CN207303062U - A kind of transfer mechanism for silicon chip image positioner - Google Patents
A kind of transfer mechanism for silicon chip image positioner Download PDFInfo
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- CN207303062U CN207303062U CN201721047181.9U CN201721047181U CN207303062U CN 207303062 U CN207303062 U CN 207303062U CN 201721047181 U CN201721047181 U CN 201721047181U CN 207303062 U CN207303062 U CN 207303062U
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Abstract
The utility model discloses a kind of transfer mechanism for silicon chip image positioner, including：Fixed frame；And for carrying the transfer framework of silicon chip carrier, it is arranged on fixed frame, wherein, transfer framework is reciprocably slid onto end from the front end of fixed frame, the lower section of transfer framework is equipped with light filling component, and the surface of light filling component is equipped with the camera for being used for silicon chip image positioning.According to the utility model, it is in raising while transfer efficient, additionally it is possible to image positioning work is completed during transfer, the working time is greatly shortened, improves location efficiency.
Description
Technical field
It the utility model is related to non-standard automatic field, more particularly to a kind of transfer machine for silicon chip image positioner
Structure.
Background technology
With the development of science and technology automatic technology is more and more applied in all trades and professions, automatic business processing technology exists
Also it is used widely in the process treatment process of silicon chip of solar cell, specifically, silicon chip of solar cell is in multiple processing
Technique needs in transfer process to concentrate pending silicon chip the positioning of batch image back and forth, occurs to reduce in process treatment process
Error and improve processing quality, and in image position fixing process, lack always a kind of mechanism can in bulk by silicon chip from
It is steady at feeding station, be quickly transferred at discharge station, in view of this, it is really necessary to develop a kind of silicon chip image that is used for position
The transfer mechanism of device, to solve the above problems.
Utility model content
For the shortcomings of the prior art, the purpose of this utility model is to provide one kind and determines for silicon chip image
The transfer mechanism of position device, it is in raising while transfer efficient, additionally it is possible to image positioning work is completed during transfer, greatly
Shorten working hours greatly, improve location efficiency.
In order to realize above-mentioned purpose according to the present utility model and other advantages, there is provided one kind is used for silicon chip image and positions
The transfer mechanism of device, including：
Fixed frame；And
For carrying the transfer framework of silicon chip carrier, it is arranged on fixed frame,
Wherein, transfer framework is reciprocably slid onto end from the front end of fixed frame, and the lower section of transfer framework, which is equipped with, mends
Optical assembly, the surface of light filling component are equipped with the camera for being used for silicon chip image positioning.
Preferably, light filling component is arranged near the stage casing of fixed frame.
Preferably, fixed frame includes：
The left fixed column being oppositely arranged and right fixed column；And
The preceding fixed column being oppositely arranged and rear fixed column,
Wherein, preceding fixed column, left fixed column, rear fixed column and right fixed column surround connect into fixed frame successively.
Preferably, left fixed column is parallel with right fixed column and interval setting is led to forming the transfer being located between the two
Left rail and right guide rail are respectively and fixedly connected with road, left fixed column and right fixed column, transfer framework is slidably led with left rail and the right side
Rail is matched.
Preferably, transfer drive component is equipped with fixed frame, transfer framework can under the driving of transfer drive component
Along left rail and right guide rail toward polyslip.
Preferably, transfer framework includes：
The left rotary column being oppositely arranged and rotary column in the right side；And
The preceding middle rotary column being oppositely arranged and rear fixed column,
Wherein, rotary column is circular successively in preceding middle rotary column, left rotary column, rear middle rotary column and the right side connects into transfer framework, left
Rotary column is slidably matched with left rail and right guide rail respectively in middle rotary column and the right side.
Preferably, the front end of transfer framework and rear end have been respectively and fixedly connected with several limited blocks and have clamped lifting cylinder.
Preferably, clamping lifting cylinder can be for linear motion with respect to front limited block in the horizontal plane and in perpendicular
Inside make elevating movement.
Preferably, when transfer framework is located at the front end of fixed frame, light filling component is placed exactly in the end for turning framework.
Preferably, when transfer framework is located at the end of fixed frame, light filling component is placed exactly in the front end for turning framework.
Compared with prior art, its advantage is the utility model：It is in raising while transfer efficient, additionally it is possible to
Image positioning work is completed during transfer, the working time is greatly shortened, improves location efficiency.
Brief description of the drawings
Fig. 1 is the stereogram according to the transfer mechanism described in the utility model for silicon chip image positioner.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings, the foregoing and other mesh of the utility model
, feature, aspect and advantage will be apparent, to make those skilled in the art can be real according to this with reference to specification word
Apply.In the accompanying drawings, for clarity, shape and size can be amplified, and identical attached drawing mark will be used in all figures
Remember to indicate the same or similar component.In the description, such as " front portion ", " rear portion ", " top ", " lower part ", " top " and
The relative terms of " bottom " and its derivative words should be interpreted to refer to then as described in or such as the institute in the attached drawing to come into question
The orientation shown.These relative terms are for convenience and are usually not intended as the specific orientation of needs.It is related to attached
The term (for example, " connection " and " attachment ") connect, couple etc. refers to that these structures are solid directly or indirectly to one another by intermediate structure
Fixed or attachment relation and movable or rigidly attached or relation, unless otherwise clearly stating.
With reference to Fig. 1, the transfer mechanism 2 for silicon chip image positioner includes：Fixed frame 21, transfer framework 22 and
Light filling component 24, wherein, transfer framework 22 is used to carry silicon chip carrier, it is arranged on fixed frame 21, transfer framework 22
Lower section is equipped with light filling component 24, and the surface of light filling component 24 is equipped with the camera for being used for silicon chip image positioning, and transfer framework 22 can
End reciprocally is slid onto from the front end of fixed frame 21, and end is slid onto from the front end of fixed frame 21 in transfer framework 22
During this, camera cooperates with light filling component 24 successively to be determined the silicon chip progress image carried on silicon chip carrier
Position.In a preferred embodiment, light filling component 24 is arranged near the stage casing of fixed frame 21.
Further, fixed frame 21 includes：
The left fixed column 212 being oppositely arranged and right fixed column 214；And
The preceding fixed column 211 being oppositely arranged and rear fixed column 213,
Wherein, preceding fixed column 211, left fixed column 212, rear fixed column 213 and right fixed column 214 successively around connecting and
Into fixed frame 21.
With reference to Fig. 1, left fixed column 212 is parallel with right fixed column 214 and is arranged at intervals to be formed between the two
Turn passage, left rail 2121 and right guide rail 2141, transfer framework 22 have been respectively and fixedly connected with left fixed column 212 and right fixed column 214
It is slidably matched with left rail 2121 and right guide rail 2141.
Further, transfer drive component 23 is equipped with fixed frame 21, transfer framework 22 is in transfer drive component 23
Driving is lower can be along left rail 2121 and right guide rail 2141 toward polyslip.
With reference to Fig. 1, transfer framework 22 includes：
The left rotary column 222 being oppositely arranged and rotary column 224 in the right side；And
The preceding middle rotary column 221 being oppositely arranged and rear fixed column 223,
Wherein, rotary column 224 is formed around connecting successively in preceding middle rotary column 221, left rotary column 222, rear middle rotary column 223, the right side
Transfer framework 22, rotary column 224 is slidably matched with left rail 2121 and right guide rail 2141 respectively in left rotary column 222 and the right side.
Further, the front end of transfer framework 22 and rear end have been respectively and fixedly connected with several limited blocks 2211 and have clamped lifting air
Cylinder 25, clamping lifting cylinder 25 can be for linear motion with respect to front limited block 2211 in the horizontal plane and be risen in perpendicular
Drop movement, when silicon chip carrier is conveyed into transfer framework 22, clamps lifting cylinder 25 and is raised above and to limited block 2211
Side applies clamping force, with 221 collective effect of limited block by silicon chip carrier clamping and positioning, when silicon chip carrier is by transfer framework
22 from the front end of fixed frame 21 when being slid onto end, clamp lifting cylinder 25 will silicon chip carrier unclamp after drop to transfer framework
Below 22 place plane, in order to which silicon chip carrier is transferred out from transfer framework 22.
Referring again to Fig. 1, during work, when transfer framework 22 is located at the front end of fixed frame 21, light filling component 24 is just
Positioned at the end for turning framework 22；When transfer framework 22 is located at the end of fixed frame 21, light filling component 24, which is placed exactly in, turns frame
The front end of body 22 so that silicon chip carrier by transfer framework 22 from when being transmitted to end from the front end of fixed frame 21, camera
Cooperate with light filling component 24 and just complete all silicon chip image positioning operations, so that before image positioning operation is ensured
Put, can further reduce the floor space of equipment.
Number of devices and treatment scale described herein are the explanations for simplifying the utility model.To the utility model
Application, modifications and variations will be readily apparent to persons skilled in the art.
Although the embodiment of the utility model is disclosed as above, it is not limited in institute in specification and embodiment
Row use, it can be applied to the field of various suitable the utility model completely, can for those skilled in the art
Easily realize other modification, therefore under the universal limited without departing substantially from claim and equivalency range, this practicality
It is new to be not limited to specific details and shown here as the legend with description.
Claims (10)
- A kind of 1. transfer mechanism (2) for silicon chip image positioner, it is characterised in that including：Fixed frame (21)；AndFor carrying the transfer framework (22) of silicon chip carrier, it is arranged on fixed frame (21),Wherein, transfer framework (22) is reciprocably slid onto end from the front end of fixed frame (21), under transfer framework (22) Side is equipped with light filling component (24), and the surface of light filling component (24) is equipped with the camera for being used for silicon chip image positioning.
- 2. it is used for the transfer mechanism of silicon chip image positioner as claimed in claim 1, it is characterised in that light filling component (24) Near the stage casing of fixed frame (21).
- 3. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 1, it is characterised in that fixed frame (21) include：The left fixed column (212) being oppositely arranged and right fixed column (214)；AndThe preceding fixed column (211) being oppositely arranged and rear fixed column (213),Wherein, preceding fixed column (211), left fixed column (212), rear fixed column (213) and right fixed column (214) are successively around phase Connect and form fixed frame (21).
- 4. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 2, it is characterised in that left fixed column (212) it is parallel with right fixed column (214) and be arranged at intervals and be located at gangway for transhipment between the two, left fixed column (212) to be formed And left rail (2121) and right guide rail (2141) have been respectively and fixedly connected with right fixed column (214), transfer framework (22) slidably with a left side Guide rail (2121) and right guide rail (2141) are matched.
- 5. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 4, it is characterised in that fixed frame (21) transfer drive component (23) is equipped with, transfer framework (22) can be along left rail under the driving of transfer drive component (23) (2121) with right guide rail (2141) toward polyslip.
- 6. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 4, it is characterised in that transfer framework (22) include：The left rotary column (222) being oppositely arranged and rotary column (224) in the right side；AndThe preceding middle rotary column (221) being oppositely arranged and rear fixed column (223),Wherein, rotary column (224) is circular successively in preceding middle rotary column (221), left rotary column (222), rear middle rotary column (223), the right side connects Into transfer framework (22), in left rotary column (222) and the right side rotary column (224) respectively slidably with left rail (2121) and right guide rail (2141) it is matched.
- 7. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 6, it is characterised in that transfer framework (22) front end and rear end has been respectively and fixedly connected with several limited blocks (2211) and has clamped lifting cylinder (25).
- 8. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 7, it is characterised in that clamp lifting Cylinder (25) can be for linear motion with respect to front limited block (2211) in the horizontal plane and makees elevating movement in perpendicular.
- 9. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 2, it is characterised in that when transfer frame When body (22) is located at the front end of fixed frame (21), light filling component (24) is placed exactly in the end for turning framework (22).
- 10. it is used for the transfer mechanism (2) of silicon chip image positioner as claimed in claim 2, it is characterised in that when transfer frame When body (22) is located at the end of fixed frame (21), light filling component (24) is placed exactly in the front end for turning framework (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721047181.9U CN207303062U (en) | 2017-08-21 | 2017-08-21 | A kind of transfer mechanism for silicon chip image positioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721047181.9U CN207303062U (en) | 2017-08-21 | 2017-08-21 | A kind of transfer mechanism for silicon chip image positioner |
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| Publication Number | Publication Date |
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| CN207303062U true CN207303062U (en) | 2018-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721047181.9U Active CN207303062U (en) | 2017-08-21 | 2017-08-21 | A kind of transfer mechanism for silicon chip image positioner |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107424950A (en) * | 2017-08-21 | 2017-12-01 | 罗博特科智能科技股份有限公司 | A kind of transfer mechanism for silicon chip image positioner |
-
2017
- 2017-08-21 CN CN201721047181.9U patent/CN207303062U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107424950A (en) * | 2017-08-21 | 2017-12-01 | 罗博特科智能科技股份有限公司 | A kind of transfer mechanism for silicon chip image positioner |
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