CN207124211U - A kind of film layer structure and display device - Google Patents
A kind of film layer structure and display device Download PDFInfo
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- CN207124211U CN207124211U CN201721089702.7U CN201721089702U CN207124211U CN 207124211 U CN207124211 U CN 207124211U CN 201721089702 U CN201721089702 U CN 201721089702U CN 207124211 U CN207124211 U CN 207124211U
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Abstract
The embodiment of the present application provides a kind of film layer structure and display device, is related to display technology field.The embodiment of the present application on substrate by being provided with the first organic film, organic film of first organic film for film layer outer rim in the film layer structure near the substrate edges, and the ramp angle of first organic film and the substrate is less than easily rupturable angle.By controlling the ramp angle of the first organic film and substrate to be less than easily rupturable angle, reduce the climbing angle of inclination for the film layer being subsequently formed on the first organic film, so as to reduce the film layer being subsequently formed on angle position due to making a concerted effort caused by the stress of both direction, the film layer for preventing from being subsequently formed ruptures, and improves the life-span of OLED.
Description
Technical field
Display technology field is the utility model is related to, more particularly to a kind of film layer structure and display device.
Background technology
OLED (Organic Light Emitting Diode, organic electroluminescence device) has actively luminous, highlighted
Degree, high-contrast, ultra-thin, low-power consumption, can flexibility and operating temperature range it is wide many advantages, such as, it has also become great competitiveness
With the Display Technique of future generation of development prospect.
In OLED, the thickness of the organic film formed on substrate is formed all in micron level by organic film
Technique and material limitation, the upper surface of organic film and the ramp angle of substrate are all bigger.
When depositing other film layers on organic film, because the upper surface of organic film and the ramp angle of substrate are all compared
It is larger so that the film layer being deposited on organic film easily ruptures in angle position, influences the life-span of OLED.
Utility model content
The embodiment of the present application provides a kind of film layer structure and display device, with solve it is existing in be deposited on organic film
Film layer easily ruptures in angle position, the problem of influenceing the life-span of OLED.
In order to solve the above problems, the embodiment of the present application discloses a kind of film layer structure, applied to electroluminance display face
Plate, the electroluminescence display panel include substrate, the first organic film are provided with the substrate；
Organic film of first organic film for film layer outer rim in the film layer structure near the substrate edges,
And the ramp angle of first organic film and the substrate is less than easily rupturable angle.
Preferably, the easily rupturable angle is 35 °.
Preferably, first organic film is the organic film in the organic film or encapsulating structure in back board structure.
Preferably, it is additionally provided with the first inorganic film on first organic film.
Preferably, first organic film is the organic film in back board structure, is also set on first inorganic film
It is equipped with the laminated construction of the second organic film and the second inorganic film；The lamination of second organic film and the second inorganic film
The number of plies of structure is more than or equal to 1 layer.
Preferably, first organic film be encapsulating structure in organic film, first organic film with it is described
The second organic film and the second inorganic film are additionally provided between substrate；First organic film and first inorganic film
Laminated construction the number of plies be more than or equal to 1 layer.
Preferably, the organic film in the back board structure includes flatness layer or pixel confining layers.
Preferably, in addition to the substrate protection film layer being oppositely arranged, the protection film layer pass through with the substrate
Glue is fixed, and first organic film is between the substrate and the protection film layer.
Preferably, the substrate is rigid substrates or flexible base board.
In order to solve the above problems, the embodiment of the present application also discloses a kind of display device, including above-mentioned film layer structure.
Compared with prior art, the embodiment of the present application includes advantages below：
By being provided with the first organic film on substrate, first organic film is in the film layer structure outside film layer
Edge near the substrate edges organic film, and the ramp angle of first organic film and the substrate be less than it is fragile
Split angle.By controlling the ramp angle of the first organic film and substrate to be less than easily rupturable angle, reduction is subsequently formed first
The climbing angle of inclination of film layer on organic film, so as to reduce the film layer being subsequently formed on angle position due to both direction
Stress caused by make a concerted effort, prevent the film layer that is subsequently formed from rupturing, improve the life-span of OLED.
Brief description of the drawings
Fig. 1 shows one of schematic diagram of film layer structure in the embodiment of the present application；
Fig. 2 shows the two of the schematic diagram of the film layer structure in the embodiment of the present application；
Fig. 3 shows the three of the schematic diagram of the film layer structure in the embodiment of the present application；
Fig. 4 shows a kind of flow chart of the preparation method of film layer structure in the embodiment of the present application.
Embodiment
It is below in conjunction with the accompanying drawings and specific real to enable the above-mentioned purpose of the application, feature and advantage more obvious understandable
Mode is applied to be described in further detail the utility model.
Embodiment one
Reference picture 1, show one of schematic diagram of film layer structure in the embodiment of the present application.
The embodiment of the present application provides a kind of film layer structure, and applied to electroluminescence display panel, the electroluminescent shows
Show that panel includes substrate, the first organic film 12 is provided with the substrate 11；First organic film 12 is the film layer
Film layer outer rim is near the organic film at the edge of substrate 11, and first organic film 12 and the substrate 11 in structure
Ramp angle be less than easily rupturable angle.
In the embodiment of the present application, the substrate 11 can be rigid substrates or flexible base board.
As shown in figure 1, the schematic diagram in left side is the partial enlarged drawing of region A (dashed circle position) in film layer structure, the
The upper surface of one organic film 12 and the ramp angle of substrate 11 are θ, and F1 is the film layer 13 to be formed on the first organic film 12
One of stress, stress F1's is oriented parallel to substrate 11, and F2 is another stress of film layer 13, and stress F2 direction is put down
The tangential direction of row upper surface of the first organic film 12 at angle position, F is making a concerted effort for stress F1 and stress F2, according to flat
Row quadrilateral rule, F2=F12+F22-2F1F2cosθ.In the case where stress F1 and stress F2 are constant, with ramp angle θ
Increase, with joint efforts F also increase, when F is bigger with joint efforts, film layer 13 be easier rupture；Therefore, it should control the first organic film 12
It is less than easily rupturable angle with the ramp angle θ of substrate 11, reduces the film layer 13 formed on the first organic film 12 in corner position
The F that makes a concerted effort at place is put, so as to prevent the rupture of film layer 13.
Wherein, as stress F1 and stress F2 equal, F=2F1sin (θ/2) can be deduced, with ramp angle θ increasing
Greatly, F also increases with joint efforts.
It should be noted that when ramp angle θ is more than or equal to easily rupturable angle, film layer 13 can not necessarily rupture, and
It is that the probability ruptured can increase.Wherein, ramp angle θ is the tangent line and base of the upper surface of the first organic film 12 at angle position
Angle between plate 11.
In addition, the film layer structure of the embodiment of the present application includes a variety of organic films, the first organic film 12 is the film layer
For film layer outer rim near the organic film at the edge of substrate 11, first organic film is having in back board structure in structure
Organic film in machine film layer or encapsulating structure.Organic film in the back board structure includes flatness layer or pixel confining layers.
Wherein, it is additionally provided with the first inorganic film on first organic film；Now, the film layer 13 in Fig. 1 can be
First inorganic film, because the first inorganic film has extremely low water oxygen penetration capacity, but its stress is bigger, hardness is high, easy
Rupture, especially it is easier to rupture in the angle position of the first inorganic film climbing, therefore, it is necessary to controls the first organic film
The ramp angle of layer and substrate is less than easily rupturable angle so that the first inorganic film is not susceptible to rupture, so as to effectively hinder
Sealing oxygen is entered inside OLED from rupture location.
Certainly, the film layer 13 in Fig. 1 can also be organic film, by controlling climbing for the first organic film 12 and substrate 11
Angle of slope, equally it is also possible to prevent the rupture of film layer 13.
In the embodiment of the present application, the occurrence of easily rupturable angle is with material, preparation technology, the film of the film layer 13 being subsequently formed
Thickness degree is related, and generally, the easily rupturable angle is 35 °.When ramp angle θ is more than or equal to 35 °, film layer 13 is more
It is easily broken, therefore, it is necessary to ramp angle θ is set smaller than 35 °, to prevent the rupture of film layer 13.
As shown in figure 1, the film layer structure also includes the protection film layer 15 being oppositely arranged with the substrate 11, the protection
Film layer 15 is fixed with the substrate 11 by glue 14, and first organic film 12 is located at the substrate 11 and the guarantor
Between cuticular layer 15.Wherein, glue is piece glue or Dam-Filler (epoxy resin+air-breathing filler) glue material.
It should be noted that the film layer 13 formed on the first organic film 12, is similarly positioned in substrate 11 and protection film layer
Between 15.
It will be illustrated below with forming the film layer 13 on the first organic film 12 for the first inorganic film.
Reference picture 2, show the two of the schematic diagram of film layer structure in the embodiment of the present application.
In a kind of embodiment of the application, first organic film 121 be back board structure in organic film, first
Organic film 121 is located on substrate 11, and the first inorganic film 131 is covered on the first organic film 121, inorganic described first
The laminated construction of the second organic film 122 and the second inorganic film 132 is additionally provided with film layer 131；Second organic film
122 and second inorganic film 132 laminated construction the number of plies be more than or equal to 1 layer.Wherein, second organic film 122 is
Organic film in encapsulating structure.
As shown in Fig. 2 the first organic film 121, relative to the second organic film 122, its film layer outer rim is near substrate 11
Edge, it is understood that be that the distance between the film layer outer rim of the first organic film 121 and the edge of substrate 11, which are less than second, to be had
The distance between the film layer outer rim of machine film layer 122 and the edge of substrate 11.Therefore, climbing the first organic film 121 and substrate 11
Angle of slope is set smaller than easily rupturable angle, to prevent the rupture of the first inorganic film 131.
Wherein, when the number of plies of the second organic film 122 and the laminated construction of the second inorganic film 132 is more, one can be entered
Step improves the ability for the oxygen that blocks water.Typically only the ramp angle of the first organic film 121 and substrate 11 can be set smaller than easily
Rupture angle, it is preferable that the ramp angle of the second organic film 122 and substrate 11 can also be also configured to be less than easily rupturable angle
Degree, prevents the rupture of the second inorganic film 132, further improves the ability for the oxygen that blocks water.
Generally, the fabrication processing of OLED is：Driving TFT (Thin Film are made on substrate
Transistor, thin film transistor (TFT)), flatness layer, anode, pixel defining layer, luminescent layer, negative electrode are then made successively, again finally
It is packaged, completes the making of OLED, the structure formed before luminescent layer is made is commonly referred to as back board structure, most laggard
The structure that row encapsulation is formed is referred to as encapsulating structure.
Organic film in the back board structure includes flatness layer or pixel confining layers, that is to say, that the first organic film
121 can be flatness layer or pixel confining layers.Certainly, can also be after luminescent layer be made in some other technological process
Pixel defining layer is made again, the organic film when pixel defining layer for film layer outer rim in the film layer structure near substrate edges
When, the ramp angle of pixel defining layer and substrate can be set smaller than easily rupturable angle.
It should be noted that be the schematic diagram of simplification figure 2, driving TFT, anode, luminescent layer, negative electrode is not shown
Structure, although it will be appreciated that when the first organic film 121 is flatness layer, between the first organic film 121 and substrate 11 also
Driving TFT should be provided with, is additionally provided with anode between the first organic film 121 and the first inorganic film 131, pixel defines
Layer, luminescent layer, negative electrode；When the first organic film 121 is pixel confining layers, between the first organic film 121 and substrate 11
Driving TFT, flatness layer, anode are should still be provided with, is additionally provided between the first organic film 121 and the first inorganic film 131
Luminescent layer and negative electrode.
In addition, on the laminated construction of the second organic film 122 and the second inorganic film 132, it is additionally provided with and the base
The protection film layer 15 that plate 11 is oppositely arranged, the protection film layer 15 are attached on the substrate 11 by glue 14.
Reference picture 3, show the three of the schematic diagram of film layer structure in the embodiment of the present application.
In another embodiment of the application, when first organic film 124 is the organic film in encapsulating structure
When, the first inorganic film 134 is covered on the first organic film 124, between first organic film 124 and the substrate 11
It is additionally provided with the second organic film 123 and the second inorganic film 133, first organic film 124 and first inoranic membrane
The number of plies of the laminated construction of layer 134 is more than or equal to 1 layer.Wherein, second organic film 123 is organic in back board structure
Film layer.
As shown in figure 3, the first organic film 124, relative to the second organic film 123, its film layer outer rim is near substrate 11
Edge, therefore, the ramp angle of the first organic film 124 and substrate 11 is set smaller than easily rupturable angle, to prevent the
The rupture of one inorganic film 134.
Wherein, the organic film in the back board structure includes flatness layer or pixel confining layers, that is to say, that second is organic
Film layer 123 can be flatness layer or pixel confining layers.
In addition, on the laminated construction of the first organic film 124 and first inorganic film 134, it is additionally provided with and institute
The protection film layer 15 that substrate 11 is oppositely arranged is stated, the protection film layer 15 is attached on the substrate 11 by glue 14.
In the embodiment of the present application, by being provided with the first organic film on substrate, first organic film is described
Film layer outer rim is near the organic film of the substrate edges, and first organic film and the substrate in film layer structure
Ramp angle is less than easily rupturable angle.By controlling the ramp angle of the first organic film and substrate to be less than easily rupturable angle, subtract
The climbing angle of inclination of the small film layer being subsequently formed on the first organic film, so as to reduce the film layer being subsequently formed in corner position
Put due to making a concerted effort caused by the stress of both direction, the film layer for preventing from being subsequently formed ruptures, and improves the life-span of OLED.
Embodiment two
The embodiment of the present application additionally provides a kind of display device, and the display device includes above-mentioned film layer structure, the film layer
Structure is applied to electroluminescence display panel, and the electroluminescence display panel includes substrate, first is provided with the substrate
Organic film；
Organic film of first organic film for film layer outer rim in the film layer structure near the substrate edges,
And the ramp angle of first organic film and the substrate is less than easily rupturable angle
Wherein, the easily rupturable angle is 35 °；First organic film is organic film or encapsulation in back board structure
Organic film in structure；The first inorganic film is additionally provided with first organic film.
In a kind of embodiment of the application, first organic film is the organic film in back board structure, described the
The laminated construction of the second organic film and the second inorganic film is additionally provided with one inorganic film；Second organic film and
The number of plies of the laminated construction of two inorganic films is more than or equal to 1 layer.
In another embodiment of the application, first organic film is the organic film in encapsulating structure, described
The second organic film and the second inorganic film are additionally provided between first organic film and the substrate；First organic film
It is more than or equal to 1 layer with the number of plies of the laminated construction of first inorganic film.
Wherein, the organic film in the back board structure includes flatness layer or pixel confining layers；The substrate is rigid base
Plate or flexible base board.
In addition, the film layer structure also includes the protection film layer that is oppositely arranged with the substrate, the protection film layer with it is described
Substrate is fixed by glue, and first organic film is between the substrate and the protection film layer.
In the embodiment of the present application, the display device includes film layer structure, by being provided with the first organic film on substrate,
First organic film be in the film layer structure film layer outer rim near the substrate edges organic film, and described the
The ramp angle of one organic film and the substrate is less than easily rupturable angle.By the climbing for controlling the first organic film and substrate
Angle is less than easily rupturable angle, reduces the climbing angle of inclination for the film layer being subsequently formed on the first organic film, so as to reduce
The film layer being subsequently formed due to making a concerted effort caused by the stress of both direction on angle position, break by the film layer for preventing from being subsequently formed
Split, improve the life-span of OLED.
Embodiment three
Reference picture 4, show a kind of flow chart of the preparation method of film layer structure in the embodiment of the present application.
Step 401, the first organic film is formed on substrate.
In the embodiment of the present application, the first organic film is formed on substrate first, due to the first organic film type not
Together, the method for its preparation is also different.
Wherein, first organic film is film layer outer rim in the film layer structure near the organic of the substrate edges
Film layer, and the ramp angle of first organic film and the substrate is less than easily rupturable angle.
Reference picture 2, when first organic film 121 is the organic film in back board structure, use is exposed and developed
Technique forms the first organic film 121, is joined by adjusting exposure intensity, time for exposure, the concentration of developer solution, developing time etc.
Number so that the ramp angle of the first organic film 121 and substrate 11 is less than easily rupturable angle.
Reference picture 3, when first organic film 124 is the organic film in encapsulating structure, using printing technology or
Chemical vapor deposition method forms the first organic film 124, the contact of material viscosity, substrate by adjusting the first organic film
Angle, the sedimentation rate etc. of the first organic film so that the ramp angle of the first organic film 124 and substrate 11 is less than easily rupturable angle
Degree.It is the organic film in encapsulating structure for the first organic film 124, the specific step of the first organic film is formed on substrate
Suddenly it is：The second organic film is formed on the substrate；The second inorganic film is formed on second organic film；Described
First organic film is formed on second inorganic film.
First, the second organic film 123 is formed using exposed and developed technique on the substrate 11, it is then, organic second
Second inorganic film 133 is formed using chemical vapor deposition method or atom layer deposition process in film layer 123, finally, second
First organic film 124 is formed using printing technology or chemical vapor deposition method on inorganic film 133.
In the embodiment of the present application, formed on substrate after the first organic film, it is also necessary in first organic film
The first inorganic film is formed on layer, the first inorganic film is formed using chemical vapor deposition method or atom layer deposition process.
Reference picture 2, when first organic film 121 is the organic film in back board structure, in the first organic film
First inorganic film 131 is formed using chemical vapor deposition method or atom layer deposition process on 121.
It is the organic film in back board structure for the first organic film 121, the first nothing is formed on the first organic film
After machine film layer, the laminated construction of the second organic film and the second inorganic film should be also formed on first inorganic film；
The number of plies of the laminated construction of second organic film and the second inorganic film is more than or equal to 1 layer.
Second organic film 122 is formed using printing technology or chemical vapor deposition method on the first inorganic film 131,
Second inorganic film 132 is formed using chemical vapor deposition method or atom layer deposition process on the second organic film 122, can
The laminated construction of the second organic film 122 and the second inorganic film 132 is formed according to above-mentioned process, its laminated construction
The number of plies is more than or equal to 1 layer.
In addition, after the laminated construction of the second organic film 122 and the second inorganic film 132 is formed, in laminated construction
The second inorganic film 132 on attach piece glue or be coated with Dam-Filler glue materials and form the glue 14 for attaching protection film layer,
Protection film layer 15 is attached on glue 14.
Reference picture 3, when first organic film 124 is the organic film in encapsulating structure, in the first organic film
First inorganic film 134 is formed using chemical vapor deposition method or atom layer deposition process on 124.
In addition, piece glue or coating Dam-Filler glue material formation attaching protection film layers are attached on the first inorganic film 134
Glue 14, on glue 14 attach protection film layer 15.
Wherein, the material of the first inorganic film and the second inorganic film can use SiNx (silicon nitride), SiCN (carbon nitridations
Silicon), SiON (silicon oxynitride), Al2O3Any one in (aluminum oxide).
In the embodiment of the present application, by forming the first organic film on substrate, first organic film is the film
Film layer outer rim is near the organic film of the substrate edges in Rotating fields, and first organic film and the substrate are climbed
Angle of slope is less than easily rupturable angle.By controlling the ramp angle of the first organic film and substrate to be less than easily rupturable angle, reduce
The climbing angle of inclination for the film layer being subsequently formed on the first organic film, so as to reduce the film layer being subsequently formed in angle position
On due to making a concerted effort caused by the stress of both direction, prevent the film layer that is subsequently formed from rupturing, improve the life-span of OLED.
For foregoing embodiment of the method, in order to be briefly described, therefore it is all expressed as to a series of combination of actions, still
Those skilled in the art should know that the utility model is not limited by described sequence of movement, because according to this practicality
New, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know, explanation
Embodiment described in book belongs to preferred embodiment, and involved action and module not necessarily the utility model must
Must.
Each embodiment in this specification is described by the way of progressive, what each embodiment stressed be with
The difference of other embodiment, between each embodiment identical similar part mutually referring to.
Finally, it is to be noted that, herein, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between any this actual relation or order be present.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, commodity or equipment including a series of elements not only include that
A little key elements, but also the other element including being not expressly set out, or also include for this process, method, commodity or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except other identical element in the process including the key element, method, commodity or equipment being also present.
Above to a kind of film layer structure provided by the utility model and display device, it is described in detail, herein
Apply specific case to be set forth principle of the present utility model and embodiment, the explanation of above example is only intended to
Help understands method and its core concept of the present utility model；Meanwhile for those of ordinary skill in the art, according to this practicality
New thought, there will be changes in specific embodiments and applications, in summary, this specification content should
It is interpreted as to limitation of the present utility model.
Claims (10)
1. a kind of film layer structure, applied to electroluminescence display panel, the electroluminescence display panel includes substrate, its feature
It is, the first organic film is provided with the substrate；
Organic film of first organic film for film layer outer rim in the film layer structure near the substrate edges, and institute
The ramp angle for stating the first organic film and the substrate is less than easily rupturable angle.
2. film layer structure according to claim 1, it is characterised in that the easily rupturable angle is 35 °.
3. film layer structure according to claim 1, it is characterised in that first organic film is having in back board structure
Organic film in machine film layer or encapsulating structure.
4. film layer structure according to claim 3, it is characterised in that be additionally provided with the first nothing on first organic film
Machine film layer.
5. film layer structure according to claim 4, first organic film is the organic film in back board structure, described
The laminated construction of the second organic film and the second inorganic film is additionally provided with first inorganic film；Second organic film and
The number of plies of the laminated construction of second inorganic film is more than or equal to 1 layer.
6. film layer structure according to claim 4, first organic film is the organic film in encapsulating structure, described
The second organic film and the second inorganic film are additionally provided between first organic film and the substrate；First organic film
It is more than or equal to 1 layer with the number of plies of the laminated construction of first inorganic film.
7. film layer structure according to claim 3, it is characterised in that the organic film in the back board structure includes flat
Layer or pixel confining layers.
8. film layer structure according to claim 1, it is characterised in that also include the diaphragm being oppositely arranged with the substrate
Layer, the protection film layer fixed with the substrate by glue, and first organic film be located at the substrate with it is described
Between protection film layer.
9. film layer structure according to claim 1, it is characterised in that the substrate is rigid substrates or flexible base board.
10. a kind of display device, it is characterised in that including the film layer structure as described in any one of claim 1~9.
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| CN201721089702.7U CN207124211U (en) | 2017-08-28 | 2017-08-28 | A kind of film layer structure and display device |
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| CN201721089702.7U CN207124211U (en) | 2017-08-28 | 2017-08-28 | A kind of film layer structure and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359276A (en) * | 2017-08-28 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of preparation method of film layer structure, display device and film layer structure |
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2017
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359276A (en) * | 2017-08-28 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of preparation method of film layer structure, display device and film layer structure |
| WO2019042015A1 (en) * | 2017-08-28 | 2019-03-07 | 京东方科技集团股份有限公司 | Film layer structure, display device, and method for manufacturing film layer structure |
| US10923677B2 (en) | 2017-08-28 | 2021-02-16 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Film structure, display device and method for fabricating the film structure |
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