CN207223700U - Spacing abrasive disk and milling apparatus - Google Patents
Spacing abrasive disk and milling apparatus Download PDFInfo
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- CN207223700U CN207223700U CN201720666832.6U CN201720666832U CN207223700U CN 207223700 U CN207223700 U CN 207223700U CN 201720666832 U CN201720666832 U CN 201720666832U CN 207223700 U CN207223700 U CN 207223700U
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Abstract
The utility model provides a kind of spacing abrasive disk and milling apparatus, wherein, spacing abrasive disk, including：Mill main body；Multiple position limiting structures, are installed on mill main body, multiple position limiting structures with the center circumferential array of mill main body, wherein, each position limiting structure moves vertically relative to the end face of mill main body.Pass through the technical solution of the utility model, add the controllability of product, by the height for adjusting multiple position limiting structures, wafer can be smoothly fixed on spacing abrasive disk first, make the work surface of wafer parallel, it is then determined that processing thickness, multiple position limiting structures are adjusted successively, the work surface of wafer is set steadily to rise corresponding height value, finally start to process, enhance the controllability of process, reduce and process situation in uneven thickness, and then reduce sliver rate and scrappage, at the same time, reduce personnel's operating time, improve processing efficiency.
Description
Technical field
Semiconductor applications are the utility model is related to, in particular to a kind of spacing abrasive disk and a kind of milling apparatus.
Background technology
Since the substrate of wafer is there are resistance, fever phenomenon can be produced, therefore, in the manufacturing process of light receiving element
In, it is necessary to by reduction process by the certain thickness of wafer substrate thinning, reduce fever phenomenon to reduce resistance, improve light and connect
The performance of device is received, in correlation technique, since the flatness of mill in itself and the depth of parallelism be not high, to the bonding difficulty of wafer
Greatly, it is necessary to which repeated measurement seriously affects work efficiency with bonding, personnel's operating time and uncontrollable factor are added, it is impossible to effectively
Thickness thinning is controlled, the non-uniform problem of thickness thinning happens occasionally, and virtually adds sliver rate and scrappage.
Utility model content
The utility model is intended at least solve one of technical problem present in the prior art or correlation technique.
For this reason, a purpose of the utility model is to provide a kind of spacing abrasive disk.
Another purpose of the utility model is to provide a kind of milling apparatus.
To achieve the above object, the embodiment of the utility model first aspect provides a kind of spacing abrasive disk, including：Mill
Disc main body；Multiple position limiting structures, are installed on mill main body, multiple position limiting structures with the center circumferential array of mill main body, wherein,
Each position limiting structure moves vertically relative to the end face of mill main body.
In the technical scheme, by installing multiple position limiting structures in mill main body, and multiple position limiting structures are with mill master
The center circumferential array of body, each position limiting structure move vertically relative to the end face of mill main body, add the controllable of product
Property, by adjusting the height of multiple position limiting structures, wafer can be smoothly fixed in mill main body first, make wafer
Work surface it is parallel, it is then determined that processing thickness, adjust multiple position limiting structures successively, put down the work surface of wafer
Surely rise corresponding height value, finally start to process, enhance the controllability of process, it is in uneven thickness to reduce processing
Situation, and then sliver rate and scrappage are reduced, meanwhile, reduce personnel's operating time, improve processing efficiency.
In addition, the spacing abrasive disk in above-described embodiment provided by the utility model can also have following supplementary technology spy
Sign：
In the above-mentioned technical solutions, it is preferable that further include：Multiple mounting holes, the end of each mounting hole connection mill main body
Face and side, each position limiting structure correspond to and are installed on each mounting hole；Position limiting structure includes：Limited post；Fixing sleeve, is covered on mill
On the mounting hole of the end face of disc main body, and the end face of fixing sleeve is concordant with the end face of mill main body, the end face of fixing sleeve be equipped with
The matching hole that limited post coordinates；Adjustment pin, arranged on mounting hole, adjustment pin one end is arranged on the side of mill main body, adjustment pin
The other end is equipped with limited post, and adjustment pin adjusts the height of limited post.
In the technical scheme, by setting multiple mounting holes, and the end face and side of each mounting hole connection mill main body
Face, each position limiting structure correspond to and are installed on each mounting hole, position limiting structure be arranged in the mounting hole of mill main body, be not take up
Exterior space, reduces the appearance and size of spacing abrasive disk, enhances the practicality of spacing abrasive disk.
Wherein, fixing sleeve is covered on the mounting hole of the end face of mill main body, and the end face of fixing sleeve and mill main body
End face is concordant, improves the flatness of the mounting surface of spacing abrasive disk, wafer is smoothly fixed on spacing abrasive disk, limit
Position column coordinates with the matching hole on fixing sleeve end face so that limited post can do vertical fortune relative to the mounting surface of spacing abrasive disk
Dynamic, adjustment pin one end is arranged on the side of mill main body, and the other end is equipped with limited post, and limit can be adjusted by adjustment pin
The height of position column, limited post is adjusted to the position below the mounting surface of spacing abrasive disk by installation wafer before, then by micro-
Multiple limited posts are adjusted, improve the depth of parallelism of wafer, finally determines to need the thickness value processed, is adjusted by adjustment pin multiple
Limited post makes wafer rise corresponding height value, makes the wafer thickness after processing uniform, improves the controllable of process
Property.
In any of the above-described technical solution, it is preferable that further include：Limit protrusion, arranged on the side of limited post；Spring, set
On limited post, spring is between limit protrusion and fixing sleeve, in the case where spring does not stress, the external part of limited post
End face be less than fixing sleeve end face.
In the technical scheme, by the sheathed spring on limited post, spring between limit protrusion and fixing sleeve, and
In the case where spring does not stress, the end face of the external part of limited post is less than the end face of fixing sleeve, i.e., adjustment pin not with it is spacing
When column interacts, in limited post automatic rebounding to mounting hole, reduce the limited post situation Nian Jie with wafer, improve limit
The practicality of Bit Grinding disk.
In any of the above-described technical solution, it is preferable that further include：Guide frame, connection limited post and adjustment pin, work as adjusting
Sell to both sides rotate when, limited post moves vertically relative to the end face of fixing sleeve.
In the technical scheme, by setting guide frame, connection limited post and adjustment pin, the operability of product is improved
Can, guide frame is simple and reliable and stable, can make end face of the limited post relative to fixing sleeve when rotating adjustment pin to both sides
Move vertically, to adjust the depth of parallelism of wafer, make the thickness of processing more uniform, improve user satisfaction.
In any of the above-described technical solution, it is preferable that further include：Multiple screens, on limited post, wherein, adjustment pin
With any one clamping matching, spacing adjustment pin is fixed on predeterminated position by limited post.
In the technical scheme, by setting multiple screens on limited post, when limited post is adjusted to appropriate height,
Limited post can be fixed on by current position by adjustment pin, improve the reliability of spacing abrasive disk, and then improve
The processing quality of wafer.
In any of the above-described technical solution, it is preferable that fixing sleeve is fixedly connected with mill main body, its connection mode includes：
Clamping, pin joint, screw connection, threaded connection and welding.
In the technical scheme, the connection mode of fixing sleeve and mill main body includes clamping, pin joint, screw are connected, screw thread
Connection and welding, wherein, clamping, pin joint are easy to operate, and convenient dismounting, are easily changed or repair, and highly practical, screw connects
Connect and be threadedly coupled same easy for installation, and connect firm, stability is strong, when the method connection fixing sleeve and mill using welding
During main body, both end faces are easier to be maintained at sustained height, and reliable and stable, be collided or be not easy under the action of external force
Dislocation is produced, reliability is high.
In any of the above-described technical solution, it is preferable that further include：Potsherd, is fixedly connected on the external part of limited post
End face.
In the technical scheme, potsherd is connected by the end face of the external part in limited post, potsherd is not easy to wear, carries
The high stability of limited post, makes the actual height of limited post be not likely to produce change, and then facilitate operating personnel and carried out to it
Adjustment.
In any of the above-described technical solution, it is preferable that mill main material includes one below or its combination：Cast iron, carbon
Steel and carborundum.
In the technical scheme, the material of mill main body includes cast iron, carbon steel and carborundum, or cast iron, carbon steel and carbon
The combination of SiClx, improves the hardness of mill main body, and then improves the reliability of spacing abrasive disk.
In any of the above-described technical solution, it is preferable that mill main body is cylindrical structure.
In the technical scheme, by the way that mill main body is arranged to cylindrical structure, can preferably coordinate with wafer,
Improve the practicality of spacing abrasive disk.
The embodiment of the utility model second aspect provides a kind of milling apparatus, including such as the utility model first aspect
The spacing abrasive disk that middle any embodiment provides.
In the technical scheme, by installing multiple position limiting structures in mill main body, and multiple position limiting structures are with mill master
The center circumferential array of body, each position limiting structure move vertically relative to the end face of mill main body, add the controllable of product
Property, by adjusting the height of multiple position limiting structures, wafer can be smoothly fixed on spacing abrasive disk first, make wafer
The work surface of piece is parallel, it is then determined that processing thickness, adjusts multiple position limiting structures, make the work surface of wafer successively
Steadily rise corresponding height value, finally start to process, enhance the controllability of process, it is in uneven thickness to reduce processing
Situation, and then reduce sliver rate and scrappage, meanwhile, reduce personnel's operating time, and then improve milling apparatus
Practicality.
The additional aspect and advantage of the utility model will become obvious in following description section, or new by this practicality
The practice of type is recognized.
Brief description of the drawings
Fig. 1 shows the structure diagram of the spacing abrasive disk of one embodiment according to the present utility model；
Fig. 2 shows the structure diagram of the position limiting structure of one embodiment according to the present utility model,
Wherein, the correspondence in Fig. 1 and Fig. 2 between reference numeral and component names is：
10 mill main bodys, 20 position limiting structures, 202 limited posts, 204 fixing sleeves, 206 adjustment pins, 208 limit protrusions, 210 bullets
Spring, 212 guide frames.
Embodiment
In order to be more clearly understood that the above-mentioned purpose of the utility model, feature and advantage, below in conjunction with the accompanying drawings and have
The utility model is further described in detail in body embodiment.It should be noted that in the case where there is no conflict, this Shen
The feature in embodiment and embodiment please can be mutually combined.
Many details are elaborated in the following description in order to fully understand the utility model, still, this practicality
New to be implemented using other different from other modes described here, therefore, the scope of protection of the utility model is simultaneously
It is not limited to the limitation of following public specific embodiment.
The spacing abrasive disk of embodiment according to the present utility model is specifically described with reference to Fig. 1 and Fig. 2.
As shown in Figure 1, the spacing abrasive disk of one embodiment according to the present utility model, including：Mill main body 10；It is multiple
Position limiting structure 20, is installed on mill main body 10, multiple position limiting structures 20 with the center circumferential array of mill main body 10, wherein, often
A position limiting structure 20 moves vertically relative to the end face of mill main body 10.
In this embodiment, by installing multiple position limiting structures 20 in mill main body 10, and multiple position limiting structures 201 are with mill
The center circumferential array of disc main body 10, each position limiting structure 20 move vertically relative to the end face of mill main body 10, add
Wafer, by adjusting the height of multiple position limiting structures 20, can be smoothly fixed on mill master by the controllability of product first
On body 10, make the work surface of wafer parallel, it is then determined that processing thickness, adjusts multiple position limiting structures 20, make crystalline substance successively
The work surface of disk steadily rises corresponding height value, finally starts to process, and enhances the controllability of process, reduces
Processing situation in uneven thickness, and then sliver rate and scrappage are reduced, meanwhile, reduce personnel's operating time, improve
Processing efficiency.
Preferably, Hydraulic Elements can be connected to realize the automatic adjustment of limited post.
As shown in Figure 1, in the above embodiment, it is preferable that further include：Multiple mounting holes, each mounting hole connect mill
The end face and side of main body 10, each position limiting structure 20 correspond to and are installed on each mounting hole；Position limiting structure 20 includes：Limited post
202；Fixing sleeve 204, on the mounting hole for the end face for being covered on mill main body 10, and the end face of fixing sleeve 204 and mill main body 10
End face it is concordant, the end face of fixing sleeve 204 is equipped with the matching hole coordinated with limited post 202；Adjustment pin 206, arranged on mounting hole, is adjusted
206 one end of section pin is arranged on the side of mill main body 10, and the other end and the limited post 202 of adjustment pin 206 are equipped with, adjustment pin
206 adjust the height of limited post 202.
In this embodiment, by setting multiple mounting holes, and the end face and side of each mounting hole connection mill main body 10
Face, each position limiting structure 20 correspond to and are installed on each mounting hole, position limiting structure 20 be arranged in the mounting hole of mill main body 10,
Exterior space is not take up, reduces the appearance and size of spacing abrasive disk, enhances the practicality of spacing abrasive disk.
Wherein, fixing sleeve 204 is covered on the mounting hole of the end face of mill main body 10, and the end face of fixing sleeve 204 and mill
The end face of disc main body 10 is concordant, improves the flatness of the mounting surface of spacing abrasive disk, wafer is smoothly fixed on spacing
On abrasive disk, limited post 202 coordinates with the matching hole on 204 end face of fixing sleeve so that limited post 202 is relative to spacing abrasive disk
Mounting surface can move vertically, 206 one end of adjustment pin is arranged on the side of mill main body 10, the other end and limited post 202
It is equipped with, the height of limited post 202 can be adjusted by adjustment pin 206, is adjusted to limit by limited post 202 before installation wafer
Position below the mounting surface of Bit Grinding disk, then by finely tuning multiple limited posts 202, improves the depth of parallelism of wafer, most
Determine to need the thickness value processed afterwards, adjusting multiple limited posts 202 by adjustment pin 206 makes wafer rise corresponding height
Value, makes the wafer thickness after processing uniform, improves the controllability of process.
As shown in Fig. 2, in any of the above-described embodiment, it is preferable that further include：Limit protrusion 208, arranged on limited post 202
Side；Spring 210, is sheathed on limited post 202, and spring 210 is between limit protrusion 208 and fixing sleeve 204, in spring
In the case that 210 do not stress, the end face of the external part of limited post 202 is less than the end face of fixing sleeve 204.
In this embodiment, by the sheathed spring 210 on limited post 202, spring 210 is located at limit protrusion 208 and consolidates
Surely between set 204, and in the case where spring 210 does not stress, the end face of the external part of limited post 202 is less than fixing sleeve 204
End face, i.e., when adjustment pin 206 does not interact with limited post 202, in 202 automatic rebounding of limited post to mounting hole, reduce
The situation Nian Jie with wafer of limited post 202, improves the practicality of spacing abrasive disk.
Preferably, limit protrusion 208 can be set along the border of limited post 202, or can be along the border of limited post 202
It is arranged at intervals multiple limit protrusions 208.
As shown in Fig. 2, in any of the above-described embodiment, it is preferable that further include：Guide frame 212, connection limited post 202
With adjustment pin 206, when adjustment pin 206 is rotated to both sides, limited post 202 moves vertically relative to the end face of fixing sleeve 204.
In this embodiment, by setting guide frame 212, connection limited post 202 and adjustment pin 206, product is improved
Operating characteristics, guide frame 212 is simple and reliable and stable, can to both sides rotate adjustment pin 206 when, make limited post 202
Move vertically relative to the end face of fixing sleeve 204, to adjust the depth of parallelism of wafer, make the thickness of processing more uniform, carry
High user satisfaction.
Preferably, guide frame 212 also has auto-lock function, and limited post 202 is adjusted to suitable height by adjustment pin 206
After degree, adjustment pin 206 is pressed, then adjustment pin 206 does not produce linkage with limited post 202, limited post 202 can be fixed on conjunction
Suitable height.
In any of the above-described embodiment, it is preferable that further include：Multiple screens, on limited post 202, wherein, adjustment pin
Limited post 202 is fixed on predeterminated position by 206 with any one clamping matching, spacing adjustment pin 206.
In this embodiment, by setting multiple screens on limited post 202, when limited post 202 is adjusted to appropriate height
When spending, by adjustment pin 206 can by the reliability for being fixed on current position, improving spacing abrasive disk of limited post 202,
And then improve the processing quality of wafer.
For example, each screens is arranged to most common thickness thinning value, whole process can be made simpler just
It is prompt.
In any of the above-described embodiment, it is preferable that fixing sleeve 204 is fixedly connected with mill main body 10, its connection mode bag
Include：Clamping, pin joint, screw connection, threaded connection and welding.
In this embodiment, the connection mode of fixing sleeve 204 and mill main body 10 includes clamping, pin joint, screw are connected, spiral shell
Line connects and welding, wherein, clamping, pin joint are easy to operate, and convenient dismounting, are easily changed or repair, highly practical, screw
Connection and threaded connection are same easy for installation, and connection is firm, and stability is strong, when the method connection fixing sleeve 204 using welding
During with mill main body 10, both end faces are easier to be maintained at sustained height, and reliable and stable, be collided or the work of external force
Dislocation is not likely to produce under, reliability is high.
In any of the above-described embodiment, it is preferable that further include：Potsherd, is fixedly connected on the external part of limited post 202
End face.
In this embodiment, potsherd being connected by the end face of the external part in limited post 202, potsherd is not easy to wear,
The stability of limited post 202 is improved, the actual height of limited post 202 is not likely to produce change, and then facilitate operating personnel
It is adjusted.
In any of the above-described embodiment, it is preferable that 10 material of mill main body includes one below or its combination：Cast iron, carbon
Steel and carborundum.
In this embodiment, the material of mill main body 10 includes cast iron, carbon steel and carborundum, or cast iron, carbon steel and carbon
The combination of SiClx, improves the hardness of mill main body 10, and then improves the reliability of spacing abrasive disk.
In any of the above-described embodiment, it is preferable that mill main body 10 is cylindrical structure.
In this embodiment, by the way that mill main body 10 is arranged to cylindrical structure, can preferably coordinate with wafer,
Improve the practicality of spacing abrasive disk.
Specific embodiment：
Wafer is bonded on spacing abrasive disk, and ensures that wafer is Nian Jie with the end face of spacing abrasive disk smooth, makes crystalline substance
The work surface of disk is parallel, and then mill is placed on micrometer rack, measurement mill height and the micrometer numeral that is zeroed,
The bottom position of limited post 202 is observed that by the mounting hole for the side for connecting mill main body 10, micrometer is moved on to limit
On the column 202 of position and adjustment pin 206 is adjusted, pays attention to observing the numeral of digital micrometer when adjusting adjustment pin 206, reaches desired height
Afterwards, for example, when needing to process the thickness of 0.25mm, when the value of digital micrometer reaches 0.25mm, then stop adjusting, then according to
Secondary remaining position limiting structure 20 of adjusting, after all position limiting structures 20 have all been adjusted, the work surface of wafer is smoothly
0.25mm is risen, starts the substrate thinning processing to wafer at this time, makes its thinned thickness uniform, can effectively reduce and split
Piece rate and scrappage, after wafer is thinned, drop next limited post 202, conveniently to remove crystalline substance by adjusting adjustment pin 206
Piece, the spring 210 being arranged on limited post 202 can play the role of good 202 retraction of limited post, wherein, every time during adjustment, need
Heat, make the gum softening being adhered between wafer and spacing abrasive disk.
The milling apparatus of one embodiment according to the present utility model, including spacing the grinding such as the offer of above-mentioned any embodiment
Mill.
In this embodiment, by installing multiple position limiting structures 20 in mill main body 10, and multiple position limiting structures 20 are with mill
The center circumferential array of disc main body 10, each position limiting structure 20 move vertically relative to the end face of mill main body 10, add
Wafer, by adjusting the height of multiple position limiting structures 20, can be smoothly fixed on spacing grind by the controllability of product first
On mill, make the work surface of wafer parallel, it is then determined that processing thickness, adjusts multiple position limiting structures 20, make crystalline substance successively
The work surface of disk steadily rises corresponding height value, finally starts to process, and enhances the controllability of process, reduces
Processing situation in uneven thickness, and then sliver rate and scrappage are reduced, meanwhile, reduce personnel's operating time, and then
Improve the practicality of milling apparatus.
The technical solution of the utility model is described in detail above in association with attached drawing, and the utility model provides a kind of spacing grind
Mill and milling apparatus, by installing multiple position limiting structures in mill main body, and multiple position limiting structures are with the center of mill main body
Circumference array, each position limiting structure move vertically relative to the end face of mill main body, add the controllability of product, pass through tune
The height of multiple position limiting structures is saved, wafer can be smoothly fixed on spacing abrasive disk first, makes the to be added of wafer
Work surface is parallel, it is then determined that processing thickness, adjusts multiple position limiting structures, the work surface of wafer is steadily increased successively
Corresponding height value, finally starts to process, enhances the controllability of process, reduces and processes situation in uneven thickness,
And then sliver rate and scrappage are reduced, meanwhile, reduce personnel's operating time, and then improve the practicality of milling apparatus.
In the utility model, term " first ", " second ", " the 3rd " are only used for the purpose of description, and it is not intended that
Instruction implies relative importance；Term " multiple " then refers to two or more, unless otherwise restricted clearly.Term " peace
The term such as dress ", " connected ", " connection ", " fixation " should all be interpreted broadly, for example, " connection " can be fixedly connected, can also
It is to be detachably connected, or is integrally connected；" connected " can be directly connected, and can also be indirectly connected by intermediary.It is right
For those of ordinary skill in the art, it can understand that specific in the utility model of above-mentioned term containing as the case may be
Justice.
In the description of the utility model, it is to be understood that term " on ", " under ", "left", "right", "front", "rear" etc. refer to
The orientation or position relationship shown be based on orientation shown in the drawings or position relationship, be for only for ease of description the utility model and
Simplify description, rather than the device or unit of instruction or hint meaning there must be specific direction, with specific azimuth configuration
And operation, it is thus impossible to be interpreted as the limitation to the utility model.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that combining the particular features, structures, materials, or characteristics that the embodiment or example describe is contained at least the one of the utility model
In a embodiment or example.In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment
Or example.Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more embodiments or example
In combine in an appropriate manner.
It these are only the preferred embodiment of the utility model, be not intended to limit the present invention, for this area
Technical staff for, various modifications and changes may be made to the present invention.Where within the spirit and principles of the present invention,
Any modification, equivalent replacement, improvement and so on, should be included within the scope of protection of this utility model.
Claims (9)
- A kind of 1. spacing abrasive disk, it is characterised in that including：Mill main body；Multiple position limiting structures, are installed on the mill main body, the multiple position limiting structure is with the center circumferential of the mill main body Array,Wherein, each position limiting structure moves vertically relative to the end face of the mill main body；Multiple mounting holes, each mounting hole connect the end face and side of the mill main body, each position limiting structure pair Each mounting hole should be installed on；Wherein, the position limiting structure includes：Limited post；Fixing sleeve, on the mounting hole for the end face for being covered on the mill main body, and the end face of the fixing sleeve and the mill The end face of disc main body is concordant, and the end face of the fixing sleeve is equipped with the matching hole coordinated with the limited post；Adjustment pin, arranged on the mounting hole, described adjustment pin one end is arranged on the side of the mill main body, the adjustment pin The other end is equipped with the limited post, and the adjustment pin adjusts the height of the limited post.
- 2. spacing abrasive disk according to claim 1, it is characterised in that further include：Limit protrusion, arranged on the side of the limited post；Spring, is sheathed on the limited post, and the spring is between the limit protrusion and the fixing sleeve, in the bullet In the case that spring does not stress, the end face of the external part of the limited post is less than the end face of the fixing sleeve.
- 3. spacing abrasive disk according to claim 1, it is characterised in that further include：Guide frame, connects the limited post and the adjustment pin, when the adjustment pin is rotated to both sides, the limited post phase Move vertically for the end face of the fixing sleeve.
- 4. spacing abrasive disk according to claim 1, it is characterised in that further include：Multiple screens, on the limited post,Wherein, the limited post is fixed on default position by the adjustment pin and any one of clamping matching, the adjustment pin Put.
- 5. spacing abrasive disk according to claim 1, it is characterised in thatThe fixing sleeve is fixedly connected with the mill main body, its connection mode includes：Clamping, pin joint, screw connection, threaded connection and welding.
- 6. spacing abrasive disk according to any one of claim 1 to 5, it is characterised in that further include：Potsherd, is fixedly connected on the end face of the external part of the limited post.
- 7. spacing abrasive disk according to any one of claim 1 to 5, it is characterised in thatThe mill main material includes one below or its combination：Cast iron, carbon steel and carborundum.
- 8. spacing abrasive disk according to any one of claim 1 to 5, it is characterised in thatThe mill main body is cylindrical structure.
- A kind of 9. milling apparatus, it is characterised in that including：Such as spacing abrasive disk described in any item of the claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720666832.6U CN207223700U (en) | 2017-06-08 | 2017-06-08 | Spacing abrasive disk and milling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720666832.6U CN207223700U (en) | 2017-06-08 | 2017-06-08 | Spacing abrasive disk and milling apparatus |
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| Publication Number | Publication Date |
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| CN207223700U true CN207223700U (en) | 2018-04-13 |
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ID=61851787
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|---|---|---|---|
| CN201720666832.6U Active CN207223700U (en) | 2017-06-08 | 2017-06-08 | Spacing abrasive disk and milling apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109079620A (en) * | 2018-08-08 | 2018-12-25 | 南通瑞斯电子有限公司 | A kind of pin mill equipment of novel spring manufacture |
| CN109573642A (en) * | 2018-12-28 | 2019-04-05 | 深圳市芯思杰智慧传感技术有限公司 | A kind of TO cap material transfering device |
| CN109623631A (en) * | 2018-11-27 | 2019-04-16 | 西安碳星半导体科技有限公司 | A kind of clamp structure and production method for the grinding of ultra thin single crystalline diamond substrate |
| CN111390750A (en) * | 2020-03-25 | 2020-07-10 | 福建北电新材料科技有限公司 | Wafer surface processing device |
-
2017
- 2017-06-08 CN CN201720666832.6U patent/CN207223700U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109079620A (en) * | 2018-08-08 | 2018-12-25 | 南通瑞斯电子有限公司 | A kind of pin mill equipment of novel spring manufacture |
| CN109079620B (en) * | 2018-08-08 | 2023-08-22 | 南通瑞斯电子有限公司 | Novel pin mill equipment for manufacturing springs |
| CN109623631A (en) * | 2018-11-27 | 2019-04-16 | 西安碳星半导体科技有限公司 | A kind of clamp structure and production method for the grinding of ultra thin single crystalline diamond substrate |
| CN109573642A (en) * | 2018-12-28 | 2019-04-05 | 深圳市芯思杰智慧传感技术有限公司 | A kind of TO cap material transfering device |
| CN109573642B (en) * | 2018-12-28 | 2023-11-28 | 芯思杰技术(深圳)股份有限公司 | TO cap material transferring device |
| CN111390750A (en) * | 2020-03-25 | 2020-07-10 | 福建北电新材料科技有限公司 | Wafer surface processing device |
| CN111390750B (en) * | 2020-03-25 | 2021-09-03 | 福建北电新材料科技有限公司 | Wafer surface processing device |
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Address after: 518071 4f, building A5, Zhiyuan, No. 1001, Xueyuan Avenue, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Core technology (Shenzhen) Co., Ltd Address before: Nanshan District Xueyuan Road in Shenzhen city of Guangdong province 518071 No. 1001 Nanshan Chi Park A5 building 4 floor Patentee before: SHENZHEN PHOGRAIN INTELLIGENT SENSING TECHNOLOGY CO., LTD. |
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