CN207199601U - Patch type SOD diode - Google Patents
Patch type SOD diode Download PDFInfo
- Publication number
- CN207199601U CN207199601U CN201721007535.7U CN201721007535U CN207199601U CN 207199601 U CN207199601 U CN 207199601U CN 201721007535 U CN201721007535 U CN 201721007535U CN 207199601 U CN207199601 U CN 207199601U
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- Prior art keywords
- lead bar
- bar
- pin area
- lead
- diode
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model discloses a kind of patch type SOD diode, including：First lead bar, the second lead bar, connection sheet and diode chip for backlight unit, the second welding ends of connection sheet are electrically connected with diode chip for backlight unit upper end by solder(ing) paste；One epoxy body is coated on the Support of the first lead bar, the weld zone of the second lead bar, connection sheet and diode chip for backlight unit surface；Region is provided with one first bending bar between the Support and pin area of the first lead bar, and this first bending bar exposes epoxy body；Region is provided with one second bending bar between the weld zone and pin area of the second lead bar, and this second bending bar exposes epoxy body；The pin area of first lead bar and the pin area of the second lead bar are less than the lower surface of epoxy body in vertical direction, and leave gap in vertical direction with epoxy body lower surface；Epoxy body lower surface is provided with a groove, has several concave points on the madial wall and bottom wall of this groove.The utility model patch type SOD diode enhances the adhesion of device and pcb board when device is fixed by red glue and PCB.
Description
Technical field
It the utility model is related to a kind of diode device structure, more particularly to a kind of patch type SOD diode.
Background technology
Rectifier is to carry out rectification to alternating current using the unilateal conduction characteristic of diode, therefore is widely used in alternating current
It is converted into the circuit of direct current.
Whole world electronic product such as phone, television set, facsimile machine, computer peripheral product are all preferably compact for research and development
Target, it requires that the volume of chip diode is small as best one can.
But SMD SOD diode productions enterprise is found all the time, in crystal grain and lead and encapsulating material at present
Under equal Qualification, the quality qualification rate after encapsulation be not it is very high, only 90% or so, it is qualified SMD in order to filter out
For SOD diodes, it is necessary to put into substantial amounts of detection device and personnel, production efficiency is low.By analyzing reason, after finding encapsulation
Quality qualification rate be not very it is high be due to crystal grain positioning it is inaccurate caused by.
Therefore, a kind of patch type SOD diode how is researched and developed, can be solved the above problems, is become as those skilled in the art
The direction of effort.
The content of the invention
The utility model purpose is to provide a kind of patch type SOD diode, and the patch type SOD diode passes through by device
When red glue is fixed with PCB, the adhesion of device and pcb board is enhanced.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of patch type SOD diode, including：The
One lead bar, the second lead bar, connection sheet and diode chip for backlight unit, the first lead bar one end is the branch being connected with diode chip for backlight unit
Area is supportted, the diode chip for backlight unit lower end is electrically connected by solder(ing) paste with the Support, and the first lead bar other end is pin area；
Described second lead bar one end is the weld zone being connected with the first welding ends of the connection sheet, the second lead bar
The other end is pin area, and the first lead bar, the pin area of the second lead bar pass as the electric current of the patch type SOD diode
Defeated end；
Second welding ends of the connection sheet is electrically connected with diode chip for backlight unit upper end by solder(ing) paste；
It is characterized in that：One epoxy body is coated on the Support of the first lead bar, the weld zone of the second lead bar, connection sheet
With diode chip for backlight unit surface；
Region is provided with one first bending bar between the Support and pin area of the first lead bar, and this first bending bar is naked
Expose epoxy body；
Region is provided with one second bending bar between the weld zone and pin area of the second lead bar, and this second bending bar is naked
Expose epoxy body；
The pin area of first lead bar and the pin area of the second lead bar are less than the lower surface of epoxy body in vertical direction,
And gap is left in vertical direction with epoxy body lower surface；
The epoxy body lower surface is provided with a groove, has several concave points on the madial wall and bottom wall of this groove.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the area of the weld zone of the second lead bar is more than the area of first welding ends.
2. in such scheme, angle is 90 ° between the first bending bar of the first lead bar and pin area, described
Angle is 90 ° between second bending bar of two lead bars and pin area.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model patch type SOD diode, its epoxy body lower surface are provided with a groove, the madial wall of this groove and
There are several concave points on bottom wall, when device is fixed by red glue and PCB, enhance the knot of device and pcb board
With joint efforts；Secondly, the pin area of the pin area of its first lead bar and the second lead bar is less than under epoxy body in vertical direction
Surface, and gap is left in vertical direction with epoxy body lower surface, epoxy body lower surface is provided with a groove, is advantageous to red glue
It is vented during bonding, avoids device sideslip, greatly reduces the sealing-off probability of device and pcb board.
Brief description of the drawings
Accompanying drawing 1 is the utility model patch type SOD diode structural representation.
In the figures above：1st, the first lead bar；2nd, the second lead bar；3rd, connection sheet；31st, the first welding ends；32nd, the second weldering
Connect end；4th, diode chip for backlight unit；5th, Support；61st, the first pin area；62nd, second pin area；7th, weld zone；8th, epoxy body；9th,
One bending bar；10th, the second bending bar；11st, groove；12nd, groove.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：
Embodiment 1：A kind of patch type SOD diode, including：First lead bar 1, the second lead bar 2, connection sheet 3 and two
Pole pipe chip 4, the one end of the first lead bar 1 is the Support 5 being connected with diode chip for backlight unit 4, and the lower end of diode chip for backlight unit 4 leads to
Cross solder(ing) paste to electrically connect with the Support 5, the other end of the first lead bar 1 is the first pin area 61；
Described one end of second lead bar 2 is the weld zone 7 being connected with the first welding ends 31 of the connection sheet 3, and this second
The other end of lead bar 2 is second pin area 62, and the first lead bar 1, the second pin area 62 of the second lead bar 2 are used as the patch
The electric current transmission end of chip SOD diodes；
Second welding ends 32 of the connection sheet 3 is electrically connected with the upper end of diode chip for backlight unit 4 by solder(ing) paste；
One epoxy body 8 is coated on the Support 5 of the first lead bar 1, the weld zone 7 of the second lead bar 2, connection sheet 3 and two
The surface of pole pipe chip 4；
Region is provided with one first bending bar 9 between the pin area 61 of Support 5 and first of the first lead bar 1, and this
One bending bar 9 exposes epoxy body 8；
Region is provided with one second bending bar 10 between the weld zone 7 of the second lead bar 2 and second pin area 62, and this
Eighty percent discount curved strip 10 exposes epoxy body；
First pin area 61 of the first lead bar 1 and the second pin area 62 of the second lead bar 2 are less than in vertical direction
The lower surface of epoxy body 8, and gap is left in vertical direction with the lower surface of epoxy body 8；
The lower surface of epoxy body 8 is provided with a groove 11, has several recessed on the madial wall and bottom wall of this groove 11
Point 12.
Embodiment 2：A kind of patch type SOD diode, including：First lead bar 1, the second lead bar 2, connection sheet 3 and two
Pole pipe chip 4, the one end of the first lead bar 1 is the Support 5 being connected with diode chip for backlight unit 4, and the lower end of diode chip for backlight unit 4 leads to
Cross solder(ing) paste to electrically connect with the Support 5, the other end of the first lead bar 1 is the first pin area 61；
Described one end of second lead bar 2 is the weld zone 7 being connected with the first welding ends 31 of the connection sheet 3, and this second
The other end of lead bar 2 is second pin area 62, and the first lead bar 1, the second pin area 62 of the second lead bar 2 are used as the patch
The electric current transmission end of chip SOD diodes；
Second welding ends 32 of the connection sheet 3 is electrically connected with the upper end of diode chip for backlight unit 4 by solder(ing) paste；
One epoxy body 8 is coated on the Support 5 of the first lead bar 1, the weld zone 7 of the second lead bar 2, connection sheet 3 and two
The surface of pole pipe chip 4；
Region is provided with one first bending bar 9 between the pin area 61 of Support 5 and first of the first lead bar 1, and this
One bending bar 9 exposes epoxy body 8；
Region is provided with one second bending bar 10 between the weld zone 7 of the second lead bar 2 and second pin area 62, and this
Eighty percent discount curved strip 10 exposes epoxy body；
First pin area 61 of the first lead bar 1 and the second pin area 62 of the second lead bar 2 are less than in vertical direction
The lower surface of epoxy body 8, and gap is left in vertical direction with the lower surface of epoxy body 8；
The lower surface of epoxy body 8 is provided with a groove 11, has several recessed on the madial wall and bottom wall of this groove 11
Point 12.
Angle is 90 ° between the bending bar 9 of Support 5 and first of above-mentioned first lead bar 1, the second lead bar 2
Angle is 90 ° between the bending bar 10 of weld zone 7 and second.
Angle is 90 ° between first bending bar 9 of above-mentioned first lead bar 1 and the first pin area 61, second lead
Angle is 90 ° between second bending bar 10 of bar 2 and second pin area 62.
During using above-mentioned patch type SOD diode, its epoxy body lower surface is provided with a groove, the madial wall of this groove and
There are several concave points on bottom wall, when device is fixed by red glue and PCB, enhance the knot of device and pcb board
With joint efforts；Secondly, the pin area of the pin area of its first lead bar and the second lead bar is less than under epoxy body in vertical direction
Surface, and gap is left in vertical direction with epoxy body lower surface, epoxy body lower surface is provided with a groove, is advantageous to red glue
It is vented during bonding, avoids device sideslip, greatly reduces the sealing-off probability of device and pcb board.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (3)
1. a kind of patch type SOD diode, including：First lead bar（1）, the second lead bar（2）, connection sheet（3）And diode
Chip（4）, the first lead bar（1）One end is and diode chip for backlight unit（4）The Support of connection（5）, the diode chip for backlight unit（4）
Lower end passes through solder(ing) paste and the Support（5）Electrical connection, the first lead bar（1）The other end is the first pin area（61）；
The second lead bar（2）One end is and the connection sheet（3）The first welding ends（31）The weld zone of connection（7）, should
Second lead bar（2）The other end is second pin area（62）, the first lead bar（1）, the second lead bar（2）Second pin area
（62）Electric current transmission end as the patch type SOD diode；
The connection sheet（3）The second welding ends（32）With diode chip for backlight unit（4）Upper end is electrically connected by solder(ing) paste；
It is characterized in that：One epoxy body（8）It is coated on the first lead bar（1）Support（5）, the second lead bar（2）Welding
Area（7）, connection sheet（3）And diode chip for backlight unit（4）Surface；
The first lead bar（1）Support（5）With the first pin area（61）Between region be provided with one first bending bar（9）,
This first bending bar（9）Expose epoxy body（8）；
The second lead bar（2）Weld zone（7）With second pin area（62）Between region be provided with one second bending bar（10）,
This second bending bar（10）Expose epoxy body；
First lead bar（1）The first pin area（61）With the second lead bar（2）Second pin area（62）In vertical direction
Less than epoxy body（8）Lower surface, and with epoxy body（8）Gap is left in vertical direction in lower surface；
The epoxy body（8）Lower surface is provided with a groove（11）, this groove（11）Madial wall and bottom wall on there are several
Concave point（12）.
2. patch type SOD diode according to claim 1, it is characterised in that：The first lead bar（1）Support
（5）With the first bending bar（9）Between angle be 90 °, the second lead bar（2）Weld zone（7）With the second bending bar（10）
Between angle be 90 °.
3. patch type SOD diode according to claim 1, it is characterised in that：The first lead bar（1）The first folding
Curved strip（9）With the first pin area（61）Between angle be 90 °, the second lead bar（2）The second bending bar（10）With second
Pin area（62）Between angle be 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721007535.7U CN207199601U (en) | 2017-08-12 | 2017-08-12 | Patch type SOD diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721007535.7U CN207199601U (en) | 2017-08-12 | 2017-08-12 | Patch type SOD diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207199601U true CN207199601U (en) | 2018-04-06 |
Family
ID=61797405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721007535.7U Active CN207199601U (en) | 2017-08-12 | 2017-08-12 | Patch type SOD diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207199601U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293525A (en) * | 2017-08-12 | 2017-10-24 | 苏州锝耀电子有限公司 | Patch type SOD diode |
| CN110010702A (en) * | 2019-03-29 | 2019-07-12 | 如皋市大昌电子有限公司 | A kind of good stamp-mounting-paper diode of leakproofness |
-
2017
- 2017-08-12 CN CN201721007535.7U patent/CN207199601U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293525A (en) * | 2017-08-12 | 2017-10-24 | 苏州锝耀电子有限公司 | Patch type SOD diode |
| CN110010702A (en) * | 2019-03-29 | 2019-07-12 | 如皋市大昌电子有限公司 | A kind of good stamp-mounting-paper diode of leakproofness |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |