CN207095012U - A kind of compact semiconductor fan heater - Google Patents
A kind of compact semiconductor fan heater Download PDFInfo
- Publication number
- CN207095012U CN207095012U CN201720800066.8U CN201720800066U CN207095012U CN 207095012 U CN207095012 U CN 207095012U CN 201720800066 U CN201720800066 U CN 201720800066U CN 207095012 U CN207095012 U CN 207095012U
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Abstract
The utility model belongs to heater context, it is related to a kind of compact semiconductor fan heater, including casing, Air Blast fan and semiconductor heating bar, Air Blast fan and the semiconductor heating bar are respectively positioned on box house, casing also includes deflection plate, air inlet and air outlet, the relative interval of deflection plate is located at box bilateral wall and forms S-shaped runner, air inlet is located at runner head, air outlet is located at runner tail, Air Blast fan is located at air inlet and blown to runner, there is through hole on deflection plate, semiconductor heating bar is through through hole and is fixed on deflection plate or wall box, semiconductor heating bar is vertical with deflection plate；The utility model, by setting deflection plate to form S-shaped runner, air with semiconductor heating bar has more frequency of exposure after entering air stream enter runner from air inlet, contact distance of the air with semiconductor heating bar is added in limited space, structure is compacter, the efficiency of heating surface of heater is improved, the temperature of heater hot gas is reached higher.
Description
Technical field
Heater context is the utility model is related to, more particularly to a kind of compact semiconductor fan heater.
Background technology
Semiconductor heating material, it is nowadays extensive because of the advantages that its uniformity is good, controllability is strong, low-power, long lifespan
Applied to market heater context, still, existing semiconductor fan heater as shown in Figure 1, the fan at casing rear portion is continuous
To semiconductor heating system blow, air by semiconductor heating system heat after directly from front flow out, in limited structure
In space, due to air is shorter with semiconductor heating material contact time section, contact distance it is shorter, structure is not compact enough, exists
The problem of heating-up temperature is relatively low, firing rate is slower.
Utility model content
In order to overcome the shortcomings of the prior art, the utility model provides a kind of compact semiconductor fan heating
Device, it is compact-sized, there is the heating flow channel of S-shaped, the efficiency of heating surface can be improved, be improved gas heating-up temperature.
Technical scheme is used by the utility model solves its technical problem：
A kind of compact semiconductor fan heater, including casing, Air Blast fan and semiconductor heating bar, Air Blast fan and
The semiconductor heating bar is respectively positioned on box house, and casing also includes deflection plate, air inlet and air outlet, and deflection plate is relative
Interval is located at box bilateral wall and forms S-shaped runner, and air inlet is located at runner head, and air outlet is located at runner tail, Air Blast fan position
Blown in air inlet to runner, there is through hole, semiconductor heating bar is through through hole and is fixed on deflection plate or case on deflection plate
Body sidewall, semiconductor heating bar are vertical with deflection plate.
Preferably, air-out fan is additionally provided with air outlet.
Preferably, it is additionally provided with air dispersion plate between Air Blast fan and conductor temp.-elevating bar.
Preferably, wind gathering plate is additionally provided between air-out fan and conductor temp.-elevating bar.
Preferably, cabinet wall is made up of heat-insulating material.
The beneficial effects of the utility model are：
A kind of compact semiconductor fan heater of the present utility model, by setting deflection plate to form S-shaped runner, air
With semiconductor heating bar have more frequency of exposure after entering air stream enter runner from air inlet, added in limited space air with
The contact distance of semiconductor heating bar, structure is compacter, effectively make use of space, improves the efficiency of heating surface of heater,
Also the temperature of heater hot gas is made to reach higher；The setting of air-out fan, air output and the air-out of heat exchanger can be increased
Speed；Setting for air dispersion plate can more uniformly can be added by the inflow runner that wind is uniform, wind is scattered by semiconductor heating bar
Heat；Because the exhausting of air-out fan compares concentration, the air outside exhausting area just compares hard-pumped and gone out, and hot air stays
Overall heat exchanger effectiveness is influenced whether in casing, the setting of wind gathering plate can increase the exhausting area of air-out fan, also between
What is connect adds the mobility and the efficiency of heating surface of gas, and hot-air flows away, and the low gas of remaining temperature is easier to absorb heat,
Improve energy utilization rate；Cabinet wall is made up of heat-insulating material so that the heat of box house can not be excessive by wall body.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is a kind of semiconductor heat booster structure chart of the prior art；
Fig. 2 is a kind of compact semiconductor heat booster structure chart of the present utility model.
In figure：1st, casing；2nd, Air Blast fan；21st, air dispersion plate；3rd, semiconductor heating bar；4th, deflection plate；5th, air inlet；6、
Air outlet；7th, runner；8th, air-out fan；81st, wind gathering plate.
Embodiment
The utility model is described in further detail presently in connection with accompanying drawing.These accompanying drawings are simplified schematic diagram,
Only illustrate basic structure of the present utility model in a schematic way, therefore it only shows the composition relevant with the utility model.
A kind of compact semiconductor fan heater as shown in Figure 2, including casing 1, Air Blast fan 2 and semiconductor heating
Bar 3, Air Blast fan 2 and the semiconductor heating bar 3 are respectively positioned on inside casing 1, and casing 1 also includes deflection plate 4, air inlet 5
With air outlet 6, the relative interval of deflection plate 4 is located at the two side of casing 1 and forms S-shaped runner 7, and air inlet 5 is located at runner 7,
In the tail of runner 7, Air Blast fan 2 is located at air inlet 5 blows air outlet 6 to runner 7, has through hole, semiconductor hair on deflection plate 4
Hot bar 3 is through through hole and is fixed on deflection plate 4 or the side wall of casing 1, semiconductor heating bar 3 are vertical with deflection plate 4.
A kind of compact semiconductor fan heater of the present utility model, provided with deflection plate 4, and forms S-shaped runner 7,
Contact distance of the air with semiconductor heating bar 3 is added in limited space, structure is compacter, effectively make use of sky
Between, air has more frequency of exposure after air inlet 5 enters air stream enter runner 7, with semiconductor heating bar 3, improves heater
The efficiency of heating surface, the temperature of heater hot gas is also set to reach higher.
Air-out fan 8 is additionally provided with air outlet 6.
The setting of air-out fan 8, the air output of heat exchanger can be increased and go out wind velocity.
Air dispersion plate 21 is additionally provided between Air Blast fan 2 and conductor temp.-elevating bar 3.
Air dispersion plate 21 set can by wind uniformly, the inflow runner 7 of fallaway type, more uniformly can be sent out by semiconductor
Hot bar 3 heats.
Wind gathering plate 81 is additionally provided between air-out fan 8 and conductor temp.-elevating bar 3.
Because the volume of air-out fan 8 and exhausting area are less than runner 7, and exhausting compares concentration, so being located at exhausting area
Outer air just compares hard-pumped and gone out, and hot air, which is stayed in casing, influences whether overall heat exchanger effectiveness, and wind gathering plate 81 is set
The exhausting area of air-out fan 8 can be increased by putting, and also indirectly add the mobility and the efficiency of heating surface of gas, stream of hot air
Walk, the low gas of remaining temperature is easier to absorb heat, improves energy utilization rate.
The inwall of casing 1 is made up of heat-insulating material.
The inwall of casing 1 is made up of heat-insulating material so that the heat inside casing 1 can not be excessive by wall body.
Using it is above-mentioned according to desirable embodiment of the present utility model as enlightenment, pass through above-mentioned description, related work people
Member can carry out various changes and amendments in the range of without departing from this item utility model technological thought completely.This item is real
The content being not limited to new technical scope on specification, it is necessary to which its technology is determined according to right
Property scope.
Claims (5)
1. a kind of compact semiconductor fan heater, including casing, Air Blast fan and semiconductor heating bar, the Air Blast fan
Box house is respectively positioned on the semiconductor heating bar, it is characterised in that：The casing also includes deflection plate, air inlet and gone out
Air port, the relative interval of the deflection plate is located at box bilateral wall and forms S-shaped runner, and the air inlet is located at the runner
Head, the air outlet are located at the runner tail, and the Air Blast fan is located at air inlet and blown to runner, had on the deflection plate
There is through hole, the semiconductor heating bar is through through hole and is fixed on deflection plate or wall box, the semiconductor heating bar and folding
Flowing plate is vertical.
A kind of 2. compact semiconductor fan heater according to claim 1, it is characterised in that：At the air outlet also
Provided with air-out fan.
A kind of 3. compact semiconductor fan heater according to claim 2, it is characterised in that：The Air Blast fan with
Air dispersion plate is additionally provided between conductor temp.-elevating bar.
A kind of 4. compact semiconductor fan heater according to claim 3, it is characterised in that：The air-out fan with
Wind gathering plate is additionally provided between conductor temp.-elevating bar.
A kind of 5. compact semiconductor fan heater according to claim any one of 1-4, it is characterised in that：The case
Internal wall is made up of heat-insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720800066.8U CN207095012U (en) | 2017-07-04 | 2017-07-04 | A kind of compact semiconductor fan heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720800066.8U CN207095012U (en) | 2017-07-04 | 2017-07-04 | A kind of compact semiconductor fan heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207095012U true CN207095012U (en) | 2018-03-13 |
Family
ID=61555669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720800066.8U Active CN207095012U (en) | 2017-07-04 | 2017-07-04 | A kind of compact semiconductor fan heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207095012U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113551512A (en) * | 2021-07-19 | 2021-10-26 | 连云港佑源医药设备制造有限公司 | Rotary air duct of multi-cabin decompression boiling cleaning and sterilizing machine |
| CN113739289A (en) * | 2020-05-30 | 2021-12-03 | 淮安金泽机电科技有限公司 | Industrial refrigerating device with tubular heating |
| WO2024094138A1 (en) * | 2022-11-02 | 2024-05-10 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Heating device |
-
2017
- 2017-07-04 CN CN201720800066.8U patent/CN207095012U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739289A (en) * | 2020-05-30 | 2021-12-03 | 淮安金泽机电科技有限公司 | Industrial refrigerating device with tubular heating |
| CN113551512A (en) * | 2021-07-19 | 2021-10-26 | 连云港佑源医药设备制造有限公司 | Rotary air duct of multi-cabin decompression boiling cleaning and sterilizing machine |
| WO2024094138A1 (en) * | 2022-11-02 | 2024-05-10 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Heating device |
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