CN207097747U - A kind of anti-bonding circuit of relay contact - Google Patents
A kind of anti-bonding circuit of relay contact Download PDFInfo
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- CN207097747U CN207097747U CN201721090440.6U CN201721090440U CN207097747U CN 207097747 U CN207097747 U CN 207097747U CN 201721090440 U CN201721090440 U CN 201721090440U CN 207097747 U CN207097747 U CN 207097747U
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- 239000003381 stabilizer Substances 0.000 claims description 20
- 230000005611 electricity Effects 0.000 claims description 3
- 230000032683 aging Effects 0.000 abstract description 4
- 238000012356 Product development Methods 0.000 abstract description 3
- 238000011084 recovery Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 3
- 206010044565 Tremor Diseases 0.000 description 2
- 210000001367 artery Anatomy 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721090440.6U CN207097747U (en) | 2017-08-29 | 2017-08-29 | A kind of anti-bonding circuit of relay contact |
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CN201721090440.6U CN207097747U (en) | 2017-08-29 | 2017-08-29 | A kind of anti-bonding circuit of relay contact |
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CN207097747U true CN207097747U (en) | 2018-03-13 |
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CN201721090440.6U Active CN207097747U (en) | 2017-08-29 | 2017-08-29 | A kind of anti-bonding circuit of relay contact |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110148544A (en) * | 2019-05-05 | 2019-08-20 | 北京新能源汽车股份有限公司 | Prevent the method and system of relay adhesion |
CN112723074A (en) * | 2020-12-30 | 2021-04-30 | 日立电梯(中国)有限公司 | Contact detection method, storage medium and elevator |
-
2017
- 2017-08-29 CN CN201721090440.6U patent/CN207097747U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110148544A (en) * | 2019-05-05 | 2019-08-20 | 北京新能源汽车股份有限公司 | Prevent the method and system of relay adhesion |
CN110148544B (en) * | 2019-05-05 | 2021-06-04 | 北京新能源汽车股份有限公司 | Method and device for preventing relay from being adhered |
CN112723074A (en) * | 2020-12-30 | 2021-04-30 | 日立电梯(中国)有限公司 | Contact detection method, storage medium and elevator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Antiseized circuit that closes of relay contact points Effective date of registration: 20200521 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2020980002394 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210616 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2020980002394 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A relay contact anti bonding circuit Effective date of registration: 20210616 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2021990000529 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220622 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2021990000529 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An anti sticking circuit of relay contact Effective date of registration: 20220623 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2022110000136 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230705 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2022110000136 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A relay contact anti adhesion circuit Effective date of registration: 20230706 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2023110000277 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231220 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2023110000277 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A relay contact anti adhesion circuit Effective date of registration: 20231222 Granted publication date: 20180313 Pledgee: Bank of China Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN CHIPSUN TECHNOLOGY Co.,Ltd. Registration number: Y2023110000543 |
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