CN207199577U - The temperature-adjusting device of manufacture of semiconductor - Google Patents
The temperature-adjusting device of manufacture of semiconductor Download PDFInfo
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- CN207199577U CN207199577U CN201721082658.7U CN201721082658U CN207199577U CN 207199577 U CN207199577 U CN 207199577U CN 201721082658 U CN201721082658 U CN 201721082658U CN 207199577 U CN207199577 U CN 207199577U
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- module
- temperature
- cooling
- manufacture
- adjusting device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 82
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims abstract description 10
- 230000004308 accommodation Effects 0.000 claims abstract description 9
- 238000005086 pumping Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 14
- 230000009183 running Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of temperature-adjusting device of manufacture of semiconductor, it includes：One casing, its outside is provided with an at least input port and a delivery outlet, and has an accommodation space in the casing；One radiating module, it is located at the accommodation space；One cold generating module, it has a heating part and a refrigeration portion, and the cold generating module has an at least cooling chip, and the heating part group is connected to the radiating module；One cooling structure, group set the refrigeration portion, and with least one runner for supplying a liquid communication, and the runner is respectively communicated with the input port and the delivery outlet；And a control module, it controls the start of the radiating module and the cold generating module；Wherein, temperature control mainly is carried out to the liquid in the runner through the cold generating module, therefore, the utility model need not install compressor, the effect of reaching simplified the utility model device volume and cost, and have small volume, radiating efficiency high and improve yield.
Description
Technical field
The utility model and a kind of thermostat device-dependent, particularly relate to a kind of temperature adjustment dress of manufacture of semiconductor
Put.
Background technology
Press, in semiconductor industry processing procedure, heat energy caused by the change of environment temperature or work implements operation is often
Have influence on the temperature of work table.
Thus it is common to use within the scope of a temperature-adjusting device by the temperature of work table to be maintained at certain, and
Processing procedure is set stably to carry out to maintain good test or workmanship；By taking current low temperature thermostat bath equipment as an example, its energy
Tank carries out isothermal experiments in machine, or is connected by flexible pipe with other equipment, is supported the use as constant temperature source；It is widely used in
Oil, chemical industry, electronic instrument, physics, chemistry, bioengineering, medical and health, life science, light industry and food, physical property measurement and change
Credit Xi Deng research departments, institution of higher learning, enterprise's quality inspection and production division, to provide the field of a temperature homogeneous constant during work
Source, steady temperature experiment or test are carried out to test specimen or the product of production.
However, above-mentioned low temperature thermostat bath equipment its by compressor, condenser, evaporator, blower fan (inside and outside) water circulating pump,
Stainless steel inner container, heating tube and temp controlled meter are formed, also, the cryostat, internal operation principle be compressor operation after through air-breathing,
Compression, exhaust, condensation, again throttling, low-temperature evaporation heat absorption vaporization so that water temperature be down to temperature set by temp controlled meter.
More know in detail, compressor is one of important component in low temperature thermostat bath, and its operation principle is mainly basis
The relation of pressure volume and temperature in physics, when the timing of quality one of gas, the product of pressure and volume is a constant；Cause
This, will realize one times of the pressure rise of the gas of unit mass, must just make its volume-diminished half, have and own on the market at present
Low temperature thermostat bath be mostly according to using compressor to entering to move gas compression.
But because the setting of compressor can make the low temperature thermostat bath equipment form one group of large-scale equipment, and not only can
Enough quietly runnings, so as to which integral device volume is big, and can not operatively control the temperature in test request in manufacture of semiconductor
Degree；Importantly, the low temperature thermostat bath equipment of installing compressor must carry out maintenance often, and refrigerant is used also during its running
Environment can be polluted；Furthermore when generation generation cooling effect is bad, most of is all cold draining matchmaker caused by cold draining matchmaker
Frozen water machine, which can be directly resulted in, to freeze, therefore need leakage detection mending-leakage, and this situation is often delayed processing procedure, and maintenance is not easy.
In addition, only stop by compressor start-stop to control temperature, but because control precision does not reach requirement, and its switching on and shutting down additionally consumes
Take much electricity, frequently switch on the service life that chance shortens compressor, and noise is big, moreover, common fixed-frequency-type compressor
Machine is restarted after a shutdown, it is necessary to is delayed more than three minutes, but in this is three minutes, temperature may significantly go up, and cause
The fluctuation of temperature and the problem of influence control accuracy.
Therefore this case creator is observing above-mentioned missing, there is generation of the present utility model then.
Utility model content
Main purpose of the present utility model is to provide a kind of temperature-adjusting device of manufacture of semiconductor, and it is through multiple
The setting of cooling chip, cooled with the liquid bulk to manufacture of semiconductor, and these cooling chips have be easily changed, and
Overall maintenance cost and maintenance time can be greatly reduced, meanwhile, it can more provide and manufacture of semiconductor of the present utility model is set
The product yield of equipment is kept more than certain level.
Secondary objective of the present utility model is to provide a kind of temperature-adjusting device of manufacture of semiconductor, through multiple causes
The setting of cold core piece, to substitute the compressor and other related refrigerating assemblies in prior art, so as to manufacture of semiconductor
Liquid carries out cooling action, in order to up to efficiency is good, temperature control is good, operation is convenient, cost is greatly reduced and can have tune control
The purpose of temperature.
A further object of the present utility model is to provide a kind of temperature-adjusting device of manufacture of semiconductor, it is not necessary to installing pressure
Contracting machine, and these cooling chips can be radiated in a manner of air cooling radiating or water-cooling, and then effectively lift this practicality
New temperature-adjusting device service life, and using the setting of multiple cooling chips regulation and control fluid temperature, can reach and simplify this
Utility model equipment volume and cost, and with small volume, radiating efficiency height and the purpose for improving yield.
For the above-mentioned purpose, the temperature-adjusting device of manufacture of semiconductor provided by the utility model, it includes：One
Casing, it is that outside is provided with an at least input port and a delivery outlet, and has an accommodation space in the casing；One radiating mould
Block, it is located at the accommodation space；One cold generating module, it has a heating part and a refrigeration portion, and the cold generating module has extremely
A few cooling chip, and the heating part group is connected to the radiating module；One cooling structure, its group set the refrigeration portion, and institute
Stating cooling structure has an at least runner, and the runner supplies a liquid communication, and the runner be respectively communicated with the input port and
The delivery outlet；And a control module, it is electrically connected with the radiating module and the cold generating module, and the control module control
Make the start of the radiating module and the cold generating module.
It is preferred that wherein described cold generating module has multiple cooling chips.
It is preferred that wherein described radiating module is made up of multiple radiating fins, and the multiple radiating fin is in interval
Set, and be mounted on the heating part, the casing, which is also organized, is provided with an at least fan unit.
It is preferred that be wherein also equipped with two through holes on the outside of the casing, the radiating module includes a water-cooling head, multiple
Woven hose and a pumping, the water-cooling head has a flow chamber, and the water-cooling head is mounted on the heating part, the water cooling
Head outside is provided with least two connection ends, and at least two connection ends are connected with the flow chamber, and the multiple woven hose
Through at least two connection ends described in two through hole and connection, the pumping is connected to a wherein woven hose, so that the water cooling
Head, the multiple woven hose and the pumping form a liquid radiating path.
It is preferred that wherein described radiating module also includes a liquid storing barrel, the liquid storing barrel connects with the woven hose, and institute
State transfusion barrel and have an aqueous.
It is preferred that wherein described cooling structure has a cooling block, the side of the cooling block connects the cooling chip,
The runner is equipped with the cooling block, the both ends of the runner connect the input port and the delivery outlet respectively.
It is preferred that wherein described cooling block is made up of metal material.
It is preferred that wherein also including a detecting module, the detecting module is interior located at the casing and is electrically connected with institute
Control module and the control module are stated, and the detecting module has an alarm unit, a fluid flow detecting unit and one
Sensing unit.
It is preferred that wherein also including a communication module, the communication module telecommunications connects the control module, and described
Control module is a temperature control main frame.
It is preferred that wherein described temperature-adjusting device is installed in semiconductor system equipment.
The temperature-adjusting device of manufacture of semiconductor provided by the utility model, it is mainly used in an edition semiconductor system and sets
In standby, and cooled for liquid of its running, also, the utility model is when operating state, mainly through the refrigeration mould
Block carries out temperature control to the liquid in the runner, also, the radiating module is to being that heat energy caused by cooling chip is carried out
Radiating, and radiating module of the present utility model can be that air cooling is radiated or the mode of water-cooling dissipates to these cooling chips
Heat, and then effectively lift temperature-adjusting device service life of the present utility model；Thereby, the utility model passes through multiple refrigeration cores
The setting of piece, to substitute the compressor and other related refrigerating assemblies in prior art, so as to manufacture of semiconductor
Liquid carries out cooling action, in order to up to efficiency is good, temperature control is good, operation is convenient, cost is greatly reduced and controls liquid with having tune
The effectiveness of temperature.
Brief description of the drawings
Fig. 1 is the block schematic diagram of the utility model first embodiment.
Fig. 2 is the configuration diagram of the utility model first embodiment.
Fig. 3 is the stereogram of the utility model first embodiment.
Fig. 4 uses schematic diagram for the utility model first embodiment.
Fig. 5 is the configuration diagram of the utility model second embodiment.
Fig. 6 is the stereogram of the utility model second embodiment.
Fig. 7 uses schematic diagram for the utility model second embodiment.
Fig. 8 is the block schematic diagram of the utility model 3rd embodiment.
Description of reference numerals：
100- temperature-adjusting devices；10- casings；11- input ports；12- delivery outlets；13- accommodation spaces；14- through holes；20-
Radiating module；21- radiating fins；22- fan units；23- water-cooling heads；231- flow chambers；232- connection ends；24- woven hoses；
25- pumpings；26- liquid storing barrels；30- cold generating modules；31- heating parts；32- refrigeration portion；33- cooling chips；40- cooling structures；41-
Cooling block；42- runners；50- control modules；60- detecting modules；61- alarm units；62- fluid flow detecting units；63- feels
Survey unit；70- communication modules；A- liquid；B- aqueous.
Embodiment
Fig. 1 and Fig. 2 is referred to, and is coordinated shown in Fig. 3, is block schematic diagram, the framework of the utility model first embodiment
Schematic diagram and stereogram, it discloses the temperature-adjusting device 100 for having a kind of manufacture of semiconductor, the temperature of the manufacture of semiconductor
Degree adjusting means 100 includes：
One casing 10, it is that outside is provided with an at least input port 11 and a delivery outlet 12, and has one in the casing 10
Accommodation space 13.
One radiating module 20, it is located at the accommodation space 13, also, the radiating module 20 is by multiple institutes of radiating fin 21
Form, and these radiating fins 21 are set in distance, the radiating module 20 is more also organized in the casing 10 and is provided with an at least wind
Fan unit 22.
One cold generating module 30, it has a heating part 31 and a refrigeration portion 32, and the cold generating module 30 has at least consistent
Cold core piece 33, and 31 groups of the heating part is connected to the radiating module 20；In the present embodiment, the cold generating module 30 has more
Individual cooling chip 33.
One cooling structure 40, its group sets the refrigeration portion 32, and the cooling structure 40 has an at least runner 42, described
Runner 42 circulates for a liquid A, and the runner 42 is respectively communicated with the input port 11 and the delivery outlet 12；In the present embodiment
In, the cooling structure 40 has one to form cooling block 41 by metal material, and the metal material is by taking aluminium as an example, and the drop
The side of warm block 41 connects the cooling chip 33, also, the runner 42 is equipped with the cooling block 41, the runner 42
Both ends connect the input port 11 and the delivery outlet 12 respectively.
One control module 50, it is electrically connected with the radiating module 20 and the cold generating module 30, and the control module
The start of the 50 controls radiating module 20 and the cold generating module 30；In the present embodiment, the control module 50 is a temperature
Control main frame.
One detecting module 60, the detecting module 60 in the casing 10 and be electrically connected with the control module 50 and
The control module 50, and the detecting module 60 has an alarm unit 61, a fluid flow detecting unit 62 and a sensing
Unit 63.
For further appreciating that the utility model construction feature, application technology means and desired the effect of reaching, hereby will
The utility model occupation mode is described, it is believed that when that can have therefrom to the utility model deeper into and specifically understand, such as
It is lower described：
Refer to Fig. 1 and Fig. 2, and coordinate shown in Fig. 3 and Fig. 4, be the utility model first embodiment block schematic diagram,
Configuration diagram, stereogram and use schematic diagram.It is mainly used in edition semiconductor system equipment, and for the liquid of its running
A is cooled, also, the utility model, when operating state, the control module 50 can pass through the fluid flow detecting unit
62 and the sensing unit 63 measure liquid A flow and temperature in the runner 42, so as to right using the control module 50
The runner 42 carries out temperature controlled program, meanwhile, these cooling chips 33 are in the runner 42 of the cooling structure 40
Liquid A is cooled, also, the heat energy of running is passed through these radiating fins 21 and the fan unit 22 by these cooling chips 33
Running, is radiated with the heating part 31 to these cooling chips 33.
It follows that the utility model passes through temperature range of the control module 50 according to acquiescence, effectively to regulate and control these
The cooling degree of cooling chip 33, and the Collaboration of arrange in pairs or groups these radiating fins 21 and the fan unit 22, so that refrigeration
The refrigeration portion 32 of chip 33 and the temperature difference of the heating part 31 are maintained in preferable value range, and then effectively lift these causes
The service life of cold core piece 33.
Importantly, the utility model passes through the setting of multiple cooling chips 33, to substitute the compressor in prior art
And other related refrigerating assemblies, so as to carrying out cooling action to the liquid A of manufacture of semiconductor, in order to up to efficiency is good, temperature control
It is good, operation is convenient, cost is greatly reduced and can have controls the effectiveness of liquid A temperature with adjusting.
Referring again to Fig. 5 and Fig. 6, and coordinate shown in Fig. 7, be the configuration diagram of the utility model second embodiment, stand
Body figure and use schematic diagram.The present embodiment is compared with first embodiment, and its difference is that the outside of casing 10 is more worn
There are two through holes 14, the radiating module 20 is by 26 water-cooling head 23, multiple woven hoses 24, a pumping 25 and a liquid storing barrel groups
Into the water-cooling head 23 has a flow chamber 231, and the water-cooling head 23 is mounted on the heating part 31, the water-cooling head
23 outsides are provided with least two connection ends 232, and these connection ends 232 are connected with the flow chamber 231, and these woven hoses 24
Through these through holes 14 and these connection ends 232 are connected, the pumping 25 is connected to a wherein woven hose 24, and the pumping 25
The liquid storing barrel 26 is more connected, so that the water-cooling head 23, the liquid storing barrel 26, these woven hoses 24 and the pumping 25 are formed
One liquid A heat dissipation path；When operating state, due to the aqueous B the flow chamber 231 flow, and the aqueous B
It is attached directly on the heating part 31, the aqueous B directly and is quickly produced heat exchange action with heating part 31, afterwards
Pumping 25 drives the aqueous B to be flowed in the liquid A heat dissipation path, can be effective so constantly under working fluid circulation
Ground makes the refrigeration face of these cooling chips 33 and the temperature difference of radiating surface be maintained in preferable value range；With this, the present embodiment
It is equally reached implementation effect such as first embodiment.
It is the block schematic diagram of the utility model 3rd embodiment please continue to refer to shown in Fig. 8.The present embodiment and first is in fact
Apply example and second embodiment is compared, its difference is that the utility model also includes a communication module 70, the communication mould
The telecommunications of block 70 connects the control module 50, and the communication module 70 can connect the main frame outside one in a wired or wireless manner
(not shown), so that semiconductor process system equipment can pass through control module 50 described in the mainframe on-line, to capture
Detect the data in road with or the manipulation control module 50；With this, the present embodiment is equally reached such as first embodiment
Implement effect.
It is noted that the utility model cooling structure 40 can set multiple runners 42, for being carried out to a large amount of liquid As
Cooling acts.
It is worth being mentioned that again, temperature-adjusting device 100 of the present utility model is installed in Metalorganic chemical vapor deposition
In (MOCVD, Metal-organic Chemical Vapor Deposition) system equipment (not shown), and to having
The work of machine metallochemistry vapour deposition (MOCVD, Metal-organic Chemical Vapor Deposition) system equipment
The program to be cooled as liquid A.
Hereby, then by feature of the present utility model and its attainable expected effect it is presented below：
The temperature-adjusting device 100 of manufacture of semiconductor of the present utility model, it is mainly used in edition semiconductor system equipment
In, and cooled for liquid A of its running, also, the utility model is when operating state, mainly through the cold generating module
Liquid A in 30 pairs of runners 42 carries out temperature control, also, the radiating module 20 is to caused by the cooling chip 33
Heat energy is radiated, and radiating module of the present utility model 20 can be that air cooling is radiated or the mode of water-cooling is to these refrigeration cores
Piece 33 is radiated, and then effectively lifts the service life of temperature-adjusting device 100 of the present utility model.
With this, the utility model has following implementation effect and technical effect：
First, through the setting of multiple cooling chips 33, cooled with the liquid A body to manufacture of semiconductor, and this
A little cooling chips 33, which have, to be easily changed, and overall maintenance cost and maintenance time can be greatly reduced, meanwhile, it can more provide
Semiconductor system equipment of the present utility model is set (for example, Metalorganic chemical vapor deposition (MOCVD, Metal-organic
Chemical Vapor Deposition) system equipment) product yield keep more than certain level.
Second, the utility model passes through the setting of multiple cooling chips 33, with substitute compressor in prior art and its
His related refrigerating assembly, so as to carry out cooling action with the liquid A to manufacture of semiconductor, in order to up to efficiency is good, temperature control is good, makees
Industry is convenient, cost is greatly reduced and can have the effect of controlling temperature with adjusting.
Third, the utility model need not install compressor, and can be in a manner of air cooling radiating or water-cooling to these causes
Cold core piece 33 is radiated, and then effectively lifts the service life of temperature-adjusting device 100 of the present utility model, and utilizes multiple causes
Cold core piece 33 regulates and controls the setting of liquid A temperature, can reach simplified the utility model device volume and cost, and with small volume,
The effect of radiating efficiency is high and improves yield.
In summary, the utility model has its splendid progress practicality in fact in like product, while domestic and international all over looking into
Also find no identical construction on the technical data of this class formation, in document to exist formerly, therefore the utility model is real
Possesses new patent important document, whence is filed an application in accordance with the law.
Only, as described above, preferably possible embodiments only of the present utility model, therefore applies the utility model such as
Equivalent structure change carried out by specification and claim, ought to be included in the scope of the claims of the present utility model.
Claims (10)
1. a kind of temperature-adjusting device of manufacture of semiconductor, it is characterised in that include：
One casing, its outside is provided with an at least input port and a delivery outlet, and has an accommodation space in the casing；
One radiating module, it is located at the accommodation space；
One cold generating module, it has a heating part and a refrigeration portion, and the cold generating module has an at least cooling chip, and described
Heating part group is connected to the radiating module；
One cooling structure, its group sets the refrigeration portion, and the cooling structure has an at least runner, and the runner supplies a liquid
Circulation, and the runner is respectively communicated with the input port and the delivery outlet；And
One control module, it is electrically connected with the radiating module and the cold generating module, and control module control is described scattered
The start of thermal modules and the cold generating module；
Wherein, temperature control mainly is carried out to the liquid in the runner through the cold generating module, the radiating module is to institute
Heat energy caused by cooling chip is stated to be radiated.
2. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that the cold generating module tool
There are multiple cooling chips.
3. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that the radiating module by
Multiple radiating fins are formed, and the multiple radiating fin is set in distance, and are mounted on the heating part, and the casing is also
Group is provided with an at least fan unit.
4. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that on the outside of the casing also
Two through holes are equipped with, the radiating module includes a water-cooling head, multiple woven hoses and a pumping, and the water-cooling head has one stream
Dynamic chamber, and the water-cooling head is mounted on the heating part, is provided with least two connection ends on the outside of the water-cooling head, and described at least two
Connection end is connected with the flow chamber, and at least two connections described in the multiple woven hose through two through hole and connection
End, the pumping are connected to a wherein woven hose, so that the water-cooling head, the multiple woven hose and the pumping form a liquid
Body heat dissipation path.
5. the temperature-adjusting device of manufacture of semiconductor according to claim 4, it is characterised in that the radiating module is also
Including a liquid storing barrel, the liquid storing barrel connects with the woven hose, and the transfusion barrel has an aqueous.
6. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that the cooling structure tool
There is a cooling block, the side of the cooling block connects the cooling chip, the runner, the stream are equipped with the cooling block
The both ends in road connect the input port and the delivery outlet respectively.
7. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that the cooling block is by gold
Category material is formed.
8. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that also include a detecting
Module, the detecting module is in the casing and is electrically connected with the control module and the control module, and described detects
Surveying module has an alarm unit, a gas flow detecting unit and a sensing unit.
9. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that also include a communication
Module, the communication module telecommunications connects the control module, and the control module is a temperature control main frame.
10. the temperature-adjusting device of manufacture of semiconductor according to claim 1, it is characterised in that the temperature adjustment
Device is installed in semiconductor system equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721082658.7U CN207199577U (en) | 2017-08-28 | 2017-08-28 | The temperature-adjusting device of manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721082658.7U CN207199577U (en) | 2017-08-28 | 2017-08-28 | The temperature-adjusting device of manufacture of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207199577U true CN207199577U (en) | 2018-04-06 |
Family
ID=61795190
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721082658.7U Expired - Fee Related CN207199577U (en) | 2017-08-28 | 2017-08-28 | The temperature-adjusting device of manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207199577U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857297A (en) * | 2020-07-31 | 2020-10-30 | 广州狸园科技有限公司 | Big data server heat abstractor |
-
2017
- 2017-08-28 CN CN201721082658.7U patent/CN207199577U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857297A (en) * | 2020-07-31 | 2020-10-30 | 广州狸园科技有限公司 | Big data server heat abstractor |
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