CN207301829U - The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer - Google Patents
The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer Download PDFInfo
- Publication number
- CN207301829U CN207301829U CN201721178274.5U CN201721178274U CN207301829U CN 207301829 U CN207301829 U CN 207301829U CN 201721178274 U CN201721178274 U CN 201721178274U CN 207301829 U CN207301829 U CN 207301829U
- Authority
- CN
- China
- Prior art keywords
- temperature
- printer
- heat exchanger
- control system
- cleanliness factor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
The utility model provides the temperature and cleanliness factor control system and biological 3D printer of a kind of 3D printer enclosure space.The temperature and cleanliness factor control system of a kind of 3D printer enclosure space, wherein, including system shell and support plate, the support plate is located in the opening of the system shell, and surround a cavity with the system shell, the system shell is equipped with semiconductor temperature-control device, and the semiconductor temperature-control device is at least partially disposed in the cavity, and the support plate is equipped with air filtration unit.The utility model realizes the temperature control in controlled region using the noiseless semiconductor chilling plate of small size, realizes air purity control using efficient extra large pa filter, so as to reduce the apparent volume and complexity of 3D printer, improves the survival rate of cell.
Description
Technical field
3D printing equipment technical field is the utility model is related to, more particularly, to a kind of 3D printer enclosure space
Temperature and cleanliness factor control system and biological 3D printer.
Background technology
Biological 3D printing technique is directly to beat the material with biocompatibility or cell by the principle of 3D printing
It is printed as required three-dimensional structure.Relatively common has two kinds of forms, extruded type printing and ink jet type printing.Due to biomaterial
Particularity, possess structure three-dimensional structure biomaterial needs solidified forming is timely completed in forming area, otherwise can
Seriously affect the stability and printing precision of whole three-dimensional structure.Common material solidification mode has chemical crosslink technique, utilizes gas
Flowing mode sprays the cell solution of biomaterial, i.e. dissolved colloidal state in the cross-linking agent solution to forming platform, utilizes chemistry to hand over
The mode of connection makes the cell solution gel conversion of dissolved colloidal state into gel state, final to shape.The shortcomings that this forming mode, is：Draw
Crosslinking agent is entered, there are crosslinking agent, the three-dimensional structure for causing to be manufactured connects on the material cell surface after curing between layers
It is unreliable, it is difficult to print the threedimensional model of more complex structure.For above drawback, it is thus proposed that the temperature of material in itself can be utilized
Quick characteristic realizes solidified forming, by controlling temperature in the graded of different zones so that the cell solution of gelatin-based is being beaten
Final gel state is progressively mutually faded to by collosol state during print., generally can be with positive temperature in order to realize temperature sensitive shaping
The file printing of quick characteristic, in order to realize lower temperature control, can generally be selected in the relatively low shaped platform of temperature or space
Selecting the mode of compressor cooling reduces the temperature in controlled region, but since the volume of Compressor Group is larger and noise can not disappear
Remove, whole 3D printer can be caused to increase extra volume and noise output, and the environment residing for the cell in the device is easy
It is contaminated, cell survival rate is relatively low.
Utility model content
The utility model is at least one defect overcome described in the above-mentioned prior art, there is provided a kind of 3D printer closing is empty
Between temperature and cleanliness factor control system.The utility model realizes controlled area using the noiseless semiconductor chilling plate of small size
The temperature control in domain, realizes air purity control, so as to reduce the appearance body of 3D printer using efficient extra large pa filter
Product and complexity, improve the survival rate of cell.
Another purpose of the utility model is to provide a kind of biological 3D with above-mentioned temperature and cleanliness factor control system
Printer.
In order to solve the above technical problems, the technical solution adopted in the utility model is：A kind of 3D printer enclosure space
Temperature and cleanliness factor control system, wherein, including system shell and support plate, the support plate be located at opening for the system shell
On mouth, and a cavity is surrounded with the system shell, the system shell is equipped with semiconductor temperature-control device, the semiconductor
Temperature control device is at least partially disposed in the cavity, and the support plate is equipped with air filtration unit.
Semiconductor temperature-control device can realize that high-temperature heating and cryogenic refrigeration export using semiconductor chilling plate as core devices.
Semiconductor chilling plate is a kind of thermoelectric cooling technology, it passes through cold and hot temperature caused by the thermocouple of different materials using direct current
Difference realizes external temperature output.For the biomaterial of positive temperature character, it would be desirable to control printer enclosure space or
Print platform is in a relatively low temperature (relative to environment temperature), and therefore, it is necessary to the cold end pair using semiconductor chilling plate
Above-mentioned zone cools down, and to control the hot junction of semiconductor chilling plate, hot junction is maintained at a rational temperature range
It is interior.For the material of inverse temperature-sensing property, then need to heat up to above-mentioned zone using the hot junction of semiconductor chilling plate, and control
The cold end of semiconductor chilling plate processed is at rational temperature range.Furthermore, it is contemplated that the particularity of biological 3D printing material,
Dust microbes in shaping room air cause the biomaterial during printing or cell the damage of unrepairable, because
This needs to carry out shaping room air the clean processing of stringent filtering.Therefore, air filtration unit is set to complete on the supporting plate
Air-filtering processing in whole equipment confined space.
Further, the semiconductor temperature-control device is located on the top surface of the system shell, the semiconductor temperature-control dress
Put and be connected including semiconductor chilling plate, heat exchanger and heat exchanger, the semiconductor chilling plate side with the heat exchanger, separately
Side is connected with the heat exchanger, and the heat exchanger is at least partially disposed in the cavity.Preferably, the heat exchanger is placed in institute
State in cavity, and the heat exchanger is close to the inner wall of the system shell top surface.When needing to be freezed by temperature controlled zone,
Lead to direct current in semiconductor refrigerating on piece so that the side that semiconductor chilling plate is bonded with heat exchanger becomes hot junction, then partly
The side that conductor cooling piece is bonded with heat exchanger is just cold end, when passing through direct current in semiconductor chilling plate, the heat quilt in hot junction
Heat exchanger is taken away, and the low temperature of cold end is absorbed by heat exchanger and reduces controlled region to convection current is constantly carried out by refrigerated area
Temperature.When needing to be heated by temperature controlled zone, the direction of the direct current passed through by varying semiconductor refrigerating on piece, makes
The cool and heat ends for obtaining semiconductor chilling plate are exchanged, its hot junction is the side being bonded with heat exchanger, and cold end is what is be bonded with heat exchanger
Side, cold end produce low temperature taken away by heat exchanger, hot junction produce heat by heat exchanger absorb and to heated region not
It is disconnected to carry out convection current to lift the temperature in controlled region.
Further, the top surface of the system shell is inclined relative to horizontal setting.The support plate and system shell
The inside cavity surrounded, is equipped with water-absorbing sponge at the least significant end of system shell top surface.Utilizing semiconductor chilling plate cold end pair
When being freezed by temperature controlled zone, since temperature declines, the vapor meeting heat release phase transformation around cold end, is changed into liquid simultaneously from gaseous state
Semiconductor chilling plate cold end is accumulated to, when semiconductor chilling plate cold end is in horizontal installation position, hydrops can produce drippage, drop
The hydrops fallen may be fallen into molding room by air filtration unit and cause the short circuit of equipment or the pollution of cell, in order to gram
Above-mentioned phenomenon is taken, the system shell top surface for installing semiconductor chilling plate is designed to be obliquely installed, when producing hydrops, hydrops meeting
Slided along the inclined-plane of system shell top surface to lower and be finally collected processing, wherein along the inner wall of system shell top surface to low
The hydrops that place is slided finally is absorbed by water-absorbing sponge, so avoids the phenomenon that hydrops arbitrarily drips.
Further, the heat exchanger is made of the excellent aluminium material of heat conductivility, and the heat exchanger is equipped with fin knot
Structure, fin like structures can increase the contact area of heat exchanger and air, can so improve the heat exchange efficiency of heat exchanger.It is described
The heat exchange method of heat exchanger is liquid heat-exchange or gas heat exchange.
Further, the air filtration unit includes the air inlet and air outlet being located in the support plate, Yi Jifen
The filtration apparatus and extractor fan not being located on the air inlet and air outlet, the filtration apparatus and extractor fan are placed in described
Inside cavity.Preferably, the filtration apparatus is extra large pa filter, and the extractor fan is mute spoiler.This practicality is new
The control system of type using when be fixed on above 3D printer Photocopy Room, and the air outlet of control system and 3D printer Photocopy Room
Communicate.The speed of regional temperature response is controlled, it is necessary to improve the speed of heat exchange, therefore, this practicality in order to improve printer
It is new that mute spoiler is provided with air outlet to change the mode of thermal convection current, with the help of spoiler, heat exchange
The heat exchange of device and the air in printer molding room is changed into forced convertion from free convection, and heat exchanger effectiveness improves tens times.
Due to biological 3D printing to the particularity of environmental requirement, it is necessary to the stringent cleanliness factor of control printing chamber region, this practicality is newly
Type is provided with air intake vent and carries out filtering processing to the air in molding room as the extra large pa filter of filter core using efficient extra large pa,
Extra large pa filter includes two symmetrical extra large pas being fixed in sealing support plate, seals and is provided with ventilation slot in support plate, air leads to
Cross ventilation slot and enter internal system, and be sealed the extra large pa in support plate and filtered, due to system hermetic design, in air outlet
Spoiler drive under, air can constantly from air intake vent enter, molding room is returned to by air outlet again after filtering, is constantly followed
Ring is until reach the temperature of setting and clean angle value.
Further, the system shell and support plate, which are equipped with, is used to the control system being fixed on 3D printer printing
Screw hole above room, facilitates the installation of the utility model control system.
The utility model also provides a kind of biological 3D printer, wherein, the biology 3D printer include above-mentioned temperature with
Cleanliness factor control system, the temperature and cleanliness factor control system are located above the Photocopy Room of biological 3D printer.
Compared with prior art, the beneficial effects of the utility model：
The semiconductor temperature-control device of the utility model is using semiconductor chilling plate as core devices, it is possible to achieve high-temperature heating and
Cryogenic refrigeration exports, and realizes the cryogenic refrigeration and high-temperature heating integrated control of biological 3D printer enclosure space.
The heat exchanger of the utility model is made of the excellent aluminium material of heat conductivility, and there is provided fin structure to increase
The contact area of big heat exchanger and air, while spoiler is provided with the air outlet of support plate, by heat exchanger and printing
The heat exchange of air in machine molding room is changed into forced convertion from free convection, improves heat exchanger effectiveness, and then improve life
Refrigeration and the speed of heating in thing 3D printer enclosure space.
The utility model is provided with the extra large pa filter pair by the use of efficient extra large pa as filter core on the air inlet of support plate
Air in molding room carries out filtering processing, realizes the cleaning filtering into air in biological 3D printer enclosure space, into
And realize the control of cleanliness factor in 3D printer enclosure space.
The temperature and cleanliness factor control system of the utility model are small, compact-sized, reduce biological 3D printer temperature
The volume and complexity of control system.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the exploded perspective view of the utility model.
Fig. 3 is the top view of the utility model.
Fig. 4 is the sectional view of A-A in Fig. 3.
Fig. 5 is the structure diagram of heat exchanger in the utility model.
Fig. 6 is the structure diagram of filtration apparatus in the utility model.
Embodiment
Attached drawing is only for illustration, it is impossible to is interpreted as the limitation to this patent；It is attached in order to more preferably illustrate the present embodiment
Scheme some components to have omission, zoom in or out, do not represent the size of actual product；To those skilled in the art,
Some known features and its explanation may be omitted and will be understood by attached drawing.Being given for example only property of position relationship described in attached drawing
Explanation, it is impossible to be interpreted as the limitation to this patent.
Embodiment 1
As shown in Fig. 1 to Fig. 4, the temperature and cleanliness factor control system of a kind of 3D printer enclosure space, wherein, including be
System shell 1 and support plate 2, the support plate 2 are located in the opening of the system shell 1, and surround one with the system shell 1
A cavity, the system shell 1 are equipped with semiconductor temperature-control device, and the semiconductor temperature-control device is at least partially disposed in the chamber
In body, the support plate 2 is equipped with air filtration unit.Semiconductor temperature-control device can be with as core devices using semiconductor chilling plate
Realize high-temperature heating and cryogenic refrigeration output.Semiconductor chilling plate is a kind of thermoelectric cooling technology, it is passed through not using direct current
External temperature output is realized with the cold and hot temperature difference caused by the thermocouple of material.For the biomaterial of positive temperature character, I
Need to control printer enclosure space or print platform to be in a relatively low temperature (relative to environment temperature), therefore,
Need to cool down to above-mentioned zone using the cold end of semiconductor chilling plate, and to control the hot junction of semiconductor chilling plate, make
Hot junction is maintained within the scope of a reasonable temperature.For the material of inverse temperature-sensing property, then need to utilize semiconductor chilling plate
Above-mentioned zone is heated up in hot junction, and controls the cold end of semiconductor chilling plate to be at rational temperature range.In addition,
In view of the particularity of biological 3D printing material, the dust microbes in room air are molded to the biomaterial during printing
Or cell causes the damage of unrepairable, it is therefore desirable to the clean processing of stringent filtering is carried out to shaping room air.Therefore, propping up
Air filtration unit is set on fagging 2 to complete the processing of the air-filtering in whole equipment confined space.
As shown in figure 4, the semiconductor temperature-control device is located on the top surface of the system shell 1, the semiconductor temperature-control
Device includes semiconductor chilling plate 3, heat exchanger 4 and heat exchanger 5,3 side of semiconductor chilling plate and the heat exchanger 4
Connection, opposite side are connected with the heat exchanger 5, and the heat exchanger 5 is at least partially disposed in the cavity.Preferably, it is described to change
Hot device 5 is placed in the cavity, and the heat exchanger 5 is close to the inner wall of 1 top surface of system shell.Needed when by temperature controlled zone
When being freezed, on semiconductor chilling plate 3 lead on direct current so that semiconductor chilling plate 3 be bonded with heat exchanger 4 one
Side becomes hot junction, then the side that semiconductor chilling plate 3 is bonded with heat exchanger 5 is just cold end, passes through direct current in semiconductor chilling plate 3
When electric, the heat in hot junction is taken away by heat exchanger 4, and the low temperature of cold end is absorbed and constantly carried out to by refrigerated area by heat exchanger 5
Convection current is reducing the temperature in controlled region.When needing to be heated by temperature controlled zone, by varying on semiconductor chilling plate 3
The direction of the direct current passed through so that the cool and heat ends of semiconductor chilling plate 3 are exchanged, its hot junction is one be bonded with heat exchanger 5
Side, cold end are the side being bonded with heat exchanger 4, and the low temperature that cold end produces is taken away by heat exchanger 4, the heat quilt that hot junction produces
Heat exchanger 5 absorbs and convection current is constantly carried out to heated region to lift the temperature in controlled region.
As shown in Figure 2 and Figure 4, the top surface of the system shell 1 is inclined relative to horizontal setting.2 He of support plate
The inside cavity that system shell 1 surrounds, is equipped with water-absorbing sponge at the least significant end of 1 top surface of system shell.In the semiconductor system of utilization
When cold 3 cold ends by temperature controlled zone to being freezed, since temperature declines, the vapor meeting heat release phase transformation around cold end, by gas
State is changed into liquid and accumulates to 3 cold end of semiconductor chilling plate, when 3 cold end of semiconductor chilling plate is in horizontal installation position, product
Liquid can produce drippage, and the hydrops of drippage may be fallen into molding room by air filtration unit and cause the short-circuit or thin of equipment
The pollution of born of the same parents, in order to overcome above-mentioned phenomenon, 1 top surface of system shell of installation semiconductor chilling plate 3 is designed to be obliquely installed, when
When producing hydrops, hydrops can slide along the inclined-plane of 1 top surface of system shell to lower and finally be collected processing, wherein along system
The inner wall of 1 top surface of shell is finally absorbed to the hydrops that lower is slided by water-absorbing sponge, so avoids what hydrops arbitrarily dripped
Phenomenon.
As shown in figure 5, the heat exchanger 5 is made of the excellent aluminium material of heat conductivility, the heat exchanger 5 is equipped with fin
Structure 51, fin structure 51 can increase the contact area of heat exchanger 5 and air, can so improve the heat exchange effect of heat exchanger 5
Rate.The heat exchange method of the heat exchanger 4 is liquid heat-exchange or gas heat exchange.
As shown in Figure 1, Figure 2, shown in Fig. 4 and Fig. 6, the air filtration unit includes the air inlet 6 being located in the support plate 2
With air outlet 7, and the filtration apparatus 8 and extractor fan 9 being respectively provided on the air inlet 6 and air outlet 7, the filtering dress
Put 8 and extractor fan 9 be placed in the inside cavity.Preferably, the filtration apparatus 8 is extra large pa filter, the extractor fan 9
For mute spoiler.The control system of the utility model using when be fixed on above 3D printer Photocopy Room, and control system
Air outlet 7 communicated with 3D printer Photocopy Room.The speed of regional temperature response is controlled, it is necessary to improve heat in order to improve printer
The speed exchanged is measured, therefore, the utility model is provided with mute spoiler to change the side of thermal convection current on air outlet 7
Formula, with the help of spoiler, heat exchanger 5 and the heat exchange of the air in printer molding room are changed into forcing from free convection
Convection current, heat exchanger effectiveness improve tens times.Due to biological 3D printing to the particularity of environmental requirement, it is necessary to strictly control Photocopy Room
The cleanliness factor in region, therefore, the utility model are provided with the extra large pa filter by the use of efficient extra large pa 61 as filter core in air intake vent
Filtering processing is carried out to the air in molding room, extra large pa filter includes two symmetrical extra large pas being fixed in sealing support plate 62
61, seal and be provided with ventilation slot in support plate 62, air enters internal system, and the sea being sealed in support plate 62 by ventilation slot
Pa 61 is filtered, and due to system hermetic design, under the drive of the spoiler of air outlet 7, air can be constantly from air intake vent
Into, molding room is returned to by air outlet 7 again after filtering, it is continuous to circulate until reaching the temperature of setting and clean angle value.
In the present embodiment, the system shell 1 and support plate 2 are equipped with and are used to the control system being fixed on 3D printer
Screw hole above Photocopy Room, facilitates the installation of the utility model control system.
Embodiment 2
A kind of biology 3D printer, wherein, which includes the temperature and cleanliness factor control described in embodiment 1
System, the temperature and cleanliness factor control system are located above the Photocopy Room of biological 3D printer.The temperature and cleanliness factor control system
The operation principle of system is same as Example 1.
Obviously, above-described embodiment of the utility model is used for the purpose of clearly demonstrating the utility model example,
And it is not the restriction to the embodiment of the utility model.For those of ordinary skill in the field, stated upper
It can also be made other variations or changes in different ways on the basis of bright.There is no need and unable to give all embodiments
With exhaustion.All any modification, equivalent and improvement made where within the spirit and principles of the present invention etc., should all include
Within the protection domain of the utility model claims.
Claims (10)
1. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space, it is characterised in that including system shell（1）With
Support plate（2）, the support plate（2）It is located at the system shell（1）Opening on, and with the system shell（1）Surround one
A cavity, the system shell（1）Semiconductor temperature-control device is equipped with, the semiconductor temperature-control device is at least partially disposed in described
In cavity, the support plate（2）It is equipped with air filtration unit.
2. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 1, its feature exist
In the semiconductor temperature-control device is located at the system shell（1）Top surface on, the semiconductor temperature-control device includes semiconductor
Cooling piece（3）, heat exchanger（4）And heat exchanger（5）, the semiconductor chilling plate（3）Side and the heat exchanger（4）Even
Connect, opposite side and the heat exchanger（5）Connection, the heat exchanger（5）It is at least partially disposed in the cavity.
3. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 2, its feature exist
In the heat exchanger（5）It is placed in the cavity, and the heat exchanger（5）With the system shell（1）The inner wall of top surface is tight
Patch.
4. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 2, its feature exist
In the system shell（1）Top surface be inclined relative to horizontal setting.
5. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 4, its feature exist
In the support plate（2）And system shell（1）The inside cavity surrounded, in system shell（1）It is equipped with and inhales at the least significant end of top surface
Water sponge（11）.
6. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to Claims 2 or 3, its feature
It is, the heat exchanger（5）It is made of the excellent aluminium material of heat conductivility, the heat exchanger（5）It is equipped with fin structure（51）,
The heat exchanger（4）Heat exchange method be liquid heat-exchange or gas heat exchange.
7. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 1, its feature exist
In the air filtration unit includes being located at the support plate（2）On air inlet（6）And air outlet（7）, and be respectively provided at
The air inlet（6）And air outlet（7）On filtration apparatus（8）And extractor fan（9）, the filtration apparatus（8）Filled with exhausting
Put（9）It is placed in the inside cavity.
8. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 7, its feature exist
In the filtration apparatus（8）For extra large pa filter, the extractor fan（9）For mute spoiler.
9. the temperature and cleanliness factor control system of a kind of 3D printer enclosure space according to claim 1, its feature exist
In the system shell（1）And support plate（2）It is equipped with and is used to the control system being fixed on above 3D printer Photocopy Room
Screw hole.
10. a kind of biology 3D printer, it is characterised in that the biology 3D printer is included described in claim any one of 1-9
Temperature and cleanliness factor control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721178274.5U CN207301829U (en) | 2017-09-14 | 2017-09-14 | The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721178274.5U CN207301829U (en) | 2017-09-14 | 2017-09-14 | The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207301829U true CN207301829U (en) | 2018-05-01 |
Family
ID=62441553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721178274.5U Active CN207301829U (en) | 2017-09-14 | 2017-09-14 | The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207301829U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505959A (en) * | 2017-09-14 | 2017-12-22 | 广州迈普再生医学科技有限公司 | The temperature and cleanliness factor control system of a kind of 3D printer closing space and biological 3D printer |
| US10649439B2 (en) * | 2017-09-21 | 2020-05-12 | Hangzhou Regenovo Biotechnology Co., Ltd. | On-line monitoring method and system for three-dimensional printing |
-
2017
- 2017-09-14 CN CN201721178274.5U patent/CN207301829U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505959A (en) * | 2017-09-14 | 2017-12-22 | 广州迈普再生医学科技有限公司 | The temperature and cleanliness factor control system of a kind of 3D printer closing space and biological 3D printer |
| US10649439B2 (en) * | 2017-09-21 | 2020-05-12 | Hangzhou Regenovo Biotechnology Co., Ltd. | On-line monitoring method and system for three-dimensional printing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110948806A (en) | Injection mold cooling device and using method | |
| CN207301829U (en) | The temperature and cleanliness factor control system of a kind of 3D printer enclosure space and biological 3D printer | |
| CN107505959A (en) | The temperature and cleanliness factor control system of a kind of 3D printer closing space and biological 3D printer | |
| CN207842069U (en) | A kind of cast type 3D printer | |
| CN205227914U (en) | Semiconductor refrigeration thermostatted water bath | |
| CN206098613U (en) | Liquid cooling and heating integration power lithium cell PACK | |
| CN105020935B (en) | Dual temperature area cold/warm mattress and its dual temperature refrigerating and heating combined equipment | |
| CN108819255B (en) | 3D printer forming chamber with circulation wind channel structure | |
| CN201476395U (en) | Multi-functional air cooler | |
| CN210402488U (en) | Intelligent stable detection APP device for system | |
| CN110345697B (en) | Refrigerator with a refrigerator body | |
| CN101896045B (en) | Natural heat dissipation outdoor cabinet | |
| CN204532518U (en) | Engine water outlet room | |
| CN110435130A (en) | Electronic cooling heat pipe-type 3D printing thermostat | |
| CN208425897U (en) | A kind of aeration radiation system of automatic dish cooking machine | |
| CN209851524U (en) | High-efficient radiating temperature control equipment | |
| CN206709474U (en) | High efficiency refrigeratig freezer | |
| CN207744258U (en) | A kind of server babinet | |
| CN203413978U (en) | Water chilling unit | |
| CN210425721U (en) | Heat exhaust hood body in heat treatment process | |
| CN200995115Y (en) | Compressed-air drier | |
| CN220453923U (en) | Radiation air conditioner with internal and external heat radiation structure | |
| CN108297649A (en) | A kind of vehicle-mounted integral cup with air-cleaning function and heating and refrigerating function | |
| CN204367946U (en) | A kind of seat cushions extractor fan | |
| CN201116761Y (en) | Air-conditioning fan |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 510663 Guangzhou, Guangdong, Guangzhou hi tech Industrial Development Zone, Science City, 80 E third district. Patentee after: Guangzhou Maple regenerative medicine Polytron Technologies Inc Address before: 510663 Guangzhou District, Guangdong, new high tech Industrial Development Zone, Science City, 80 E third district. Patentee before: Medprin Regenerative Medical Technologies Co., Ltd. |
|
| CP03 | Change of name, title or address |