CN2073130U - Semiconductor temp.-control dust-proof shielding apparatus for microcomputor - Google Patents
Semiconductor temp.-control dust-proof shielding apparatus for microcomputor Download PDFInfo
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- CN2073130U CN2073130U CN 90218640 CN90218640U CN2073130U CN 2073130 U CN2073130 U CN 2073130U CN 90218640 CN90218640 CN 90218640 CN 90218640 U CN90218640 U CN 90218640U CN 2073130 U CN2073130 U CN 2073130U
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- temperature
- microcomputer
- semiconductor
- pile
- transformer
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Abstract
The utility model relates to a temp-control dust-proof shielding apparatus for microcomputor semiconductors, which is composed of a sealed insulating container for placing a microcomputer, and a power box. On the basis of the Peltier effect, the utility model uses a semiconductor galvanic pile with direct current to carry out refrigeration and heating, so that the purpose of controlling the temperature of the microcomputer. The utility model can be used for various occasions, and has the advantages of no mechanical vibration and noise, lower starting current than operating current, no influence on the normal operation of the microcomputer, favorable dust-proof effect, simple structure and convenient maintenance.
Description
A kind of dustproof shield assembly of microcomputer semiconductor temperature that suitable working environment can be provided for microcomputer.
Because microcomputer has higher requirement to working environment, need special Air Conditioning Facilities to place microcomputer.But must use microcomputer not possess the occasion of establishing special-purpose machine room again for some, then need the design specialized casing to guarantee the normal running conditions of microcomputer." the Computerized multifunctional casing " that provides as CN88203143U, this device volume is little, can be used for various occasions, but what it adopted is that the traditional compressor method is carried out temperature control, thereby mechanical shock and noise are big, and starting current disturbs big to microcomputer, and temperature control system and microcomputer can not be powered by uninterrupted power source simultaneously, and this casing can only can not heat the casing maintenance difficult in refrigeration.
The purpose of this utility model is to provide a kind of dustproof shield assembly of microcomputer temperature control that has overcome above-mentioned defective.
The technical solution of the utility model is, utilizing peltier effect is the semiconductor devices thermoelectric effect, original paper that P type, N-type semiconductor are formed on, give directed DC current, promptly can form a cold junction at certain right end of element, the other end forms a hot junction.At cold junction and each affixed heating radiator that heat conductivility is good of hot junction, the cold junction heating radiator will absorb the heat of environment of living in like this, by orientation of semiconductor device the heat that cold junction absorbs is conducted to the hot-side heat dissipation device again, the last residing environment of heat transferred that semiconductor devices is transmitted by the hot-side heat dissipation device, thereby realized the orientation transmission of heat, promptly outside the heat transferred auto levelizer of microcomputer generation in the shield assembly.Change sense of current; Also but the outer heat of handle assembly passes in the device, thereby realizes the temperature control of microcomputer working environment.
The dustproof shield assembly of microcomputer semiconductor temperature has the sealing hot box of a placement microcomputer, the semiconductor pile that refrigeration heats usefulness is housed on the casing, the pile two ends are added with heating radiator, the temperature-sensitive thermistor also is housed on the casing, so that with the temperature signal in the hot box pass to be located in the device and with hot box separate power source case, make failure of current or connection by thermostat and current controling element, thus temperature constant in the guard box.Be equipped with in the power supply box casing and give semiconductor pile and thermostat direct current power source supplying power and semiconductor pile reversing arrangement respectively.
The utility model is owing to adopt the semiconductor pile as the refrigeration heat-producing machine, thereby do not have machinery motion, not vibrations and noise, do not exist starting current greater than defectives such as working currents, and it is simple in structure, easy to maintenance, the casing of laying microcomputer also has well dustproof effect for what seal.
The utility model has following accompanying drawing.
Fig. 1 is an embodiment hot box structural representation.
Fig. 2 is the electrical principle synoptic diagram.
As shown, tandem type semiconductor pile (4) two ends are that workplace respectively is bonded with a heating radiator (5), pile (4) is installed in respectively on the sealing hot box (3) with temperature-sensitive thermistor (8), and a heating radiator (5) is positioned at outside the casing (6), and remaining part is all in casing.
In power supply box, the transformation rectification circuit output end of being made up of transformer (1) and bridge rectifier (2) is connected with two contacts (7) of reversing arrangement (13), the semiconductor pile (4) of series connection and the circuit of choking coil (6) and contact (7) thus connect and compose loop formation semiconductor pile feed circuit, in this circuit, transformer (1) becomes the pile required voltage with civil power, by rectifier (2) alternating current is become direct current again, by reversing arrangement (13) direct current is sent to semiconductor pile (4), the effect of choking coil (6) is the ripple coefficient that reduces semiconductor pile (4) supply current.
In temperature-adjusting circuit, the transformation rectification circuit output end of being made up of transformer (11) and bridge rectifier (10) links to each other with temperature controller (9), temperature controller (9) also is connected with temperature-sensitive thermistor (8) and pilot relay (12), resistance (8) is connected on the hot box (3), elementary the linking to each other of pilot relay (12) other end and transformer (1).Source current is supplied with temperature controller (9) through transformer (11) and rectifier (10) with direct current, the signal that temperature controller (9) transmits according to temperature-sensitive thermistor (8), the adhesive and the disconnection of pilot relay (12), elementary open close by relay (12) control transformer (1) again, thus temperature constant in the hot box guaranteed.Power supply box separates with hot box, has louvre on the power supply box.
Claims (3)
1, the dustproof shield assembly of a kind of microcomputer semiconductor temperature, have hot box (3) and the power supply box of placing microcomputer, it is characterized in that: tandem type semiconductor pile (4) and temperature-sensitive thermistor (8) are housed on the described hot box (3), pile (4) two ends are that workplace is connected with a heating radiator (5) respectively, wherein a heating radiator (5) is positioned at outside the casing (3), and remaining part is all in casing.
2, device as claimed in claim 1 is characterized in that: hot box (3) separates with power supply box, and has louvre on the power supply box.
3, device as claimed in claim 1 or 2 is characterized in that:
Transformer (1) is connected with two contacts (7) of reversing arrangement (13) with the transformation rectification circuit output end that bridge rectifier (2) is formed, and the semiconductor pile (4) of series connection and the circuit two ends of choking coil (6) and contact (7) connect and compose the loop and form semiconductor pile feed circuit;
Transformer (11) links to each other with temperature controller (9) with the transformation rectification circuit output end that bridge rectifier (10) is formed, temperature controller (9) also is connected with temperature-sensitive thermistor (8) and pilot relay (12), temperature-sensitive thermistor (8) is connected on the hot box (3), elementary the linking to each other of pilot relay (12) other end and transformer (1), thus constitute temperature-adjusting circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 90218640 CN2073130U (en) | 1990-08-25 | 1990-08-25 | Semiconductor temp.-control dust-proof shielding apparatus for microcomputor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 90218640 CN2073130U (en) | 1990-08-25 | 1990-08-25 | Semiconductor temp.-control dust-proof shielding apparatus for microcomputor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2073130U true CN2073130U (en) | 1991-03-13 |
Family
ID=4897429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 90218640 Withdrawn CN2073130U (en) | 1990-08-25 | 1990-08-25 | Semiconductor temp.-control dust-proof shielding apparatus for microcomputor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2073130U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151213A (en) * | 2013-03-21 | 2013-06-12 | 国家电网公司 | Heat preservation device of arc extinguish chamber used for outdoor SF6 high-voltage breaker |
| CN110410305A (en) * | 2019-07-23 | 2019-11-05 | 珠海格力电器股份有限公司 | Compressor temperature control device based on semiconductor thermocouple |
-
1990
- 1990-08-25 CN CN 90218640 patent/CN2073130U/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151213A (en) * | 2013-03-21 | 2013-06-12 | 国家电网公司 | Heat preservation device of arc extinguish chamber used for outdoor SF6 high-voltage breaker |
| CN110410305A (en) * | 2019-07-23 | 2019-11-05 | 珠海格力电器股份有限公司 | Compressor temperature control device based on semiconductor thermocouple |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |