CN207070442U - Carry scolding tin and the circuit board provided with protective layer - Google Patents
Carry scolding tin and the circuit board provided with protective layer Download PDFInfo
- Publication number
- CN207070442U CN207070442U CN201720918474.3U CN201720918474U CN207070442U CN 207070442 U CN207070442 U CN 207070442U CN 201720918474 U CN201720918474 U CN 201720918474U CN 207070442 U CN207070442 U CN 207070442U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit
- insert hole
- protective layer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
It the utility model is related to a kind of circuit board for carrying scolding tin and being provided with protective layer; including circuit board body and protective layer; the surface of circuit board body is provided with circuit; protective layer covers circuit and circuit board body; circuit is provided with the insert hole for penetrating the circuit board body; the position that protective layer corresponds to the insert hole is provided with via, and the position that circuit is provided with insert hole is exposed to via, tin set is equipped with insert hole.The utility model provide a kind of pin through component when can reduce welding passes to the heat of component, pin can also be fixed together with insert hole, can prevent that circuit is destroyed and produce electric fault carry scolding tin and the circuit board provided with protective layer, solve during existing welding circuit board through pin pass to component heat is more, component with the bonding strength difference between circuit board and stress point it is single caused by easily produce that electrical contact is bad and the easy impaired problem of circuit.
Description
Technical field
Circuit board technology field is the utility model is related to, more particularly, to a kind of circuit for carrying scolding tin and being provided with protective layer
Plate.
Background technology
Circuit board is the plank for being used to fix electronic component and be electrically connected in electrical equipment.It is in China Patent No.
2015203357241st, Authorization Notice No. CN204733458U, the patent of entitled " a kind of on-deformable printed circuit board (PCB) "
A kind of circuit board is disclosed in file.The basic structure of circuit board includes circuit board body, and the surface of circuit board body is provided with
Circuit.Single-sided circuit board only sets circuit in the side of circuit board body, and double-sided PCB is then in the both sides table of circuit board body
Face all sets circuit.Inserted for the pin of supplied for electronic component, if China Patent No. is 2011200082107, Granted publication
Number for CN201947534U, entitled " a kind of high after footpath than multilayer board " patent document in it is i.e. open as,
Need to set insertion on the line to the insert hole of circuit board body.In use, by the pin of component from insert hole away from line
One end insertion on road, is then welded together pin with circuit by scolding tin.
Existing circuit has the following disadvantages：Heat caused by welding can pass to along the pin of component in large quantities
Component, easily cause component quality decline；Pin can not be located at into the part in insert hole during welding with insert hole to consolidate
It is scheduled on together, so as to cause the bonding strength between component and circuit poor；When component is by the power extracted, stress point all positions
Junction in pin with circuit, easily produce electrical connection bad phenomenon；Circuit is easily damaged and produces electric fault.Separately
On the one hand, a large amount of electronic components are possessed on circuit board, substantial amounts of heat, circuit board thermal diffusivity itself can be produced in use
The poor and narrow space of energy, causes heat to be difficult to distribute, so that circuit board is rapidly heated, influences the performance of electronic component, i.e.,
It has impact on the reliability of circuit board.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide when one kind can reduce welding through member
The pin of device passes to the heat of component, pin can also be fixed together with insert hole, circuit quilt can be prevented
Destroy and produce electric fault, radiating is preferable and avoids influenceing the circuit for carrying scolding tin and being provided with protective layer of circuit board reliability
Plate.
What the technical solution of the utility model was realized in：It is a kind of to carry scolding tin and the circuit board provided with protective layer, bag
Circuit board body is included, the surface of the circuit board body is provided with circuit, and the circuit, which is provided with, penetrates inserting for the circuit board body
Part hole, it is characterised in that：Also include covering the circuit and the protective layer of circuit board body, the protective layer corresponds to described insert
The position in part hole is provided with via, and the position that the circuit is provided with the insert hole is exposed to the via, worn in the insert hole
Provided with tin set；In use, the pin of component is inserted from one end away from circuit of insert hole, then by tin soldering machine by pin
Weld together with circuit, covered and absorb by tin when pin of the heat in welding process through component is conducted so that transmit
Heat to component reduces, so as to reduce the influence to component.Tin set absorbs heat and melted, by pin after fusing
The part being located at insert hole in circuit is also welded to and forms internal solder joint together, and internal welding point, which plays, improves first device
The effect of bonding strength between part and circuit；The formation of internal solder joint can be played when extracting component, and auxiliary pin is same
The junction of circuit carries out stress, to reduce the probability for producing electrical connection bad phenomenon.Due to there is provided protective layer, therefore circuit
It is not easy to be damaged with circuit board body.It is logical that two radiatings connected respectively with insert hole are provided with the circuit board body
Road, two heat dissipation paths are divided into heat dissipation channel and go out heat dissipation channel, and this enters the bore of heat dissipation channel by close to the one of insert hole
Hold toward one end away from insert hole and become larger, this goes out the bore of heat dissipation channel from one end of close insert hole toward away from insert hole
One end taper into, be additionally provided with interface channel in the circuit board body, the both ends of the interface channel are respectively with entering radiating
Passage is connected with heat dissipation channel is gone out, and the interface channel is set close to insert hole.Circuit board produces substantial amounts of in use
Heat, due to being provided with two heat dissipation paths in circuit board body, two heat dissipation paths are divided into heat dissipation channel and go out radiating
Passage so that extraneous air is introduced into heat dissipation channel horizontal stroke, is then entered heat dissipation channel by interface channel, is realized air
It convection current, ensure that circuit board produces substantial amounts of heat and can timely excluded, and enter the bore of heat dissipation channel by close to plug-in unit
The one end in hole is become larger toward one end away from insert hole so that extraneous air can be rapidly entered into heat dissipation channel, with reference to this
Go out the bore of heat dissipation channel from being tapered into close to one end of insert hole toward one end away from insert hole so that produced by circuit board
A large amount of heat energy quickly exclude, finally further accelerate the flowing of the hot gas and extraneous air inside circuit board, further
Improve radiating effect.
Wherein, the entrance point for entering heat dissipation channel connects with extraneous air, and the port of export and extraneous air for going out heat dissipation channel connect
It is logical.
If preferably, be provided with dry copper pin in the wall of tin set, the copper pin covered along tin it is circumferentially distributed axially extending,
The copper pin is exposed to the tin set close to one end of the circuit.The efficiency that tin set imports heat can be improved so that welding
During tin set more can reliably be melted.
Preferably, the copper pin abuts together with the circuit.Can further improve when heat conduction covers to tin can
By property.
Preferably, being provided with guide ring in the insert hole, the tin set is described between the guide ring and circuit
The inner peripheral surface of guide ring is the big conical surface of the small outer diameter of inner diameter.It is convenient when component inserts to cause, and can is enough anti-
During only manually being welded by soldering gun, tin set fusing after outflow be unable to by pin with circuit board body weld
Together.Note：Component is in the lower section of circuit board during human weld, is that component is located at circuit board when tin soldering machine is welded
Top.
Preferably, it is interference fit between the guide ring and insert hole.Can easily and effectively prevent guide ring from
Deviate from insert hole.
Preferably, the guide ring, which is provided with, prevents from being plugged on the pins of electric elements in insert hole from away from circuit
The elastic retaining pin that one end is extracted.When inserting pin, pin causes retaining pin to open and produces avoidance.Then retaining during extraction
Resistance when pin increase is extracted, so that pin is not easy to be pulled out, play a part of improving electrical connection reliability.
Preferably, the retaining pin is arranged at the inner face of the guide ring.It can be carried out when tin set aperture is smaller
Layout, improves convenience during circuit-board laying-out.
Preferably, the inner peripheral surface of medial surface and the guide ring of the retaining pin along the radial direction of guide ring is positioned at same
On the conical surface.It is easy to make, it is compact-sized.
Preferably, the circuit board body, which is provided with, deposits hole, the protective layer, which is provided with, is contained in the connection deposited in hole
Head.The connection reliability of protective layer can be improved.
Preferably, it is described deposit hole the big outer end opening area of inner aperture area it is small, the connector is connected to described
Deposit in hole.Connection reliability is more preferable.
The utility model tool has the advantage that：Pin of the heat through component in welding process can be by tin when being conducted
Set absorbs so that passing to the heat of component reduces, so as to reduce the influence to component；Tin set absorbs heat and produced molten
Pin can be also welded to the part that insert hole is located in circuit after change and form internal solder joint together, internal welding point, which plays, to be carried
The effect of bonding strength between high component and circuit；When the formation of internal solder joint can play extraction component, auxiliary is inserted
Pin carries out stress with the junction of circuit, so as to not allow to be also easy to produce electrical connection bad phenomenon；Circuit is not easy to be damaged.
The utility model is further arranged to：It is described to enter heat dissipation channel and to go out heat dissipation channel in wavy.
By using above-mentioned technical proposal, area of dissipation is improved, so as to accelerate the radiating of circuit board.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model specific embodiment one；
Fig. 2 is the use state diagram of embodiment one；
Fig. 3 is the structural representation of the utility model embodiment two；
Fig. 4 is the structural representation of the utility model embodiment three；
Fig. 5 is the structural representation of the utility model embodiment four.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Embodiment one, referring to Fig. 1, the utility model discloses a kind of circuit board for carrying scolding tin and being provided with protective layer, bag
Include circuit board body 1.One side surface of circuit board body 1 is provided with circuit 2.Circuit 2 is provided with insert hole 3.Insert hole 3 penetrates circuit
Plate body 1 and circuit 2.Tin set 4 is equipped with insert hole 3.Circuit board body 1 is provided with the side covering matcoveredn 8 of circuit.Protect
Sheath 8 covers circuit 2 simultaneously.The position of the corresponding insert hole of protective layer 8 is provided with via 81.Circuit is provided with the position 21 of insert hole
It is exposed to via 81.Circuit board body 1 is provided with and deposits hole 11.The big outer end opening area of inner aperture area for depositing hole 11 is small.Protection
Layer 8 is provided with connector 82.The size and shape of connector 82 is deposited hole 11 together and matched.Connector 82, which is connected to, to be deposited in hole 11.
In the utility model specific embodiment, two connected respectively with insert hole 3 are provided with the circuit board body 1
Heat dissipation paths, two heat dissipation paths are divided into heat dissipation channel 100 and go out heat dissipation channel 200, and this enters the bore of heat dissipation channel 100
From being become larger close to one end of insert hole 3 toward one end away from insert hole 3, this goes out the bore of heat dissipation channel 200 by close to slotting
The one end in part hole 3 is tapered into toward one end away from insert hole 3, and interface channel 300 is additionally provided with the circuit board body 1,
The both ends of the interface channel 300 connect with entering heat dissipation channel 100 and going out heat dissipation channel 200 respectively, and the interface channel 300 is close
Insert hole 3 is set.Circuit board produces substantial amounts of heat in use, is dissipated due to being provided with two in circuit board body 1
The passage of heat, two heat dissipation paths are divided into heat dissipation channel 100 and go out heat dissipation channel 200 so that extraneous air is introduced into radiating
Passage 100 is horizontal, then enters heat dissipation channel 200 by interface channel 300, realizes cross-ventilation, ensure that circuit board produces
Raw substantial amounts of heat can be excluded timely, and enter the bore of heat dissipation channel 100 from being inserted close to one end of insert hole 3 toward remote
The one end in part hole 3 is become larger so that extraneous air can be rapidly entered into heat dissipation channel 100, with reference to this goes out heat dissipation channel
200 bore close to one end of insert hole 3 toward one end away from insert hole 3 from tapering into so that big caused by circuit board
Calorimetric can be excluded quickly, finally further accelerated the flowing of the hot gas and extraneous air inside circuit board, further carried
High radiating effect.
Wherein, the entrance point for entering heat dissipation channel 100 connects with extraneous air, goes out the port of export and the outside of heat dissipation channel 200
Air communication.
It is described to enter heat dissipation channel 100 and to go out heat dissipation channel 200 in wavy in the utility model specific embodiment.
Area of dissipation is improved, so as to accelerate the radiating of circuit board.
Referring to Fig. 2, in use, the pin 51 of component 5 is inserted from the one end of insert hole 3 away from circuit.Then will insert
Pin 51 and circuit 2 weld together and form outside solder joint 6.When heat pin 51 in welding process is conducted 4 are covered by tin
Absorb, tin set 4 absorbs heat and produces fusing, and pin 51 is located at into the part in circuit with insert hole 3 after the fusing of tin set 4 also welds
It is connected together to form internal solder joint 41.
Embodiment two, the difference with embodiment one are：
Referring to Fig. 3, the both side surface of circuit board body 1 is designed with circuit 2.Insert hole 3 is designed with the circuit 2 of both sides.
Accordingly the both side surface of circuit board body 1 is designed with protective layer 8.
Embodiment three, the difference with embodiment one are：
Referring to Fig. 4, if being provided with dry copper pin 42 in the jacket wall of tin set 4.Copper pin 42 covers circumferentially distributed along tin.Copper pin 42 is along tin
What is covered is axially extending.Copper pin is exposed to tin set 4 close to one end 421 of circuit.Copper pin is led close to one end 421 of circuit with circuit 2
Hot abutting is together.Guide ring 7 is provided with insert hole 3.Tin set 4 is between guide ring 7 and circuit 2.The inner circumferential of guide ring
Face 71 is the big conical surface of the small outer diameter of inner diameter.It is interference fit between guide ring 7 and insert hole 3.Guide ring 7 is provided with bullet
The retaining pin 72 of property.Retaining pin 72 is arranged at the inner face of guide ring 7.Medial surface 721 He of the retaining pin along the radial direction of guide ring
The inner peripheral surface 71 of guide ring is located on the same conical surface.
Copper pin 42 can play a part of improving heat-conducting effect during use.Guide ring 7 enables to pin can be easily
Insertion, retaining pin 72 can play a part of preventing pin from extracting during extraction.
Example IV, the difference with embodiment three are：
Referring to Fig. 5, the both side surface of circuit board body 1 is designed with circuit 2.Insert hole 3 is designed with the circuit 2 of both sides.
Accordingly the both side surface of circuit board body 1 is designed with protective layer 8.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Within the spirit and principle of utility model, any modification, equivalent substitution and improvements made etc., the utility model should be included in
Protection domain within.
Claims (4)
1. a kind of circuit board for carrying scolding tin and being provided with protective layer, including circuit board body, the surface of the circuit board body are set
There is circuit, the circuit is provided with the insert hole for penetrating the circuit board body, it is characterised in that：Also include covering the circuit
With the protective layer of circuit board body, the position that the protective layer corresponds to the insert hole is provided with via, and the circuit is provided with described
The position of insert hole is exposed to the via, and tin set is equipped with the insert hole；Difference is provided with the circuit board body
Two heat dissipation paths connected with insert hole, two heat dissipation paths are divided into heat dissipation channel and go out heat dissipation channel, and it is logical that this enters radiating
For the bore in road from being become larger close to one end of insert hole toward one end away from insert hole, this goes out the bore of heat dissipation channel by close
One end of insert hole tapers into toward one end away from insert hole, is additionally provided with interface channel in the circuit board body, the company
The both ends for connecting road are connected with entering heat dissipation channel and going out heat dissipation channel respectively, and the interface channel is set close to insert hole.
2. according to claim 1 carry scolding tin and the circuit board provided with protective layer, it is characterised in that：It is described enter radiating it is logical
Road is in wavy with heat dissipation channel is gone out.
3. according to claim 1 carry scolding tin and the circuit board provided with protective layer, it is characterised in that：The wall of the tin set
If it is provided with dry copper pin in, the copper pin covers circumferentially distributed axially extending along tin, and the copper pin is naked close to one end of the circuit
It is exposed to the tin set.
4. according to claim 3 carry scolding tin and the circuit board provided with protective layer, it is characterised in that：The same institute of copper pin
Circuit is stated to abut together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720918474.3U CN207070442U (en) | 2017-07-27 | 2017-07-27 | Carry scolding tin and the circuit board provided with protective layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720918474.3U CN207070442U (en) | 2017-07-27 | 2017-07-27 | Carry scolding tin and the circuit board provided with protective layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207070442U true CN207070442U (en) | 2018-03-02 |
Family
ID=61517550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720918474.3U Expired - Fee Related CN207070442U (en) | 2017-07-27 | 2017-07-27 | Carry scolding tin and the circuit board provided with protective layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207070442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699119A (en) * | 2018-12-04 | 2019-04-30 | 郑州云海信息技术有限公司 | A kind of printed circuit board, system board and data processing equipment |
-
2017
- 2017-07-27 CN CN201720918474.3U patent/CN207070442U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699119A (en) * | 2018-12-04 | 2019-04-30 | 郑州云海信息技术有限公司 | A kind of printed circuit board, system board and data processing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180302 Termination date: 20200727 |