CN207183236U - Silicon wafer carrier - Google Patents
Silicon wafer carrier Download PDFInfo
- Publication number
- CN207183236U CN207183236U CN201721070804.4U CN201721070804U CN207183236U CN 207183236 U CN207183236 U CN 207183236U CN 201721070804 U CN201721070804 U CN 201721070804U CN 207183236 U CN207183236 U CN 207183236U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- cushion pad
- wafer carrier
- perforating
- carrier bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a kind of silicon wafer carrier, it is related to silicon chip processing field, including carrier bodies, carrier bodies include some symmetrically arranged inserted slots, inserted slot up/down perforation, inserted sheet trench bottom is provided with the cushion pad of dismountable strip, the two sides that carrier bodies are located at the same side inserted slot are arranged with the perforating of strip, perforating is located at the minimum altitude of inserted slot, in carrier bodies folding and unfolding wheel is provided with close to one of perforating, one end of cushion pad is wound on folding and unfolding wheel, and the other end sequentially passes through perforating and fixation.The utility model greatly reduces the breakage rate of silicon chip, at the same have it is simple in construction, use and clear up the advantages of facilitating.
Description
Technical field
Silicon chip processing field is the utility model is related to, more particularly to a kind of silicon wafer carrier.
Background technology
With the development at full speed of semiconductor science and technology, silicon chip is widely applied to all trades and professions of modern society.Cause
This, the demand and production and processing amount of silicon chip are constantly soaring, it is desirable to could meet the market demand using large-scale pipeline production.
It is adapted with this, with the continuous progress of integrated circuit fabrication process, silicon chip produces, the automaticity more and more higher of processing,
Many auxiliary equipments to match with automation, large-scale production are needed, such as being placed in Wafer Cleaning equipment, being used for
Silicon chip is loaded to complete the silicon wafer carrier of Wafer Cleaning.
Silicon wafer carrier is to be used for carrying silicon chip in silicon chip working process, and silicon chip is formed by silicon ingot cutting, now
Silicon chip with many impurity, it is necessary into cleaning, i.e., silicon chip is placed in silicon wafer carrier.Due to silicon wafer carrier
Crack material is consistent with silicon wafer carrier material between piece, and hardness is higher, in inserted sheet after silicon chip and silicon wafer carrier bottom impacts
Silicon chip is impacted, causes silicon chip bright border etc. occur abnormal.
Utility model content
Silicon chip easily causes with silicon wafer carrier bottom impacts when technical problem to be solved in the utility model is inserted sheet
Extremely, the shortcomings that overcoming prior art, there is provided a kind of silicon wafer carrier, its impact to silicon chip can be reduced.
In order to solve the above technical problems, the utility model provides a kind of silicon wafer carrier, including carrier bodies, carrying
Device body includes some symmetrically arranged inserted slots, inserted slot up/down perforation, and inserted sheet trench bottom is provided with dismountable strip
Cushion pad, the two sides that carrier bodies are located at the same side inserted slot are arranged with the perforating of strip, and perforating is located at slotting
The minimum altitude of film trap, be provided with folding and unfolding wheel close to one of perforating in carrier bodies, one end of cushion pad, which is wound, is receiving
Put on wheel, the other end sequentially passes through perforating and fixation.
Technique effect：The utility model is deposited the crack between silicon chip to silicon wafer carrier bottom and transformed, using slow
Punching pad installed in silicon wafer carrier bottom, silicon chip is first touched cushion pad when being inserted to inserted sheet trench bottom, by cushion pad come
The shock that silicon chip is subject to when buffering inserted sheet, so as to ensure the intact of silicon chip.In addition, after silicon wafer carrier uses a period of time,
A part of impurity may have been accumulated on cushion pad or carrier bodies, cushion pad volume is easy to wind on folding and unfolding wheel, cleaned
It is more convenient when carrier bodies or cushion pad.The utility model greatly reduces the breakage rate of silicon chip, at the same have it is simple in construction,
Use and clear up the advantages of facilitating.
The technical scheme that the utility model further limits is：
Further, fastener is equipped with perforating, fastener includes a pair of tablettings, and one end of two pieces of tablettings is fixed,
Other end snap-fastener is detachably fixed.
A kind of preceding described silicon wafer carrier, folding and unfolding wheel inside are provided with automatic rewinding component.
A kind of preceding described silicon wafer carrier, cushion pad use polyurethane adhesive tape, and the cross sectional shape of cushion pad is triangle
And its angle position contacts with silicon chip.
The beneficial effects of the utility model are：
（1）In the utility model, perforating, pilot hole are set so that cushion pad is arranged on inserted slot in carrier bodies
It is more smooth during bottom, it can agree with carrier bodies more closely, to ensure that its buffering effect more preferably plays；
（2）In the utility model, cushion pad is realized by a pair of tablettings with snap-fastener and fixed, simple in construction, easy to operate；
（3）In the utility model, using polyurethane adhesive tape as cushion pad, polyurethane adhesive tape is that one kind is corrosion-resistant, there have to be tough
The material of property, so as to meet the corrosion-resistant use environment of silicon wafer carrier strong acid or highly basic；
（4）In the utility model, silicon wafer carrier, polyvinylidene fluoride injection processability are made using polyvinylidene fluoride
Can be good, it is a kind of good fluidity, easily injection molding resin material, its manufactured silicon wafer carrier mechanical performance, chemistry are resistance to
Corrosive nature and dimensional stability are good, also with cost performance it is economical the advantages of.
Brief description of the drawings
Fig. 1 is the overall schematic of embodiment 1；
Fig. 2 is the winding end schematic diagram of cushion pad in embodiment 1；
Fig. 3 is the free end schematic diagram of cushion pad in embodiment 1；
Wherein：1- carrier bodies；2- inserted slots；3- cushion pads；4- perforatings；5- folding and unfolding wheels；6- fasteners.
Embodiment
A kind of silicon wafer carrier that the present embodiment provides, structure is as Figure 1-3.
The silicon wafer carrier includes carrier bodies 1, and carrier bodies 1 include some symmetrically arranged inserted slots 2, inserted sheet
The up/down perforation of groove 2.
The bottom of inserted slot 2 is provided with the cushion pad 3 of strip, and cushion pad 3 is made of polyurethane adhesive tape, and cushion pad 3 is cut
Face is shaped as triangle and its angle position contacts with silicon chip.The two sides that carrier bodies 1 are located at the same side inserted slot 2 are symmetrical
Perforating 4 provided with strip, perforating 4 are located at the minimum altitude of inserted slot 2.
Folding and unfolding wheel 5 is provided with close to one of perforating 4 in carrier bodies 1, the inside of folding and unfolding wheel 5 is provided with automatic rewinding structure
Part, the automatic rewinding component is identical with automatic tape measure internal structure, has automatic rebounding winding function.
One end of cushion pad 3 is wound on folding and unfolding wheel 5, and the other end sequentially passes through two perforatings 4.It is all provided with perforating 4
There is fastener 6, fastener 6 includes a pair of tablettings, and one end of two pieces of tablettings is fixed, and other end snap-fastener is detachably fixed.
In addition to the implementation, the utility model can also have other embodiment.It is all to use equivalent substitution or equivalent change
The technical scheme to be formed is changed, all falls within the protection domain of the requires of the utility model.
Claims (4)
1. a kind of silicon wafer carrier, including carrier bodies（1）, the carrier bodies（1）Including some symmetrically arranged slotting
Film trap（2）, it is characterised in that：The inserted slot（2）Up/down perforation, the inserted slot（2）Bottom is provided with dismountable strip
Cushion pad（3）, the carrier bodies（1）Positioned at the same side inserted slot（2）Two sides be arranged with wearing for strip
Hole（4）, the perforating（4）It is located at inserted slot（2）Minimum altitude, the carrier bodies（1）It is upper to be worn close to one of them
Apertured（4）Provided with folding and unfolding wheel（5）, the cushion pad（3）One end wind in folding and unfolding wheel（5）On, the other end sequentially passes through described
Perforating（4）It is and fixed.
2. silicon wafer carrier according to claim 1, it is characterised in that：Two perforatings（4）Place is equipped with fastening
Part（6）, the fastener（6）Including a pair of tablettings, one end of two pieces of tablettings is fixed, and the other end is detachably solid by snap-fastener
It is fixed.
3. silicon wafer carrier according to claim 1, it is characterised in that：The folding and unfolding wheel（5）Inside is provided with automatic rewinding
Component.
4. silicon wafer carrier according to claim 1, it is characterised in that：The cushion pad（3）Using polyurethane adhesive tape, institute
State cushion pad（3）Cross sectional shape contacted for triangle and its angle position with silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721070804.4U CN207183236U (en) | 2017-08-24 | 2017-08-24 | Silicon wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721070804.4U CN207183236U (en) | 2017-08-24 | 2017-08-24 | Silicon wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207183236U true CN207183236U (en) | 2018-04-03 |
Family
ID=61738877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721070804.4U Active CN207183236U (en) | 2017-08-24 | 2017-08-24 | Silicon wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207183236U (en) |
-
2017
- 2017-08-24 CN CN201721070804.4U patent/CN207183236U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105086858B (en) | A kind of gum and processing mold group and its processing technology | |
| WO2005024932A3 (en) | Apparatus and method for removing semiconductor chip | |
| IL205243A0 (en) | Cutting tool with protrusions, and methods of use thereof | |
| WO2012031251A3 (en) | Bonded abrasive articles, method of forming such articles, and grinding performance of such articles | |
| JP2011202176A5 (en) | ||
| CN207183236U (en) | Silicon wafer carrier | |
| MY186890A (en) | Adhesive sheet and usage method therefor | |
| CN107325739A (en) | A kind of preparation method of Mylar conductive tapes | |
| EP1521299A3 (en) | Method of mounting a semiconductor chip with an adhesive film and apparatus using the same | |
| CN107689340A (en) | A kind of silicon wafer carrier and its manufacture method | |
| WO2013006447A3 (en) | Use of repellent material to protect fabrication regions in semiconductor assembly | |
| WO2010077999A3 (en) | Reinforced smart cards, components, & methods of making same | |
| CN202121930U (en) | Metal buckle assembly for tape connection | |
| CN204223462U (en) | Carrying belt | |
| CN110066607A (en) | A kind of preparation method of composite conducting adhesive tape | |
| CN206116351U (en) | A tool for board is crossed to sheet metal | |
| CN202624765U (en) | Air-absorbing jig used for protective film pasting | |
| CN207943353U (en) | Burst bar tearing notch mechanism and manufacturing device | |
| CN206718029U (en) | One kind cross cutting punching block component | |
| CN202174662U (en) | Silicon ingot beneficial to cutting | |
| CN206787748U (en) | For pasting the servicing unit of foil gauge | |
| CN207447056U (en) | The asynchronous material strip die cut systems of odd even dislocation | |
| CN206250168U (en) | A kind of PLC wafer assemblies | |
| CN205066074U (en) | Display box and panel be fixed structure in advance | |
| CN103587877A (en) | Double-layer conveying belt |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201221 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Jiangsu Province Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |