CN207233005U - A kind of heat safe RFID trademarks of thermal transfer - Google Patents
A kind of heat safe RFID trademarks of thermal transfer Download PDFInfo
- Publication number
- CN207233005U CN207233005U CN201721212096.3U CN201721212096U CN207233005U CN 207233005 U CN207233005 U CN 207233005U CN 201721212096 U CN201721212096 U CN 201721212096U CN 207233005 U CN207233005 U CN 207233005U
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- China
- Prior art keywords
- layer
- coating
- trademarks
- thermal transfer
- thermal insulation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model discloses a kind of thermal transfer high temperature resistant RFID trademarks; including protective layer, printing layer, coating and printing ink layer and the hot melt adhesive layer being arranged in order from top to bottom; RFID tag is equipped with the coating and printing ink layer, further includes thermal insulation layer, the thermal insulation layer is arranged on the periphery of the RFID tag.The thickness of the thermal insulation layer is 0.1 0.4mm.0.02 0.03 Wa meter Kai of thermal conductivity factor of the thermal insulation layer.The utility model can effectively protect RFID tag so that it is not damaged during thermal transfer and when laundry is dried by high temperature, substantially increases the qualification rate of product.
Description
Technical field
It the utility model is related to the technical field of trademark, more particularly to a kind of thermal transfer high temperature resistant RFID trade mark marks
Know.
Background technology
RFID radio frequency identifications are a kind of contactless automatic identification technologies, it passes through radiofrequency signal automatic identification target pair
As and obtain related data, identification work is operable with various adverse circumstances without manual intervention.At present, RFID radio frequency identifications
Have been widely used for hotel, bank, hospital and enterprises and institutions of government.
In order to embody the different brands of clothes, all need to be stained with trademark on clothes, at present, print the aspect of trademark
Frequently with thermal transfer, in addition to realizing the logistics management of clothes, many enterprises can set RFID to mark on the products such as clothes
Label, since RFID tag has one-to-one characteristic, greatly facilitate logistics management, reduce needed for logistics management into
This.In the prior art, the trademark with RFID tag easily fails in an environment of high temperature, such as in thermal transfer process
In or in drying course of doing washing.
In view of this, the present inventor studies and devises a kind of thermal transfer high temperature resistant RFID trademarks, thus this case is produced
It is raw.
Utility model content
The purpose of this utility model is to provide a kind of thermal transfer high temperature resistant RFID trademarks, by setting thermal insulation layer to protect
RFID tag is protected, makes it have heat safe effect.
To achieve these goals, the technical scheme in the invention for solving the technical problem is：
A kind of thermal transfer high temperature resistant RFID trademarks, including protective layer, printing layer, the coating being arranged in order from top to bottom
Ink layer and hot melt adhesive layer, are equipped with RFID tag in the coating and printing ink layer, further include thermal insulation layer, and the thermal insulation layer is arranged on described
The periphery of RFID tag.
As the preferred embodiment of embodiment, the thickness of the thermal insulation layer is 0.1-0.4mm.
As the preferred embodiment of embodiment, the thermal conductivity factor 0.02-0.03 Wa meter Kai of the thermal insulation layer.
As the preferred embodiment of embodiment, fluorescence coating is further included, the fluorescence coating is arranged on the printing layer and the coating
Between ink layer.
As the preferred embodiment of embodiment, further include adhesion layer, the adhesion layer be arranged on the coating and printing ink layer with it is described
Between hot melt adhesive layer.
Since a kind of thermal transfer high temperature resistant RFID trademarks of the utility model employ above-mentioned technical solution, that is, include
Protective layer, printing layer, coating and printing ink layer and the hot melt adhesive layer being arranged in order from top to bottom, are equipped with RFID in the coating and printing ink layer
Label, further includes thermal insulation layer, and the thermal insulation layer is arranged on the periphery of the RFID tag so that the utility model can be protected effectively
RFID tag so that it is not damaged during thermal transfer and when laundry high temperature is dried, and substantially increases the qualification rate of product.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is structure diagram of the utility model with fluorescence coating；
Fig. 3 is structure diagram of the utility model with adhesion layer.
Embodiment
Embodiment 1
As shown in Figure 1, the utility model discloses a kind of thermal transfer high temperature resistant RFID trademarks, including from top to bottom according to
Protective layer 1, printing layer 2, coating and printing ink layer 3 and the hot melt adhesive layer 4 of secondary arrangement, are equipped with RFID tag in the coating and printing ink layer 3
5, the protective layer is PET film, further includes thermal insulation layer 6, the thermal insulation layer 6 is arranged on the periphery of the RFID tag 5, described heat-insulated
The thickness of layer 6 is 0.1-0.4mm, the thermal conductivity factor 0.02-0.03 Wa meter Kai of the thermal insulation layer 6.The material that the thermal insulation layer uses
Expect that there is ultralow thermal conductivity factor, relatively thin insulating thickness, work heatproof height for micro-nano thermal insulation board, micro- resistance to thermal insulation board.Thermal insulation layer
RFID tag can effectively be protected so that it is not damaged during thermal transfer and when laundry high temperature is dried.
Embodiment 2
As shown in Fig. 2, the utility model discloses a kind of thermal transfer high temperature resistant RFID trademarks, including from top to bottom according to
Protective layer 1, printing layer 2, coating and printing ink layer 3 and the hot melt adhesive layer 4 of secondary arrangement, are equipped with RFID tag in the coating and printing ink layer 3
5, thermal insulation layer 6 is further included, the thermal insulation layer 6 is arranged on the periphery of the RFID tag 5；Further include fluorescence coating 7, the fluorescence coating 7
Between the printing layer 2 and the coating and printing ink layer 3.Fluorescence coating can pass through clear area and the protective layer of printing layer, hair
Go out the effect of fluorescence, have the function that to show trademark under dark surrounds.
Embodiment 3
As shown in figure 3, the utility model discloses a kind of thermal transfer high temperature resistant RFID trademarks, including from top to bottom according to
Protective layer 1, printing layer 2, coating and printing ink layer 3 and the hot melt adhesive layer 4 of secondary arrangement, are equipped with RFID tag in the coating and printing ink layer 3
5, thermal insulation layer 6 is further included, the thermal insulation layer 6 is arranged on the periphery of the RFID tag 5；Further include adhesion layer 8, the adhesion layer 8
Between the coating and printing ink layer 3 and the hot melt adhesive layer 4.Adhesion layer can be further enhanced between trademark and clothing
Adhesive force, effectively prevent from causing the situation that trademark comes off to occur during laundry etc..
The above, is only the utility model preferred embodiment, therefore cannot limit the utility model implementation according to this
Scope, i.e., the equivalent changes and modifications made according to the utility model patent scope and description, it is new all should still to belong to this practicality
In the range of type covers.
Claims (5)
- A kind of 1. thermal transfer high temperature resistant RFID trademarks, it is characterised in that：Including be arranged in order from top to bottom protective layer, print Brush layer, coating and printing ink layer and hot melt adhesive layer, are equipped with RFID tag in the coating and printing ink layer, further include thermal insulation layer, described heat-insulated Layer is arranged on the periphery of the RFID tag.
- A kind of 2. thermal transfer high temperature resistant RFID trademarks as claimed in claim 1, it is characterised in that：The thickness of the thermal insulation layer Spend for 0.1-0.4mm.
- A kind of 3. thermal transfer high temperature resistant RFID trademarks as claimed in claim 1, it is characterised in that：The thermal insulation layer is led Hot coefficient 0.02-0.03 Wa meter Kai.
- A kind of 4. thermal transfer high temperature resistant RFID trademarks as claimed in claim 1, it is characterised in that：Further include fluorescence coating, The fluorescence coating is arranged between the printing layer and the coating and printing ink layer.
- A kind of 5. thermal transfer high temperature resistant RFID trademarks as claimed in claim 1, it is characterised in that：Further include adhesion layer, The adhesion layer is arranged between the coating and printing ink layer and the hot melt adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721212096.3U CN207233005U (en) | 2017-09-21 | 2017-09-21 | A kind of heat safe RFID trademarks of thermal transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721212096.3U CN207233005U (en) | 2017-09-21 | 2017-09-21 | A kind of heat safe RFID trademarks of thermal transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207233005U true CN207233005U (en) | 2018-04-13 |
Family
ID=61863216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721212096.3U Expired - Fee Related CN207233005U (en) | 2017-09-21 | 2017-09-21 | A kind of heat safe RFID trademarks of thermal transfer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207233005U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063253A (en) * | 2019-12-31 | 2020-04-24 | 晋江市深沪键升印刷有限公司 | Heat transfer trademark identification with built-in chip and manufacturing method thereof |
| TWI729359B (en) * | 2019-03-07 | 2021-06-01 | 香港商永道無線射頻標籤(香港)有限公司 | A thermal transfer rfid tag, the product thereof, and the method of manufacturing the same |
-
2017
- 2017-09-21 CN CN201721212096.3U patent/CN207233005U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI729359B (en) * | 2019-03-07 | 2021-06-01 | 香港商永道無線射頻標籤(香港)有限公司 | A thermal transfer rfid tag, the product thereof, and the method of manufacturing the same |
| CN111063253A (en) * | 2019-12-31 | 2020-04-24 | 晋江市深沪键升印刷有限公司 | Heat transfer trademark identification with built-in chip and manufacturing method thereof |
| CN111063253B (en) * | 2019-12-31 | 2022-03-22 | 晋江市深沪键升印刷有限公司 | Heat transfer trademark identification with built-in chip and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180413 Termination date: 20190921 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |