CN110265528A - A kind of full-automatic LED sealing machine and its packaging method - Google Patents
A kind of full-automatic LED sealing machine and its packaging method Download PDFInfo
- Publication number
- CN110265528A CN110265528A CN201910560931.XA CN201910560931A CN110265528A CN 110265528 A CN110265528 A CN 110265528A CN 201910560931 A CN201910560931 A CN 201910560931A CN 110265528 A CN110265528 A CN 110265528A
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- mold
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- filling mould
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- 238000007789 sealing Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 55
- 230000001070 adhesive effect Effects 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 description 7
- 238000012536 packaging technology Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Making Paper Articles (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The present invention relates to a kind of full-automatic LED sealing machine and its packaging methods, including apparatus main body, mold fixes chamber, store drawer, sealing block, mold base, fixed pillar, bracket card slot and plate, the both ends of apparatus main body have been bolted fixed pillar, the inside of fixed pillar offers bracket card slot, the top center position of apparatus main body is equipped with the fixed chamber of mold, the down either side position of the fixed chamber of mold opens up fluted, the inside of groove is placed with storage drawer, the two sides top position of the fixed chamber of mold is mounted on sealing block, and it is fixed by plate, the top center of the fixed chamber of mold is embedded with mold base, the inside of the fixed chamber of mold offers counterbore.The present invention, is provided with the assembling adhesive filling mould of disassembly, can not only meet different product package requirements, but also be convenient for the later period maintenance and maintenance of mold, meanwhile, the table wall of adhesive filling mould is heated evenly, and the curing efficiency of glue is improved.
Description
Technical field
The present invention relates to LED packaging technology technical field, in particular to a kind of full-automatic LED sealing machine and its encapsulation side
Method.
Background technique
LED encapsulation technology is mostly to develop and be evolved in Discrete device packaging technical foundation, but have very big
Particularity.Under normal circumstances, the tube core of discrete device is sealed in packaging body, the effect of encapsulation mainly protect tube core and
Complete electric interconnection.And LED encapsulation is then to complete output electric signal, protection tube core works normally.LED packaging technology mainly includes
Die bond, primary baking, bonding wire, test, encapsulating and secondary baking etc..And full-automatic LED sealing machine is a kind of novel LED encapsulation
Machinery processes the important link in packaging technology by mechanical automation.
But existing full-automatic LED sealing machine is during carrying out encapsulating, is all that the glue that will be prepared is injected into finger
In fixed encapsulating die, by standing, drying forming.Due to the needs of producer, need to match more set encapsulating dies to meet not
With product requirement need, and traditional encapsulating die is made of integral cast, cause more mold exchange compared with
To be cumbersome, and the maintenance cost of mold is big, meanwhile, traditional encapsulating die is during being toasted, the body of die main body
Product is big, and uneven heating is even, causes the curing efficiency of glue slow.Therefore, a kind of adjustable building template for agitating torque is designed to tear open
Handler and its method for dismounting are necessary.
Summary of the invention
(1) technical problems to be solved
The present invention can solve in existing conventional packaging method, due to the needs of producer, need to match more set adhesive filling moulds
Have to meet different product requirement needs, and traditional encapsulating die is made of integral cast, is caused
More mold exchange is relatively complicated, and the maintenance cost of mold is big, meanwhile, traditional encapsulating die is during being toasted, mould
The volume for having main body is big, and uneven heating is even, causes the curing efficiency of glue slow.
(2) technical solution
To achieve the goals above, the invention adopts the following technical scheme: a kind of full-automatic LED sealing machine, including device
The fixed chamber of main body, mold, storage drawer, sealing block, mold base, fixed pillar, bracket card slot and plate, the two of apparatus main body
End has been bolted fixed pillar, and the inside of fixed pillar offers bracket card slot, the center of top position of apparatus main body
It sets and the fixed chamber of mold is installed, the down either side position of the fixed chamber of mold opens up fluted, and the inside of groove is placed with
Drawer is stored, the two sides top position of the fixed chamber of mold is mounted on sealing block, and is fixed by plate, and mold is fixed
The top center of chamber is embedded with mold base；
The fixed chamber of the mold includes positioning column, connecting hole and straight trough, and the inside of the fixed chamber of mold offers counterbore,
The bottom of counterbore is provided with positioning column, and the top of positioning column is embedded with the first magnet, and the middle section position of counterbore offers straight trough, directly
The inner wall of slot is equipped with guide post, and the inside of guide post offers connecting hole, is provided with sealing cover at the top of counterbore；
The mold base includes locating piece, radiating seat, adhesive filling mould, card slot, clamp device and support slot, the bottom of mold base
Rectangular channel is offered, the inside of rectangular channel is equipped with locating piece, and the inside of locating piece offers location hole, and the top of location hole is embedding
Entering has the second magnet, and radiating seat is uniformly distributed at the top of mold base, and the inner wall of radiating seat offers card slot, the inside of card slot
Clamp device is installed, the inside of radiating seat is placed with adhesive filling mould, and the outer wall of adhesive filling mould and the junction of clamp device offer
Arc groove, the middle position of mold base symmetrically offer support slot.
Wherein, the sealing block includes fixing groove, link slot, mandril, occlusal crib, extruding wheel, connecting column and support bar, close
The junction at the top and plate of sealing block offers fixing groove, and sealing block is provided with link slot above one end of mold base,
Link slot and sealing cover are matching mechanism, are provided with mandril below link slot, the inside of mandril offers occlusal crib, occlusal crib
Inside extruding wheel is equipped with by shaft, the two sides of mandril are provided with connecting column, and connecting column and connecting hole are fit structure,
The side of sealing block is welded with support bar close to the lower position of mandril, and support bar and support slot are fit structure, sealing block
When being closed inwardly, support bar snaps onto the inside of support slot, so that will not make to the bracket of LED when carrying out demoulding work
At damage.
Wherein, the clamp device includes dead ring, clutch disk, force fit plate and through-hole, and dead ring is placed on card slot
Inner wall, through-hole is distributed in the circumferentially uniform of dead ring, and in baking process, hot gas acts on adhesive filling mould uniformly through through-hole
Outer wall, so that the glue injected inside adhesive filling mould is uniform curing, the both ends of dead ring are welded with force fit plate, two pressings
It is fixed between plate by clutch disk, adhesive filling mould is locked by clamp device, guarantee that adhesive filling mould will not fall off when demoulding.
Wherein, the clutch disk includes line slide rail, reset spring, square groove and sliding block, in the inside of clutch disk
Heart position offers square groove, and the two sides up and down of square groove are mounted on line slide rail, and the upper end of line slide rail is fitted with
Sliding block, sliding block are welded on the outer wall of force fit plate, are equipped with reset spring between two sliding blocks, will be fastened by clutch disk
Ring is fixed on the inside of square groove.
Wherein, the quantity of the extruding wheel is three, and the radius of three extruding wheels is all different, three extruding
Wheel is installed step by step the inside of occlusal crib is descending, passes through the change of radius to realize the change of extruding force.
Wherein, the end of the force fit plate is a kind of globoidal structure, enables the extruding wheel of minimum diameter along cambered surface
It is moved, force fit plate is squeezed, guarantee that sliding block can be in the upper end normal movement of square groove.
Wherein, the inside of the storage drawer is placed with the adhesive filling mould of multiple and different shapes, meets different light emitting diodes
Encapsulation need.
Wherein, the bottom centre position of the radiating seat is provided with round bump, and the bottom centre position of adhesive filling mould opens up
There is circular trough, round bump and circular trough are matching mechanism, are carried out by round bump and circular trough to adhesive filling mould position opposite
Constraint, guarantees that the surface of adhesive filling mould is parallel to horizontal plane.
Furthermore the present invention also provides a kind of packaging method of full-automatic LED sealing machine, the envelopes of the full-automatic LED sealing machine
Dress method specifically includes the following steps:
S1, selection mold: according to product demand, storage drawer, adhesive filling mould needed for artificial taking-up are opened, and closes storage
Drawer；
S2, mold locking: the adhesive filling mould taken out in S1 is sequentially placed into the inside of radiating seat, hand is against adhesive filling mould
Top presses down on, so that the circular trough of adhesive filling mould bottom and the arc groove of outer wall are respectively clamped into round bump and dead ring
Outer wall, then sealing block is pushed, mandril movement is driven, so that the occlusal crib inside mandril is fitted in the outer wall of clutch disk, meanwhile,
The extruding wheel installed inside occlusal crib is moved along the cambered surface of force fit plate, force fit plate is inwardly squeezed, so that dead ring and arc groove
Between locking, finally plate is inserted into inside fixing groove, the locking of adhesive filling mould can be completed；
S3, LED support are fixed and encapsulating: taking out LED support, observes by the naked eye the both ends of LED support and bracket clamp
Slot, the artificial top for pressing LED support further take out syringe, sucking is matched until the Lamp cup of LED support drops into adhesive filling mould
Good glue, will first spray into release agent, then successively glue is injected into adhesive filling mould in adhesive filling mould；
S4, drying: the apparatus main body for filling glue is put into oven for baking, duration 10-15min；
S5, demoulding: the apparatus main body of drying is taken out from oven, is put into ingot stripper and is demoulded.
(3) beneficial effect
1, a kind of full-automatic LED sealing machine of the present invention, this big bright demand for different product are provided with independence
Adhesive filling mould can quickly finish the exchange of mold, and pass through fastening to be detachably connected between the adhesive filling mould and apparatus main body
Device clamping, is effectively guaranteed the stability of adhesive filling mould connection, the case where will not falling off during demoulding；
2, a kind of full-automatic LED sealing machine of the present invention, maintenance cost is low, when encapsulating die damages, only
Encapsulating head need to be simply replaced, whole device main body that no replacement is required；
3, a kind of full-automatic LED sealing machine of the present invention, retains certain gap between adhesive filling mould and clamp device,
And the outer wall of dead ring is evenly distributed with through-hole, guarantees apparatus main body in baking process, hot gas can be covered uniformly entirely
Adhesive filling mould, so that the curing efficiency of glue improves.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is overall structure side view of the invention；
Fig. 2 is overall structure top view of the invention；
Fig. 3 is the cross-sectional view of mold base of the invention；
Fig. 4 is the cross-sectional view of fixation chamber of the invention；
Fig. 5 is the partial cross-sectional view of clamp device of the invention；
Fig. 6 is the cross-sectional view of clutch disk of the invention；
Fig. 7 is the sectional view of sealing block of the invention；
Fig. 8 is flow chart of the invention.
Specific embodiment
Below with reference to the accompanying drawings the embodiment of the present invention is illustrated.In the process, for ensure illustrate definition and
Convenience, we may the width to lines in diagram or constituent element the mark exaggerated of size.
In addition, term hereinafter is defined based on the function in the present invention, it can be according to the intention of user, fortune user
Or convention and difference.Therefore, these terms are defined based on the full content of this specification.
As shown in figures 1-8, a kind of full-automatic LED sealing machine, including the fixed chamber 2 of apparatus main body 1, mold, storage drawer
3, sealing block 4, mold base 5, fixed pillar 6, bracket card slot 7 and plate 8, the both ends of apparatus main body 1 have been bolted
Fixed pillar 6, the inside of fixed pillar 6 offer bracket card slot 7, and it is solid that the top center position of apparatus main body 1 is equipped with mold
Determine chamber 2, the down either side position of the fixed chamber 2 of mold opens up fluted, and the inside of groove is placed with storage drawer 3, mould
The two sides top position for having fixed chamber 2 is mounted on sealing block 4, and is fixed by plate 8, the fixed chamber 2 of mold
Top center is embedded with mold base 5；
The fixed chamber 2 of the mold includes positioning column 21, connecting hole 22 and straight trough 23, and the inside of the fixed chamber 2 of mold is opened
Equipped with counterbore, the bottom of counterbore is provided with positioning column 21, and the top of positioning column 21 is embedded with the first magnet, the middle section position of counterbore
Straight trough 23 is offered, the inner wall of straight trough 23 is equipped with guide post, and the inside of guide post offers connecting hole 22, is provided at the top of counterbore
Sealing cover；
The mold base 5 includes locating piece 51, radiating seat 52, adhesive filling mould 53, card slot 54, clamp device 55 and support slot
56, the bottom of mold base 5 offers rectangular channel, and the inside of rectangular channel is equipped with locating piece 51, and the inside of locating piece 51 offers
Location hole is embedded with the second magnet at the top of location hole, and the top of mold base 5 is uniformly distributed with radiating seat 52, radiating seat 52
Inner wall offer card slot 54, the inside of card slot 54 is equipped with clamp device 55, and the inside of radiating seat 52 is placed with adhesive filling mould 53,
The outer wall of adhesive filling mould 53 and the junction of clamp device 55 offer arc groove, and the middle position of mold base 5, which symmetrically offers, holds
Bracket 56.
The sealing block 4 includes fixing groove 41, link slot 42, mandril 43, occlusal crib 44, extruding wheel 45,46 and of connecting column
Support bar 47, the top of sealing block 4 and the junction of plate 8 offer fixing groove 41, and sealing block 4 is close to one end of mold base 5
Top is provided with link slot 42, and link slot 42 and sealing cover are matching mechanism, and the lower section of link slot 42 is provided with mandril 43, mandril
43 inside offers occlusal crib 44, and the inside of occlusal crib 44 is equipped with extruding wheel 45 by shaft, and the two sides of mandril 43 are all provided with
It is equipped with connecting column 46, connecting column 46 and connecting hole 22 are fit structure, and the side of sealing block 4 is welded close to the lower position of mandril 43
It is connected to support bar 47, and support bar 47 and support slot 56 are fit structure, when sealing block 4 is closed inwardly, support bar 47 is caught in
To the inside of support slot 56, so that will not be damaged to the bracket of LED when carrying out demoulding work.
The clamp device 55 includes dead ring 551, clutch disk 552, force fit plate 553 and through-hole 554, dead ring 551
It is placed on the inner wall of card slot 54, through-hole 554 is distributed in the circumferentially uniform of dead ring 551, and in baking process, hot gas uniformly leads to
The outer wall that through-hole 554 acts on adhesive filling mould 53 is crossed, so that the glue injected inside adhesive filling mould 53 is uniform curing, dead ring 551
Both ends are welded with force fit plate 553, are fixed between two force fit plates 553 by clutch disk 552, pass through clamp device 55
Adhesive filling mould 53 is locked, guarantees that adhesive filling mould 53 will not fall off when demoulding.
The clutch disk 552 includes line slide rail 552a, reset spring 552b, square groove 552c and sliding block 552d, is connected
The inner hub location for connecing disk 552 offers square groove 552c, and the two sides up and down of square groove 552c are mounted on line slide rail
552a, the upper end of line slide rail 552a are fitted with sliding block 552d, and sliding block 552d is welded on the outer wall of force fit plate 553, and two
Reset spring 552b is installed between the sliding block 552d, dead ring 551 is fixed on by square groove 552c by clutch disk 552
Inside.
The quantity of the extruding wheel 45 is three, and the radius of three extruding wheels 45 is all different, three extruding
Wheel 45 is installed step by step the inside of occlusal crib 44 is descending, passes through the change of radius to realize the change of extruding force.
The end of the force fit plate 553 is a kind of globoidal structure, enables the extruding wheel 45 of minimum diameter along cambered surface
It is moved, force fit plate 553 is squeezed, guarantee that sliding block 552d can be in the upper end normal movement of square groove 552c.
The inside of the storage drawer 3 is placed with the adhesive filling mould 53 of multiple and different shapes, meets different light emitting diodes
Encapsulation needs.
The bottom centre position of the radiating seat 52 is provided with round bump, and the bottom centre position of adhesive filling mould 53 offers
Circular trough, round bump and circular trough are matching mechanism, are carried out by round bump and circular trough to 53 position of adhesive filling mould opposite
Constraint guarantees that the surface of adhesive filling mould 53 is parallel to horizontal plane.
Furthermore the present invention also provides a kind of packaging method of full-automatic LED sealing machine, the envelopes of the full-automatic LED sealing machine
Dress method specifically includes the following steps:
S1, selection mold: according to product demand, storage drawer 3, adhesive filling mould 53 needed for artificial taking-up are opened, and is closed
Store drawer 3；
S2, mold locking: the adhesive filling mould 53 taken out in S1 is sequentially placed into the inside of radiating seat 52, hand is against encapsulating
The top of mould 53 presses down on so that the circular trough of 53 bottom of adhesive filling mould and the arc groove of outer wall be respectively clamped into round bump and
The outer wall of dead ring 551, then sealing block 4 is pushed, drive mandril 43 to move, so that 44 company of being fitted in of occlusal crib inside mandril 43
The outer wall of disk 552 is connect, meanwhile, the extruding wheel 45 installed inside occlusal crib 44 is moved along the cambered surface of force fit plate 553, is inwardly squeezed
Force fit plate 553 is pressed, so that plate 8, is finally inserted into inside fixing groove 41 by locking between dead ring 551 and arc groove
Complete the locking of adhesive filling mould 53；
S3, LED support are fixed and encapsulating: taking out LED support, observes by the naked eye the both ends of LED support and bracket clamp
Slot 7, the artificial top for pressing LED support further take out syringe until the Lamp cup of LED support drops into adhesive filling mould 53, suck
The glue prepared first will spray into release agent in adhesive filling mould 53, then successively glue is injected into adhesive filling mould 53；
S4, drying: the apparatus main body 1 for filling glue is put into oven for baking, duration 10-15min；
S5, demoulding: the apparatus main body 1 of drying is taken out from oven, ingot stripper is put into and is demoulded.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (9)
1. a kind of full-automatic LED sealing machine, including apparatus main body (1), mold fixed chamber (2), storage drawer (3), sealing block
(4), mold base (5), fixed pillar (6), bracket card slot (7) and plate (8), it is characterised in that: the both ends of apparatus main body (1) are equal
It has been bolted fixed pillar (6), the inside of fixed pillar (6) offers bracket card slot (7), the top of apparatus main body (1)
Portion central location is equipped with that mold is fixed chamber (2), the down either side position of mold fixed chamber (2) open up it is fluted, it is recessed
The inside of slot is placed with storage drawer (3), and the two sides top position of mold fixed chamber (2) is mounted on sealing block (4), and logical
It crosses plate (8) to be fixed, the top center of mold fixed chamber (2) is embedded with mold base (5)；
The mold fixed chamber (2) includes positioning column (21), connecting hole (22) and straight trough (23), and mold fixes chamber (2)
Inside offers counterbore, and the bottom of counterbore is provided with positioning column (21), and the top of positioning column (21) is embedded with the first magnet, counterbore
Middle section position offer straight trough (23), the inner wall of straight trough (23) is equipped with guide post, and the inside of guide post offers connecting hole (22),
Sealing cover is provided at the top of counterbore；
The mold base (5) include locating piece (51), radiating seat (52), adhesive filling mould (53), card slot (54), clamp device (55) and
Support slot (56), the bottom of mold base (5) offer rectangular channel, and the inside of rectangular channel is equipped with locating piece (51), locating piece
(51) inside offers location hole, and the second magnet is embedded at the top of location hole, and mold base is uniformly distributed at the top of (5)
Radiating seat (52), the inner wall of radiating seat (52) offer card slot (54), and the inside of card slot (54) is equipped with clamp device (55), dissipate
The inside of hot seat (52) is placed with adhesive filling mould (53), and the outer wall of adhesive filling mould (53) and the junction of clamp device (55) offer arc
Shape slot, the middle position of mold base (5) symmetrically offer support slot (56).
2. a kind of full-automatic LED sealing machine according to claim 1, it is characterised in that: the sealing block (4) includes fixing
Slot (41), link slot (42), mandril (43), occlusal crib (44), extruding wheel (45), connecting column (46) and support bar (47), sealing
The top of block (4) and the junction of plate (8) offer fixing groove (41), and sealing block (4) is above the one end of mold base (5)
It being provided with link slot (42), link slot (42) and sealing cover are matching mechanism, mandril (43) are provided with below link slot (42),
The inside of mandril (43) offers occlusal crib (44), and the inside of occlusal crib (44) is equipped with extruding wheel (45), mandril by shaft
(43) two sides are provided with connecting column (46), and connecting column (46) and connecting hole (22) are fit structure, the side of sealing block (4)
Lower position close to mandril (43) is welded with support bar (47), and support bar (47) and support slot (56) are fit structure.
3. a kind of full-automatic LED sealing machine according to claim 1, it is characterised in that: the clamp device (55) includes
Dead ring (551), clutch disk (552), force fit plate (553) and through-hole (554), dead ring (551) are placed on card slot (54)
Inner wall, the circumferentially uniform of dead ring (551) are distributed with through-hole (554), and the both ends of dead ring (551) are welded with force fit plate
(553), fixed by clutch disk (552) between two force fit plates (553).
4. a kind of full-automatic LED sealing machine according to claim 3, it is characterised in that: the clutch disk (552) includes
Line slide rail (552a), reset spring (552b), square groove (552c) and sliding block (552d), in the inside of clutch disk (552)
Heart position offers square groove (552c), and the two sides up and down of square groove (552c) are mounted on line slide rail (552a), and straight line is sliding
The upper end of rail (552a) is fitted with sliding block (552d), and sliding block (552d) is welded on the outer wall of force fit plate (553), described in two
Reset spring (552b) is installed between sliding block (552d).
5. a kind of full-automatic LED sealing machine according to claim 1, it is characterised in that: the quantity of the extruding wheel (45)
It is three, the radius of three extruding wheels (45) is all different, inside of three extruding wheels (45) in occlusal crib (44)
It is descending to install step by step.
6. a kind of full-automatic LED sealing machine according to claim 3, it is characterised in that: the end of the force fit plate (553)
For a kind of globoidal structure.
7. a kind of full-automatic LED sealing machine according to claim 1, it is characterised in that: the inside of storage drawer (3)
It is placed with the adhesive filling mould (53) of multiple and different shapes.
8. a kind of full-automatic LED sealing machine according to claim 1, it is characterised in that: the bottom of the radiating seat (52)
Center is provided with round bump, and the bottom centre position of adhesive filling mould (53) offers circular trough, round bump and circular trough
For matching mechanism.
9. a kind of full-automatic LED sealing machine according to any one of claims 1 to 8, it is characterised in that: the full-automatic LED
The packaging method of sealing machine specifically includes the following steps:
S1, selection mold: according to product demand, storage drawer (3), adhesive filling mould (53) needed for artificial taking-up are opened, and is closed
It stores drawer (3)；
S2, mold locking: the adhesive filling mould taken out in S1 (53) is sequentially placed into the inside of radiating seat (52), and by manually pressing
Means of press seals block (4) makes adhesive filling mould (53) be fastened on the inside of mold base (5)；
S3, LED support are fixed and encapsulating: taking out LED support, observes by the naked eye the both ends of LED support and bracket card slot
(7), manually the top of pressing LED support further takes out syringe until the Lamp cup of LED support drops into adhesive filling mould (53), inhales
Enter the glue prepared, is implanted sequentially in adhesive filling mould (53)；
S4, drying: the apparatus main body (1) for filling glue is put into oven for baking；
S5, demoulding: the apparatus main body (1) of drying is taken out from oven, ingot stripper is put into and is demoulded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560931.XA CN110265528B (en) | 2019-06-26 | 2019-06-26 | Full-automatic LED packaging machine and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560931.XA CN110265528B (en) | 2019-06-26 | 2019-06-26 | Full-automatic LED packaging machine and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110265528A true CN110265528A (en) | 2019-09-20 |
| CN110265528B CN110265528B (en) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910560931.XA Active CN110265528B (en) | 2019-06-26 | 2019-06-26 | Full-automatic LED packaging machine and packaging method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116885075A (en) * | 2023-09-06 | 2023-10-13 | 深圳市德明新微电子有限公司 | Pin quick welding cut-off type LED packaging device |
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| CN203472028U (en) * | 2013-09-16 | 2014-03-12 | 铜陵荣鑫机械有限公司 | High-power light-emitting diode (LED) spherical packaging and molding machine |
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| CN116885075A (en) * | 2023-09-06 | 2023-10-13 | 深圳市德明新微电子有限公司 | Pin quick welding cut-off type LED packaging device |
| CN116885075B (en) * | 2023-09-06 | 2023-11-24 | 深圳市德明新微电子有限公司 | Pin quick welding cut-off type LED packaging device |
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| CN110265528B (en) | 2020-08-18 |
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