CN207190189U - A kind of LED semiconductor packaging molds stripper apparatus - Google Patents
A kind of LED semiconductor packaging molds stripper apparatus Download PDFInfo
- Publication number
- CN207190189U CN207190189U CN201720929188.7U CN201720929188U CN207190189U CN 207190189 U CN207190189 U CN 207190189U CN 201720929188 U CN201720929188 U CN 201720929188U CN 207190189 U CN207190189 U CN 207190189U
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- CN
- China
- Prior art keywords
- lower template
- upper impression
- semiconductor packaging
- cooling fan
- impressions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The utility model discloses a kind of LED semiconductor packaging molds stripper apparatus,Including cope plate and lower template,Upper impression is provided with the downside of the cope plate,Lower impressions are provided with below the upper impression,Lower template is installed on the downside of the lower impressions,Frame body is provided between the upper impression and lower impressions,The lower template both sides are welded with L-shaped support frame,Pulley is installed on the inside of the L-shaped support frame,The lower template is internally provided with installation cavity,Bottom side is provided with electric expansion bar and temperature sensor inside installation cavity,The electric expansion bar is connected by connecting rod with thimble,The thimble passes lower template and lower impressions,Installation cavity side is provided with thermovent,It is close to cooling fan in described thermovent one end,The cooling fan is arranged on lower template inwall side,The lower template side is provided with screen pack,Screen pack and the cooling fan position is relative.The utility model is provided with colloid by thimble front end, product can be avoided to crack.
Description
Technical field
Stripper apparatus field is the utility model is related to, specifically a kind of LED semiconductor packaging molds stripper apparatus.
Background technology
Often there are LED semiconductors and cracked during demoulding in LED semiconductor packaging molds, cope plate and upper impression
Swing, reduce product quality, high temperature is easily damaged lower impressions, and well dust can not be avoided to enter in radiation processes
Device interior, reduce the service life of equipment.
Utility model content
The purpose of this utility model is to provide a kind of LED semiconductor packaging molds stripper apparatus, to solve prior art
In service life it is shorter, product quality is relatively low, product cracks and is easily damaged lower impressions problem with high temperature.
To achieve the above object, the utility model provides following technical scheme：A kind of LED semiconductor packaging molds demoulding dress
Put, including cope plate and lower template, the cope plate downside are provided with upper impression, lower impressions are provided with below the upper impression,
Lower template is installed on the downside of the lower impressions, frame body, the lower template two are provided between the upper impression and lower impressions
Side is welded with L-shaped support frame, and pulley is provided with the inside of the L-shaped support frame, and the lower template is internally provided with installation cavity, installation
Intracavitary portion bottom side is provided with electric expansion bar and temperature sensor, and the electric expansion bar is connected by connecting rod with thimble, described
Thimble passes lower template and lower impressions, and installation cavity side is provided with thermovent, and cooling fan is close in described thermovent one end, described
Cooling fan is arranged on lower template inwall side, and the lower template side is provided with screen pack, the screen pack and cooling fan
Position is relative.
Preferably, the pulley is slidably connected with the slideway on the outside of cope plate and upper impression.
Preferably, the screen pack is removably mounted at lower template side.
Preferably, the thimble front end is provided with colloid.
Preferably, frequency converter is installed on the cooling fan.
Compared with prior art, the beneficial effects of the utility model are：The utility model passes through pulley and cope plate and upper
Slideway on the outside of die cavity is slidably connected, and can be good at avoiding cope plate and upper impression in knockout course to produce swing, so as to keep away
Exempt to cause damage of product, lower template side is removably mounted at by screen pack, can be avoided when being radiated to lower impressions
Dust enters inside, so as to improve the service life of equipment, thimble front end is provided with colloid, product can be avoided to produce
Raw crackle, by being provided with frequency converter on cooling fan, it can be good at realizing and lower impressions radiated, avoid temperature too high
Damage lower impressions.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is front view of the present utility model.
In figure：1- cope plates, 2- upper impressions, 3- lower templates, 4- lower impressions, 5- frame bodies, 6- screen packs, 7-L shape branch
Support, 8- pulleys, 9- colloids, 10- thermovents, 11- cooling fans, 12- thimbles, 13- connecting rods, 14- temperature sensors, 15- electricity
Dynamic expansion link.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Refer to Fig. 1~2, in the utility model embodiment, a kind of LED semiconductor packaging molds stripper apparatus, including it is upper
Template 1 and lower template 3, the downside of cope plate 1 are provided with upper impression 2, and the lower section of upper impression 2 is provided with lower impressions 4, the downside of lower impressions 4
Lower template 3 is installed, frame body 5 is provided between upper impression 2 and lower impressions 4, the both sides of lower template 3 are welded with L-shaped support frame
7, the inner side of L-shaped support frame 7 is provided with pulley 8, and lower template 3 is internally provided with installation cavity, and installation cavity inside bottom side is provided with electronic
Expansion link 15 and temperature sensor 14, electric expansion bar 15 are connected by connecting rod 13 and thimble 12, and thimble 12 passes the He of lower template 3
Lower impressions 4, installation cavity side are provided with thermovent 10, and cooling fan 11 is close in the one end of thermovent 10, and cooling fan 11 is arranged on
The inwall side of lower template 3, the side of lower template 3 are provided with screen pack 6, and screen pack 6 is relative with the position of cooling fan 11, in use,
Cope plate 1 drives upper impression 2 to move downward, and the lower impressions 4 in upper impression 2 and lower template 3 are bonded, and then electric expansion bar 15 is dynamic
Make, realized by the thimble 12 on connecting rod 13 and push the upper impression 2 on cope plate 1 open, so as to realize the demoulding, the energy of cooling fan 11
Enough realize well is radiated to lower impressions 4, is avoided temperature too high, is caused lower impressions 4 to deform, influence product quality, passes through L-shaped branch
Support 7 and pulley 8, it can be good at avoiding cope plate 1 and upper impression 2 from rocking, so as to avoid damaging product, pulley 8 and upper mould
Plate 1 and the slideway in the outside of upper impression 2 are slidably connected, and screen pack 6 is removably mounted at the side of lower template 3, and the front end of thimble 12 is set
There is colloid 9, frequency converter is installed on cooling fan 11.
Operation principle of the present utility model is：In use, cope plate 1 drives upper impression 2 to move downward, upper impression 2 is with
Lower impressions 4 in template 3 are bonded, and then electric expansion bar 15 acts, and are realized by the thimble 12 on connecting rod 13 by cope plate 1
Upper impression 2 push open, so as to realize the demoulding, temperature sensor 14 is WRM-101 temperature sensors 14, and cooling fan 11 can be very
Good realization is radiated to lower impressions 4, is avoided temperature too high, is caused lower impressions 4 to deform, influence product quality, passes through L-shaped support frame
7 and pulley 8, it can be good at avoiding cope plate 1 and upper impression 2 from swinging, so as to avoid damaging product.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Claims (5)
1. a kind of LED semiconductor packaging molds stripper apparatus, including cope plate (1) and lower template (3), it is characterised in that:It is described
Upper impression (2) is provided with the downside of cope plate (1), is provided with lower impressions (4) below the upper impression (2), under the lower impressions (4)
Side is provided with lower template (3), and frame body (5), the lower template (3) are provided between the upper impression (2) and lower impressions (4)
Both sides are welded with L-shaped support frame (7), and pulley (8) is provided with the inside of the L-shaped support frame (7), is set inside the lower template (3)
Installation cavity is equipped with, bottom side is provided with electric expansion bar (15) and temperature sensor (14), the electric expansion bar inside installation cavity
(15) connected by connecting rod (13) and thimble (12), the thimble (12) passes lower template (3) and lower impressions (4), installation cavity one
Side is provided with thermovent (10), and cooling fan (11) is close in described thermovent (10) one end, and the cooling fan (11) is arranged on
Lower template (3) inwall side, lower template (3) side are provided with screen pack (6), the screen pack (6) and cooling fan
(11) position is relative.
A kind of 2. LED semiconductor packaging molds stripper apparatus according to claim 1, it is characterised in that：The pulley (8)
It is slidably connected with the slideway on the outside of cope plate (1) and upper impression (2).
A kind of 3. LED semiconductor packaging molds stripper apparatus according to claim 1, it is characterised in that：The screen pack
(6) it is removably mounted at lower template (3) side.
A kind of 4. LED semiconductor packaging molds stripper apparatus according to claim 1, it is characterised in that：The thimble
(12) front end is provided with colloid (9).
A kind of 5. LED semiconductor packaging molds stripper apparatus according to claim 1, it is characterised in that：The radiation air
Machine is provided with frequency converter on (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720929188.7U CN207190189U (en) | 2017-07-28 | 2017-07-28 | A kind of LED semiconductor packaging molds stripper apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720929188.7U CN207190189U (en) | 2017-07-28 | 2017-07-28 | A kind of LED semiconductor packaging molds stripper apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207190189U true CN207190189U (en) | 2018-04-06 |
Family
ID=61799073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720929188.7U Expired - Fee Related CN207190189U (en) | 2017-07-28 | 2017-07-28 | A kind of LED semiconductor packaging molds stripper apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207190189U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786294A (en) * | 2018-12-29 | 2019-05-21 | 铜陵三佳山田科技股份有限公司 | The mould bases of the multiple rows of automatic diaphragm capsule of ultra-wide suitable for automatic packaging system |
| CN110265528A (en) * | 2019-06-26 | 2019-09-20 | 俞烽 | A kind of full-automatic LED sealing machine and its packaging method |
-
2017
- 2017-07-28 CN CN201720929188.7U patent/CN207190189U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786294A (en) * | 2018-12-29 | 2019-05-21 | 铜陵三佳山田科技股份有限公司 | The mould bases of the multiple rows of automatic diaphragm capsule of ultra-wide suitable for automatic packaging system |
| CN110265528A (en) * | 2019-06-26 | 2019-09-20 | 俞烽 | A kind of full-automatic LED sealing machine and its packaging method |
| CN110265528B (en) * | 2019-06-26 | 2020-08-18 | 台州保镖电子有限公司 | Full-automatic LED packaging machine and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180406 Termination date: 20190728 |