CN207267116U - A kind of integrated laser processing unit (plant) - Google Patents
A kind of integrated laser processing unit (plant) Download PDFInfo
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- CN207267116U CN207267116U CN201721124098.7U CN201721124098U CN207267116U CN 207267116 U CN207267116 U CN 207267116U CN 201721124098 U CN201721124098 U CN 201721124098U CN 207267116 U CN207267116 U CN 207267116U
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- speculum
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- optical path
- cutting head
- reflecting assembly
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Abstract
The utility model discloses a kind of integrated laser processing unit (plant), which includes：Optical path converter, galvanometer system, reflecting assembly and the cutting head system that combination installation is integrated；The optical path converter is coaxially disposed in the horizontal direction with galvanometer system, the reflecting assembly is located at below the optical path converter, the cutting head system is located at below the reflecting assembly, laser carries out light path switching after injecting the optical path converter, laser after light path switching enters the galvanometer system, projected under the action of the galvanometer system and laser marking is carried out on the workpiece surface to be added of lower section, or entered after cutting head system focuses on to project through reflex by reflecting assembly and be cut by laser on the workpiece surface to be added.It is simple in structure, cost is greatly saved, while the Fast Labeling function of galvanometer marking machine is realized, and had the requirement to a wide range of high-quality slot of laser cutting machine concurrently completely, improve the efficiency of Product processing.
Description
Technical field
It the utility model is related to technical field of laser processing, more particularly to a kind of integrated laser processing unit (plant).
Background technology
Existing laser cutting machine and laser marking machine are the two kinds of different type of machines independently to work.
After the laser beam line focus system that laser marking machine usually comes out laser work to be processed is projected with galvanometer
So as to fulfill marking function on part, for galvanometer movement velocity up to 8000-10000mm/s, labeling effciency is high, but is subject to structure shadow
Ring, mark scope and image distance are limited, and lines are not fine during a wide range of large format mark, notch out-of-flatness, using being subject to more limit
System.
Laser cutting machine be by laser come out laser beam through reflection and focusing system (cutting head) project it is to be processed
Workpiece is cut on workpiece, the work such as line, speculum and cutting head can carry out three-dimensional (XYZ) feeding fortune on guide rail
It is dynamic, cutting and the mark of a wide range of large format can be carried out, but the rotating speed limitation for being limited by motor can not possibly be as galvanometer mark
System is equally flexibly quick, inefficient in terms of small range mark.
In process of the present invention is realized, inventor has found that at least there are the following problems in the prior art：Laser cutting machine and
Laser marking machine is respectively present limitation in laser processing procedure.
Utility model content
In order to overcome the shortcomings of Related product in the prior art, the utility model proposes a kind of processing of integrated laser to fill
Put, laser cutting and laser marking function are combined, solve laser cutting machine and laser marking machine and individually carrying out laser
There are the problem of limitation during processing.
The utility model provides a kind of integrated laser processing unit (plant), including：The light path converting that combination installation is integrated
Device, galvanometer system, reflecting assembly and cutting head system, the optical path converter, galvanometer system, reflecting assembly and cutting head
System is generally aligned in the same plane in vertical direction；The optical path converter is coaxially disposed in the horizontal direction with galvanometer system, institute
State reflecting assembly to be located at below the optical path converter, the cutting head system is located at below the reflecting assembly, and laser is injected
Light path switching is carried out after the optical path converter, the laser after light path switching enters the galvanometer system, in the galvanometer system
Under the action of project and carry out laser marking on the workpiece surface to be added of lower section, or entered by reflecting assembly through reflex and cut
Cut to project after head system focuses on and be cut by laser on the workpiece surface to be added.
As further improvement of the utility model, the reflecting assembly includes the reflection as be arranged in parallel two
Mirror, the first speculum and the second speculum, wherein, first speculum is located at below the optical path converter, and described second
Speculum is above the cutting head system.
As further improvement of the utility model, height that the surface of first speculum and the second speculum is coated with
The film layer of reflection, and horizontal by 45° angle.
As further improvement of the utility model, when the reflecting assembly is except including above-mentioned first speculum and second
Outside speculum, the speculum as two is further included, when the 3rd speculum and four speculums, the optical path converter, shake
Mirror system, reflecting assembly and cutting head system are not at same plane in vertical direction, and first speculum and
The position of second speculum corresponds to adjustment angle and position according to the 3rd speculum and the 4th speculum.
As further improvement of the utility model, first speculum is located at below the optical path converter, described
3rd speculum is located at sustained height and positioned at the right side of first speculum, the 4th reflection with first speculum
Mirror is located at the top of the 3rd speculum, and the 4th speculum and second speculum are located at sustained height, and described the
Two-mirror is above the cutting head system；3rd speculum and the 4th speculum are horizontal by 45° angle；
First speculum is generally aligned in the same plane in vertical direction with the optical path converter and galvanometer system, second reflection
Mirror, the 3rd speculum, the 4th speculum and cutting head system are located at another plane in vertical direction.
Compared with prior art, the utility model has the advantage that：
The laser integral processing apparatus is by by optical path converter, galvanometer system, reflecting assembly and cutting head
System is integrally mounted, and light path is switched over by optical path converter, laser is arrived separately at galvanometer system and cutting head
System performs mark or cutting function, simple in structure, is greatly saved cost, while realizes the quick mark of galvanometer marking machine
Cite sb. for meritorious service can, and had the requirement to a wide range of high-quality slot of laser cutting machine concurrently completely, improved the efficiency of Product processing.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the utility model, will make below to required in embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the utility model,
For those of ordinary skill in the art, without creative efforts, can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is a horizontal side structure schematic view of laser integrated laser processing unit (plant) described in the utility model；
Fig. 2 is another horizontal side structure schematic view of laser integral processing apparatus described in the utility model；
Fig. 3 is the corresponding longitudinal side structure schematic views of Fig. 2.
Description of reference numerals：100- optical path converters；200- galvanometer systems；300- reflecting assemblies；The first speculums of 301-；
The second speculums of 302-；The 3rd speculums of 303-；The 4th speculums of 304-；400- cuts head system.
Embodiment
It is real below in conjunction with the utility model in order to make those skilled in the art more fully understand the utility model
The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described.Obviously, it is described
Embodiment is only the utility model part of the embodiment, instead of all the embodiments, the utility model is given in attached drawing
Preferred embodiment.The utility model can be realized in many different forms, however it is not limited to embodiment described herein,
On the contrary, the purpose for providing these embodiments is the understanding more thorough and comprehensive made to the disclosure of the utility model.It is based on
Embodiment in the utility model, those of ordinary skill in the art are obtained all without creative efforts
Other embodiment, shall fall within the protection scope of the present invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood implication of technical staff in domain is identical.It is simply in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.The specification and right of the utility model will
Ask the term " comprising " and " having " in book and above-mentioned attached drawing and their any deformations, it is intended that cover non-exclusive bag
Contain.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the utility model., which there is the phrase, in each position in the description to be each meant
Identical embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art are explicit
Ground and implicitly understand, embodiment described herein can be combined with other embodiments.
As shown in fig.1, the integrated laser processing unit (plant) include combination installation be integrated optical path converter 100,
Galvanometer system 200, reflecting assembly 300 and cutting head system, the optical path converter 100 is with galvanometer system 200 in level side
It is coaxially disposed upwards, the reflecting assembly 300 is positioned at the lower section of optical path converter 100, and the cutting head system is positioned at described
The lower section of reflecting assembly 300, laser is injected the optical path converter 100 and carries out light path switching by laser light source, after light path switching
Laser enters the galvanometer system 200, and the workpiece surface to be added that lower section is projected under the action of the galvanometer system 200 is enterprising
Row laser marking, or entered by reflecting assembly 300 through reflex after cutting head system focuses on and project the workpiece to be added
It is cut by laser on surface.
It is the horizontal side view structure of laser integral processing apparatus described in the utility model in the utility model embodiment
Schematic diagram, the optical path converter 100, galvanometer system 200, reflecting assembly 300 and cutting head system position in vertical direction
In same plane；The reflecting assembly 300 includes the speculum as be arranged in parallel two, the first speculum 301 and second
Speculum 302, the film layer for the high reflection that the surface of 301 and second speculum 302 of the first speculum is coated with, and with level
Face is in 45° angle, wherein, first speculum 301 is positioned at the lower section of optical path converter 100, second speculum 302
Above the cutting head system, laser is anti-by described first successively after the optical path converter 100 carries out light path switching
The cutting head system is reached after penetrating the reflex of 301 and second speculum 302 of mirror, the cutting head system is to the laser
Project after focusing and be cut by laser on the workpiece surface to be added.
It is respectively laser described in the utility model refering to shown in Fig. 2 and Fig. 3 in another embodiment of the utility model
The horizontal side structure schematic view of integral processing apparatus and longitudinal side structure schematic view, the optical path converter 100, shake
Mirror system 200, reflecting assembly 300 and cutting head system are not at same plane in vertical direction；The reflecting assembly
300 in addition to including above-mentioned first speculum, 301 and second speculum 302, further includes the speculum as two, the 3rd reflection
303 and the 4th speculum 304 of mirror, the 3rd speculum 303 and the 4th speculum 304 horizontal by 45° angle, its
In, the position of 301 and second speculum 302 of the first speculum is right according to the 3rd speculum 303 and the 4th speculum 304
Angles and positions should be have adjusted, specifically, first speculum 301 is located at below the optical path converter 100, the described 3rd
Speculum 303 and first speculum 301 be located at sustained height and are located at the right side of first speculum 301, and described the
Four speculums 304 are located at the top of the 3rd speculum 303, the 4th speculum 304 and second speculum 302
In sustained height, second speculum 302 above the cutting head system, laser through the optical path converter 100 into
Successively by first speculum 301, the 3rd speculum 303, the 4th speculum 304 and the second reflection after the switching of row light path
The cutting head system is reached after the reflex of mirror 302, the cutting head system projects described after being focused on to the laser
It is cut by laser on workpiece surface to be added；First speculum 301 and the optical path converter 100 and galvanometer system 200
It is generally aligned in the same plane, second speculum 302, the 3rd speculum 303, the 4th speculum 304 and cuts in vertical direction
Cut head system and be located at another plane in vertical direction.
Optionally, in some cases, the 3rd speculum 303 can also be located at a left side for first speculum 301
Side, the 4th speculum 304 can also be located at the lower section of the 3rd speculum 303 accordingly, according to the actual requirements can be with
Voluntarily adjust the position of each speculum.
Optionally, in the case where the reflection angle of each speculum of holding is constant, second speculum 302 and cutting
Head system can adjust position according to the actual requirements without changing actual functional capability as a whole.
In the utility model embodiment, the laser integral processing apparatus is by by optical path converter 100, galvanometer
System 200, reflecting assembly 300 and cutting head system are integrally mounted, and light path is switched over by optical path converter 100,
Laser is set to arrive separately at galvanometer system 200 and the execution mark of cutting head system or cutting function, it is simple in structure, greatly save
Cost, while realize the Fast Labeling function of galvanometer marking machine, and had concurrently completely to a wide range of excellent of laser cutting machine
The requirement of matter slot, improves the efficiency of Product processing.
In above-described embodiment provided by the utility model, it should be understood that the mould illustrated as separating component
Block may or may not be physically separate, you can with positioned at a place, or can also be distributed to multiple positions
Put.It can select therein some or all of to realize the purpose of this embodiment scheme according to the actual needs.
It these are only the embodiment of the utility model, be not intended to limit the scope of the claims of the utility model, although with reference to before
State embodiment the utility model is described in detail, for those skilled in the art comes, it still can be right
Technical solution described in foregoing each embodiment is modified, or carries out equivalent replace to which part technical characteristic
Change.Every equivalent structure done using the utility model specification and accompanying drawing content, it is related to be directly or indirectly used in other
Technical field, similarly within the utility model patent protection domain.
Claims (5)
- A kind of 1. integrated laser processing unit (plant), it is characterised in that including：Optical path converter, the galvanometer that combination installation is integrated System, reflecting assembly and cutting head system, the optical path converter, galvanometer system, reflecting assembly and cutting head system exist It is generally aligned in the same plane in vertical direction；The optical path converter is coaxially disposed in the horizontal direction with galvanometer system, and the reflecting assembly is located at the light path converting Below device, the cutting head system is located at below the reflecting assembly, and progress light path is cut after laser injects the optical path converter Change, the laser after light path switching enters the galvanometer system, and the to be processed of lower section is projected under the action of the galvanometer system Laser marking is carried out on part surface, or is entered by reflecting assembly through reflex after cutting head system focuses on and projects described treat It is cut by laser in work piece surface.
- 2. integrated laser processing unit (plant) according to claim 1, it is characterised in that：The reflecting assembly includes parallel set The speculum as two put, the first speculum and the second speculum, wherein, first speculum is located at the light path and turns Below parallel operation, second speculum is above the cutting head system.
- 3. integrated laser processing unit (plant) according to claim 2, it is characterised in that：First speculum and second anti- The film layer for the high reflection that the surface of mirror is coated with is penetrated, and horizontal by 45° angle.
- 4. integrated laser processing unit (plant) according to claim 3, it is characterised in that：When the reflecting assembly except including Outside above-mentioned first speculum and the second speculum, the speculum as two, the 3rd speculum and the 4th speculum are further included When, the optical path converter, galvanometer system, reflecting assembly and cutting head system are not at same flat in vertical direction Face, and the position of first speculum and the second speculum corresponds to according to the 3rd speculum and the 4th speculum and adjusts the angle And position.
- 5. integrated laser processing unit (plant) according to claim 4, it is characterised in that：First speculum is positioned at described Below optical path converter, the 3rd speculum is located at sustained height and is located at first speculum with first speculum Right side, the 4th speculum is located at the top of the 3rd speculum, the 4th speculum and second speculum Positioned at sustained height, second speculum is above the cutting head system；3rd speculum and the 4th reflection Mirror is horizontal by 45° angle；First speculum is generally aligned in the same plane in vertical direction with the optical path converter and galvanometer system, and described second Speculum, the 3rd speculum, the 4th speculum and cutting head system are located at another plane in vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721124098.7U CN207267116U (en) | 2017-09-04 | 2017-09-04 | A kind of integrated laser processing unit (plant) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721124098.7U CN207267116U (en) | 2017-09-04 | 2017-09-04 | A kind of integrated laser processing unit (plant) |
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| Publication Number | Publication Date |
|---|---|
| CN207267116U true CN207267116U (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721124098.7U Active CN207267116U (en) | 2017-09-04 | 2017-09-04 | A kind of integrated laser processing unit (plant) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378284A (en) * | 2018-10-24 | 2019-02-22 | 京东方科技集团股份有限公司 | Laser equipment and its working method |
| CN113146062A (en) * | 2020-01-03 | 2021-07-23 | 星云电脑股份有限公司 | Laser integrated switching device |
| CN113284981A (en) * | 2021-05-17 | 2021-08-20 | 白四方 | Nondestructive cutting equipment and process for silicon and silicon-based semiconductor wafer |
-
2017
- 2017-09-04 CN CN201721124098.7U patent/CN207267116U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378284A (en) * | 2018-10-24 | 2019-02-22 | 京东方科技集团股份有限公司 | Laser equipment and its working method |
| CN109378284B (en) * | 2018-10-24 | 2020-11-17 | 京东方科技集团股份有限公司 | Laser device and working method thereof |
| CN113146062A (en) * | 2020-01-03 | 2021-07-23 | 星云电脑股份有限公司 | Laser integrated switching device |
| CN113284981A (en) * | 2021-05-17 | 2021-08-20 | 白四方 | Nondestructive cutting equipment and process for silicon and silicon-based semiconductor wafer |
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