CN207305067U - A kind of flexible PCB and display device - Google Patents
A kind of flexible PCB and display device Download PDFInfo
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- CN207305067U CN207305067U CN201721426073.2U CN201721426073U CN207305067U CN 207305067 U CN207305067 U CN 207305067U CN 201721426073 U CN201721426073 U CN 201721426073U CN 207305067 U CN207305067 U CN 207305067U
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- contact electrode
- substrate
- circuit board
- flexible circuit
- liquid
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- 239000007788 liquid Substances 0.000 claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 239000000126 substance Substances 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- 239000012528 membrane Substances 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 29
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 6
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 5
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 3
- 229920000295 expanded polytetrafluoroethylene Polymers 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 21
- 230000008859 change Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 15
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000007769 metal material Substances 0.000 description 8
- 238000000059 patterning Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
The utility model discloses a kind of flexible PCB and display device, the flexible PCB, including：Substrate, positioned at least one conductive structure of substrate, contacts electrode group, for packaging conductive structure and the encapsulated layer of contact electrode group, and ventilated membrane；Wherein, electrode group is contacted, including：For contacting electrode and the second contact electrode with the first of the both ends electrical connection of conductive structure respectively；Encapsulated layer forms interconnected cavity and liquid storage area with substrate；Conductive structure, including：Liquid conductive substance in cavity；Liquid storage area is used for storing liquid conductive materials, and ventilated membrane is used to encapsulate liquid storage area and make liquid storage area connect with external atmosphere pressure.When stretching the flexible PCB, the liquid conductive substance in conductive structure is flowed due to the change of air pressure, realize liquid conductive substance with first contact electrode and second contact electrode between conducting, realize the stretchable of flexible PCB.
Description
Technical Field
The utility model relates to a show technical field, indicate a flexible circuit board and display device especially.
Background
With the continuous development of Display technology, Display screens or touch screens are widely used in the life of people, wherein Liquid Crystal Displays (LCDs) have the characteristics of small volume, low power consumption, no radiation and the like, and occupy an important position in the market. Organic Light-Emitting diodes (OLEDs) have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, lightness, thinness, and the like, and have also been widely used in the market.
With the rapid development of display technologies, people have a higher pursuit for display modes, effects and the like, and more users have higher requirements for flexible stretching, wearable display and the like. However, the conventional Flexible Printed Circuit (FPC) is not stretchable, and a signal line is easily broken during a use process, so that signal transmission is abnormal, normal display of a display screen is affected, and poor display is caused.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a flexible circuit board and display device for the flexible circuit board that exists among the solution prior art can not tensile problem.
In a first aspect, an embodiment of the present invention provides a flexible circuit board, including: the packaging structure comprises a substrate, at least one conductive structure positioned on the substrate, a contact electrode group, a packaging layer used for packaging the conductive structure and the contact electrode group, and a breathable film; wherein,
the set of contact electrodes includes: the first contact electrode and the second contact electrode are respectively electrically connected with two ends of the conductive structure;
the packaging layer and the substrate form a cavity and a liquid storage area which are communicated with each other;
the conductive structure includes: a liquid conductive substance located within the cavity;
the liquid storage area is used for storing the liquid conductive substance, and the breathable film is used for packaging the liquid storage area and communicating the liquid storage area with the external atmospheric pressure.
In a possible implementation manner, in the above-mentioned flexible circuit board provided in the embodiment of the present invention, the liquid storage region is located at an end of the conductive structure connected to the first contact electrode.
In a possible implementation manner, in the above flexible circuit board provided by the embodiment of the present invention, the first contact electrode and the orthographic projection of the liquid storage region on the substrate partially overlap, and the second contact electrode and the orthographic projection of the cavity on the substrate partially overlap.
In a possible implementation manner, in the flexible circuit board provided in the embodiments of the present invention, the encapsulation layer includes: the first packaging layer and the second packaging layer are positioned on one side, away from the substrate, of the first packaging layer;
the surface of the first packaging layer, which deviates from one side of the substrate, is flush with the surface of the liquid storage area, and the surface of the second packaging layer, which deviates from one side of the substrate, is flush with the surface of the breathable film.
In a possible implementation manner, in the flexible circuit board provided by the embodiment of the present invention, a part of a surface of the first contact electrode near one side of the substrate is exposed; or part of the surface of one side of the first contact electrode, which is far away from the substrate, is exposed;
part of the surface of the second contact electrode close to one side of the substrate is exposed; or the surface part of the second contact electrode on the side facing away from the substrate is exposed.
In a possible implementation manner, in the flexible circuit board provided by the embodiment of the present invention, the pore diameter of the gas permeable membrane is between the largest molecular diameter in the air and the particle diameter of the liquid conductive substance.
In one possible implementation manner, in the flexible circuit board provided by the embodiment of the present invention, the breathable film includes an expanded polytetrafluoroethylene material.
In a possible implementation manner, in the flexible circuit board provided by the embodiment of the present invention, the liquid conductive substance includes a liquid metal or an electrolyte solution, and the liquid metal includes an indium tin gallium alloy material or mercury.
In a possible implementation manner, in the flexible circuit board provided by the embodiment of the present invention, the substrate includes a resin material, and the encapsulation layer includes a resin material.
In a second aspect, an embodiment of the present invention provides a display device, including: the flexible circuit board is provided.
The utility model discloses beneficial effect as follows:
the embodiment of the utility model provides a flexible circuit board and display device, this flexible circuit board, include: the packaging structure comprises a substrate, at least one conductive structure, a contact electrode group, a packaging layer and a breathable film, wherein the conductive structure is positioned on the substrate; wherein, contact electrode group includes: the first contact electrode and the second contact electrode are used for being electrically connected with two ends of the conductive structure respectively; the packaging layer and the substrate form a cavity and a liquid storage area which are communicated with each other; a conductive structure comprising: a liquid conductive substance located within the cavity; the liquid storage area is used for storing liquid conductive substances, and the breathable film is used for packaging the liquid storage area and communicating the liquid storage area with the external atmospheric pressure. The embodiment of the utility model provides an above-mentioned flexible circuit board, because conductive structure is including the liquid conducting material that is located the cavity, when tensile this flexible circuit board, the liquid conducting material in the conductive structure flows because the change of atmospheric pressure, realizes switching on between liquid conducting material and first contact electrode and the second contact electrode, therefore on the basis of having guaranteed flexible circuit board's electric conductivity, has realized stretching of flexible circuit board.
Drawings
Fig. 1 is a top view of a flexible circuit board according to an embodiment of the present invention;
FIGS. 2a and 2b are schematic cross-sectional views at AB of FIG. 1;
fig. 3 is a schematic diagram of a flexible circuit board in the stretching process according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of the flexible circuit board after being stretched in the embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing the flexible printed circuit board according to an embodiment of the present invention;
fig. 6a to 6c, fig. 8 and fig. 10a to 10c are schematic structural views illustrating the manufacturing method according to the embodiment of the present invention;
fig. 7 is a second flowchart of a method for manufacturing the flexible printed circuit board according to an embodiment of the present invention;
fig. 9 is a third flowchart of a method for manufacturing the flexible circuit board according to an embodiment of the present invention;
wherein, 11, a substrate; 12. a conductive structure; 13. a set of contact electrodes; 131. a first contact electrode; 132. a second contact electrode; 14. a packaging layer; 141. a first encapsulation layer; 142. a second encapsulation layer; 15. a gas permeable membrane; 16. a conductive layer; 17. a substrate base plate; 18. a groove; 21. a cavity; 22. a liquid storage area.
Detailed Description
To the flexible circuit board that exists among the prior art can not tensile problem, the embodiment of the utility model provides a flexible circuit board and display device.
The following describes in detail a specific embodiment of a flexible printed circuit board and a display device according to an embodiment of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the respective layers in the drawings do not reflect actual proportions, and are merely intended to schematically illustrate the present invention.
In a first aspect, an embodiment of the present invention provides a flexible circuit board, as shown in fig. 1, fig. 2a and fig. 2b, including: a substrate 11, at least one conductive structure 12 located on top of the substrate 11, a set of contact electrodes 13, an encapsulation layer 14 for encapsulating the conductive structure 12 and the set of contact electrodes 13, and a gas permeable membrane 15; wherein,
a contact electrode group 13 including: a first contact electrode 131 and a second contact electrode 132 for electrically connecting both ends of the conductive structure, respectively;
the packaging layer and the substrate form a cavity 21 and a liquid storage area 22 which are communicated with each other;
a conductive structure 12 comprising: a liquid conductive substance located in the cavity 21;
the liquid storage region 22 is used for storing liquid conductive substances, and the air permeable membrane 15 is used for packaging the liquid storage region 22 and communicating the liquid storage region 22 with the external atmospheric pressure.
The embodiment of the utility model provides an above-mentioned flexible circuit board, because substrate and encapsulated layer generally have certain stretchability, conductive structure 12 is including the liquid conducting material that is located cavity 21 in addition, and when stretching this flexible circuit board, the liquid conducting material in the conductive structure 12 flows because the change of atmospheric pressure, realizes switching on between liquid conducting material and first contact electrode 131 and second contact electrode 132, therefore on the basis of having guaranteed flexible circuit board's electric conductivity, has realized stretching of flexible circuit board.
In practical implementation, as shown in fig. 1, the first contact electrode 131 and the second contact electrode 132 in each contact electrode group 13 are generally disposed at two ends of the flexible circuit board, and one conductive structure 12 is connected to the first contact electrode 131 and the second contact electrode 132 at the two ends, respectively, so that two devices can be conducted through the flexible circuit board, which is illustrated in fig. 1 by including 7 conductive structures 12 and 7 contact electrode groups, and the number of the conductive structures 12 and the contact electrode groups 13 is not limited herein. Specifically, the first contact electrode 131 and the second contact electrode 132 may be generally made of a metal material, for example, the first contact electrode and the second contact electrode may be copper electrodes, or the first contact electrode and the second contact electrode may also be made of other conductive materials, and may be flexible or rigid, because the first contact electrode and the second contact electrode are generally respectively located at two ends of the flexible circuit board, stress generated in the stretching process is not concentrated on the first contact electrode and the second contact electrode, and therefore, the first contact electrode and the second contact electrode do not affect the stretching performance of the flexible circuit board, and the flexible circuit board does not break the first contact electrode and the second contact electrode in the stretching process.
Referring to fig. 1, since each conductive structure 12 connects the first contact electrode 131 and the second contact electrode 132 at two ends, two adjacent conductive structures 12 need to be insulated, and therefore one conductive structure 12 preferably corresponds to one liquid storage region 22, and for manufacturing convenience, several adjacent conductive structures 12 may share one gas permeable membrane 15, and the number of gas permeable membranes 15 and liquid storage regions 22 is not limited at this time.
In particular, the embodiment of the present invention provides an above-mentioned flexible Circuit Board, in a display device, for connecting a display screen and a Printed Circuit Board (PCB), specifically, each first contact electrode (i.e. a golden finger) located at the same end is respectively connected to each contact pad (pad) on the display screen, and each second contact electrode located at the other end is respectively connected to each contact pad (pad) on the Printed Circuit Board. In addition, the flexible circuit board can also be applied to other equipment, such as a bracelet, a watch and other devices, and the application range of the flexible circuit board is not limited at this time.
Referring to fig. 1, fig. 2a and fig. 2b, in the flexible circuit board provided by the embodiment of the present invention, the substrate and the encapsulation layer may be made of materials with certain tensile properties, so that the tensile properties of the substrate 11 and the encapsulation layer 14 may be achieved, and the conductive structure 12 plays a conductive role, including: the liquid conductive substance in the cavity 21 has fluidity, so that the flexible circuit board does not break the conductive structure 12 during the stretching process. The shape of each conductive structure 12 in fig. 1 is only a preferred implementation manner of the embodiment of the present invention, and in practical applications, the shape of the conductive structure 12 may be set according to practical needs, which is not limited herein.
In addition, by providing the liquid storage region 22 for storing the liquid conductive substance and the air permeable membrane 15 for enclosing the liquid storage region 22 and communicating the liquid storage region 22 with the external atmosphere, the liquid conductive substance can flow toward the direction of low air pressure during the stretching process, so as to ensure that the conductive structure 12 keeps good contact with the first contact electrode 131 and the second contact electrode 132 after stretching, and ensure the conductive performance, and the specific stretching process is described in detail with reference to fig. 3 and 4;
fig. 2a and 2b are original states of the flexible circuit board which is not stretched, and it can be seen that the liquid conductive substance in the cavity 21 is in good contact with the first contact electrode 131 and the second contact electrode 132 at the two ends; as shown in fig. 3, during the stretching process, as the volume of the cavity 21 increases, a negative pressure region is formed at the position shown by the arrow C in the drawing, that is, the air pressure at the arrow C is small, and the air pressure of the liquid storage region 22 communicated with the external atmospheric pressure is large, so that the liquid conductive substance in the liquid storage region 22 flows to the negative pressure region C under the effect of the atmospheric pressure, and after the stretching process is completed, the structure shown in fig. 4 is obtained, and the liquid conductive substance is in good contact with the first contact electrode 131 and the second contact electrode 132. In practical applications, the content of the liquid conductive substance in the cavity 21 and the liquid storage region 22 needs to be set according to the stretching degree, so as to ensure that the liquid conductive substance can be well contacted with the contact electrode group in the original state and after stretching.
It should be noted that, in the embodiment of the present invention, the above-mentioned liquid conductive material may refer to a liquid conductive material in the working environment of the flexible circuit board, and is not limited to a liquid conductive material at room temperature, for example, a liquid metal material in the working environment may be adopted, because the liquid metal has the characteristics of high electrical conductivity, high thermal conductivity, high elasticity, high yield strength, etc., and also has the characteristics of high temperature resistance and corrosion resistance, and does not flow at high temperature, and is not easy to volatilize and oxidize, therefore, the flexible circuit board can be ensured to have good electrical conductivity and stability. Due to the fact that the melting points of liquid metals of different materials are different, in practical application, the liquid metal material required to be adopted needs to be determined according to the actual working environment.
Specifically, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 2a and 2b, the liquid storage region 22 is located at one end of the conductive structure 12 connected to the first contact electrode 131. In this way, in the stretching process of the flexible circuit board, the liquid conductive substance flows only in one direction, which is easier to ensure that the liquid conductive substance is in good contact with the first contact electrode 131 and the second contact electrode 132 at two ends, and the liquid storage region 22 may also be disposed at one end of the conductive structure 12 connected to the second contact electrode 132, or the liquid storage region 22 may be disposed at another position according to actual needs, which is not limited herein.
Referring also to fig. 2a and 2b, an embodiment of the present invention provides the above-mentioned flexible circuit board, wherein the first contact electrode 131 and the orthographic projection of the liquid storage region 22 on the substrate partially overlap, and the second contact electrode 132 and the orthographic projection of the cavity 21 on the substrate partially overlap. Therefore, the contact area between the first contact electrode (or the second contact electrode) and the liquid conductive substance can be increased, so that the conductive structure 12 and the first contact electrode (or the second contact electrode) are not easy to break, and the conductive performance of the flexible circuit board is ensured. For example, in fig. 2a and 2b, the second contact electrode and the cavity have an overlapping region at the right end of the cavity 21, so that both the side surface of the second contact electrode and the surface located in the cavity 21 can be contacted with the liquid conductive material, compared with the case where only the side surface of the second contact electrode is contacted with the liquid conductive material, the contact area is greatly increased, and the principle of overlapping the first contact electrode with the liquid storage region 22 is similar, and thus the description is omitted here.
Specifically, in the flexible circuit board provided in the embodiment of the present invention, as shown in fig. 2a and fig. 2b, the encapsulation layer 14 may include: a first encapsulation layer 141, and a second encapsulation layer 142 on a side of the first encapsulation layer 141 facing away from the substrate 11;
the surface of the first encapsulation layer 141 facing away from the substrate 11 is flush with the surface of the liquid storage region 22, and the surface of the second encapsulation layer 142 facing away from the substrate 11 is flush with the surface of the air-permeable membrane 15.
As can be seen from fig. 2a and 2b, the liquid storage region 22 and the cavity 21 are formed by disposing the first encapsulation layer 141 to accommodate the liquid conductive substance, and the surface of the encapsulation layer 14 away from the substrate 11 is kept flat by disposing the second encapsulation layer 142 flush with the surface of the breathable film 15, so that the structure of the flexible circuit board is more compact. In the embodiment of the present invention, the surface of the first encapsulating layer that deviates from one side of the substrate is flush with the surface of the liquid storage area, and the surface of the second encapsulating layer that deviates from one side of the substrate is flush with the surface of the gas permeable membrane, which is an advantageous embodiment of the present invention, in practical applications, the surface of the first encapsulating layer that deviates from one side of the substrate may not be flush with the surface of the liquid storage area, and the surface of the second encapsulating layer that deviates from one side of the substrate may not be flush with the surface of the gas permeable membrane.
Specifically, in the flexible circuit board provided by the embodiment of the present invention, as shown in fig. 2a, a partial surface of the first contact electrode on the side close to the substrate 11 is exposed, and as the maximum width of the encapsulation layer 14 is set to be greater than the width of the substrate 11, a side of the first contact electrode 131 on the side far from the conductive structure 12 is flush with the encapsulation layer 14, so as to expose a partial surface of the first contact electrode 131 on the side close to the substrate 11; or, as shown in fig. 2b, a part of the surface of the first contact electrode 131 on the side away from the substrate 11 is exposed, and as the width of the substrate 11 is set to be greater than the maximum width of the encapsulation layer 14, the side edge of the first contact electrode 131 on the side away from the conductive structure 12 is flush with the substrate 11, so that the part of the surface of the first contact electrode 131 on the side away from the substrate 11 is exposed. Similarly, a part of the surface of the second contact electrode close to one side of the substrate can be exposed; or the surface part of the second contact electrode on the side facing away from the substrate is exposed. This allows, on the one hand, the first contact electrode (or the second contact electrode) to be electrically connected to the liquid conductive substance encapsulated between the substrate and the encapsulation layer, and, on the other hand, the partially exposed surface of the first contact electrode (or the second contact electrode) to be connected to other devices, for example to contact pads on a display screen.
In specific implementation, in order to connect the liquid storage region 22 to the atmosphere and ensure that the liquid metal in the liquid storage region 22 will not flow out through the permeable membrane 15, the embodiment of the present invention provides an embodiment of the flexible circuit board, wherein the pore diameter of the permeable membrane 15 is preferably between the largest molecular diameter of the air molecules and the particle diameter of the liquid conductive material. Specifically, the gas permeable membrane 15 preferably comprises an expanded polytetrafluoroethylene material.
In practical applications, the liquid conductive substance is a liquid substance in the working environment of the flexible circuit board, and therefore, the material of the liquid conductive substance can be arranged according to the requirement of the actual working environment, because the working environment of display equipment such as mobile phones, televisions or computers and the like is generally room temperature, in some special cases, it is also applicable to sub-zero environments, therefore, the liquid conductive substance is preferably a material with a low melting point, for example, the liquid conductive substance preferably comprises an indium tin gallium alloy material having a melting point of about-19 deg.C, a boiling point of about 1300 deg.C, namely, the indium-tin-gallium alloy is in liquid state at the temperature of more than-19 ℃, and the performance of the indium-tin-gallium alloy material is relatively stable, therefore, the alloy can be used in a normal working environment, and specifically, the gallium indium tin alloy material can be prepared from Ga: in: sn 68.5%: 21.5%: 10 percent. In addition, the liquid conductive substance may also be an electrolyte solution or mercury, or may be other materials that can meet the requirements of use in a normal working environment, and is not limited herein.
Specifically, in the flexible circuit board according to the embodiment of the present invention, the substrate 11 preferably includes a resin material, and the encapsulation layer 14 preferably includes a resin material. Specifically, the first encapsulation layer 141 and the second encapsulation layer 142 in the encapsulation layer 14 may both employ a resin material. The resin material has certain elasticity, so that the tensile property of the flexible circuit board can be satisfied, and specifically, the resin material is preferably an elastic resin, and other materials with a good tensile effect can also be adopted, and the materials of the substrate 11 and the encapsulation layer 14 are not limited herein.
In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including: the flexible circuit board is provided. The display device can be applied to any product or component with a display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Because the principle of the display device for solving the problems is similar to that of the flexible circuit board, the implementation of the display device can be referred to that of the flexible circuit board, and repeated details are omitted.
The third aspect of the present invention is based on the same inventive concept, and the embodiment of the present invention further provides a manufacturing method of the flexible circuit board. Because the principle of solving the problems of the manufacturing method is similar to that of the flexible circuit board, the implementation of the manufacturing method can refer to the implementation of the flexible circuit board, and repeated details are not repeated.
The embodiment of the utility model provides a manufacturing method of above-mentioned flexible circuit board, as shown in fig. 5, can include:
s201, providing a substrate 11, for example, the substrate 11 may be made of elastic resin to make the formed substrate stretchable, or the substrate 11 may be made of other materials, where the material of the substrate 11 is not limited;
s202, forming at least one contact electrode group on the substrate 11, as shown in fig. 6a, the contact electrode group generally includes a first contact electrode and a second contact electrode at two ends of the substrate 11, the first contact electrode and the second contact electrode extend outward relative to the substrate 11 to form a first contact electrode and a second contact electrode exposed at a portion of a surface near one side of the substrate 11, if the first contact electrode and the second contact electrode to be formed are exposed at a portion of a surface far from one side of the substrate 11, side edges of the first contact electrode and the second contact electrode may be disposed to be flush with side edges of the substrate 11;
s203, forming the encapsulation layer 14 by using a 3D printing process, where a cavity 21 for accommodating a liquid conductive substance and a liquid storage region 22 communicated with the cavity 21 are disposed on one side of the encapsulation layer 14 close to the substrate 11, as shown in fig. 6b, for example, the encapsulation layer 14 may be formed by using an elastic resin, so that the encapsulation layer has stretchability, or the encapsulation layer 14 may be made of other materials, where the material of the encapsulation layer 14 is not limited, and in the 3D printing process, the encapsulation layer 14 may be integrally formed, or the first encapsulation layer 141 and the second encapsulation layer 142 may be respectively formed;
s204, injecting a liquid conductive substance into the liquid storage region 22, so that the liquid conductive substance is connected to the contact electrode group, as shown in fig. 6c, in practical application, the content of the liquid conductive substance injected into the liquid storage region 22 needs to be determined according to the stretching degree, so as to ensure that the liquid conductive substance can be in good contact with the contact electrode group in the original state and after stretching;
s205, the liquid storage region 22 is encapsulated by the breathable film 15 to form the structure shown in the figure 2 a.
In a fourth aspect, based on the same inventive concept, the embodiment of the present invention further provides a manufacturing method of the flexible circuit board. Because the principle of solving the problems of the manufacturing method is similar to that of the flexible circuit board, the implementation of the manufacturing method can refer to the implementation of the flexible circuit board, and repeated details are not repeated.
The embodiment of the utility model provides a manufacturing method of above-mentioned flexible circuit board, as shown in FIG. 7, can include:
s301, providing a substrate 11, for example, the substrate 11 may be made of elastic resin, or the substrate 11 may be made of other materials, and the material of the substrate 11 is not limited herein;
s302, forming at least one contact electrode group on the substrate 11, as shown in fig. 6a, the contact electrode group generally includes a first contact electrode and a second contact electrode at two ends of the substrate 11, the first contact electrode (or the second contact electrode) extends outward relative to the substrate 11 to form a first contact electrode (or a second contact electrode) exposed at a portion of the surface near one side of the substrate 11, and if the first contact electrode (or the second contact electrode) to be formed is exposed at a portion of the surface far from one side of the substrate 11, a side edge of the first contact electrode (or the second contact electrode) may be disposed to be flush with a side edge of the substrate 11;
s303, forming a conducting layer 16 by adopting a liquid metal material at a temperature lower than the melting point of the liquid metal material, and patterning the conducting layer; the conductive layer 16 is connected to at least one contact electrode group; at a temperature lower than the melting point of the liquid metal, the liquid metal is solid, so that a solid conductive layer 16 can be formed, and the conductive layer 16 is patterned, resulting in the structure shown in fig. 8;
s304, forming the encapsulation conductive layer 16 and the encapsulation layer 14 contacting the electrode group at a temperature lower than the melting point of the liquid metal material to form the cavity 21 and the liquid storage region 22 of the conductive structure 12, as shown in fig. 6 c; at a temperature below the melting point of the liquid metal material, the conductive layer 16 remains solid and the encapsulation layer 14 is formed over the conductive layer 16 and the set of contact electrodes, thereby forming cavities 21 and reservoir regions 22 of the conductive structure 12 as shown in fig. 6c, and at a temperature above the melting point of the liquid metal material, the conductive layer 16 is liquid and thus can flow within the formed cavities 21 and reservoir regions 22;
s305, forming a breathable film 15 for encapsulating the liquid storage region 22 to form the structure shown in figure 2 a.
In a fifth aspect, based on the same inventive concept, the embodiment of the present invention further provides a manufacturing method of the flexible circuit board. Because the principle of solving the problems of the manufacturing method is similar to that of the flexible circuit board, the implementation of the manufacturing method can refer to the implementation of the flexible circuit board, and repeated details are not repeated.
The embodiment of the utility model provides a manufacturing method of above-mentioned flexible circuit board, as shown in FIG. 9, can include:
s401, providing a substrate base plate 17, wherein the substrate base plate 17 can be a stretchable substrate base plate 17 or a non-stretchable substrate base plate 17, such as a glass base plate, and the material of the substrate base plate 17 is not limited herein;
s402, forming an encapsulation layer 14 on a substrate 17, as shown in fig. 10a, where a groove 18 for accommodating a liquid conductive substance and a liquid storage region 22 communicated with the groove 18 are formed on the encapsulation layer 14, and a breathable film 15 is disposed on a side of the liquid storage region 22 close to the substrate 17, in the manufacturing method provided in this embodiment, the encapsulation layer 14 is formed on the substrate 17, and then a patterning process is used to form the groove 18 (i.e., the cavity 21 after encapsulation) for accommodating the liquid conductive substance and the liquid storage region 22, specifically, a one-time patterning process may be used to form an encapsulation layer having an integrated structure, or two-time patterning processes may be used to form a pattern of a first encapsulation layer 141 and a pattern of a second encapsulation layer 142, respectively, so as to form a pattern of the encapsulation layer 14;
s403, filling the groove 18 and the liquid storage region 22 on the encapsulation layer 14 with a liquid conductive material, as shown in fig. 10b, in practical application, the content of the liquid conductive material injected into the liquid storage region 22 needs to be determined according to the degree of stretching, so as to ensure that the liquid conductive material can be in good contact with the contact electrode set in an original state and after stretching;
s404, providing a substrate 11; for example, the substrate 11 made of elastic resin may be used to provide stretchability to the substrate, or the substrate 11 made of other materials may be used, and the material of the substrate 11 is not limited herein;
s405, forming at least one contact electrode group on the substrate 11; as shown in fig. 6a, the contact electrode group generally includes a first contact electrode and a second contact electrode at two ends of the substrate 11, the first contact electrode (or the second contact electrode) extends outward relative to the substrate 11 to form a first contact electrode (or a second contact electrode) exposed at a portion of the surface near one side of the substrate 11, and if the first contact electrode (or the second contact electrode) to be formed is exposed at a portion of the surface far from one side of the substrate 11, a side edge of the first contact electrode (or the second contact electrode) may be disposed flush with a side edge of the substrate 11;
s406, aligning the substrate 17 filled with the liquid conductive material with the substrate 11 formed with the contact electrode group, i.e. aligning the substrate 17 with the substrate 11, and then attaching the two together by glue or other fixing means, as shown in fig. 10 c;
s407, the substrate 17 is removed to obtain the structure shown in fig. 2 a.
In this embodiment, the structure shown in fig. 2a is obtained by first forming the encapsulation layer 14 in an inverted shape, filling the encapsulation layer with a liquid conductive material, and then placing the substrate 11 on which the contact electrode group is formed in a cassette, and inverting the flexible circuit board obtained after the cassette is placed.
The embodiment of the utility model provides a flexible circuit board and display device, because conducting structure is including the liquid conducting material that is located the cavity, when stretching this flexible circuit board, the liquid paddy field material in the conducting structure flows because the change of atmospheric pressure, realizes switching on between liquid conducting material and first contact electrode and the second contact electrode, therefore on the basis of having guaranteed flexible circuit board's electric conductivity, has realized stretching of flexible circuit board.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A flexible circuit board, comprising: the packaging structure comprises a substrate, at least one conductive structure positioned on the substrate, a contact electrode group, a packaging layer used for packaging the conductive structure and the contact electrode group, and a breathable film; wherein,
the set of contact electrodes includes: the first contact electrode and the second contact electrode are respectively electrically connected with two ends of the conductive structure;
the packaging layer and the substrate form a cavity and a liquid storage area which are communicated with each other;
the conductive structure includes: a liquid conductive substance located within the cavity;
the liquid storage area is used for storing the liquid conductive substance, and the breathable film is used for packaging the liquid storage area and communicating the liquid storage area with the external atmospheric pressure.
2. The flexible circuit board of claim 1, wherein the reservoir region is located at an end of the conductive structure that is connected to the first contact electrode.
3. The flexible circuit board of claim 2, wherein the first contact electrode overlaps an orthographic projection of the reservoir region on the substrate, and the second contact electrode overlaps an orthographic projection of the cavity on the substrate.
4. The flexible circuit board of claim 1, wherein the encapsulation layer comprises: the first packaging layer and the second packaging layer are positioned on one side, away from the substrate, of the first packaging layer;
the surface of the first packaging layer, which deviates from one side of the substrate, is flush with the surface of the liquid storage area, and the surface of the second packaging layer, which deviates from one side of the substrate, is flush with the surface of the breathable film.
5. The flexible circuit board of claim 1, wherein a portion of a surface of the first contact electrode adjacent to the substrate side is exposed; or part of the surface of one side of the first contact electrode, which is far away from the substrate, is exposed;
part of the surface of the second contact electrode close to one side of the substrate is exposed; or the surface part of the second contact electrode on the side facing away from the substrate is exposed.
6. The flexible circuit board according to claim 1, wherein the size of the pore diameter of the gas permeable film is between the largest molecular diameter in air and the particle diameter of the liquid conductive substance.
7. The flexible circuit board of claim 6, wherein the gas permeable membrane comprises an expanded polytetrafluoroethylene material.
8. The flexible circuit board of any one of claims 1 to 7, wherein the liquid conductive substance comprises a liquid metal or an electrolyte solution, and the liquid metal comprises an indium tin gallium alloy material or mercury.
9. The flexible circuit board according to any one of claims 1 to 7, wherein the substrate includes a resin material, and the encapsulation layer includes a resin material.
10. A display device, comprising: the flexible circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721426073.2U CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721426073.2U CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305067U true CN207305067U (en) | 2018-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721426073.2U Withdrawn - After Issue CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
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| Country | Link |
|---|---|
| CN (1) | CN207305067U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660066A (en) * | 2017-10-31 | 2018-02-02 | 北京京东方显示技术有限公司 | A kind of flexible PCB, its preparation method and display device |
| CN108882540A (en) * | 2018-09-05 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of pcb board manufacturing method, pcb board and electronic equipment |
-
2017
- 2017-10-31 CN CN201721426073.2U patent/CN207305067U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660066A (en) * | 2017-10-31 | 2018-02-02 | 北京京东方显示技术有限公司 | A kind of flexible PCB, its preparation method and display device |
| CN107660066B (en) * | 2017-10-31 | 2024-05-14 | 北京京东方显示技术有限公司 | Flexible circuit board, manufacturing method thereof and display device |
| CN108882540A (en) * | 2018-09-05 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of pcb board manufacturing method, pcb board and electronic equipment |
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