CN207149535U - Split type sapphire air jet system - Google Patents

Split type sapphire air jet system Download PDF

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Publication number
CN207149535U
CN207149535U CN201720989313.3U CN201720989313U CN207149535U CN 207149535 U CN207149535 U CN 207149535U CN 201720989313 U CN201720989313 U CN 201720989313U CN 207149535 U CN207149535 U CN 207149535U
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flow orifice
main body
split type
air jet
jet system
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CN201720989313.3U
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许赞
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Chongqing Zhen Bao Industrial Co Ltd
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Chongqing Zhen Bao Industrial Co Ltd
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Abstract

The utility model discloses a kind of split type sapphire air jet system, including the first main body and the second main body, the two is process by sapphire material；Be provided with flow orifice a and flow orifice b in first main body, wherein flow orifice a runs through the upper and lower ends of the first main body, the first main body provided with respectively with flow orifice a and flow orifice b the injecting hole a connected and injecting hole b；Flow orifice c and flow orifice d is provided with second main body, flow orifice c runs through the second main body upper and lower ends, and the lower end circumference outer rim of the second main body is provided with least one tap being connected with flow orifice d；The upper end of second main body is fixedly connected with the lower end of the first main body, and flow orifice c connects with flow orifice a, and flow orifice d connects with flow orifice b.Device entirety rotproofness and high-temperature stability are improved, tap is kept permanent stable form, jet uniformity and product yield is improved, reduces difficulty of processing, and improves the intensity of junction, the service life of extension fixture.

Description

Split type sapphire air jet system
Technical field
The utility model belongs to semiconductor wafer etch engineering device technique field, and in particular to a kind of split type sapphire jet Device.
Background technology
Plasma gas injection apparatus is mainly for the production of semiconductor wafer, version when making the wafer surface form tiny loop Carve the device of engineering.Its bottom can have multiple gas jetting holes, and can be combined with plasma electrode, make plasma gas Sprayed in cabin uniformly, is the consumption-type core part for determining semiconductor production efficiency.
What conventional gas injection apparatus was formed and used with the injection apparatus of gas injection system or quartz material, still Conventional gas injection apparatus, easily the jet pore cross section is caused to be in because of the corrosion of plasma gas during long-term use The deformation of taper, so as to which the plasma gas for causing to spray into mechanical machine cabin can not uniformly spray, but with irregular Form is sprayed.It uniformly should spray to form finished product in wafer surface, finally but by the uneven part of plasma gas Injection forms, it will causes the production efficiency of chip low, the problem of triggering substantial amounts of defect ware.
Traditional integrally formed mode of production of gas injection apparatus generally use, increase difficulty of processing also occurs in this, Extend process time, the problems such as increasing production cost, also have it is a small number of injection apparatus is made using sapphire material, but because Binding site is passed through frequently with the mode connected in bottom, is so easy to rupture in use, can also be substantially reduced The service life of device.
Utility model content
To solve above technical problem, the utility model provides a kind of split type sapphire air jet system, is given birth to reducing While producing cost, injection apparatus service life can be effectively improved, while ensures to spray into the uniformity of gas, so as to improve crystalline substance Piece production efficiency, and yields.
To achieve the above object, technical solutions of the utility model are as follows：
A kind of split type sapphire air jet system, it is characterized by：Including the first main body and the second main body, the two is by indigo plant Diamond material is process；
It is axially arranged with flow orifice a and flow orifice b to the first main body interior edge, and wherein flow orifice a is through the first main body Upper and lower ends, the first body outer wall be provided with respectively with flow orifice a and flow orifice b the injecting hole a connected and injecting hole b；
It is axially arranged with flow orifice c and flow orifice d to the second main body interior edge, and wherein flow orifice c is in the second main body Lower both ends, the lower end circumference outer rim of the second main body are provided with least one tap being connected with flow orifice d；
The upper end of second main body is fixedly connected with the lower end of the first main body, and flow orifice c connects with flow orifice a, stream Dynamic hole d connects with flow orifice b.
Using above scheme, by selecting fabricated from sapphire air jet system, increase device corrosion resistant performance and high-temperature stable Property, it can effectively prevent that tap and flow orifice are corroded, so as to ensure to spray the uniformity of gas, improve product yield, Parts processing is used simultaneously, the mode of two sections of connections, reduces difficulty of processing, while ensures the fastness of junction, extends dress The service life put.
As preferred：The flow orifice a and flow orifice c are set along the axis of the first main body and the second main body respectively, stream Dynamic hole a and flow orifice c internal diameters are in identical hollow circuit cylinder cavernous structure；
The flow orifice b and flow orifice a is coaxially disposed, and the radial outside in flow orifice a, flow orifice d and flow orifice c It is coaxially disposed, and the radial outside in flow orifice c, flow orifice b and flow orifice d are in the same size, structure annular in shape.Use with Upper structure, convenient processing, and it is more beneficial for the uniform injection of gas.
To be further ensured that the gas sprayed out of flow orifice d is uniformly entered in etched cavity, the tap is in a ring Array is evenly distributed on the lower end of the second main body.
As preferred：The tap lower tilt is outwards set.Using above structure, increase flow orifice d goes out to spray gas The area of body covering, the uniformity of etching is improved, reduces product defective goods rate.
As preferred：First main body and the second main body are in cylindrical structure, and the diameter of the first main body is more than the The diameter of two main bodys.Using above structure, step is formed between two main bodys, device can be facilitated to be fixed on the jet of etched cavity Mouth position.
As preferred：The upper end wall of first main body is provided with the annular groove to lower recess, and the annular groove is in flow orifice a Outside, the configuration closure adaptable with it in annular groove.Using above structure, it is ensured that the gas in flow orifice a can only be down Spray into etched cavity, so as to ensure etching when air jet system and etched cavity between sealing.
As preferred：The first main body lower end, which has, extends axially upward cylindrical groove along it, the groove Diameter and the diameter of the second main body are adapted, and the upper end of second main body is embedded in the groove.Using above structure, increase by two Person's connection area, the sealing of junction, and the fastness of connection can be effectively improved.
When being connected to further facilitate the gas injection tube head of outside with two injecting holes, contact surface is convenient to be sealed, and described first Body outer wall is provided with deep gouge in injecting hole a and injecting hole b position, and the deep gouge bottom wall is smooth flat structure.
Compared with prior art, the beneficial effects of the utility model are：
Using split type sapphire air jet system provided by the utility model, improve device entirety rotproofness and high temperature is steady It is qualitative, so as to the stable form for making tap keep permanent, jet uniformity is improved, improves product yield, meanwhile, use Split type, the reduction difficulty of processing of middle part connection, and the intensity of junction is improved, the service life of extension fixture.
Brief description of the drawings
Fig. 1 is front view of the present utility model；
Fig. 2 is the top view of embodiment illustrated in fig. 1；
Fig. 3 is the internal structure schematic diagram of embodiment illustrated in fig. 1；
Fig. 4 is the first main body and the second main body connection diagram；
Fig. 5 is use state diagram of the present utility model；
Fig. 6 is partial enlarged drawing at a in Fig. 5.
Embodiment
The utility model is described in further detail with accompanying drawing with reference to embodiments.
It is main to include in the first main body of cylindrical shape referring to figs. 1 to the split type sapphire air jet system shown in Fig. 4 1 and second main body 2, and the first main body 1 and the second main body 2 are process respectively using sapphire material.
It is axially arranged with two separate flow orifice a10 and flow orifice b11 to the interior edge of first main body 1, in the present embodiment Axis of the flow orifice a10 along the first main body 1 is set, and in hollow cylindrical-shaped structure, and flow orifice b11 and flow orifice a10 are same Axle is set, and the radial outside in flow orifice a10, so sets the overall stress that can largely ensure the first main body 1 Stability, it is more beneficial for the processing in each hole.
The upper end outer wall of first main body 1 is provided with the deep gouge 17 radially to cave inward, and the bottom wall of deep gouge 17 is in light Sliding perpendicular, injecting hole a12 and injecting hole b13, wherein injecting hole a12 and flow orifice are offered on the bottom wall of deep gouge 17 A10 is connected, and injecting hole b13 connects with flow orifice b11.
Likewise, it is axially arranged with two separate flow orifice c20 and flow orifice d21 in the interior edge of the second main body 2, this In embodiment, axis of the flow orifice c20 along the second main body 2 is set, and in hollow cylindrical-shaped structure, and flow orifice d21 is with flowing Dynamic hole c20 is coaxially disposed, and the radial outside in flow orifice c20.
With reference to figure 4, the diameter of the first main body 1 is more than the diameter of the second main body 2, the lower end of the first main body 1 and the second main body 2 Upper end be fixedly connected；In the present embodiment, there is the groove 16 extended straight up, groove 16 in the lower end wall of the first main body 1 In hollow cylindrical, its diameter and the size of the second main body 2 are adapted, so can be recessed using first the second main body 2 is embedded into After groove 16, then the two is welded to integral mode, overlapping area between the two can be effectively increased, ensure the steady of junction It is qualitative, and sealing, tradition is avoided in bottom combination, and broken situation is easily occurring using process.
After being connected with the second main body 2 of first main body 1, flow orifice c20 connects with flow orifice a10, flow orifice d21 and flowing Hole b11 is connected, and to ensure that the gas of each flow orifice is not interfere with each other, during processing, preferably flow orifice c20 and flow orifice a10's is straight Footpath is the same, and flow orifice d21 is as flow orifice b11 ring footpath, that is, after connecting, upper and lower flow orifice just aligns, and can both ensure Gas flows smoothness, and and can ensures the air-tightness of each flow orifice, so as to improve the stability of device.
The lower end edge peripheral, oblique of second main body 2 is provided with multiple taps 22, and tap 22 connects with flow orifice d21, this Tap 22 sets the on parallax that the side wall and bottom wall of main body 2 are had a common boundary in embodiment, and circular array is distributed in The lower end of second main body 2, so see tap 22 in the outward eight shape distribution in bottom from overall, can effectively extend from The spray regime of gas is ejected at tap 22, and ensures that gas can be ejected uniformly, can fully ensure that chip is in Boundary position farther out can also obtain relatively sufficient gas etch effect, and certainly, tap 22 can also be set directly at the On the bottom wall of two main bodys 2, simply spray regime can be relatively reduced.
The annular groove 14 to lower recess is machined with the upper end wall of first main body 1, annular groove 14 is in flow orifice a10 upper ends opening Radial outside, by the inner cap of the annular groove 14 such as closure 15, you can play sealing function to flow orifice a10 top, make Gas inside flow orifice a10 can only down spray.During without being sealed to flow orifice a10 top, take away Closure 15, it can also be facilitated by annular groove 14 and be connected with other device features of etching.
In the present embodiment, for convenience of gas injection pipette tips and injecting hole a10 mating connection, injecting hole a10 is processed into both ends Cylinder not of uniform size is step-like, i.e. injecting hole a10 connects the internal diameter that one end internal diameter is less than the other end with flow orifice a10.
With reference to figure 5 and Fig. 6, chip 4 is etched using split type sapphire air jet system in the present embodiment, will be sprayed Device is fixed at the window opened up on upper electrode 3, and upper electrode 3 is provided with through hole with from the second main body 2 to adaptation, and second Main body 2 can be just inserted, and side wall is in contact with upper electrode 3, and lower end is stretched into the etched cavity 5 of sealing, because first The diameter of main body 1 is more than the diameter of the second main body 2, then the two step formed is just fixed on the through hole position on upper electrode 3 Put, the stability of whole injection apparatus can be effectively ensured, meanwhile, the first main body 1 and the connecting portion of the second main body 2 are in etching The outside of chamber 5, avoid in corrosion and hot environment, be advantageous to keep the permanent fastness of connecting portion, so as to extend Service life.
Plasma gas or other auxiliary type gases, different gas difference are injected by injecting hole a12 and injecting hole 13 Uniformly sprayed into from tap 22 and flow orifice c20 lower end in etched cavity, because tap 22 expands outwardly in splayed Mode, in this way it can be ensured that gas ejection is arranged at the bottom and side of injection apparatus, then stepless action is complete on chip 4 again Into the etching work of chip 4, the yields of product is improved, effectively improves production efficiency.
Finally it should be noted that foregoing description is only preferred embodiment of the present utility model, the common skill of this area Art personnel on the premise of without prejudice to the utility model aims and claim, can make under enlightenment of the present utility model Expression, such conversion are each fallen within the scope of protection of the utility model as multiple types.

Claims (8)

  1. A kind of 1. split type sapphire air jet system, it is characterised in that：Including the first main body (1) and the second main body (2), the two is equal It is process by sapphire material；
    It is axially arranged with flow orifice a (10) and flow orifice b (11) to first main body (1) interior edge, and wherein flow orifice a (10) runs through The upper and lower ends of first main body (1), the first main body (1) outer wall are provided with and connected respectively with flow orifice a (10) and flow orifice b (11) Injecting hole a (12) and injecting hole b (13)；
    It is axially arranged with flow orifice c (20) and flow orifice d (21) to second main body (2) interior edge, and wherein flow orifice c (20) runs through Second main body (2) upper and lower ends, the lower end circumference outer rim of the second main body (2) are connected provided with least one with flow orifice d (21) Tap (22)；
    The upper end of second main body (2) is fixedly connected with the lower end of the first main body (1), and flow orifice c (20) and flow orifice a (10) connect, flow orifice d (21) connects with flow orifice b (11).
  2. 2. split type sapphire air jet system according to claim 1, it is characterised in that：The flow orifice a (10) and stream Dynamic hole c (20) is set along the axis of the first main body (1) and the second main body (2) respectively, flow orifice a (10) and flow orifice c (20) Identical internal diameter is in hollow circuit cylinder cavernous structure；
    The flow orifice b (11) is coaxially disposed with flow orifice a (10), and the radial outside in flow orifice a (10), flow orifice d (21) it is coaxially disposed with flow orifice c (20), and the radial outside in flow orifice c (20), flow orifice b (11) and flow orifice d (21) it is in the same size, structure annular in shape.
  3. 3. split type sapphire air jet system according to claim 1 or 2, it is characterised in that：The tap (22) is in Annular array is evenly distributed on the lower end of the second main body (2).
  4. 4. split type sapphire air jet system according to claim 3, it is characterised in that：Incline tap (22) bottom Oblique outer setting.
  5. 5. split type sapphire air jet system according to claim 1, it is characterised in that：First main body (1) and Two main bodys (2) are in cylindrical structure, and the diameter of the first main body (1) is more than the diameter of the second main body (2).
  6. 6. split type sapphire air jet system according to claim 1 or 5, it is characterised in that：First main body (1) Upper end wall is provided with the annular groove (14) to lower recess, and the annular groove (14) is in flow orifice a (10) outside, matches somebody with somebody in annular groove (14) Put the closure adaptable with it (15).
  7. 7. split type sapphire air jet system according to claim 5, it is characterised in that：First main body (1) lower end With extending axially upward cylindrical groove (16) along it, the diameter and the diameter phase of the second main body (2) of the groove (16) Adapt to, the upper end of second main body (2) is embedded in the groove (16).
  8. 8. split type sapphire air jet system according to claim 1, it is characterised in that：First main body (1) outer wall Deep gouge (17) is provided with injecting hole a (12) and injecting hole b (13) position, deep gouge (17) bottom wall is smooth flat structure.
CN201720989313.3U 2017-08-09 2017-08-09 Split type sapphire air jet system Active CN207149535U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720989313.3U CN207149535U (en) 2017-08-09 2017-08-09 Split type sapphire air jet system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720989313.3U CN207149535U (en) 2017-08-09 2017-08-09 Split type sapphire air jet system

Publications (1)

Publication Number Publication Date
CN207149535U true CN207149535U (en) 2018-03-27

Family

ID=61674683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720989313.3U Active CN207149535U (en) 2017-08-09 2017-08-09 Split type sapphire air jet system

Country Status (1)

Country Link
CN (1) CN207149535U (en)

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