CN207053884U - Anti- displacement Multi-layer circuit board structure - Google Patents

Anti- displacement Multi-layer circuit board structure Download PDF

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Publication number
CN207053884U
CN207053884U CN201721035270.1U CN201721035270U CN207053884U CN 207053884 U CN207053884 U CN 207053884U CN 201721035270 U CN201721035270 U CN 201721035270U CN 207053884 U CN207053884 U CN 207053884U
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CN
China
Prior art keywords
section
substrate
laminate
top plate
clip section
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Active
Application number
CN201721035270.1U
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Chinese (zh)
Inventor
刘金全
许中列
杨芳
钟勇
李林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Fu Sheng Electronic Technology Co Ltd
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Chengdu Fu Sheng Electronic Technology Co Ltd
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Priority to CN201721035270.1U priority Critical patent/CN207053884U/en
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Publication of CN207053884U publication Critical patent/CN207053884U/en
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Abstract

The utility model discloses a kind of anti-displacement Multi-layer circuit board structure, including substrate, top plate and laminate, top plate to be set in parallel in the top of substrate;Multiple laminates, which stack gradually, to be fixedly installed between substrate and top plate;Between the first end of multiple laminates, between the first end of laminate and the first end of substrate, by being fixedly connected by toggle clip device between the first end of laminate and top plate, it is fixedly connected between second end at the second end of multiple laminates, the second end of substrate and top plate by screw rod, the medial surface of the medial surface of substrate, the two sides of laminate and top plate is provided with circuit arrangement groove.A kind of anti-displacement Multi-layer circuit board structure of the utility model can avoid passing through the fixed unstable situation that rivet is fixed and occurred by toggle clip device and screw fixed substrate, top plate and laminate.Possess structure fixed up and down between each laminate simultaneously, can flexible regulating laminate according to demand quantity, be easy to multiple-plate production.

Description

Anti- displacement Multi-layer circuit board structure
Technical field
It the utility model is related to circuit structure, more particularly to anti-displacement Multi-layer circuit board structure.
Background technology
At present, in the manufacturing of multilayer circuit board, generally fixed by the single circuit board of multilayer by closing-up Together.However, when hammer into the operation of rivet, the relative skew of generation between layers of multilayer circuit board is easily caused The problem of, have a strong impact on the quality of multilayer circuit board.
Utility model content
The purpose of this utility model is that to solve the above problems and provides anti-displacement Multi-layer circuit board structure.
The utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of anti-displacement Multi-layer circuit board structure, including,
Substrate;
Top plate, the top plate are set in parallel in the top of the substrate;
Laminate, multiple laminates, which stack gradually, to be fixedly installed between the substrate and the top plate;
It is described between the first end of the first end of the laminate and the substrate between the first end of multiple laminates It is the second end of multiple laminates, described by being fixedly connected by toggle clip device between the first end of laminate and the top plate It is fixedly connected between second end of substrate and the second end of the top plate by screw rod, the medial surface of the substrate, the laminate Two sides and the medial surface of the top plate be provided with circuit arrangement groove.
Specifically, the laminate includes,
Lower clip section, the section of the lower clip section is L-type structure;
Flat plate section, the flat plate section be arranged in parallel, and its first end is consolidated with the middle part on the inside of the riser at the lower clip end Fixed connection;
Upper clip section, the section of the upper clip section is n-type structure, the first end of the lower clip section and the lower clip The top of the riser outer end of section is fixedly connected;
Canned paragraph, the canned paragraph are fixedly connected with the second end of the flat plate section, and are provided with the canned paragraph more Individual vertical screwed hole.
Preferably, the upper side of the upper side of the flat plate section and the lower clip section, the downside of the flat plate section with The circuit arrangement groove is formed between the downside of the lower clip section;
The upper side in the inner underside face of the upper clip section, the upper side of the lower clip section and the canned paragraph overlaps, The downside of the lower clip section overlaps with the downside of the canned paragraph;
The distance between outer downside of the transverse slat upper side of the lower clip section and the upper clip section is equal on described The distance between the superolateral surface of clip section and upper medial surface.
The distance between the interior upper side of the upper clip section and inner underside face are equal to the thickness of the transverse slat of the lower clip section Degree.
Specifically, the substrate includes flat plate section, upper clip section and canned paragraph;
The top plate includes flat plate section, lower clip section and canned paragraph;
The upper clip section and the lower clip section composition toggle clip device.
The beneficial effects of the utility model are:
A kind of anti-displacement Multi-layer circuit board structure of the utility model passes through toggle clip device and screw fixed substrate, top plate and layer Plate, the fixed unstable situation that rivet is fixed and occurred can be avoided passing through.Possess what is fixed up and down between each laminate simultaneously Structure, can flexible regulating laminate according to demand quantity, be easy to multiple-plate production.
Brief description of the drawings
Fig. 1 is the structural representation of anti-displacement Multi-layer circuit board structure described in the utility model;
Fig. 2 is the structural representation of laminate described in the utility model.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings:
As shown in figure 1, a kind of anti-displacement Multi-layer circuit board structure of the utility model, including substrate 1, top plate 6 and laminate 2, The top that top plate 6 is set in parallel in substrate 1 is stated, multiple laminates 2, which stack gradually, to be fixedly installed between substrate 1 and top plate 6;It is multiple Between the first end of laminate 2, between the first end of laminate 2 and the first end of substrate 1, lead between the first end and top plate 6 of laminate 2 Cross and be fixedly connected by toggle clip device 4, led between second end at the second end of multiple laminates 2, the second end of substrate 1 and top plate 6 Cross screw rod 5 to be fixedly connected, it is recessed that the medial surface of the medial surface of substrate 1, the two sides of laminate 2 and top plate 6 is provided with circuit arrangement Groove 3.
As shown in Fig. 2 laminate 2 includes lower clip section 7, flat plate section 8, upper clip section 10 and canned paragraph 9, lower clip section 7 Section is L-type structure;Flat plate section 8 is be arranged in parallel, and its first end is fixedly connected with the middle part on the inside of the riser at lower clip end;On The section of clip section 10 is n-type structure, and the first end of lower clip section 7 is fixedly connected with the top of the riser outer end of lower clip section 7; Canned paragraph 9 is fixedly connected with the second end of flat plate section 8, and multiple vertical screwed holes are provided with canned paragraph 9.
The upper side of flat plate section 8 and the upper side of lower clip section 7, the downside of flat plate section 8 and the downside of lower clip section 7 Between form circuit arrangement groove 3;The upper side in the inner underside face of upper clip section 10, the upper side of lower clip section 7 and canned paragraph 9 Overlap, the downside of lower clip section 7 overlaps with the downside of canned paragraph 9;The transverse slat upper side of lower clip section 7 and upper clip section 10 The distance between outer downside be equal to the distance between the superolateral surface of upper clip section 10 and upper medial surface, upper clip section 10 The distance between interior upper side and inner underside face are equal to the thickness of the transverse slat of lower clip section 7.
Substrate 1 includes flat plate section 8, upper clip section 10 and canned paragraph 9;Top plate 6 includes flat plate section 8, lower clip section 7 and fixed Section 9.
The operation principle of the anti-displacement Multi-layer circuit board structure of the utility model is as follows:
When in use, the lower clip section 7 of laminate 2 is inserted into the upper clip section 10 of substrate 1, and aligned position;
Then the lower clip section 7 of another laminate 2 is inserted into the upper clip section 10 of lower section laminate 2, and aligned position;
Then laminate 2 is stacked on the laminate 2 of lower section successively, reaches estimated 2 numbers of laminate;
The lower clip section 7 of top plate 6 is inserted into the upper clip section 10 of laminate 2, and aligned position;
Then second end of substrate 1, laminate 2 and top plate 6 is fixed by screw rod 5, circuit is placed in circuit arrangement In groove 3.
The technical solution of the utility model is not limited to the limitation of above-mentioned specific embodiment, every according to skill of the present utility model The technology deformation that art scheme is made, each falls within the scope of protection of the utility model.

Claims (4)

  1. A kind of 1. anti-displacement Multi-layer circuit board structure, it is characterised in that:Including,
    Substrate;
    Top plate, the top plate are set in parallel in the top of the substrate;
    Laminate, multiple laminates, which stack gradually, to be fixedly installed between the substrate and the top plate;
    Between the first end of multiple laminates, between the first end of the first end of the laminate and the substrate, the laminate First end and the top plate between by being fixedly connected by toggle clip device, the second end of multiple laminates, the substrate The second end and the top plate the second end between be fixedly connected by screw rod, the medial surface of the substrate, the two of the laminate The medial surface of side and the top plate is provided with circuit arrangement groove.
  2. 2. anti-displacement Multi-layer circuit board structure according to claim 1, it is characterised in that:The laminate includes,
    Lower clip section, the section of the lower clip section is L-type structure;
    Flat plate section, the flat plate section are be arranged in parallel, and its first end is fixed with the middle part on the inside of the riser at the lower clip end and connected Connect;
    Upper clip section, the section of the upper clip section is n-type structure, the first end of the lower clip section and the lower clip section The top of riser outer end is fixedly connected;
    Canned paragraph, the canned paragraph are fixedly connected with the second end of the flat plate section, and are provided with the canned paragraph multiple perpendicular Straight screwed hole.
  3. 3. anti-displacement Multi-layer circuit board structure according to claim 2, it is characterised in that:The upper side of the flat plate section with The circuit is formed between the downside of the upper side of the lower clip section, the downside of the flat plate section and the lower clip section Arrange groove;
    The upper side in the inner underside face of the upper clip section, the upper side of the lower clip section and the canned paragraph overlaps, described The downside of lower clip section overlaps with the downside of the canned paragraph;
    The distance between outer downside of the transverse slat upper side of the lower clip section and the upper clip section is equal to the upper clip The distance between superolateral surface and upper medial surface of section,
    The distance between the interior upper side of the upper clip section and inner underside face are equal to the thickness of the transverse slat of the lower clip section.
  4. 4. the anti-displacement Multi-layer circuit board structure according to Claims 2 or 3, it is characterised in that:The substrate includes flat board Section, upper clip section and canned paragraph;
    The top plate includes flat plate section, lower clip section and canned paragraph;
    The upper clip section and the lower clip section composition toggle clip device.
CN201721035270.1U 2017-08-17 2017-08-17 Anti- displacement Multi-layer circuit board structure Active CN207053884U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721035270.1U CN207053884U (en) 2017-08-17 2017-08-17 Anti- displacement Multi-layer circuit board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721035270.1U CN207053884U (en) 2017-08-17 2017-08-17 Anti- displacement Multi-layer circuit board structure

Publications (1)

Publication Number Publication Date
CN207053884U true CN207053884U (en) 2018-02-27

Family

ID=61502402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721035270.1U Active CN207053884U (en) 2017-08-17 2017-08-17 Anti- displacement Multi-layer circuit board structure

Country Status (1)

Country Link
CN (1) CN207053884U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107343356A (en) * 2017-08-17 2017-11-10 成都富升电子科技有限公司 Anti- displacement Multi-layer circuit board structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107343356A (en) * 2017-08-17 2017-11-10 成都富升电子科技有限公司 Anti- displacement Multi-layer circuit board structure

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