CN207121652U - A kind of electroplating device for chip surface - Google Patents

A kind of electroplating device for chip surface Download PDF

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Publication number
CN207121652U
CN207121652U CN201720849755.8U CN201720849755U CN207121652U CN 207121652 U CN207121652 U CN 207121652U CN 201720849755 U CN201720849755 U CN 201720849755U CN 207121652 U CN207121652 U CN 207121652U
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China
Prior art keywords
welded
electroplating
piston
chip surface
base
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CN201720849755.8U
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Chinese (zh)
Inventor
卓廷厚
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Xiamen Core Technology Co Ltd
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Xiamen Core Technology Co Ltd
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Priority to CN201720849755.8U priority Critical patent/CN207121652U/en
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Abstract

The utility model discloses a kind of electroplating device for chip surface, including base, the top side of the base is welded with electroplating bath, the two bottom sides of the electroplating bath are provided with hole, and it is plugged with anode stub and cathode bar on the inwall in hole, the bottom of the cathode bar and anode stub is socketed with sealing ring, cavity is provided with inside the side of the base, and the inside of cavity is placed with battery, the top side of the base is welded with retracting cylinder, piston is plugged with the inwall of the retracting cylinder, expansion link is welded with the top of the piston, the expansion link is threaded with commutator on the outer wall away from piston one end, supporting plate is welded with the top of commutator, and motor is bolted at the top of supporting plate.The utility model whole equipment uses electric cabinet, realizes the Automated condtrol of electroplating time, electroplating current, bath temperature, improves the quality of endoporus part coating, and makes the simple to operate of equipment, reaches the effect that a kind of people want.

Description

A kind of electroplating device for chip surface
Technical field
The electroplating technology of chip surface is the utility model is related to, more particularly to a kind of plating for chip surface is set It is standby.
Background technology
In electronic chip industry, in order that circuit connector obtains higher coupling reliability, it is necessary in connector The metal such as contact site surface gold-plating or silver, electric conductivity, overall electroplating technology are improved to reduce the contact resistance of contact site Although can also meet the requirement of workpiece, there is also following shortcoming, precious metal consumption is big, and production cost is very Height, inner hole of workpiece quality of coating be not high.So how to reduce the consumption of precious metal, the matter of inner hole of workpiece coating is improved Amount always is the focus of industry research.
Utility model content
The purpose of this utility model is to solve shortcoming present in prior art, and the one kind proposed is used for chip list The electroplating device in face.
To achieve these goals, the utility model employs following technical scheme:
A kind of electroplating device for chip surface, including base, the top side of the base are welded with electroplating bath, institute The two bottom sides for stating electroplating bath are provided with hole, and anode stub and cathode bar are plugged with the inwall in hole, the cathode bar and anode The bottom of rod is socketed with sealing ring, and cavity is provided with inside the side of the base, and the inside of cavity is placed with battery, institute The top side for stating base is welded with retracting cylinder, and piston, the top welding of the piston are plugged with the inwall of the retracting cylinder There is expansion link, the expansion link is threaded with commutator, the top welding of the commutator on the outer wall away from piston one end There is supporting plate, and motor be bolted at the top of supporting plate, connecting rod is welded with the side outer wall of the commutator, The one end of the connecting rod away from commutator is welded with fixed seat, and the bottom of the fixed seat is welded with mechanical gripping by hinge Hand, the inside of the electroplating bath are placed with magazine, and the both sides of the magazine are provided with hole, and are plugged with the inwall in hole solid Fixed pole, handle is welded with the top exterior walls of the magazine.
Preferably, chip is socketed with the outer wall of the fix bar, and the quantity of chip is four to ten two.
Preferably, the expansion link is linked together by piston and retracting cylinder, and the phase between expansion link and retracting cylinder Electroplating bath and the relative movement distance of magazine are more than to displacement.
Preferably, the mechanical gripper is by mechanical finger, spring and motor switch composition, and motor switch by wire with Timer connects.
Preferably, linked together between the cathode bar and anode stub by wire, and the centre position connection of wire There is battery, the side of battery is provided with regular tap.
Preferably, the two bottom sides of the magazine are welded with footing, and the quantity of footing is two to six.
The beneficial effects of the utility model are:The utility model is using the electricity that cathode bar and anode stub are set inside electroplating bath Plating mode, and chip uses and chip equidistant arrangement is arranged in magazine, is clamped with the circulation of mechanical arm to complete to core The purpose of piece plating, whole equipment use electric cabinet, realize the Automated condtrol of electroplating time, electroplating current, bath temperature, from And the quality of endoporus part coating is greatly improved, and make the simple to operate of equipment, reach the effect that a kind of people want.
Brief description of the drawings
Fig. 1 be the utility model proposes a kind of electroplating device for chip surface structural representation;
Fig. 2 be the utility model proposes a kind of electroplating device for chip surface magazine structural representation.
In figure:1 base, 2 batteries, 3 sealing rings, 4 anode stubs, 5 electroplating baths, 6 cathode bars, 7 fix bars, 8 magazines, 9 Handle, 10 mechanical grippers, 11 fixed seats, 12 connecting rods, 13 motors, 14 commutators, 15 expansion links, 16 pistons, 17 retracting cylinders.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole Embodiment.
Reference picture 1-2, a kind of electroplating device for chip surface, including base 1, the top side of base 1 are welded with Electroplating bath 5, the two bottom sides of electroplating bath 5 are provided with hole, and anode stub 4 and cathode bar 6 are plugged with the inwall in hole, cathode bar 6 Sealing ring 3 is socketed with the bottom of anode stub 4, cavity is provided with inside the side of base 1, and the inside of cavity is placed with electric power storage Pond 2, the top side of base 1 are welded with retracting cylinder 17, and piston 16, the top weldering of piston 16 are plugged with the inwall of retracting cylinder 17 Expansion link 15 is connected to, expansion link 15 is threaded with commutator 14, the top of commutator 14 on the outer wall away from the one end of piston 16 Supporting plate is welded with, and motor 13 has been bolted at the top of supporting plate, the company of being welded with the side outer wall of commutator 14 Extension bar 12, the one end of connecting rod 12 away from commutator 14 are welded with fixed seat 11, and the bottom of fixed seat 11 is welded with by hinge Mechanical gripper 10, the inside of electroplating bath 5 are placed with magazine 8, and the both sides of magazine 8 are provided with hole, and grafting on the inwall in hole There is fix bar 7, handle 9 is welded with the top exterior walls of magazine 8.
In the utility model, chip is socketed with the outer wall of fix bar 7, and the quantity of chip is four to ten two, is stretched Bar 15 is linked together by piston 16 and retracting cylinder 17, and the relative movement distance between expansion link 15 and retracting cylinder 17 is more than Electroplating bath 5 and the relative movement distance of magazine 8, mechanical gripper 9 are made up of mechanical finger, spring and motor switch, and electronic Switch is connected by wire and timer, is linked together between cathode bar 6 and anode stub 4 by wire, and wire Centre position is connected with battery 2, and the side of battery 2 is provided with regular tap, and the two bottom sides of magazine 8 are welded with bottom Pin, and the quantity of footing is two to six.
Operation principle:In use, operator is equidistantly placed in chip in the fix bar 7 inside magazine 8, chip is completed Fixation work, anode stub 4 inside electroplating bath 5 is then opened by battery and cathode bar 6 is formed to electroplate and reached State, the up and down motion of mechanical arm is adjusted by retracting cylinder 17, piston 16 and expansion link 15, passes through motor 13, commutator 14 The spinning movement of mechanical arm is adjusted with connecting rod 12, so as to pick and place magazine 8, the electric power system carried inside device can The residence time of reliable control machinery arm, while ensure the quality of plating, whole device will be simple in construction, electroplating effect It is good, it is cost-effective, it is easy to use.
It the foregoing is only the preferable embodiment of the utility model, but the scope of protection of the utility model not office It is limited to this, any one skilled in the art is new according to this practicality in the technical scope that the utility model discloses Technical scheme and its utility model design of type are subject to equivalent substitution or change, should all cover in the scope of protection of the utility model Within.

Claims (6)

1. a kind of electroplating device for chip surface, including base(1), it is characterised in that the base(1)Top side It is welded with electroplating bath(5), the electroplating bath(5)Two bottom sides be provided with hole, and anode stub is plugged with the inwall in hole(4)With Cathode bar(6), the cathode bar(6)And anode stub(4)Bottom be socketed with sealing ring(3), the base(1)Side in Portion is provided with cavity, and the inside of cavity is placed with battery(2), the base(1)Top side be welded with retracting cylinder(17), The retracting cylinder(17)Inwall on be plugged with piston(16), the piston(16)Top be welded with expansion link(15), it is described Expansion link(15)Away from piston(16)Commutator is threaded with the outer wall of one end(14), the commutator(14)Top weldering Supporting plate is connected to, and motor has been bolted at the top of supporting plate(13), the commutator(14)Side outer wall on weld It is connected to connecting rod(12), the connecting rod(12)Away from commutator(14)One end be welded with fixed seat(11), the fixed seat (11)Bottom mechanical gripper is welded with by hinge(10), the electroplating bath(5)Inside be placed with magazine(8), it is described Magazine(8)Both sides be provided with hole, and fix bar is plugged with the inwall in hole(7), the magazine(8)Top exterior walls on It is welded with handle(9).
A kind of 2. electroplating device for chip surface according to claim 1, it is characterised in that the fix bar(7) Outer wall on be socketed with chip, and the quantity of chip is four to ten two.
A kind of 3. electroplating device for chip surface according to claim 1, it is characterised in that the expansion link(15) Pass through piston(16)With retracting cylinder(17)Link together, and expansion link(15)With retracting cylinder(17)Between relative movement distance More than electroplating bath(5)With magazine(8)Relative movement distance.
A kind of 4. electroplating device for chip surface according to claim 1, it is characterised in that the mechanical gripper (9)By mechanical finger, spring and motor switch composition, and motor switch is connected by wire and timer.
A kind of 5. electroplating device for chip surface according to claim 1, it is characterised in that the cathode bar(6) And anode stub(4)Between linked together by wire, and the centre position of wire is connected with battery(2), battery(2)'s Side is provided with regular tap.
A kind of 6. electroplating device for chip surface according to claim 1, it is characterised in that the magazine(8) Two bottom sides be welded with footing, and the quantity of footing is two to six.
CN201720849755.8U 2017-07-13 2017-07-13 A kind of electroplating device for chip surface Active CN207121652U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720849755.8U CN207121652U (en) 2017-07-13 2017-07-13 A kind of electroplating device for chip surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720849755.8U CN207121652U (en) 2017-07-13 2017-07-13 A kind of electroplating device for chip surface

Publications (1)

Publication Number Publication Date
CN207121652U true CN207121652U (en) 2018-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720849755.8U Active CN207121652U (en) 2017-07-13 2017-07-13 A kind of electroplating device for chip surface

Country Status (1)

Country Link
CN (1) CN207121652U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114318452A (en) * 2020-09-29 2022-04-12 深圳市恒通五金制品有限公司 A electroplate auxiliary device fast for fin production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114318452A (en) * 2020-09-29 2022-04-12 深圳市恒通五金制品有限公司 A electroplate auxiliary device fast for fin production
CN114318452B (en) * 2020-09-29 2023-08-08 深圳市恒通五金制品有限公司 A electroplate auxiliary device fast for fin production

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