit board in temperature data transfer to sensor main body, heat dissipation is driven through process chip control actuator
Device main body radiates, and avoids the excessive heat dissipation of high density SFP optical port interchanger temperatures not in time, effectively improves heat dissipation effect.
Brief description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon.
Fig. 1 is a kind of structure diagram of the radiator of high density SFP optical port interchangers of the utility model；
Fig. 2 is the heat sensor schematic diagram of the utility model.
In figure：Storage battery -1, driver -2, mainboard -3, shell -4, radiator body -5, heat sensor -6, detection
Device -601, circuit board -602, process chip -603, actuator -604, sensor main body -605, housing -606, protective cover -7, turn
Axis -8, flabellum -9, driver -10, heat transfer device -11.
Embodiment
To make the technical means, creative features, achievable purpose and effectiveness that the utility model is realized easy to understand, below
With reference to embodiment, the utility model is expanded on further.
- Fig. 2 is please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high density SFP optical port interchangers dissipate
Thermal, its structure include storage battery 1, driver 2, mainboard 3, shell 4, radiator body 5, heat sensor 6, protective cover 7,
Shaft 8, flabellum 9, driver 10, heat transfer device 11, the shell 4 be the strong inner hollow of outer wall rectangular parallelepiped structure, 4 side of shell
Square surface is equipped with and storage battery 1 and is mutually perpendicular to, and the radiator body 5 is equal and internal strong rectangular for two lateral sections
Body structure, 5 surrounded surface of radiator body are located at 4 interior surface of shell, and the 5 outer surface edge of radiator body is located at outer
4 inner surface of shell, the 4 side surface of shell are welded and are mutually perpendicular to, the mainboard with 2 side face extremities of driver
3 is two lateral sections and are mutually perpendicular to, and 4 inner surface of shell is equipped with mainboard 3, the 1 side surface of storage battery and 4 outside table of shell
Weld and be mutually perpendicular on face, the driver 2 is located at by being electrically connected storage battery 1, the 10 inside bottom end of driver
4 side face center of shell, the 8 side center of shaft are located at 10 inside top end of driver, and the heat sensor 6 is
The equal cylindrical structure in two lateral sections, 6 side rim surface of heat sensor are located at 4 surface right end of shell and mutually hang down
Directly.The heat sensor 6 by detector 601, circuit board 602, process chip 603, actuator 604, sensor main body 605,
Housing 606 forms, and the 601 top surface end of detector is welded with 606 lower surface end of housing, the circuit board 602
Lower surface is located at 606 interior surface of housing and is parallel to each other, and the process chip 603 is equal and mutually vertical for two lateral sections
Directly, process chip 603,604 bottom end of actuator and 602 surface of circuit board are equipped with above 602 top surface of circuit board
Top using interference fit type be flexibly connected, 605 lower surface of sensor main body be located at 602 surface of circuit board and
It is mutually perpendicular to, the 4 surface right end of shell is equipped with housing 606.7 both-side ends of protective cover and 10 side table of driver
Face is gap-matched mode and is flexibly connected.The flabellum 9 is that section is fan-shaped, and 8 rim surface of shaft is equipped with flabellum 9.It is described
11 lower surface of heat transfer device and 5 over top surface soldered of radiator body and it is in same level.The flabellum 9 is equipped with 6
Flabellum.It is respectively 15cm*10cm, 20cm*15cm that the shell 4, which is equipped with 2 and length and width,.
Heat sensor 6 described in this patent refers to that temperature can be experienced and is converted into the sensor of usable output signal.
When user operates the utility model, 6 side rim surface of heat sensor is installed on the right side of 4 surface of shell
End, storage battery 1 transmit electric energy by being electrically connected, and detector 601 is detected the temperature in high density SFP optical port interchangers,
By circuit board 602 in temperature data transfer to sensor main body 605, control actuator 604 to start through process chip 603 and drive
Dynamic device 2, mainboard 3 drive heat transfer device 11 that temperature is delivered to radiator body 5, rotate driver 10 and drive the control fan of shaft 8
The rotation heat dissipation of leaf 9, avoids the excessive heat dissipation of high density SFP optical port interchanger temperatures not in time, effectively improves heat dissipation effect.
The storage battery 1 of the utility model, driver 2, mainboard 3, shell 4, radiator body 5, heat sensor 6, protection
Cover 7, shaft 8, flabellum 9, driver 10, heat transfer device 11, the portion that component is universal standard part or those skilled in the art know
Part, its structure and principle all can be learnt by technical manual or be known by normal experiment method, this reality for this technology personnel
With new problem to be solved be the said equipment can not according to the temperature situation in high density SFP optical port interchangers, automatically into
The problem of going and radiate, easily making temperature interference influence using effect, the utility model is combined with each other by above-mentioned component, Neng Goushe
There is heat sensor, detector detects the temperature in high density SFP optical port interchangers, by circuit board temperature data transfer
Onto sensor main body, drive radiator body to radiate through process chip control actuator, avoid high density SFP optical ports from handing over
The excessive heat dissipation of temperature of changing planes not in time, effectively improves heat dissipation effect, described in detail below.
The 601 top surface end of detector is welded with 606 lower surface end of housing, 602 bottom of circuit board
Surface is located at 606 interior surface of housing and is parallel to each other, and the process chip 603 is equal and be mutually perpendicular to for two lateral sections, electricity
Process chip 603 is equipped with above 602 top surface of road plate, 604 bottom end of actuator is adopted with 602 surface of circuit board
It is flexibly connected with interference fit type, 605 lower surface of sensor main body is located at 602 surface of circuit board and mutually hangs down
Directly, the 4 surface right end of shell is equipped with housing 606.7 both-side ends of protective cover are used with 10 side surface of driver
Gap fiting mode is flexibly connected.
The advantages of basic principle and main feature and the utility model of the utility model has been shown and described above, for
For those skilled in the art, it is clear that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than described above limit, it is intended that will fall in the implication and scope of the equivalency of claim
All changes are embraced therein.Any reference numeral in claim should not be considered as to the involved right of limitation
It is required that.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical solution, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (6)
1. a kind of radiator of high density SFP optical port interchangers, its structure include storage battery（1）, driver（2）, mainboard
（3）, shell（4）, radiator body（5）, heat sensor（6）, protective cover（7）, shaft（8）, flabellum（9）, driver（10）、
Heat transfer device（11）, the shell（4）For the rectangular parallelepiped structure of the strong inner hollow of outer wall, shell（4）Side surface is equipped with
Storage battery（1）And it is mutually perpendicular to, the radiator body（5）For two lateral sections are equal and internal strong rectangular parallelepiped structure, dissipate
Hot device main body（5）Surrounded surface is located at shell（4）Interior surface, it is characterised in that：
The radiator body（5）Outer surface edge is located at shell（4）Inner surface, the shell（4）Side surface
With driver（2）Side face extremities are welded and are mutually perpendicular to, the mainboard（3）For two lateral sections and it is mutually perpendicular to, shell（4）
Inner surface is equipped with mainboard（3）, the storage battery（1）Side surface and shell（4）Weld and be mutually perpendicular on outer surface, institute
State driver（2）By being electrically connected storage battery（1）, the driver（10）Inside bottom end is located at shell（4）Side surface
Center, the shaft（8）Side center is located at driver（10）Inside top end, the heat sensor（6）Cut for both sides
The equal cylindrical structure in face, heat sensor（6）Side rim surface is located at shell（4）Surface right end and mutually hang down
Directly,
The heat sensor（6）By detector（601）, circuit board（602）, process chip（603）, actuator（604）, sensing
Device main body（605）, housing（606）Composition, the detector（601）Top surface end and housing（606）Lower surface end
Welding, the circuit board（602）Lower surface is located at housing（606）Interior surface and it is parallel to each other, the process chip（603）
It is equal and be mutually perpendicular to, circuit board for two lateral sections（602）Process chip is equipped with above top surface（603）, the actuator
（604）Bottom end and circuit board（602）Surface is flexibly connected using interference fit type, the sensor main body
（605）Lower surface is located at circuit board（602）Surface and it is mutually perpendicular to, the shell（4）Surface right end is equipped with shell
Body（606）.
A kind of 2. radiator of high density SFP optical port interchangers according to claim 1, it is characterised in that：It is described anti-
Shield（7）Both-side ends and driver（10）Side surface is gap-matched mode and is flexibly connected.
A kind of 3. radiator of high density SFP optical port interchangers according to claim 1, it is characterised in that：The fan
Leaf（9）It is fan-shaped, shaft for section（8）Rim surface is equipped with flabellum（9）.
A kind of 4. radiator of high density SFP optical port interchangers according to claim 1, it is characterised in that：It is described to lead
Hot device（11）Lower surface and radiator body（5）Over top surface soldered and it is in same level.
A kind of 5. radiator of high density SFP optical port interchangers according to claim 1, it is characterised in that：The fan
Leaf（9）Equipped with 6 flabellums.
A kind of 6. radiator of high density SFP optical port interchangers according to claim 1, it is characterised in that：It is described outer
Shell（4）It is respectively 15cm*10cm, 20cm*15cm equipped with 2 and length and width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720665504.4U CN207354321U (en) | 2017-06-09 | 2017-06-09 | A kind of radiator of high density SFP optical port interchangers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720665504.4U CN207354321U (en) | 2017-06-09 | 2017-06-09 | A kind of radiator of high density SFP optical port interchangers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207354321U true CN207354321U (en) | 2018-05-11 |
Family
ID=62358692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720665504.4U Expired - Fee Related CN207354321U (en) | 2017-06-09 | 2017-06-09 | A kind of radiator of high density SFP optical port interchangers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207354321U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108769838A (en) * | 2018-07-03 | 2018-11-06 | 合肥科塑信息科技有限公司 | A kind of computer network LAN switch |
-
2017
- 2017-06-09 CN CN201720665504.4U patent/CN207354321U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108769838A (en) * | 2018-07-03 | 2018-11-06 | 合肥科塑信息科技有限公司 | A kind of computer network LAN switch |
| CN108769838B (en) * | 2018-07-03 | 2022-01-28 | 东营中达石油设备有限公司 | Computer network LAN switch |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180511 Termination date: 20200609 |