CN207199664U - High-power LED light source and LED light source module - Google Patents

Abstract

The utility model provides a kind of high-power LED light source and LED light source module, the high-power LED light source, including chip and substrate, the back side of chip is provided with the first metal layer, second metal layer is correspondingly provided with substrate, high-power LED light source also includes the welding thin slice of preforming making, and welding thin slice is located between the first metal layer and second metal layer, and the first metal layer and second metal layer are linked with welding thin slice.The utility model welds thin slice by setting, and the first metal layer is set in chip back, second metal layer is set on substrate, the first metal layer and second metal layer bonding are connected using welding thin slice, die bond efficiency is lifted, effectively reduces the hole ratio between chip and substrate, ensures the uniformity consistency of welding, and then the homogeneity of the die bond layer formed is improved, improve heat dispersion.And when using LED light source module, it can avoid bridge joint problem occur during Solder-Paste Printing and Reflow Soldering.

Description

High-power LED light source and LED light source module

Technical field

The utility model belongs to LED die bond technical fields, is to be related to a kind of high-power LED light source and LED more specifically Light source module group.

Background technology

LED die bond layers are a heat dissipation channels nearest apart from LED chip luminescent layer, and there are about 90% heat will pass through Die bond layer distributes.The die bond technology of great power LED (chip of the power in more than 1w is generally high-power LED chip) is Into the key technology of semiconductor lighting industry.LED light source module is by the light source die of plurality of LEDs integrated chip encapsulated moulding Group, LED light source module is more prone to heat localization effect, therefore has more to the heat-sinking capability of the die bond layer of LED light source module High requirement.The die bond technologies such as traditional heat-conducting glue, silver paste can not meet high-power LED light source and LED light source module Die bond requirement, thus the current solder die bond technology typically used.When using solder welding die bond, chip is adopted with substrate interface It is welded and fixed with solder connected, the thickness that solder welds the die bond layer to be formed is difficult to keep homogeneity, and in chip and substrate circle Substantial amounts of hole can be formed between face, hole ratio is high, causes die bond layer heat dispersion poor, in addition using Solder-Paste Printing and Reflow Soldering During bridge joint problem occurs.

Utility model content

The purpose of this utility model is to provide a kind of high-power LED light source and LED light source module, to solve prior art Present in chip and substrate welding die bond when, the thickness of die bond layer is difficult to keep homogeneity, and hole ratio is high, die bond layer thermal diffusivity Can be poor the problem of.

To achieve the above object, the technical solution adopted in the utility model is：A kind of high-power LED light source is provided, including For luminous chip and the substrate of the support chip, the back side of the chip is provided with the first metal layer, correspondingly set on substrate Have a second metal layer, the high-power LED light source also includes welding thin slice, the welding thin slice located at the first metal layer and Between the second metal layer, the first metal layer and the second metal layer are linked with the welding thin slice.

Further, the welding thin slice is solder matrix band.

Further, deposit to form the welding thin slice using brazing metal in the second metal layer.

Or the welding thin slice is thermal sheet, the two sides of the thermal sheet is coated with solder layer respectively.

Further, the thermal sheet is gold plaque, silver strip, copper sheet or silicon carbide plate.

Further, the first metal layer is goldleaf layer, silver foil layer or copper foil layer, and the second metal layer is goldleaf Layer, silver foil layer or copper foil layer.

Further, the thickness of the welding thin slice is 3-600 microns.

Another object of the present utility model is to provide a kind of LED light source module, including some chips and supports each described The substrate of chip, in addition to some welding thin slices, the back side of the chip are provided with the first metal layer, and the substrate is provided with difference The second metal layer of each chip is supported, the weldering is provided between each the first metal layer and the corresponding second metal layer Thin slice is connect, the first metal layer and the second metal layer are linked with the welding thin slice.

Further, the welding thin slice is formed in the second metal layer using brazing metal deposition.

Or the welding thin slice is thermal sheet, the two sides of the thermal sheet is coated with solder layer respectively.

The beneficial effect of high-power LED light source and LED light source module provided by the utility model is：With prior art phase Than the utility model welds thin slice by setting, and sets the first metal layer in chip back, and the second metal is set on substrate Layer, the first metal layer and second metal layer bonding are connected using welding thin slice, die bond efficiency is lifted, effectively reduces chip and base Hole ratio between plate, ensure the uniformity consistency of welding, and then improve the homogeneity of the die bond layer formed, improve heat dispersion. And when using LED light source module, it can avoid bridge joint problem occur during Solder-Paste Printing and Reflow Soldering.

Brief description of the drawings

, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with Other accompanying drawings are obtained according to these accompanying drawings.

Fig. 1 is the structural representation for the high-power LED light source that the utility model embodiment one provides；

Fig. 2 is the structural representation for the high-power LED light source that the utility model embodiment two provides；

Fig. 3 is the structural representation for the LED light source module that the utility model embodiment provides；

Fig. 4 is the structural representation of the LED light source module chips shown in Fig. 3；

Fig. 5 be Fig. 3 shown in LED light source module in substrate structural representation；

Fig. 6 is the flow chart for the LED chip die-bonding method that the utility model embodiment provides.

Wherein, each accompanying drawing main mark in figure：

10- chips；11- the first metal layers；20- substrates；21- second metal layers；30- welds thin slice；31- thermal sheets； 32- solder layers.

Embodiment

In order that technical problem to be solved in the utility model, technical scheme and beneficial effect are more clearly understood, with Lower combination drawings and Examples, the utility model is further elaborated.It is it should be appreciated that described herein specific real Example is applied only to explain the utility model, is not used to limit the utility model.

It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another On one element or it is connected on another element.When an element is known as " being connected to " another element, it can To be directly to another element or be indirectly connected on another element.

In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two More than, unless otherwise specifically defined.

In description of the present utility model, it is to be understood that term " " center ", " length ", " width ", " thickness ", The orientation of instruction such as " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " or Position relationship is based on orientation shown in the drawings or position relationship, is for only for ease of description the utility model and simplifies description, Rather than instruction or imply signified device or element must have specific orientation, with specific azimuth configuration and operation, because This is it is not intended that to limitation of the present utility model.

, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly Connection；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Can be connection or the interaction relationship of two elements of two element internals.For one of ordinary skill in the art Speech, can understand concrete meaning of the above-mentioned term in the utility model as the case may be.

Embodiment one：

Referring to Fig. 1, existing illustrate to high-power LED light source provided by the utility model.The great power LED light Source, including chip 10, substrate 20 and welding thin slice 30, chip 10 are used to light, and substrate 20 is used to support chip 10, by chip 10 Installation forms high-power LED light source on the base plate 20, with encapsulation.The back side of chip 10 is provided with the first metal layer 11, on substrate 20 Second metal layer 21 is correspondingly provided with, welding thin slice 30 is located between the first metal layer 11 and second metal layer 21, the first metal layer 11 and second metal layer 21 be linked with welding thin slice 30, so as to improve die bond efficiency, reduce chip 10 and substrate Hole ratio between 20 interfaces, and welding thin slice 30 is used, by the first metal layer 11 and second metal layer 21 with welding thin slice 30 Bonding, the then thickness for welding thin slice 30 directly determine the thickness for the die bond layer to be formed, improve the die bond layer homogeneity of formation, carry Rise heat dispersion.

High-power LED light source provided by the utility model, compared with prior art, the utility model are thin by setting welding Piece 30, and the first metal layer 11 is set at the back side of chip 10, second metal layer 21 is set on the base plate 20, uses welding thin slice 30 The first metal layer 11 and second metal layer 21 are bonded connection, die bond efficiency is lifted, effectively reduces between chip 10 and substrate 20 Hole ratio, ensure the uniformity consistency of welding, and then improve the homogeneity of the die bond layer formed, improve heat dispersion.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, the first metal layer 11 can use the film deposition techniques such as photolithographicallpatterned, plating mode, evaporation mode to be produced on chip 10 The back side.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, the first metal layer 11 are goldleaf layer, silver foil layer or copper foil layer etc..I.e. the first metal layer 11 can use the materials such as gold, silver, copper Make, to ensure good electric conductivity and good heat conductivility.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, second metal layer 21 can use the film deposition techniques such as photolithographicallpatterned, plating mode, evaporation mode to be produced on substrate 20 On.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, second metal layer 21 are goldleaf layer, silver foil layer or copper foil layer etc..I.e. second metal layer 21 can use the materials such as gold, silver, copper Make, to ensure good electric conductivity and good heat conductivility.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, the modes such as Reflow Soldering, eutectic weldering can be used to be bonded the first metal layer 11 and second metal layer 21 with welding thin slice 30.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, welding thin slice 30 are solder matrix band.It is same to enter to improve in order to which the first metal layer 11 and second metal layer 21 are linked Efficiency high.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, the welding thin slice 30 being molded using solder can use commercially available preforming solder thin slice, to improve die bond efficiency.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, welding thin slice 30 can require selection according to the bonding of reality, and usual thickness is at several microns to hundreds of microns.Specifically, weld The thickness of thin slice 30 is 3-600 microns.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, deposit in second metal layer 21 to form welding thin slice 30 using brazing metal, so as to which welding thin slice 30 directly is produced on into the On two metal levels 21, to reduce thickness.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, welding thin slice 30 can be the thin slices that the solders such as AuSn, CuSn, SnAgCu, SnAg or pure Sn make.

Further, referring to Fig. 1, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, multiple chips 10 can be set on substrate 20, to form high-power LED light source module.Specifically such as：Set on the base plate 20 more Individual second metal layer 21, to form pad structure, then welding thin slice 30 is set in each second metal layer 21, then each second The correspondence position of metal level 21 sets chip 10, and the first metal layer 11 on chip 10 is bonded with welding thin slice 30.

Embodiment two

Referring to Fig. 2, the high-power LED light source of the present embodiment and the high-power LED light source of embodiment one are distinguished as：

In the present embodiment, welding thin slice is thermal sheet 31, and the two sides of thermal sheet 31 is coated with solder layer 32 respectively.Use Thermal sheet 31, can more accurately determine the thickness for the die bond layer to be formed, while preferably carry out heat conduction, improve thermal diffusivity Energy.And solder layer 32 is set respectively on the two sides of thermal sheet 31, it can facilitate the first metal layer 11 and second metal layer 21 It is connected with thermal sheet 31.

Further, referring to Fig. 2, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, thermal sheet 31 are gold plaque, silver strip, copper sheet or silicon carbide plate etc., i.e., thermal sheet 31 can use gold, silver, copper or carbonization Silicon makes.

Further, referring to Fig. 2, a kind of specific embodiment party as high-power LED light source provided by the utility model Formula, solder layer 32 are deposited on thermal sheet 31 using materials such as AuSn, CuSn, SnAgCu, SnAg or pure Sn.Further Ground, several microns-several millimeters of the thickness of thermal sheet 31.Specifically, the thickness of thermal sheet 31 is 3-4000 microns.

Further, a kind of embodiment as high-power LED light source provided by the utility model, on substrate 20 Multiple chips 10 can be set, to form high-power LED light source module.Specifically such as：Multiple second metals are set on the base plate 20 Layer 21, to form pad structure, then welding thin slice 30 is set in each second metal layer 21, it is then right in each second metal layer 21 Answer position that chip 10 is set, and the first metal layer 11 on chip 10 is bonded with welding thin slice 30.

The other structures of the high-power LED light source of the present embodiment and the other structures of the high-power LED light source of embodiment one It is identical, it will not be repeated here.

Fig. 3 to Fig. 5 is referred to, the utility model embodiment also discloses a kind of LED light source module, including some chips 10th, substrate 20 and some welding thin slices 30, chip 10 are used to light, and substrate 20 is used to support chip 10, and multiple chips 10 are pacified Dress forms LED light source module on the base plate 20, with encapsulation.The back side of each chip 10 is provided with the first metal layer 11, right on substrate 20 Second metal layer 21 should be provided with, each second metal layer 21 can be used as pad, to install each chip 10；Each the first metal layer 11 Welding thin slice 30 is respectively equipped between corresponding second metal layer 21, the first metal layer 11 and second metal layer 21 are thin with welding Piece 30 is linked, and so as to improve die bond efficiency, reduces the hole ratio between chip 10 and the interface of substrate 20, and uses welding Thin slice 30, the first metal layer 11 and second metal layer 21 are bonded with welding thin slice 30, then the thickness for welding thin slice 30 is direct The thickness for the die bond layer to be formed is determined, improves the die bond layer homogeneity of formation, heat radiation performance, while soldering paste can be avoided Printing improves die bond efficiency with occurring bridge joint problem during Reflow Soldering.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, the first metal layer 11 can use the film deposition techniques such as photolithographicallpatterned, plating mode, evaporation mode to be produced on chip 10 The back side.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, the first metal layer 11 are goldleaf layer, silver foil layer or copper foil layer etc..I.e. the first metal layer 11 can use the materials such as gold, silver, copper Material makes, to ensure good electric conductivity and good heat conductivility.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, second metal layer 21 can use the film deposition techniques such as photolithographicallpatterned, plating mode, evaporation mode to be produced on substrate 20 On.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, second metal layer 21 are goldleaf layer, silver foil layer or copper foil layer etc..I.e. second metal layer 21 can use the materials such as gold, silver, copper Material makes, to ensure good electric conductivity and good heat conductivility.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, the modes such as Reflow Soldering, eutectic weldering can be used the first metal layer 11 and second metal layer 21 with welding the key of thin slice 30 Close.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, welding thin slice 30 are solder matrix band.It is same to enter to carry in order to which the first metal layer 11 and second metal layer 21 are linked High efficiency is high.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, deposit in second metal layer 21 to form welding thin slice 30 using brazing metal, so as to directly be produced on welding thin slice 30 In second metal layer 21, to reduce thickness, while efficiency is improved.

Further, Fig. 3 to Fig. 5 is referred to, one kind specific implementation as LED light source module provided by the utility model Mode, welding thin slice 30 can be the thin slices that the solders such as AuSn, CuSn, SnAgCu, SnAg or pure Sn make.

In other embodiments, the welding thin slice 30 being molded using solder can use commercially available preforming solder thin slice, To improve die bond efficiency.Selection can be required according to the bonding of reality by welding thin slice 30, and usual thickness is at several microns to hundreds of microns. Specifically, the thickness for welding thin slice 30 is 3-600 microns.

In further embodiments, welding thin slice is thermal sheet 31, and the two sides of thermal sheet 31 is coated with solder respectively Layer 32.Using thermal sheet 31, the thickness for the die bond layer to be formed can be more accurately determined, while preferably carries out heat conduction, is carried High heat dispersion.And solder layer 32 is set respectively on the two sides of thermal sheet 31, it can facilitate the first metal layer 11 and second Metal level 21 is connected with thermal sheet 31.Further, thermal sheet 31 is gold plaque, silver strip, copper sheet or silicon carbide plate etc., that is, is led Hot thin slice 31 can use gold, silver, copper or carborundum to make.

Referring to Fig. 6, the utility model embodiment also discloses a kind of LED chip die-bonding method, comprise the following steps：

S1：The first metal layer is made in chip back；

S2：Second metal layer is made on substrate；

S3：It is preforming to make welding thin slice；

S4：Welding thin slice is located between the first metal layer and second metal layer；

S5：The first metal layer and second metal layer are bonded with welding thin slice.

Also referring to Fig. 1 to Fig. 3, thin slice 30 is welded by setting, and the first metal layer 11 is set at the back side of chip 10, Second metal layer 21 is set on the base plate 20, using welding thin slice 30 by the first metal layer 11 and the company of bonding of second metal layer 21 Connect, lift die bond efficiency, effectively reduce the hole ratio between chip 10 and substrate 20, ensure the uniformity consistency of welding, Jin Erti The homogeneity for the die bond layer that height is formed, improve heat dispersion.LED chip die-bonding method of the present utility model can be used for making State high-power LED light source and LED light source module.

Further, also referring to Fig. 3 to Fig. 5, one kind as LED chip die-bonding method provided by the utility model Embodiment, welding thin slice 30 are formed in second metal layer 21 using brazing metal deposition.It is thin so as to will directly weld Piece 30 is produced in second metal layer 21, to reduce thickness, while improves efficiency.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, the first gold medal Category layer 11 can be produced on the back side of chip 10 using film deposition techniques such as photolithographicallpatterned, plating mode, evaporation modes.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, the first gold medal Category layer 11 is goldleaf layer, silver foil layer or copper foil layer etc..I.e. the first metal layer 11 can use the materials such as gold, silver, copper to make, to protect Demonstrate,prove good electric conductivity and good heat conductivility.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, the second gold medal Belonging to layer 21 can use the film deposition techniques such as photolithographicallpatterned, plating mode, evaporation mode to make on the base plate 20.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, the second gold medal Category layer 21 is goldleaf layer, silver foil layer or copper foil layer etc..I.e. second metal layer 21 can use the materials such as gold, silver, copper to make, to protect Demonstrate,prove good electric conductivity and good heat conductivility.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, can be adopted The first metal layer 11 and second metal layer 21 are bonded with welding thin slice 30 with modes such as Reflow Soldering, eutectic welderings.

Further, a kind of embodiment as LED chip die-bonding method provided by the utility model, welding are thin Piece 30 is solder matrix band.It is same to enter to improve efficiency high in order to which the first metal layer 11 and second metal layer 21 are linked.Enter One step, welding thin slice 30 can be the thin slice that the solders such as AuSn, CuSn, SnAgCu, SnAg or pure Sn make.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims (10)

1. high-power LED light source, including for luminous chip and the substrate of the support chip, it is characterised in that：The core The back side of piece is provided with the first metal layer, second metal layer is correspondingly provided with substrate, it is thin that the high-power LED light source also includes welding Piece, the welding thin slice are located between the first metal layer and the second metal layer, the first metal layer and described the Two metal levels are linked with the welding thin slice.

2. high-power LED light source as claimed in claim 1, it is characterised in that：The welding thin slice is solder matrix band.

3. high-power LED light source as claimed in claim 2, it is characterised in that：Brazing metal is used in the second metal layer Deposition forms the welding thin slice.

4. high-power LED light source as claimed in claim 1, it is characterised in that：The welding thin slice is thermal sheet, described to lead The two sides of hot thin slice is coated with solder layer respectively.

5. high-power LED light source as claimed in claim 4, it is characterised in that：The thermal sheet is gold plaque, silver strip, copper sheet Or silicon carbide plate.

6. the high-power LED light source as described in claim any one of 1-5, it is characterised in that：The first metal layer is goldleaf Layer, silver foil layer or copper foil layer, the second metal layer are goldleaf layer, silver foil layer or copper foil layer.

7. the high-power LED light source as described in claim any one of 1-5, it is characterised in that：It is described welding thin slice thickness be 3-600 microns.

8. a kind of LED light source module, including some chips and the substrate for supporting each chip, it is characterised in that：If also include Dry welding thin slice, the back side of the chip are provided with the first metal layer, and the substrate provided with supporting the of each chip respectively Two metal levels, the welding thin slice, first gold medal are provided between each the first metal layer and the corresponding second metal layer Category layer and the second metal layer are linked with the welding thin slice.

9. LED light source module as claimed in claim 8, it is characterised in that：The welding thin slice is using brazing metal deposition shape Described in Cheng Yu in second metal layer.

10. LED light source module as claimed in claim 8, it is characterised in that：The welding thin slice is thermal sheet, described to lead The two sides of hot thin slice is coated with solder layer respectively.