CN207252077U - Glass back cover and electronic equipment - Google Patents
Glass back cover and electronic equipment Download PDFInfo
- Publication number
- CN207252077U CN207252077U CN201721232828.5U CN201721232828U CN207252077U CN 207252077 U CN207252077 U CN 207252077U CN 201721232828 U CN201721232828 U CN 201721232828U CN 207252077 U CN207252077 U CN 207252077U
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- CN
- China
- Prior art keywords
- back cover
- glass back
- glass
- electronic equipment
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The embodiment of the present application discloses a kind of glass back cover and electronic equipment, the glass back cover is used to connect to form confined space with the protecgulum group of electronic equipment, including the inner surface in face of the confined space and the outer surface opposite with the inner surface, thermal insulation layer is provided with the inner surface, through the above way, the application can effectively reduce conduction to the heat in glass back cover, so as to avoid glass back cover from producing larger temperature rise.
Description
Technical field
This application involves electronic technology field, and in particular to a kind of glass back cover and electronic equipment.
Background technology
The electronic equipments such as mobile phone, tablet increasingly become essential articles for daily use in people's life.Conditional electronic is set
Standby cell rear cover is typically to be formed using plastics or metal material, but the easy aging of the cell rear cover of plastic material and is fallen
Color, metal back cover then easily have an impact aerial signal, and the appearance of glass battery cover solves conventional batteries lid institute well
The problem of bringing.Aging is neither easy using the cell rear cover of glass material to fade, aerial signal will not be had an impact, more
More to be welcome be subject to each electronic equipment manufacturer.
Glass battery cover is usually mutually close with the heater element (such as battery, circuit components) of electronic equipment internal,
Cause the heat that heater element distributes to conduct to glass battery to cover, however, the heat conductivility of glass is usually poor, work as glass
Having heat to concentrate on battery cover can cause the temperature rising of glass battery cover larger, be broken automatically so as to be easy to cause glass battery cover
Split, certain threat can be caused to the safety of user.
Utility model content
The embodiment of the present application provides a kind of glass back cover and electronic equipment, can effectively reduce conduction to glass back cover
Heat, so as to avoid glass back cover from producing larger temperature rise, improves the security of glass back cover.
The embodiment of the present application provides a kind of glass back cover, is connect for the protecgulum group with electronic equipment to form confined space,
The glass back cover includes the inner surface and the outer surface opposite with the inner surface in face of the confined space, the interior table
Thermal insulation layer is provided with face.
The embodiment of the present application also provides a kind of electronic equipment, including protecgulum and glass back cover, the protecgulum and glass back cover
Group connects to form confined space with accommodating electric element, and the glass back cover is glass back cover described above.
In the glass back cover of the application, it is used to connect to form confined space with the protecgulum group of electronic equipment, after the glass
Lid includes the inner surface and the outer surface opposite with the inner surface in face of confined space, wherein, thermal insulation layer is provided with inner surface,
Therefore this programme sets thermal insulation layer by the inner surface in glass back cover, so as to obstruct the heater element of electronic equipment internal
The heat of generation is conducted to glass back cover, conduction can be effectively reduced to the heat in glass back cover, so that after avoiding glass
Lid produces larger temperature rise, improves the security of glass back cover.
Brief description of the drawings
In order to illustrate more clearly of the technical solution in the embodiment of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is a structure diagram of electronic equipment provided by the embodiments of the present application.
Fig. 2 is another structure diagram of electronic equipment provided by the embodiments of the present application.
Fig. 3 is a structure diagram of glass back cover provided by the embodiments of the present application.
Fig. 4 is another structure diagram of glass back cover provided by the embodiments of the present application.
Fig. 5 is the another structure diagram of glass back cover provided by the embodiments of the present application.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, the technical solution in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained without creative efforts
Example, shall fall in the protection scope of this application.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, can also be by between intermediary
Connect connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component and setting of specific examples are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of glass back cover and electronic equipment, and wherein electronic equipment can be specifically mobile phone, put down
Plate computer or, palm PC (Personal Digital Assistant, PDA) etc..It will be described in detail respectively below.
Refering to Fig. 1, Fig. 1 is the structure diagram of electronic equipment provided by the embodiments of the present application.The electronic equipment 100 includes
Housing 10, display screen 20, printed circuit board 30 and battery 40.
Wherein, which can include protecgulum 11, center 12 and glass back cover 13, after protecgulum 11, center 12 and glass
Lid 13 is mutually combined to form the housing 10, which has connects the confined air to be formed by 13 groups of protecgulum 11 and glass back cover
Between, to accommodate the electronic components such as display screen 20, printed circuit board 30, battery 40.In certain embodiments, during the lid of protecgulum 11 is set to
On frame 12, the lid of glass back cover 13 is set on center 12, and protecgulum 11 and glass back cover 13 are located at the opposite face of center 12,11 He of protecgulum
Glass back cover 13 is oppositely arranged, and the confined space of housing 10 is between protecgulum 11 and glass back cover 13.
In certain embodiments, center 12 can be metal shell.It should be noted that the embodiment of the present application housing 10
Material is not limited to this, and can also use other manner, such as：Center 12 can include plastic portions and metal part.Compare again
Such as：Center 12 can be plastic casing.Also such as：Center 12 can be the shell structure that metal and plastic cement cooperate.Wherein,
Protecgulum 11 can be transparent glass cover plate.In some embodiments, protecgulum 11 can be made of materials such as sapphires
Glass cover-plate.
Wherein, which installs in the housing 10, which can be the master of electronic equipment 100
Plate, can be integrated with the work(such as motor, microphone, camera, light sensor, receiver and processor on printed circuit board 30
Can component.
In certain embodiments, which is fixed in housing 10.Specifically, the printed circuit board 30 can be with
It is screwed on center 12, card can also be fitted on by the way of buckle on center 12 by screw.It should be noted that the application
The mode that embodiment printed circuit board 30 is specifically fixed on center 12 is not limited to this, can be with other manner, for example is passed through
The mode that buckle and screw are fixed jointly.
Wherein, which installs in the housing 10, and battery 40 is electrically connected with the printed circuit board 30, with to electronics
Equipment 100 provides power supply.Glass back cover 13 can be as the battery cover of battery 40.Glass back cover 13 covers battery 40 to protect electricity
Pond 40, reduces collision, the damage falling etc. and be subject to of the battery 40 due to electronic equipment 100.
Wherein, which installs in the housing 10, meanwhile, which is electrically connected on printed circuit board 30,
To form the display surface of electronic equipment 100.The display screen 20 includes display area 111 and non-display area 112.The display area
111 can be used for showing the picture of electronic equipment 100 or carry out touching manipulation etc. for user.The top of the non-display area 112
Portion region opens up the perforate for sound and light conduction, and fingerprint module, touch-control can be set on 112 bottom of non-display area
The functional units such as button.Wherein the protecgulum 11 is installed on display screen 20, to cover display screen 20, is formed identical with display screen 20
Display area and non-display area, specifically can refer to display screen 20 display area and non-display area.
It should be noted that the structure of the display screen 20 is not limited to this.For example the display screen can be comprehensive screen or different
Property screen, specifically, referring to Fig. 2, Fig. 2 be electronic equipment provided by the embodiments of the present application another structure diagram.In Fig. 2
Electronic equipment in electronic equipment and Fig. 1 difference lies in：The non-display area is formed directly on display screen 20, such as aobvious
The non-display area of display screen 20 is arranged to transparent configuration, so that optical signal passes through, or directly in the non-display area of display screen 20
Domain is opened up for structures such as the perforate of light conduction or notches, can be arranged at front camera, photoelectric sensor etc. non-display
Regional location, so that front camera is taken pictures, photoelectric sensor detects.
Refering to Fig. 3, Fig. 3 is a structure diagram of glass back cover 13 provided by the embodiments of the present application.Wherein glass back cover
13 connect to form confined space with 11 groups of the protecgulum of electronic equipment 100.As shown in the figure, glass back cover 13 is included in face of confined space
Inner surface 131 and the outer surface 132 opposite with the inner surface 131.Wherein, thermal insulation layer 300 is provided with inner surface 131.This reality
Example is applied, by setting thermal insulation layer 300, the printed circuit board 30 in confined space and the production of the grade of battery 40 component can be obstructed
Raw heat, greatly reduces conduction to the heat in glass back cover 13, it is possible thereby to avoid glass back cover 13 from producing larger temperature rise,
So as to reduce the risk that glass back cover 13 bursts, the security of glass back cover 13 is improved.
In some embodiments, thermal insulation layer 300 can be the thermal insulation board that glass fiber material is formed, and glass fibre has
Higher heat-proof quality, so as to preferably stop heat transfer to glass back cover 13.In other embodiments, thermal insulation layer
300 can also be the thermal insulation board that the other materials such as foam or asbestos are formed, this is not limited.Wherein, thermal insulation board can pass through
Glue, which is pasted, to be fixed on the inner surface 131 of glass back cover 13, which for example can be heat conductive silica gel, or can also pass through
The mode of injection is integrally formed with glass back cover 13.
In other embodiments, thermal insulation layer 300 can also be heat insulating coat.Wherein, which for example can be with
It is nano-stannic oxide heat insulating coat or ceramic heat insulating coating etc..Heat insulating coat can be by way of smearing in glass back cover
Formed, or can also be sprayed heat-proof coating material after glass by modes such as plasma sprayings on 13 inner surface 131
On the inner surface 131 of lid 13.
As shown in figure 4, in another embodiment of the application, further, the inside of glass back cover 13 is hollow structure,
The inside of the glass back cover 13 has a hollow cavity 133.Wherein, in a kind of possible implementation, the hollow cavity 133
For the hollow cavity of vacuum, i.e. the hollow cavity 133 passes through vacuumize process, can be with from there through the hollow cavity 133 of vacuum
The heat insulation of glass back cover 13 is further improved, further reduces conduction to the heat on glass outer.
In alternatively possible implementation, filling heat-conducting gas, such as heat conduction are can also be in the hollow cavity 133
The higher helium of coefficient or argon gas etc., or can also be air.By filling high heat conduction gas in hollow cavity 133,
With the temperature of uniform glass rear cover 13 heat can be avoided to concentrate on some position of glass back cover 13 and cause the temperature of the position
Rise it is larger, so as to reduce glass back cover 13 occur explosion equivalent risk.
In the present embodiment, doped with high thermal conductivity coefficient particle 134 in glass back cover 13, i.e. glass back cover 13 can be passed through
It is made doped with the glass material of high thermal conductivity coefficient particle 134.The high thermal conductivity coefficient particle 134 for example can be metal ion,
Metal oxide particle, boron nitride or carbon nanotubes, etc., and high thermal conductivity coefficient particle can be a kind of grain of material
The combination of son or the particle of unlike material, does not limit this.By adulterating high thermal conductivity coefficient in glass back cover 13
Particle 134, can cause glass back cover 13 that there is high-termal conductivity, be conducive to improve glass back cover 13 heat dissipation performance so that
Heat in glass back cover 13 faster dissipates, and can effectively reduce the temperature of glass back cover 13.
As shown in figure 5, in the another embodiment of the application, heat dissipating layer is provided with the outer surface 132 of glass back cover 13
135, which for example can be heat conduction silicone, and dissipating for glass back cover 13 can be further improved using the heat dissipating layer 135
Hot property, and can play a protective role to glass back cover 13.
Alternatively, cooling ring 136 can also be surrounded with the surrounding of glass back cover 13, after which forms glass
The outer rim of lid 13, thus when the glass back cover 13 lid is set to the center 12 of electronic equipment 100, passes through the cooling ring 136
It is connected with center 12, so that using cooling ring 136 can quickly conduction be to center 12 by the heat in glass back cover 13, to utilize
Center 12 radiates, and can further improve the heat dissipation performance of glass back cover 13, effectively reduces the temperature of glass back cover 13.
It will be understood by those skilled in the art that the structure of Fig. 1 and electronic equipment shown in Figure 2 100 is not formed to electricity
The restriction of sub- equipment 100.Electronic equipment 100 can include components more more or fewer than diagram, or some components of combination, or
The different component arrangement of person.Electronic equipment 100 can also include processor, memory, bluetooth module etc., and details are not described herein.
In conclusion glass back cover provided by the embodiments of the present application, heat-insulated by the inner surface setting one in glass back cover
Layer, conducts to glass back cover so as to obstruct heat caused by the heater element of electronic equipment internal, efficiently reduces
The heat being transferred in glass back cover, so as to avoid glass back cover from producing larger temperature rise, improves the safety of glass back cover
Property.
Although the application, those skilled in the art have shown and described relative to one or more implementations
Based on the reading to the specification and drawings and understand it will be appreciated that equivalent variations and modification.The application includes all such repair
Change and modification, and be limited only by the scope of the following claims.In particular, to the various functions performed by said modules, use
Being intended to correspond to the specified function of performing the component in the term of component as description, (such as it is functionally of equal value
) random component (unless otherwise instructed), with performing the exemplary realization of this specification shown in this article in structure
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to some realization sides
Only one in formula is disclosed, but this feature can with as can be it is expected and favorably for given or application-specific
Other one or more combinations of features of other implementations.Moreover, with regard to term " comprising ", " having ", " containing " or its deformation
For being used in embodiment or claim, such term is intended to the bag in a manner of similar to term "comprising"
Include.
In conclusion although the application is disclosed above with preferred embodiment, above preferred embodiment simultaneously is not used to limit
The application processed, those of ordinary skill in the art, are not departing from spirit and scope, can make various changes and profit
Decorations, therefore the protection domain of the application is subject to the scope that claim defines.
Claims (10)
1. a kind of glass back cover, connects to form confined space, it is characterised in that the glass for the protecgulum group with electronic equipment
Rear cover includes the inner surface and the outer surface opposite with the inner surface in face of the confined space, is set on the inner surface
There is thermal insulation layer.
2. glass back cover according to claim 1, it is characterised in that the thermal insulation layer for glass fiber material formed every
Hot plate.
3. glass back cover according to claim 2, it is characterised in that the thermal insulation board pasted by glue be fixed on it is described
On the inner surface of glass back cover.
4. glass back cover according to claim 1, it is characterised in that the thermal insulation layer is heat insulating coat.
5. glass back cover according to claim 1, it is characterised in that the inside of the glass back cover has hollow cavity,
The hollow cavity is the hollow cavity of vacuum.
6. glass back cover according to claim 1, it is characterised in that the inside of the glass back cover has hollow cavity,
Heat-conducting gas is filled with the hollow cavity.
7. the glass back cover according to claim 5 or 6, it is characterised in that doped with high heat conduction system in the glass back cover
Several particles.
8. glass back cover according to claim 1, it is characterised in that be provided with heat dissipating layer on the outer surface.
9. glass back cover according to claim 1, it is characterised in that the surrounding of the glass back cover is surrounded with cooling ring simultaneously
Form the outer rim of the glass back cover.
10. a kind of electronic equipment, it is characterised in that including protecgulum and glass back cover, the protecgulum and glass back cover group connect to be formed
For confined space with accommodating electric element, the glass back cover is such as claim 1-9 any one of them glass back covers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721232828.5U CN207252077U (en) | 2017-09-22 | 2017-09-22 | Glass back cover and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721232828.5U CN207252077U (en) | 2017-09-22 | 2017-09-22 | Glass back cover and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207252077U true CN207252077U (en) | 2018-04-17 |
Family
ID=61886910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721232828.5U Expired - Fee Related CN207252077U (en) | 2017-09-22 | 2017-09-22 | Glass back cover and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207252077U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110683861A (en) * | 2018-07-04 | 2020-01-14 | 辽宁爱尔创科技有限公司 | Fiber-reinforced electronic equipment back plate and preparation method thereof |
| CN111106447A (en) * | 2018-10-26 | 2020-05-05 | 泰科电子(上海)有限公司 | Electronic device |
| WO2023023461A1 (en) * | 2021-08-19 | 2023-02-23 | Motorola Solutions, Inc. | Portable radio with thermal insulation barrier |
-
2017
- 2017-09-22 CN CN201721232828.5U patent/CN207252077U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110683861A (en) * | 2018-07-04 | 2020-01-14 | 辽宁爱尔创科技有限公司 | Fiber-reinforced electronic equipment back plate and preparation method thereof |
| CN111106447A (en) * | 2018-10-26 | 2020-05-05 | 泰科电子(上海)有限公司 | Electronic device |
| WO2023023461A1 (en) * | 2021-08-19 | 2023-02-23 | Motorola Solutions, Inc. | Portable radio with thermal insulation barrier |
| US11714308B2 (en) | 2021-08-19 | 2023-08-01 | Motorola Solutions, Inc. | Portable radio with thermal insulation barrier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180417 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |